CN116142100A

CN116142100A - Domain controller with condensation prevention structure

Info

Publication number: CN116142100A
Application number: CN202211558782.1A
Authority: CN
Inventors: 张勇; 毛潘泽; 饶银; 陈永豪; 张龙
Original assignee: Ningbo Junsheng Intelligent Automobile Technology Research Institute Co ltd
Current assignee: Ningbo Junsheng Intelligent Automobile Technology Research Institute Co ltd
Priority date: 2022-12-06
Filing date: 2022-12-06
Publication date: 2023-05-23

Abstract

The invention provides a domain controller with a condensation prevention structure, comprising: a housing; the chip is arranged in the shell; the temperature sensor is used for monitoring the temperature of the chip; a temperature and humidity sensor for detecting the temperature and humidity of the inner wall of the housing; the heating body is used for heating the shell; the processing module comprises a pre-stored enthalpy-humidity diagram, and is used for combining the data acquired by the temperature sensor and the temperature-humidity sensor with the enthalpy-humidity diagram to obtain the condensation temperature and judging whether the shell needs to be heated by a heating body according to the condensation temperature. The application adopts temperature sensor to detect the kernel temperature of chip to detect the temperature and the humidity of shell inner wall through temperature humidity sensor, and utilize the enthalpy wet graph to calculate the dew point temperature of shell, and calculate the temperature difference with the shell and judge whether the shell exists the condensation risk, local regional prevention condensation phenomenon of accessible heat-generating body heating.

Description

Domain controller with condensation prevention structure

Technical Field

The invention relates to the technical field of vehicle-mounted domain controllers, in particular to a domain controller with a condensation prevention structure.

Background

The automatic driving domain controller is responsible for realizing and controlling the automatic driving function of the automobile, and needs to have the receiving capability of image information, the processing and judging capability of the image information, the processing and calculating capability of data, the navigation and route planning capability, the judging and decision making capability of real-time conditions, and the algorithms of three layers of perception, decision making and control, so that the hardware requirements of the domain controller are higher and higher.

With the development of the autopilot function of L4 and above, the autopilot domain controller needs to adopt SoC chips with larger computation power to meet the demand of autopilot. Meanwhile, the thermal design of the autopilot domain controller becomes a problem to be solved in industry class urgently because the higher the power of the SoC is accompanied by the higher power.

In the current industry, in order to meet the requirement of durable and stable operation of the domain controller, liquid cooling is generally adopted to dissipate heat of the domain controller. Because SoC is the main heat source temperature is higher, and the coolant is lower in order to play an effective cooling effect. There are two temperature extremes inside the autopilot controller. When the temperature of the SoC and the liquid cooling temperature reach a certain temperature difference, condensation is easily formed in the automatic driving domain controller under a certain environmental humidity, and the risk that condensation gathers to form water drops which fall on a PCB to burn out devices exists.

Based on the above technical problems, the inventors propose a domain controller with a condensation prevention structure to solve the above technical problems.

Disclosure of Invention

The invention solves the technical problems that when the temperature of the SoC and the liquid cooling temperature reach a certain temperature difference, condensation is easy to form in the automatic driving domain controller under a certain environmental humidity, and the risk that condensation gathers to form water drops which fall on a PCB to burn out devices exists.

In order to solve the above problems, the present invention provides a domain controller having a condensation preventing structure, comprising: a housing; the chip is arranged in the shell; the temperature sensor is used for monitoring the temperature of the chip; a temperature and humidity sensor for detecting the temperature and humidity of the inner wall of the housing; the heating body is used for heating the shell; the processing module comprises a pre-stored enthalpy-humidity diagram, and is used for combining the data acquired by the temperature sensor and the temperature-humidity sensor with the enthalpy-humidity diagram to obtain the condensation temperature and judging whether the shell needs to be heated by a heating body according to the condensation temperature.

Compared with the prior art, the technical effect that adopts this scheme can reach: the application adopts temperature sensor to detect the kernel temperature of chip to detect the temperature and the humidity of shell inner wall through temperature humidity sensor, and utilize the enthalpy-humidity diagram to calculate the dew point temperature of shell, and calculate the temperature difference with the shell and judge whether the shell exists the condensation risk, accessible heat-generating body heating local area prevention condensation phenomenon has solved the problem among the prior art.

In this embodiment, the water cooling chamber includes: a water inlet cavity provided with a water inlet; the water outlet cavity is provided with a water outlet; the water outlet cavity is communicated with the water inlet cavity; and the outer wall of the water inlet cavity is provided with at least one chip radiating surface.

