JP2007263636A - Temperature measuring instrument and temperature monitoring method for electronic equipment unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inexpensively and accurately measure an air temperature in the periphery of a printed circuit board, and to monitor and control a temperature of an electronic equipment unit with multidirectional mounted directions. <P>SOLUTION: A device type temperature sensor 5 is mounted on the printed board 4 of the electronic equipment unit, and a notched groove 4c is provided in the periphery of a portion mounted with the temperature sensor 5 of the printed circuit board 4 to remain an area 4b for passing a wiring pattern for connecting the temperature sensor 5 to a circuit formed in the printed circuit board 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a temperature measuring device and a temperature monitoring method for an electronic device unit.

  In an electronic device unit, a temperature sensor may be mounted on a printed board mounted therein for temperature monitoring and temperature control. FIG. 7 shows an example of a temperature measuring apparatus for a conventional electronic device unit. Reference numeral 1 denotes a temperature sensor fixed inside the unit. A connector 3 is connected to the temperature sensor 1 via a wiring 2, and the connector 3 is printed. It is connected to a connection terminal 4 a provided on the plate 4. In this example, since the temperature sensor 1 is connected to the printed board 4 via the wiring 2, the heat of the printed board 4 is not transmitted to the temperature sensor 1 by heat conduction, and the temperature sensor 1 indicates the ambient air temperature. It can be measured accurately. 8A and 8B show a plan view of the device type temperature sensor 5 and a state in which the temperature sensor 5 is mounted on the printed board 4. The device type temperature sensor has a surface mount type in addition to a DIP shape. In either case, it is mounted directly on the printed board 4. Since the temperature sensor 5 is directly mounted on the printed board 4, the temperature of the printed board 4 is transmitted to the temperature sensor 5 by heat conduction, and the measured temperature of the temperature sensor 5 is a temperature determined by the temperature of the printed board 4 and the ambient air temperature. It becomes. In particular, when the SMD component is mounted on the printed board 4 of the naturally air-cooled unit, the temperature of the SMD component becomes almost equal to the temperature of the printed board 4, so that the temperature of the printed board 4 can be easily measured.

  On the other hand, in the temperature monitoring of the natural air-cooled electronic device unit, the mounting position of the temperature sensor and the monitoring target are performed as follows. First, when a temperature sensor is attached to a specific part such as a part that generates heat locally or the most important device in the system (for example, a CPU processor), the monitoring target is a specific part temperature. In this case, the entire unit cannot be monitored. The target parts are monitored with high accuracy. Next, when the temperature sensor is attached to the unit intake section, the unit intake (ambient) temperature becomes a monitoring target, and the measurement result is evaluated by a determination value based on the temperature specification of the unit. That is, since it is determined that the temperature of each component when the unit reaches the maximum load is always within the allowable range, safe monitoring is possible. On the other hand, even though the load is small and the internal temperature is low, it may be determined that the intake (ambient) temperature is high and that it is not acceptable. Next, when a temperature sensor is attached to the unit exhaust section, the unit exhaust (internal) temperature will be monitored, and judgment will be made at a temperature obtained by adding the intake (ambient) temperature to the unit load. It can be used in an ambient temperature environment. That is, FIG. 9 shows the relationship between the unit load and the unit allowable ambient temperature, the part a is the allowable range when judged only by the intake tail temperature, and the part b is the allowable range corresponding to the unit load. The smaller the load, the higher the allowable ambient temperature of the unit. However, when the unit exhaust temperature is monitored, local heating parts cannot be monitored.

Technical literature information relating to the invention of this application includes the following.
JP-A-8-63237 JP 2000-124367 A

  In the conventional temperature measuring device for an electronic device unit shown in FIG. 7, the temperature sensor 1 is connected to the printed board 4 by the connector 3, so that the number of assembling steps increases and the cost increases. Moreover, the mounting structure of the temperature sensor 1 becomes large, so that it cannot be mounted in a narrow place, and even when the mounting is possible, the convection of heat is inhibited. Although it is suitable for measuring the ambient air temperature, in order to measure the surface temperature of the printed board 4, it is necessary to devise the mounting structure of the temperature sensor 1, and it is difficult to measure with high accuracy. Met. On the other hand, as shown in FIG. 8, when the device-type temperature sensor 5 is used, it can be mechanically mounted in the same manner as other components, and the unit unit price is reduced. Since 5 is on the printed board 4, the ambient air temperature could not be measured. In particular, when a highly heat-generating component is mounted in the vicinity, it is impossible to measure the ambient air temperature because it is greatly affected by heat from heat conduction from the component.

  Further, in the above-described conventional temperature monitoring method for an electronic device unit, when the mounting direction of a naturally air-cooled electronic device unit is multi-directional, the temperature measured by the temperature sensor varies depending on the direction, and the temperature is measured by measuring the temperature of a specific component. It was only possible to monitor and control, and it was impossible to monitor and control the temperature of the entire components in the unit.

  The present invention has been made to solve the above-described problems, and can monitor the temperature of a natural air cooling unit in which the ambient air temperature can be measured inexpensively and accurately and the mounting direction is multidirectional. It is an object of the present invention to obtain a temperature measuring device and a temperature monitoring method for an electronic device unit that can be controlled.

  According to a first aspect of the present invention, there is provided a temperature measuring apparatus for an electronic device unit, in which a device type temperature sensor is mounted on a printed board of the electronic device unit, and the temperature sensor and the print are mounted around a portion of the printed board on which the temperature sensor is mounted. A notch groove is provided leaving an area through which a wiring pattern connecting the circuit formed on the board passes.

