CN115792566A

CN115792566A - Integrated circuit chip translation type automatic detection device and detection method

Info

Publication number: CN115792566A
Application number: CN202211413030.6A
Authority: CN
Inventors: 陈云
Original assignee: Shanghai Zezhidun Artificial Intelligence Technology Co ltd
Current assignee: Shanghai Zezhidun Artificial Intelligence Technology Co ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-03-14

Abstract

The invention relates to the technical field of integrated circuits, in particular to a translation type automatic detection device and a translation type automatic detection method for an integrated circuit chip.

Description

Integrated circuit chip translation type automatic detection device and detection method

Technical Field

Background

The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring.

Chinese patent No. CN202210089035.1 discloses an automatic detection device and detection method for a translational sorting machine for integrated circuit chips, wherein a chip suction mechanism moves a chip on a feeding tray onto a material shuttle, the material shuttle moves to a position below a working platform, a lifting rod of the material shuttle is driven to descend to suck up the chip, and a sliding seat is moved by a horizontal screw rod, so that the lifting rod with the chip is moved to a detection mechanism for detection, and the overall production efficiency is improved.

However, the existing slope reinforcing device has the following problems when in use:

1. because the chips are usually detected in a large scale, the prior art does not test the hardness, the impact resistance and the like of the chips by synchronously matching the detection device when the large batch of chips are conveyed, so that the chip detection efficiency is reduced;

2. because the temperature of the electronic component can rise after being used for a long time, the temperature of the chip can rise, and the use environment of the chip is not simulated in the conventional chip delivery detection, so that whether the chip is normal at high temperature after being detected cannot be ensured.

Based on the above, a device and a method for automatically detecting the translation of an integrated circuit chip are provided.

Disclosure of Invention

The invention aims to provide a translation type automatic detection device and a translation type automatic detection method for an integrated circuit chip, so as to solve the problems in the background technology.

The purpose of the invention can be realized by the following technical scheme:

the utility model provides an integrated circuit chip translation formula automatic checkout device, which comprises a base, base upper surface one side fixed mounting has conveying unit, base upper surface middle part is equipped with the transposition unit, base upper surface opposite side is provided with the extrusion unit, conveying unit upper surface middle part is equipped with the unit that heaies up, it is equipped with the subassembly that strikes to rise up one side, strike the subassembly and be connected with conveying unit, conveying unit is used for realizing carrying out the integrated circuit chip translation of batch, make it carry out the continuity auto-feed when detecting, the extrusion unit is used for carrying out the extrusion operation to the both sides of chip, whether it is qualified for the hardness that detects the chip.

Preferably, the conveying unit includes the riser, and the riser is equipped with two, and the common fixed mounting in riser upper portion of both sides has the fixed plate, and the neutral groove has transversely been seted up at the fixed plate middle part, and the riser of both sides is close to one side equal fixed mounting mutually and has the fixing base, and the fixing base is equipped with a plurality ofly, and fixing base one side turns over the board through electronic slider fixed mounting.

Preferably, turn over board one side and rotate and install the propelling movement frame, the fixing base front side is equipped with the side frame, the propelling movement frame is kept away from to turn over board one end and is rotated and install the pendulum rod, the pendulum rod is kept away from and is connected with the rotation of side frame one end, the fixing base top is rotated and is installed the lifter plate, the lifter plate upper surface equidistance has been arranged and has been pushed away the frame, conveying unit is used for carrying out the translation to a plurality of chips and carries, it pushes away before carrying out to drive the propelling movement frame when turning over the board rotation, it drives the pendulum rod horizontal hunting to push away before the frame forward, it realizes pushing away after rising forward to push away frame upper portion simultaneously, a plurality of pushing away that lifter plate upper surface was arranged move in the median groove, thereby realize carrying out equidistance translation to a plurality of chips that the median groove upper surface was placed and carry out the test to intensification unit and strike the subassembly below.

Preferably, the intensification unit is including linking the board, link board and riser fixed connection, it is equipped with two to link the board, it has the traction plate to link board upper surface slidable mounting, it has the synchronizing shaft to turn over board one end fixed mounting, the synchronizing shaft runs through and rotates in the riser, the synchronizing shaft is kept away from and is turned over board one end fixed mounting and have the action wheel, the even board outside rotation of one side is installed and is linked the axle, link epaxial fixed mounting to have from the driving wheel, the action wheel and from driving through belt transmission between the driving wheel, turn over the board rotation and drive even axle rotation simultaneously, it rotates to drive the action wheel when axle rotates even, the action wheel passes through the belt and drives from the driving wheel rotation.