The technical effect after this technical scheme of adoption is, rivers can dispel the heat the cooling to the chip in the shell, through passing through the cooling water into the water cavity to take away the heat in the chip from rivers through chip cooling surface, in order to make the cooling water play the radiating effect to the chip.

In this embodiment, a heat dissipation fin is disposed on the inner side corresponding to the heat dissipation surface of the chip.

The technical effect after adopting this technical scheme is, radiating area can be increased in radiating fin's effect, and the water-cooling liquid flows the radiating fin and takes away the heat on the radiating fin and then flows outside to the domain controller.

In this embodiment, the heating element is fixedly connected to the inner wall of the housing; the heating element is attached with a temperature and humidity sensor, the inner wall of the shell is provided with a groove for installing the temperature and humidity sensor, and a plurality of isolating grooves are formed in the position, close to the groove, of the shell.

Adopt the technical effect behind this technical scheme to, the inner wall at the shell is installed to fixed mode such as heat-generating body accessible double faced adhesive tape, and the temperature humidity transducer on the heat-generating body can monitor the temperature and the humidity of shell inner wall, and set up the recess of temperature humidity transducer installation on the shell inner wall so that temperature humidity transducer installation space, the setting up of isolation groove is isolated heat-generating body and is produced when heating the casing heat transfer to the recess surface to influence temperature humidity transducer to the temperature measurement of outer wall surface.

In this embodiment, ventilation holes for exhausting the humid air from the back of the temperature and humidity sensor to the front of the temperature and humidity sensor are provided around the temperature and humidity sensor.

The technical effect after adopting this technical scheme is, and humid air can pass through bleeder vent to temperature humidity transducer's front from temperature humidity transducer's back, guarantees that temperature humidity transducer detects the humidity accuracy.

In this embodiment, the chip includes: a PCB board; and the PCB is electrically connected with the connector.

The technical effect after adopting this technical scheme is, and the chip can adopt PCB board and connector to constitute, through the electric connection between connector and the PCB board to make the chip normal operating.

In this embodiment, the side surface of the heating element extends to have the flexible connection section, and the flexible connection section is electrically connected with the connector.

The technical effect after the technical scheme is adopted is that the heating element can be electrically connected with the connector through the wiring of the flexible connecting section, so that the chip can control the heating element to heat.

In this embodiment, the heating element is provided with a positive electrode heating wire and a negative electrode heating wire, which are made of metal foil or metal wire.

The technical effect after adopting this technical scheme is, can realize the heating to the heat-generating body through anodal heater strip and negative pole heater strip, anodal heater strip and negative pole heater strip can adopt foil, wire to make, and the wire has good heat conduction effect for the heating effect is better.

In this embodiment, the heating element includes one or more of PI heating film, PET heating sheet, and silica gel heating sheet.

The technical effect after the technical scheme is adopted is that the heating body can comprise one or more of a heating film, a PET heating sheet and a silica gel heating sheet, and the heating material can adopt a metal wire heating mode to heat and generate heat so as to prevent the condensation phenomenon.

In this embodiment, the heating element is fixedly connected to the flat area far away from the heat dissipation surface of the chip and located in the housing and close to the water cooling cavity.

The technical effect after adopting this technical scheme is, in the flat area that just is close to the water cooling chamber of shell, and its probability that appears the condensation phenomenon is higher, can heat this area with the heat-generating body setting in this area, reducible condensation phenomenon that this area appears.

Drawings

FIG. 1 is a partial view of a domain controller having a condensation prevention structure according to the present invention;

FIG. 2 is a partial 3D view of a domain controller with condensation prevention structure according to the present invention;

FIG. 3 is a partial cross-sectional view of a domain controller having a condensation prevention structure according to the present invention;

FIG. 4 is a cross-sectional view of a heating element and a flexible connection section of the present invention;

FIG. 5 is a top view and a partial enlarged view of the temperature and humidity sensor of the present invention;

FIG. 6 is a partial view of the wiring of the temperature and humidity sensor and the heating element of the invention;

fig. 7 is an exploded view of a domain controller having a condensation preventing structure according to the present invention.