Preferably, a cam is arranged on one side of the driven wheel, the cam is fixedly connected with the connecting shaft, a fitting wheel is arranged above the cam, the fitting wheel is fixedly connected with the traction plate, a position adjusting rod is rotatably installed on the middle portion of the traction plate through threads, a sealing frame is rotatably installed at the lower end of the position adjusting rod, a heating plate is arranged in the sealing frame and used for raising the temperature of the outer side of the chip, the driven wheel is driven to rotate, the cam is driven to rotate intermittently to push the fitting wheel to lift, the traction plate is driven to lift when the fitting wheel lifts, the sealing frame below the cam is driven to be matched with the conveying unit to heat the chip in sequence, then the chip is subjected to a detection test, and whether the performance of the chip is normal at high temperature is simulated.

Preferably, the subassembly of strikeing includes the crane, crane upper surface middle part fixed mounting has driving motor, driving motor output fixed mounting has the plectane, plectane one side fixed mounting has the drive shaft, crane one side bilateral symmetry fixed mounting has the flange, slidable mounting has the frame of strikeing on the flange of both sides, the drive shaft is located and beats the frame, it has the vibrations board to strike frame bottom fixed mounting, the vibrations board is used for knocking the test to the chip of below, when carrying the unit with the chip remove to the subassembly below of strikeing, driving motor opens and drives the plectane rotation, drive the frame of strikeing through the drive shaft when the plectane rotates and slide from top to bottom in the flange, the vibrations board of the frame below of strikeing this moment is strikeed the chip and is carried out the vibration.

Preferably, the transposition unit comprises a rotary table, supports are fixedly mounted on two sides of the upper surface of the rotary table, a lifting rod is mounted in the support on one side in a rotating mode, a sliding rod is fixedly mounted in the support on the other side in a rotating mode, a cross frame is mounted in the lifting rod in a rotating mode, one end, far away from the lifting rod, of the cross frame is connected with the sliding rod in a sliding mode, an adjusting groove is formed in the middle of the cross frame, and positive rotation and reverse rotation of the lifting rod are used for driving lifting adjustment of the cross frame.

Preferably, a rotating rod is rotatably installed on threads in the middle of the adjusting groove, a moving frame is rotatably installed on the rotating rod through threads, a displacement frame is arranged in the middle of the moving frame, two rotating plates are installed on two sides in the moving frame through electric sliders, a connecting rod is arranged between the two rotating plates and is positioned in the displacement frame to slide, the rotating rod is rotated to control horizontal displacement of the moving frame on the rotating rod, the electric sliders are opened to drive the rotating plates to rotate, and the rotating plates drive the displacement frame to rotate when rotating so as to subsequently replace the clamping assembly and move the chip to the 21274type frame.

Preferably, crossbearer lower surface both sides fixed mounting has the hanger plate, the hanger plate of both sides is close to the common slidable mounting in one side mutually and has the cross bar, cross bar both sides slidable mounting has the balladeur train, displacement frame one end articulates there is the balance plate, the balance plate both sides are located the balladeur train and slide, fixed mounting has the centre gripping subassembly in the middle part of the balance plate lower surface, the displacement frame drives the balladeur train when rotating and slides from top to bottom, reciprocate in the hanger plate of both sides through the cross bar when the displacement frame slides from top to bottom, so that the centre gripping subassembly even running of displacement frame one end.

Preferably, the centre gripping subassembly includes the holding frame, the inboard top of holding frame is equipped with the connecting piece through electronic slider, the connecting piece is equipped with two, the arm-tie is installed in the inside rotation of connecting piece, the arm-tie is equipped with two, arm-tie one end and the holding frame of one side rotate to be connected, the arm-tie of opposite side rotates installs the profile shapes, profile shapes one side and holding frame sliding connection, electronic slider opens the connecting piece that drives both sides and is close to mutually, be used for realizing carrying out the centre gripping to the both sides of chip, the connecting piece of both sides is kept away from mutually, be used for realizing placing the chip.

Preferably, profile part downside fixed mounting has the planking, planking upper portion slidable mounting has the gag lever post, gag lever post one end fixed mounting has the grip block, grip block downside middle part is for lining up the structure, the layer board is installed in the rotation of grip block downside, layer board one side is equipped with the rubber pad, be equipped with the spring between layer board and the planking, the spring below is equipped with the electric putter with planking articulated, electric putter keeps away from planking one end and articulates with the layer board, the grip block carries out the centre gripping to the chip both sides when the connecting piece of both sides is close to mutually, electric putter stretches the layer board that drives both sides before afterwards and holds in the palm the chip bottom and put, avoid taking place to drop the chip when removing to the extrusion unit in.

Preferably, the extrusion unit comprises a bottom plate, the bottom plate is rotatably connected with the base through an electric sliding block, a screw is rotatably arranged in the middle of the upper surface of the bottom plate through threads, a cylinder is rotatably arranged on the outer side of the screw through threads, a probabal 21274frame is arranged on the outer side of the cylinder along the axis of the cylinder, clamping plates are slidably arranged on the upper side and the lower side of the probabal 21274frame, springs are arranged between one sides of the clamping plates on the two sides, which are far away from the cylinder, and the other sides of the clamping plates on the two sides are inclined, the electric sliding block is used for driving the bottom plate to rotate, the four probabal 21274frames on the outer side of the cylinder are sequentially moved to face the clamping assembly through the rotation of the bottom plate, when the clamped chip is moved into the probabal 21274frame by the transposition unit, the two clamping plates can rapidly clamp the chip up and down, and then the extruding pieces on the two sides of the probabal 21274frame can extrude the chip to detect whether the hardness of the chip is qualified.

Preferably, another object of the present invention is to provide a method for detecting a translational automatic detection device of an integrated circuit chip, comprising the following steps:

s1: chip conveying:

the electric slider is opened to drive the turning plate to rotate, one end of the pushing frame is driven to lift up when the turning plate rotates, one end of the pushing frame is driven to swing left and right when lifted upwards, the swing rod swings left and right to enable the lifting plate to lift upwards and push forwards, and when the lifting plate rises and pushes forwards, the plurality of chips are sequentially translated and pushed forwards through the pushing frame for conveying;

s2: chip simulation temperature rise:

when the turning plate rotates, the driving wheel is driven to rotate through the synchronizing shaft, the driving wheel drives the driven wheel to rotate through the belt, the driven wheel drives the cam to rotate, the cam intermittently pushes the laminating wheel, the laminating wheel drives the traction plate to slide up and down, the traction plate drives the sealing frame to cover and seal the chip, and meanwhile, the heating plate in the sealing frame simulates the chip to generate heat;

s3: vibration testing:

after the chip passes the heating test, the chip moves to the position below the knocking assembly, a driving motor is started, the driving motor drives a circular plate to rotate, the circular plate drives a driving shaft to rotate when rotating, the driving shaft drives a knocking frame to slide up and down in a convex plate when rotating, and the knocking frame drives a vibrating plate to carry out knocking vibration test on the chip when sliding up and down;

s4: and (3) hardness testing:

the centre gripping subassembly carries out the centre gripping to the chip fixedly, and the transposition unit carries out displacement to extrusion unit to the chip, and the telescopic link is opened afterwards and is driven splint and fix the both sides of chip, detects the hardness of chip, encapsulates the test to the chip at last.

The invention has the beneficial effects that:

1. according to the chip conveying device, the conveying unit is arranged, the pushing frame is driven to push forwards when the turnover plate rotates, the swing rod is driven to swing left and right when the pushing frame pushes forwards, and the plurality of pushing frames arranged on the upper surface of the lifting plate move in the median groove, so that the chips placed on the upper surface of the median groove are conveyed in a translation mode at equal intervals.

2. Through setting up the cam, drive the cam when following the driving wheel rotation and rotate, the cam rotates time and pushes the laminating wheel in intermittent type nature and goes up and down, drives the traction plate and goes up and down when laminating wheel goes up and down to the sealed frame that drives the below is mutually supported the operation with conveying unit and is heated the chip in proper order, and the simulation is whether normal under high temperature the performance of chip.

3. According to the invention, the knocking assembly is arranged, when the conveying unit moves the chip to the position below the knocking assembly, the driving motor is started to drive the circular plate to rotate, the circular plate drives the knocking frame to slide up and down in the convex plate through the driving shaft when rotating, and the vibration plate below the knocking frame vibrates and knocks the chip at the moment.

4. According to the invention, through arranging a v-21274frame, four v-21274frames at the outer side of a cylinder are sequentially moved towards a clamping component by rotating a bottom plate, and when a position changing unit moves a clamped chip into the v-21274frame, extruding extrusion parts at two sides of the v-21274frame to detect whether the hardness of the chip is qualified or not.

Drawings

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without creative efforts;

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the rear side structure of the present invention;

FIG. 3 is a schematic view of the structure of the conveying unit of the present invention;

FIG. 4 is a schematic side sectional view of a delivery unit of the present invention;

FIG. 5 is a schematic diagram of the structure of the transposition unit of the present invention;

FIG. 6 is a schematic view of a clamping assembly of the present invention;

FIG. 7 is an enlarged view of the portion A of FIG. 6 according to the present invention;

FIG. 8 is a schematic view of the extrusion unit of the present invention;

FIG. 9 is a schematic cross-sectional view of the extruding unit of the present invention;

FIG. 10 is an enlarged view of the portion B of FIG. 9 according to the present invention;

FIG. 11 is a structural schematic of the rapping assembly of the present invention;

FIG. 12 is a schematic view of the temperature increasing unit of the present invention;

fig. 13 is a partial structural schematic of the present invention.