Reference numerals illustrate: 110. a housing; 111. a water pipe joint; 112. a water cooling cavity; 113. a chip heat dissipation surface; 114. an inner wall of the housing; 115. a groove; 116. a partition groove; 121. a temperature and humidity sensor; 122. a heating element; 123. a flexible connection section; 124. double faced adhesive tape; 125. ventilation holes; 300. a PCB board; 302. a connector; 401. a positive electrode heating wire; 402. a negative electrode heating wire; 403. wiring a temperature and humidity sensor; 500. a domain controller; 1131. a first chip heat dissipation surface 1132 and a second chip heat dissipation surface; 1121. a water inlet cavity; 1122. and a water outlet cavity.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

In order to solve the problems in the prior art, the following three ways are available to alleviate the problems in the prior art:

the first mode adopts the coating multilayer protection paint on the PCB of chip, and multilayer protection paint is equivalent to having covered one deck protective layer for the PCB panel for isolated PCB and outside steam can slow down the condensation phenomenon, but because the protection paint has very strong stickness, the solidification is difficult to clear away, needs to repair the PCB when so, then can't carry out the operation of repairing.

The second mode is based on the first mode, and the temperature and flow rate of the water-cooling liquid are increased. The purpose of increasing the temperature of the water cooling liquid is to ensure that the temperature difference between the temperature of the water cooling liquid and the temperature of the SoC chip is always smaller than the condensation temperature, thereby achieving the purpose of controlling the condensation to a certain extent. The heat dissipation efficiency of SoC is improved by increasing the water cooling flow rate.

However, the following problems still exist in the present method: 1. increasing the temperature of the water-cooling liquid can lead to the reduction of heat dissipation efficiency of the SoC chip position, and is not in line with the popularization of SoCs with larger power in the future.

2. Also, the increase in water cooling flow rate increases the performance requirements of the water pump. And the water cooling system consumes more power, which is against the energy-saving large environment.

Third mode: the automatic driving domain controller is sealed, and the sealing ring, the ventilation valve, the three-proofing external connector, the vacuum pumping of the internal gas of the domain controller and other embodiments are arranged. The condensation is prevented by isolating the outside humid air from entering the inside of the domain controller.

However, the following problems still exist in the present method: 1: the sealing design of the domain controller needs to be added with a sealing ring and a ventilation valve, a three-proofing connector is selected, the cost of the whole machine is increased relatively more, and the three-proofing connector has few selectable types in the current automobile industry, so that the three-proofing connector is not beneficial to mass popularization. 2: the domain controller has a harsh use environment, high temperature and high humidity and a high risk of sealing failure in a vibration environment. 3: the parts need higher dimensional processing precision to meet the sealing design requirement of the domain controller, the part processing difficulty is increased, and the production test cost is indirectly increased.

A domain controller 500 with a condensation prevention structure, as shown in fig. 1-7, is described in the domain controller 500, comprising: a housing 110; a chip disposed within the housing 110; the temperature sensor is used for monitoring the temperature of the chip; a temperature and humidity sensor 121 for detecting the temperature and humidity of the inner wall of the housing 110; a heating body 122 for heating the housing 110; the processing module includes a pre-stored psychrometric chart, and is configured to combine the data collected by the temperature sensor and the temperature and humidity sensor 121 with the psychrometric chart to obtain a condensation temperature, and determine whether the heating element 122 is needed to heat the housing 110 according to the condensation temperature.

The housing 110 is preferably an aluminum alloy housing 110, and the material used for the housing 110 in the prior art is usually aluminum alloy, so that the heat transfer effect is good. The chip is an SoC chip, is a brain of the domain controller 500, is responsible for realizing and controlling an automatic driving function of the automobile, and is not described herein in detail.

The temperature sensor (not shown in the figure) can be arranged near the chip and connected by adopting wires, can detect the core temperature of the chip, and is used for detecting the temperature of the chip in real time, so that when the temperature of the chip is calculated later, the temperature of the chip can be detected to be combined with the temperature and the humidity of the inner wall 114 of the shell, the dew point temperature of the shell 110 can be calculated, and the dew condensation risk of the areas can be calculated through the temperature difference between the dew point temperature and the temperature of the inner wall 114 of the shell.

The temperature and humidity sensor 121 is configured to detect the temperature and humidity of the inner wall 114 of the casing, so that the dew point temperature can be conveniently calculated through a psychrometric chart, where the psychrometric chart is a chart showing the relationship between various parameters of air, and the dew point temperature is a temperature called a dew point temperature when the air is cooled to reach saturation under the condition that the water vapor content in the air is unchanged and the air pressure is kept constant. The dew point temperature is calculated by detecting the temperature and humidity of the housing inner wall 114 and using the psychrometric chart as described above. Then, the condensation is likely to occur in the region where the difference between the temperature of the inner wall 114 of the case and the temperature of the core exceeds the dew point temperature, and the condensation can be eliminated by locally heating the region by the heating element 122.