The reference numbers in the figures are as follows:

1. a base; 2. a conveying unit; 21. a vertical plate; 22. a fixing plate; 23. a median trough; 24. a fixed seat; 25. turning over a plate; 26. a pushing frame; 27. a side frame; 28. a swing rod; 29. a lifting plate; 290. pushing the frame; 3. a temperature increasing unit; 31. connecting plates; 32. a traction plate; 33. a synchronizing shaft; 34. a driving wheel; 35. a driven wheel; 36. a belt; 37. a cam; 38. a laminating wheel; 39. a positioning rod; 390. a hermetic frame; 4. a knocking component; 41. a lifting frame; 42. a drive motor; 43. a circular plate; 44. a drive shaft; 45. a convex plate; 46. a knocking frame; 47. a vibration plate; 5. a transposition unit; 51. a turntable; 52. a support; 53. a lifting rod; 54. a cross frame; 55. an adjustment groove; 56. a rotating rod; 57. a movable frame; 58. a displacement frame; 59. rotating the plate; 590. a hanger plate; 591. a cross bar; 592. a carriage; 594. a balance plate; 71. a clamping frame; 72. a connecting member; 73. pulling a plate; 74. a special-shaped piece; 75. an outer plate; 76. a limiting rod; 77. a clamping plate; 78. a pallet; 79. a rubber pad; 6. a pressing unit; 61. a base plate; 62. a screw; 63. a cylinder; 65. model frame of 21274; 66. and (4) clamping the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in figure 1, an integrated circuit chip translation formula automatic checkout device, including base 1, base 1 upper surface one side fixed mounting has conveying unit 2, base 1 upper surface middle part is equipped with transposition unit 5, base 1 upper surface opposite side is provided with extrusion unit 6, conveying unit 2 upper surface middle part is equipped with intensification unit 3, intensification unit 3 one side is equipped with strikes subassembly 4, strike subassembly 4 and conveying unit 2 are connected, conveying unit 2 is used for realizing carrying the integrated circuit chip translation of batch, make it carry out continuity automatic feed when examining, extrusion unit 6 is used for carrying out the extrusion operation to the both sides of chip, whether qualified for the hardness that detects the chip.

As a technical optimization scheme of the invention, the conveying unit 2 comprises two vertical plates 21, the upper parts of the vertical plates 21 on two sides are jointly and fixedly provided with a fixing plate 22, the middle part of the fixing plate 22 is transversely provided with a middle groove 23, one side, close to the vertical plate 21 on two sides, of each vertical plate 21 is fixedly provided with a fixing seat 24, the fixing seats 24 are provided with a plurality of fixing seats, and one side of each fixing seat 24 is fixedly provided with a turning plate 25 through an electric slide block.

As a technical optimization scheme of the invention, a pushing frame 26 is rotatably mounted on one side of a turning plate 25, a side frame 27 is arranged on the front side of a fixed seat 24, a swing rod 28 is rotatably mounted on one end, away from the turning plate 25, of the pushing frame 26, one end, away from the pushing frame 26, of the swing rod 28 is rotatably connected with one end of the side frame 27, a lifting plate 29 is rotatably mounted on the top of the fixed seat 24, pushing frames 290 are equidistantly arranged on the upper surface of the lifting plate 29, a conveying unit 2 is used for horizontally conveying a plurality of chips, the pushing frame 26 is driven to be pushed forwards when the turning plate 25 rotates, the swing rod 28 is driven to swing left and right when the pushing frame 26 is pushed forwards, meanwhile, the upper portion of the pushing frame 26 drives the lifting plate 29 to be pushed forwards after being lifted, the plurality of pushing frames 290 arranged on the upper surface of the lifting plate 29 move in a middle groove 23, so that the plurality of chips placed on the upper surface of the middle groove 23 are horizontally conveyed equidistantly, and the chips are convenient to move to a heating unit 3 and a knock component 4 for testing.

As shown in fig. 3, as a technical optimization scheme of the present invention, the temperature increasing unit 3 includes two connecting plates 31, the connecting plates 31 are fixedly connected with the vertical plate 21, a traction plate 32 is slidably mounted on an upper surface of the connecting plates 31, a synchronizing shaft 33 is fixedly mounted at one end of the turning plate 25, the synchronizing shaft 33 penetrates and rotates in the vertical plate 21, a driving wheel 34 is fixedly mounted at one end of the synchronizing shaft 33 away from the turning plate 25, a connecting shaft is rotatably mounted at an outer side of the connecting plate 31 at one side, a driven wheel 35 is fixedly mounted on the connecting shaft, the driving wheel 34 and the driven wheel 35 are driven by a belt 36, the turning plate 25 rotates and drives the connecting shaft to rotate, the driving wheel 34 is driven by the driving wheel 34 to rotate by the belt 36.

As a technical optimization scheme of the invention, one side of a driven wheel 35 is provided with a cam 37, the cam 37 is fixedly connected with a connecting shaft, a fitting wheel 38 is arranged above the cam 37, the fitting wheel 38 is fixedly connected with a traction plate 32, the middle part of the traction plate 32 is provided with a positioning rod 39 in a rotating manner through threads, the lower end of the positioning rod 39 is provided with a sealing frame 390 in a rotating manner, a heating plate is arranged in the sealing frame 390 and used for raising the temperature of the outer side of a chip, the driven wheel 35 drives the cam 37 to rotate when rotating, the cam 37 pushes the fitting wheel 38 to lift intermittently, the fitting wheel 38 drives the traction plate 32 to lift when lifting, so that the sealing frame 390 below is driven to be matched with a conveying unit 2 to heat the chip in sequence, and then the chip is tested to simulate whether the performance of the chip is normal at high temperature.

As a technical optimization scheme of the invention, the knocking assembly 4 comprises a lifting frame 41, a driving motor 42 is fixedly installed in the middle of the upper surface of the lifting frame 41, a circular plate 43 is fixedly installed at the output end of the driving motor 42, a driving shaft 44 is fixedly installed at one side of the circular plate 43, convex plates 45 are fixedly installed at one side of the lifting frame 41 in a left-right symmetrical mode, knocking frames 46 are installed on the convex plates 45 at two sides in a sliding mode, the driving shaft 44 is located in the knocking frames 46, a vibration plate 47 is fixedly installed at the bottom end of the knocking frames 46, the vibration plate 47 is used for performing knocking tests on chips below the knocking assembly 4, when the conveying unit 2 moves the chips to the lower portion of the knocking assembly 4, the driving motor 42 is started to drive the circular plate 43 to rotate, the knocking frames 46 are driven by the driving shaft 44 to slide up and down in the convex plates 45 when the circular plate 43 rotates, and the vibration plate 47 below the knocking frames 46 performs vibration knocking on the chips.

As shown in fig. 5, as a technical optimization scheme of the present invention, the transposition unit 5 includes a rotary table 51, brackets 52 are fixedly mounted on both sides of the upper surface of the rotary table 51, a lifting rod 53 is rotatably mounted in an internal thread of the bracket 52 on one side, a sliding rod is fixedly mounted in the bracket 52 on the other side, a cross frame 54 is rotatably mounted on the lifting rod 53 in a threaded manner, one end of the cross frame 54, which is far away from the lifting rod 53, is slidably connected with the sliding rod, an adjusting groove 55 is formed in the middle of the cross frame 54, and forward rotation and reverse rotation of the lifting rod 53 are used for driving lifting adjustment of the cross frame 54.

As a technical optimization scheme of the invention, a rotating rod 56 is rotatably installed on the middle part of an adjusting groove 55 through threads, a moving frame 57 is rotatably installed on the rotating rod 56 through threads, a displacement frame 58 is arranged in the middle part of the moving frame 57, two rotating plates 59 are installed on two sides in the moving frame 57 through electric sliders, a connecting rod is arranged between the two rotating plates 59 and is positioned in the displacement frame 58 to slide, the rotating rod 56 is rotated to control the horizontal displacement of the moving frame 57 on the rotating rod 56, the electric sliders are opened to drive the rotating plates 59 to rotate, and the displacement frame 58 is driven to rotate when the rotating plates 59 rotate, so that the clamping assembly is subsequently shifted, and a chip is moved into a 2127465.

As a technical optimization scheme of the invention, hanging plates 590 are fixedly arranged on two sides of the lower surface of the cross frame 54, cross rods 591 are arranged on two sides of the hanging plates 590 close to one side of the two sides in a sliding mode, sliding frames 592 are arranged on two sides of the cross rods 591 in a sliding mode, a balancing plate 594 is hinged to one end of the displacement frame 58, two sides of the balancing plate 594 are located in the sliding frames 592 in a sliding mode, a clamping assembly is fixedly arranged in the middle of the lower surface of the balancing plate 594, the displacement frame 58 drives the sliding frames 592 to slide up and down when rotating, and the displacement frame 58 moves up and down in the hanging plates 590 on two sides through the cross rods 591 so that the clamping assembly on one end of the displacement frame 58 can operate stably.

As shown in fig. 6, as a technical optimization scheme of the present invention, the clamping assembly includes a clamping frame 71, the top of the inner side of the clamping frame 71 is provided with two connecting members 72 through an electric slider, the connecting members 72 are provided with two pulling plates 73, the pulling plates 73 are provided with two pulling plates 73, one end of the pulling plate 73 on one side is rotatably connected with the clamping frame 71, the pulling plate 73 on the other side is rotatably provided with a special-shaped member 74, one side of the special-shaped member 74 is slidably connected with the clamping frame 71, the electric slider is opened to drive the connecting members 72 on both sides to approach each other for clamping both sides of the chip, and the connecting members 72 on both sides are far away from each other for placing the chip.