The processing module is a part of the chip and comprises a pre-stored enthalpy-humidity diagram, and is used for combining the data acquired by the temperature sensor and the temperature-humidity sensor 121 with the enthalpy-humidity diagram to obtain a condensation temperature, and judging whether the heating element 122 is needed to heat the shell 110 according to the condensation temperature.

Preferably, the water cooling chamber 112 includes: a water inlet 1121 provided with a water inlet; a water outlet chamber 1122 provided with a water outlet; the water outlet cavity 1122 is communicated with the water inlet cavity 1121; at least one chip radiating surface is arranged on the outer wall of the water inlet cavity 1121.

As shown in fig. 7, the water cooling chamber 112 is generally U-shaped, the water inlet 1121 is a straight line portion in the U-shape, the water inlet is disposed on the housing 110, so that the cooling water flows through the water inlet, the water outlet 1122 is a straight line portion in the U-shape, and the water outlet is disposed on the housing 110, so that the cooling water flows out of the housing 110 through the water outlet. And delivery port and water inlet set up the same side on shell 110, all set up water pipe joint 111 on water inlet and the delivery port, be provided with two chip cooling surfaces on the water inlet 1121 outer wall, including first chip cooling surface 1131 is close to water inlet and delivery port setting, and second chip cooling surface 1132 keeps away from water inlet and delivery port and is close to the bight of U type water-cooling chamber 112, and two chip cooling surfaces all laminate into water cavity 1121 outer wall surface, can take away the heat of chip through the chip cooling surface to guarantee its radiating effect. In order to improve the heat dissipation capability of the SoC chip heat dissipation surface, the most direct method is to improve the flow rate and temperature of the water cooling liquid in the water cooling cavity 112, the performance of the water pump and the actual heat exchange efficiency of the flow rate are not obviously improved, and the heat dissipation efficiency of the SoC chip heat dissipation surface can be effectively improved by adjusting the temperature of the water cooling liquid.

The SoC chip cooling surface is the primary heat source location on the aluminum alloy housing 110. When the temperature of the water cooling liquid in the water cooling cavity 112 is reduced, the surface temperature of the aluminum alloy housing 110 away from the heat dissipation surface of the SoC chip is also reduced. Thus exacerbating the temperature differential across the aluminum alloy housing 110. When the temperature difference of the aluminum alloy housing 110 is large in a certain humidity environment, the cold area is very easy to be lower than the condensation temperature, so that the condensation phenomenon occurs. ( Cold zone position: 1. refers to a region which is far away from a heat source and is difficult to transmit the temperature of the heat source; 2. the water cooling liquid is typically below the average temperature of the aluminum alloy housing 110 around the water cooling chamber 112 flow path. )

Preferably, the inner side corresponding to the heat radiating surface of the chip is provided with a heat radiating fin.

The inner sides of the two chip radiating surfaces are provided with radiating fins, so that the radiating efficiency of the chip radiating surfaces can be effectively improved through the action of the radiating fins, and the radiating effect is improved.

Preferably, the heating element 122 is fixedly connected to the inner wall 114 of the housing; the heating element 122 is attached with a temperature and humidity sensor 121, the inner wall 114 of the housing is provided with a groove 115 for installing the temperature and humidity sensor 121, and the housing 110 is provided with a plurality of isolating grooves 116 at positions close to the groove 115.

The heating element 122 is fixed on the inner wall 114 of the casing, the heating element 122 is preferably fixed on the inner wall 114 of the casing 110 by a double faced adhesive tape 124, the double faced adhesive tape 124 is made of foam rubber or VHB rubber material which is resistant to high temperature and moisture and firmly adhered to the surface of the aluminum alloy casing 110, and the purpose that the heating element 122 is fixed on the inner wall 114 of the casing can be achieved by adopting a fixing screw, a fixing pressing sheet and a fixing bracket instead of the double faced adhesive tape 124. The SMT patch on the heat-generating body 122 has a temperature and humidity sensor 121, and the temperature and humidity of the inner wall 114 of the case can be detected by the temperature and humidity sensor 121, and in order to provide an installation space for the temperature and humidity sensor 121, the inner wall 114 of the case is provided with a groove 115, and the temperature and humidity sensor 121 is installed in the groove 115 to complete the installation. In addition, in order to ensure that the measurement accuracy of the temperature and humidity sensor 121 is not affected when the heating element 122 heats the local position of the case 110, a plurality of isolation grooves 116 are provided around the groove 115, and the heat generated when the heating element 122 heats the aluminum alloy case 110 is isolated by the action of the isolation grooves 116 and transferred to the surface of the groove 115, so that the measurement of the surface temperature of the aluminum alloy case 110 before heating by the temperature and humidity sensor 121 is affected.