As a technical optimization scheme of the invention, an outer plate 75 is fixedly installed on the lower side of a special-shaped piece 74, a limiting rod 76 is slidably installed on the upper portion of the outer plate 75, a clamping plate 77 is fixedly installed at one end of the limiting rod 76, the middle portion of the lower side of the clamping plate 77 is of a through structure, a supporting plate 78 is rotatably installed on the lower side of the clamping plate 77, a rubber pad 79 is arranged on one side of the supporting plate 78, a spring is arranged between the supporting plate 78 and the outer plate 75, an electric push rod hinged with the outer plate 75 is arranged below the spring, one end of the electric push rod, far away from the outer plate 75, is hinged with the supporting plate 78, when connecting pieces 72 on two sides are close to each other, the clamping plate 77 clamps two sides of a chip, and then the electric push rod stretches forwards to drive the supporting plate 78 on two sides to support the bottom of the chip, so that the chip is prevented from falling off when the chip is moved into an extrusion unit 6.

As a technical optimization scheme of the invention, the extrusion unit 6 comprises a bottom plate 61, the bottom plate 61 is rotatably connected with the base 1 through an electric slider, a screw 62 is rotatably installed on the middle part of the upper surface of the bottom plate 61 through threads, a cylinder 63 is rotatably installed on the outer side of the screw 62 through threads, a 21274frame 65 is arranged on the outer side of the cylinder 63 along the axis thereof, splints 66 are slidably installed on the upper and lower sides in the 2127465, a spring is arranged between the splint 66 far away from one side and the 21274frame 65 on the two sides, one side of the splint 66 on the two sides is inclined, the electric slider is used for driving the bottom plate 61 to rotate, the bottom plate 61 rotates to enable the four 2127465 on the outer side of the cylinder 63 to sequentially move towards a clamping component, when the transposition unit 5 moves the clamped chip into the 2127465, the two splints 66 can rapidly clamp the chip up and down, and then extrusions on the two sides of the 2127465 squeeze the chip to detect whether the hardness of the chip is qualified.

As shown in fig. 1 to 13, as a technical optimization solution of the present invention, another object of the present invention is to provide a detection method for a translational automatic detection device of an integrated circuit chip, comprising the following steps:

s1: chip conveying:

the electric slider is started to drive the turning plate 25 to rotate, one end of the pushing frame 26 is driven to lift up when the turning plate 25 rotates, one end of the pushing frame 26 is driven to swing left and right when lifted upwards, the swing rod 28 swings left and right to enable the lifting plate 29 to lift upwards and push forwards, and when the lifting plate 29 rises and pushes forwards, the plurality of chips are sequentially translated and pushed forwards through the pushing frame 290 for conveying;

s2: chip simulation temperature rise:

when the turning plate 25 rotates, the driving wheel 34 is driven to rotate through the synchronizing shaft 33, the driving wheel 34 drives the driven wheel 35 to rotate through the belt 36, the driven wheel 35 drives the cam 37 to rotate when rotating, the cam 37 intermittently pushes the attaching wheel 38, the attaching wheel 38 drives the traction plate 32 to slide up and down, the traction plate 32 drives the sealing frame 390 to cover and seal the chip, and meanwhile, the heating plate in the sealing frame 390 simulates the chip to generate heat;

s3: vibration testing:

after the chip passes the heating test, the chip moves to the position below the knocking component 4, the driving motor 42 is started, the driving motor 42 drives the circular plate 43 to rotate, the circular plate 43 drives the driving shaft 44 to rotate when rotating, the driving shaft 44 drives the knocking frame 46 to slide up and down in the convex plate 45 when rotating, and the vibrating plate 47 is driven to carry out knocking vibration test on the chip when the knocking frame 46 slides up and down;

s4: and (3) hardness testing:

the clamping component clamps and fixes the chip, the transposition unit 5 displaces the chip to the extrusion unit 6, then the telescopic rod is opened to drive the clamping plate 66 to fix the two sides of the chip, the hardness of the chip is detected, and finally the chip is packaged and tested.

When the chip lifting mechanism is used, firstly, the electric slider is started to drive the turning plate 25 to rotate, the turning plate 25 drives one end of the pushing frame 26 to lift upwards when rotating, one end of the pushing frame 26 drives the swing rod 28 to swing left and right when lifting upwards, the swing rod 28 swings left and right to enable the lifting plate 29 to lift upwards and push forwards, and when the lifting plate 29 rises and pushes forwards, the plurality of chips are sequentially translated and pushed forwards through the pushing frame 290;

when the chips conveyed to the lower part of the heating unit 3 are simulated at high temperature, the driven wheel 35 drives the cam 37 to rotate when rotating, the cam 37 drives the attaching wheel 38 to lift intermittently when rotating, and the attaching wheel 38 drives the traction plate 32 to lift when lifting, so that the sealing frame 390 below is driven to be matched with the conveying unit 2 to heat the chips in sequence;

when the chip is moved to the position below the knocking assembly 4 by the conveying unit 2, the driving motor 42 is started to drive the circular plate 43 to rotate, the circular plate 43 drives the knocking frame 46 to slide up and down in the convex plate 45 through the driving shaft 44 when rotating, and the vibrating plate 47 below the knocking frame 46 performs a vibrating knocking test on the chip;

then, the clamping component sequentially clamps a plurality of chips into the v-shaped frame 65, and the extrusions on the two sides of the v-shaped frame 65 extrude the chips to detect whether the hardness of the chips is qualified or not, the extrusions are the prior art and are not described in detail, finally, the chips are subjected to packaging test, and the unqualified chips are removed.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.

Claims

1. The translation type automatic detection device for the integrated circuit chip comprises a base (1) and is characterized in that a conveying unit (2) is fixedly mounted on one side of the upper surface of the base (1), a transposition unit (5) is arranged in the middle of the upper surface of the base (1), an extrusion unit (6) is arranged on the other side of the upper surface of the base (1), a heating unit (3) is arranged in the middle of the upper surface of the conveying unit (2), a knocking assembly (4) is arranged on one side of the heating unit (3), and the knocking assembly (4) is connected with the conveying unit (2);

conveying unit (2) includes riser (21), riser (21) are equipped with two, the common fixed mounting in riser (21) upper portion of both sides has fixed plate (22), median groove (23) have transversely been seted up at fixed plate (22) middle part, the riser (21) of both sides are close to the equal fixed mounting in one side and have fixing base (24), fixing base (24) are equipped with a plurality ofly, fixing base (24) one side is through electronic slider fixed mounting and is turned over board (25), turn over board (25) one side and rotate and install propelling movement frame (26), fixing base (24) front side is equipped with side frame (27), propelling movement frame (26) are kept away from turning over board (25) one end and are rotated and are installed pendulum rod (28), pendulum rod (28) are kept away from propelling movement frame (26) one end and are rotated with side frame (27) one end and are connected, fixing base (24) top is rotated and is installed lifter plate (29), lifter plate (29) upper surface equidistance has been arranged and has been pushed away from frame (290), conveying unit (2) are used for carrying out the translation to a plurality of chips and carry.

2. The automatic translation detection device for the integrated circuit chip according to claim 1, wherein the temperature rise unit (3) comprises two connecting plates (31), the connecting plates (31) are fixedly connected with the vertical plate (21), two connecting plates (31) are provided, a traction plate (32) is slidably mounted on the upper surface of each connecting plate (31), a synchronizing shaft (33) is fixedly mounted at one end of the turning plate (25), the synchronizing shaft (33) penetrates through and rotates in the vertical plate (21), a driving wheel (34) is fixedly mounted at one end, away from the turning plate (25), of the synchronizing shaft (33), the connecting shaft is rotatably mounted on the outer side of the connecting plate (31) at one side, a driven wheel (35) is fixedly mounted on the connecting shaft, and the driving wheel (34) and the driven wheel (35) are driven through a belt (36);

follow driving wheel (35) one side and be equipped with cam (37), cam (37) and even axle fixed connection, cam (37) top is equipped with laminating wheel (38), laminating wheel (38) and traction plate (32) fixed connection, and traction plate (32) middle part screw rotates installs positioning lever (39), and positioning lever (39) lower extreme rotates installs closed frame (390), is equipped with the hot plate in closed frame (390) and is used for rising the temperature in the chip outside.

3. The automatic detection device of integrated circuit chip translation formula of claim 1, characterized in that strikes subassembly (4) and includes crane (41), crane (41) upper surface middle part fixed mounting has driving motor (42), driving motor (42) output end fixed mounting has plectane (43), plectane (43) one side fixed mounting has drive shaft (44), crane (41) one side bilateral symmetry fixed mounting has flange (45), slidable mounting has on flange (45) of both sides and strikes frame (46), drive shaft (44) are located and strike frame (46), strike frame (46) bottom fixed mounting and have vibrations board (47), vibrations board (47) are used for striking the chip of below and test.

4. The automatic translation detection device for the integrated circuit chip according to claim 1, wherein the transposition unit (5) comprises a rotary table (51), supports (52) are fixedly mounted on two sides of the upper surface of the rotary table (51), a lifting rod (53) is rotatably mounted in the inner thread of the support (52) on one side, a sliding rod is fixedly mounted in the support (52) on the other side, a cross frame (54) is rotatably mounted on the lifting rod (53) through the upper thread, one end, far away from the lifting rod (53), of the cross frame (54) is slidably connected with the sliding rod, and an adjusting groove (55) is formed in the middle of the cross frame (54).

5. The automatic translation detection device for the integrated circuit chip according to claim 4, wherein a rotating rod (56) is rotatably installed on a thread in the middle of the adjusting groove (55), a moving frame (57) is rotatably installed on the rotating rod (56) through a thread, a displacement frame (58) is arranged in the middle of the moving frame (57), two rotating plates (59) are installed on two sides in the moving frame (57) through electric sliders, two rotating plates (59) are arranged, a connecting rod is arranged between the two rotating plates (59), and the connecting rod is positioned in the displacement frame (58) and slides.