Preferably, ventilation holes 125 for passing the humid air from the back of the temperature and humidity sensor 121 to the front of the temperature and humidity sensor 121 are provided around the temperature and humidity sensor 121.

In order to ensure that the humidity of the inner surface of the aluminum alloy housing 110 can be accurately measured, ventilation holes 125 are formed in the periphery of the temperature and humidity sensor 121, and the ventilation holes 125 are formed so that the humid air can pass from the back surface of the temperature and humidity sensor 121 to the front surface of the temperature and humidity sensor 121, so that the humidity of the surface of the aluminum alloy housing 110 can be accurately measured, and the accuracy of data is ensured.

Preferably, the chip includes: a PCB 300; and a connector 302, wherein the PCB 300 is electrically connected with the connector 302.

The chip can be composed of the PCB 300 and the connector 302, and the chip can be normally operated by the electric connection between the connector 302 and the PCB 300, the connector 302 is used for connecting wires to electrically connect the temperature and humidity sensor 121 with the chip through the wires, and wires are also connected between the connector 302 and the heating plate for electrically connecting the heating plate with the chip.

Preferably, the flexible connection section 123 extends from a side surface of the heating element 122, and the flexible connection section 123 is electrically connected to the connector 302.

The side surface of the heating body 122 is extended with or bent with a flexible connection section 123, and the flexible connection section 123 is a flexible circuit board for wiring of a circuit, so that the heating body 122 is electrically connected with the connector 302 through the flexible circuit board. And the temperature and humidity sensor wiring 403 is also connected to the flexible connection section 123 through the heating element 122 and transmitted to the connector 302, wherein the flexible circuit board can be replaced by a flexible flat cable, the corresponding flexible circuit connector 302 is replaced by a flexible flat cable connector 302, and the flexible connection section 123 can be used for power supply of the heating element 122 and signal transmission of the temperature and humidity sensor 121.

Preferably, the heating element 122 is provided with a positive electrode heating wire 401 and a negative electrode heating wire 402, and the positive electrode heating wire 401 and the negative electrode heating wire 402 are made of metal foil or metal wire.

Because the wiring of the temperature and humidity sensor 121 is also connected to the flexible connection section 123, in order to avoid that heat on the heating wire is directly transferred to the temperature and humidity sensor 121, a certain safety space is reserved between the temperature and humidity sensor 121 and the anode and cathode heating wire 402, and mutual noninterference between the heating wire and the temperature and humidity sensor 121 is ensured. The positive electrode heating wire 401 and the negative electrode heating wire 402 arranged on the heating body 122 are important heating areas, and the actual wiring can be adjusted according to the heating efficiency. The placement position of the heating element 122 is based on the data of the CAE condensation analysis by the domain controller 500, and the heating element 122 is set at a position with a high probability of occurrence of condensation based on the CAE condensation analysis data. The status of the heater 122 is not particularly limited, and in practice the status of the heater 122 may be adjusted according to the area of the condensation surface and the potential high risk condensation point in the domain controller 500.

Preferably, the heating element 122 includes one or more of PI heating film, PET heating sheet, and silica gel heating sheet.

When the heating material is adopted to control the chip to heat the heating body 122, the heating body 122 can heat the shell so as to reduce the occurrence of condensation phenomenon.

Preferably, the heating element 122 is fixedly connected to the flat area of the housing 110 away from the heat dissipation surface of the chip and is close to the water cooling cavity 112.

The heating element 122 is typically disposed in a flat area of the aluminum alloy housing 110 away from the heat dissipation surface of the SoC chip, and as close to the water cooling chamber 112 as possible. Under the action of atmospheric pressure and under the condition that the PCB 300 generates heat, the humid air is generally collected toward the top, so the loading of the domain controller 500 is prevented as horizontally as possible, and the aluminum alloy housing 110 is located at the top of the domain controller 500.