6. The automatic translation detection device for the integrated circuit chip according to claim 5, wherein hanging plates (590) are fixedly mounted on two sides of the lower surface of the cross frame (54), cross rods (591) are slidably mounted on two sides of the hanging plates (590) on two sides close to one side, carriages (592) are slidably mounted on two sides of the cross rods (591), a balance plate (594) is hinged to one end of the displacement frame (58), two sides of the balance plate (594) are located in the carriages (592) to slide, and a clamping assembly is fixedly mounted in the middle of the lower surface of the balance plate (594).

7. The automatic translation detection device for the integrated circuit chip according to claim 6, wherein the clamping assembly comprises a clamping frame (71), the top of the inner side of the clamping frame (71) is provided with two connecting pieces (72) through an electric slider, the connecting pieces (72) are provided with two pulling plates (73), the pulling plates (73) are rotatably mounted inside the connecting pieces (72), the two pulling plates (73) are provided, one end of the pulling plate (73) on one side is rotatably connected with the clamping frame (71), the pulling plate (73) on the other side is rotatably mounted with a special-shaped piece (74), and one side of the special-shaped piece (74) is slidably connected with the clamping frame (71).

8. The automatic translation detection device for the integrated circuit chip according to claim 7, wherein an outer plate (75) is fixedly mounted on the lower side of the special-shaped piece (74), a limiting rod (76) is slidably mounted on the upper portion of the outer plate (75), a clamping plate (77) is fixedly mounted at one end of the limiting rod (76), a through structure is arranged in the middle of the lower side of the clamping plate (77), a supporting plate (78) is rotatably mounted on the lower side of the clamping plate (77), a rubber pad (79) is arranged on one side of the supporting plate (78), a spring is arranged between the supporting plate (78) and the outer plate (75), an electric push rod hinged to the outer plate (75) is arranged below the spring, and one end, away from the outer plate (75), of the electric push rod is hinged to the supporting plate (78).

9. The automatic translation detection device for the integrated circuit chip according to claim 1, wherein the extrusion unit (6) comprises a bottom plate (61), the bottom plate (61) is rotatably connected with the base (1) through an electric slider, a screw (62) is rotatably mounted in the middle of the upper surface of the bottom plate (61) through a thread, a cylinder (63) is rotatably mounted in the outer side of the screw (62) through a thread, a v-21274type frame (65) is arranged on the outer side of the cylinder (63) along the axis of the cylinder, clamping plates (66) are slidably mounted on the upper side and the lower side of the v-21274type frame (65), a spring is arranged between the clamping plate (66) on the two sides away from one side and the v-21274type frame (65), and one side of the clamping plates (66) on the two sides is inclined.

10. A method for detecting a device for automatically detecting the translation of an ic chip, comprising the device for automatically detecting the translation of an ic chip as claimed in claim (9), wherein the method comprises the steps of:

s1: chip conveying:

the electric slider is started to drive the turning plate (25) to rotate, one end of the pushing frame (26) is driven to lift up when the turning plate (25) rotates, one end of the pushing frame (26) drives the swing rod (28) to swing left and right when lifting upwards, the swing rod (28) swings left and right to enable the lifting plate (29) to lift upwards and push forwards, and when the lifting plate (29) rises and pushes forwards, the plurality of chips are sequentially translated and pushed forwards through the pushing frame (290) for conveying;

s2: chip simulation temperature rise:

when the turning plate (25) rotates, the synchronous shaft (33) drives the driving wheel (34) to rotate, the driving wheel (34) drives the driven wheel (35) to rotate through the belt (36), the driven wheel (35) drives the cam (37) to rotate, the cam (37) intermittently pushes the attaching wheel (38), the attaching wheel (38) drives the traction plate (32) to slide up and down, the traction plate (32) drives the sealing frame (390) to cover and seal the chip, and meanwhile, the heating plate in the sealing frame (390) simulates the chip to heat;

s3: vibration testing:

the chip moves to the position below the knocking assembly (4) after passing a heating test, a driving motor (42) is started, the driving motor (42) drives a circular plate (43) to rotate, the circular plate (43) drives a driving shaft (44) to rotate when rotating, the driving shaft (44) drives a knocking frame (46) to slide up and down in a convex plate (45) when rotating, and the knocking frame (46) drives a vibration plate (47) to carry out knocking vibration test on the chip when sliding up and down;

s4: and (3) hardness testing:

the clamping assembly clamps and fixes the chip, the transposition unit (5) displaces the chip to the extrusion unit (6), then the telescopic rod is opened to drive the clamping plates (66) to fix the two sides of the chip, the hardness of the chip is detected, and finally the chip is packaged and tested.