The principle of the invention is as follows: 1) Before the domain controller 500 leaves the factory, a calculation formula for processing an enthalpy-humidity diagram, a temperature resistant temperature T (chip temperature resistant temperature) of normal operation of an SoC chip and the processing module on the PCB 300 is recorded in the processing module;

2) The domain controller 500 works normally, firstly, a temperature sensor is adopted to detect the core temperature of the SoC chip, and the acquired data is T (core temperature);

3) The temperature and humidity sensor 121 detects a case temperature (T case temperature) of a case surface of the aluminum alloy case 110 and an ambient humidity% RH;

4) Then, the collected T (core temperature), T (shell temperature) and%rh (humidity) are transmitted to the processing module on the PCB 300 in real time.

6) The processing unit on the PCB 300 calculates the condensation temperature T (condensation temperature) of the aluminum alloy housing 110 according to the received T (housing temperature),% RH (humidity) combined with the pre-stored enthalpy-humidity map of the processing module. It is determined whether or not the aluminum alloy housing 110 needs to be heat-treated based on the calculated condensation temperature T (condensation temperature).

7) When the environmental data meets the following conditions, the processing module sends out a control instruction to the corresponding countermeasure measures:

8) When T (case temperature) > T (dew condensation temperature), the heating element 122 does not operate;

9) When T (case temperature) < T (dew condensation temperature) and T (core temperature) < T (chip temperature resistance temperature), the heat generating body 122 operates;

10 When T (shell temperature) is less than T (dew temperature) and T (core temperature) is more than or equal to T (chip temperature resistance temperature), the heating body 122 adjusts the heating parameters to heat until T (core temperature) is less than T (chip temperature resistance temperature) and then the chip temperature resistance temperature is operated again.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims

1. A domain controller having a condensation prevention structure, the domain controller comprising: a housing (110);

a chip disposed within the housing (110);

a temperature sensor for monitoring the temperature of the chip;

a temperature and humidity sensor (121) for detecting the temperature and humidity of the inner wall of the housing (110);

a heating element (122) for heating the housing (110);

the processing module comprises a pre-stored enthalpy-humidity diagram, and is used for combining data acquired by the temperature sensor and the temperature-humidity sensor (121) with the enthalpy-humidity diagram to obtain a condensation temperature, and judging whether a heating body (122) is needed to heat the shell (110) according to the condensation temperature.

2. The domain controller with condensation preventing structure according to claim 1, wherein the water cooling chamber (112) comprises:

a water inlet cavity (1121) provided with a water inlet;

a water outlet cavity (1122) provided with a water outlet; the water outlet cavity (1122) is communicated with the water inlet cavity (1121); at least one chip radiating surface (113) is arranged on the outer wall of the water inlet cavity (1121).

3. Domain controller with condensation preventing structure according to claim 2, characterized in that the inner side of the chip cooling surface (113) is provided with cooling fins.

4. The domain controller with condensation preventing structure according to claim 1, wherein the heating body (122) is fixedly connected to the housing inner wall (114); the heating element (122) is attached with a temperature and humidity sensor (121), the inner wall (114) of the shell is provided with a groove (115) for installing the temperature and humidity sensor (121), and a plurality of isolating grooves (116) are formed in the position, close to the groove (115), of the shell (110).

5. The domain controller with condensation preventing structure according to claim 1, wherein ventilation holes (125) for guiding the humid air from the back of the temperature humidity sensor to the front of the temperature humidity sensor (121) are provided around the temperature humidity sensor (121).

6. The domain controller with condensation preventing structure according to claim 1, wherein the chip comprises:

a PCB (300);

-a connector (302), the PCB board (300) being electrically connected to the connector (302).

7. The domain controller with condensation preventing structure according to claim 6, wherein the side of the heating body (122) is extended with the flexible connection section (123), and the flexible connection section (123) is electrically connected with the connector (302).

8. Domain controller with condensation preventing structure according to claim 1, characterized in that the heating body (122) is arranged with a positive heating wire (401) and a negative heating wire (402), the positive heating wire (401) and the negative heating wire (402) being made of metal foil or metal wire.

9. The domain controller with condensation preventing structure according to claim 7, wherein the heat generating body (122) comprises one or more of PI heat generating film, PET heat generating sheet, silicone heat generating sheet.

10. The domain controller with condensation preventing structure according to claim 4, wherein the heat generating body (122) is fixedly connected to the flat area away from the chip heat dissipating surface (113) and located in the housing (110) and close to the water cooling cavity (112).