  According to a second aspect of the present invention, there is provided a temperature measuring apparatus for an electronic device unit, in which an extended portion of the printed board is provided on the intake side or the exhaust side of the printed board of the electronic device unit, and a device type temperature sensor is mounted on the extended portion. And the connection part between the extension part and the extension part is an area through which a wiring pattern connecting the temperature sensor and a circuit formed on the printed board passes only.

  According to a third aspect of the present invention, there is provided a temperature measuring apparatus for an electronic device unit, in which a device type temperature sensor is mounted on a small printed board manufactured together with a main printed board of the electronic device unit, and the small printed board is connected to the main printed board through leads. Is implemented.

  According to a fourth aspect of the present invention, there is provided a temperature monitoring method for an electronic device unit in which a temperature sensor is provided on each of one side and the other side of a printed board mounted in the electronic device unit, and the temperature difference between the one side and the other side. Is positive, negative, or nearly zero, and it is determined whether one side is the vertical mounting on the upper exhaust side or the other side is the vertical mounting or horizontal mounting on the upper exhaust side, and the exhaust side temperature in each mounting direction is It is determined that the electronic device unit is within the allowable temperature range because the absolute value of the temperature difference is lower than the maximum allowable temperature rise value when the vertical mounting is lower than the maximum allowable exhaust temperature set for each mounting direction. To do.

  As described above, according to the first aspect of the present invention, an area through which the wiring pattern connecting the temperature sensor and the circuit formed on the printed board passes is left around the portion of the printed board on which the temperature sensor is mounted. A notch groove is formed, which increases the thermal resistance between the printed board and the part where the temperature sensor is mounted, making the temperature sensor less susceptible to heat from highly heated components mounted on the printed board. The ambient air temperature can be measured accurately. Further, a device type sensor is used as the temperature sensor, which can be mounted on a machine and can be made inexpensive.

  According to the second aspect of the present invention, only the wiring pattern connecting the temperature sensor and the circuit formed on the printed board passes through the connecting portion between the printed board and the extended portion provided on the intake side or the exhaust side. Because it is an area, the thermal resistance between the printed board and its extended part increases, and the temperature sensor is less susceptible to the heat of components mounted on the printed board, and the ambient air temperature must be measured accurately. Can do. In addition, since a device type temperature sensor is used, it can be made inexpensive. Furthermore, when the temperature sensor is provided in the extended portion on the intake side, the temperature sensor can be provided on the windward side of the heat generating component, and the influence of the heat of the heat generating component can be further avoided. In addition, when the temperature sensor is provided in the extended part on the exhaust side, the temperature sensor is provided on the leeward side of the heat generating component. Not affected.

  According to the third aspect, since the small printed board is mounted on the main printed board via the elongated lead wire, the thermal resistance between the temperature sensor mounted on the small printed board and the main printed board is increased, and the temperature sensor Is less susceptible to the heat of components mounted on the main printed circuit board, and the ambient air temperature can be accurately measured. In addition, since a device type temperature sensor is used, it can be made inexpensive.

  According to the fourth aspect of the present invention, the temperature sensor is provided on each of the one side and the other side of the printed board mounted in the electronic device unit, and printing is performed depending on whether the temperature difference between the temperature sensors is positive, negative, or substantially zero. Determine the mounting direction of the board, determine that the temperature in the electronic device unit is within the allowable temperature by the exhaust side temperature in each mounting direction being lower than the maximum allowable exhaust temperature set for each mounting direction, Further, in the case of vertical mounting, the internal mounting abnormality or operation abnormality is determined by the absolute value of the measured temperature difference of each temperature sensor being smaller than the maximum allowable temperature rise value. Therefore, when the mountable directions are multi-directional, the mounting direction is determined, the exhaust side temperature is lower than the maximum allowable exhaust temperature for each mounting direction, and the absolute value of the measured temperature difference is the maximum allowable temperature for vertical mounting. By being smaller than the increase value, it can be determined that the inside of the electronic device unit is within the allowable range in terms of temperature.

Best Embodiment 1
The best mode for carrying out the present invention will be described below with reference to the drawings. 1A and 1B are a plan view and an enlarged view of a main part of a temperature measuring device for an electronic device unit according to Embodiment 1 of the present invention, and a mounting component 6 is mounted on a printed board 4, A device type temperature sensor 5 is mounted. The printed circuit board 4 is formed with a wiring pattern for connecting the mounting component 6 and the temperature sensor 5, thereby forming a circuit. A cutout groove 4c is formed around a portion of the printed board 4 where the temperature sensor 5 is mounted, leaving an area 4b through which a wiring pattern connecting the temperature sensor 5 and a circuit formed on the printed board 4 passes.

  In the first embodiment, a cutout is left around the portion of the printed board 4 where the temperature sensor 5 is mounted, leaving an area 4b through which a wiring pattern connecting the temperature sensor 5 and a circuit formed on the printed board 4 passes. Since the groove 4c is formed, the thermal resistance between the printed board 4 and the portion where the temperature sensor 5 is mounted becomes very large, and even if a high heat-generating component is mounted in the vicinity, the heat conduction from the component The air temperature around the temperature sensor 5 can be measured with high accuracy. Moreover, the device-type temperature sensor 5 can be mounted on a machine and can be made inexpensive. Therefore, the air temperature in the unit can be accurately measured at a low cost. Further, the temperature sensor 5 need only be mounted on the printed board 4, and the mounting structure is simple, small and inexpensive. Furthermore, no wiring is required and there is no factor of ventilation resistance, and stable and highly accurate measurement is possible, and mounting is possible even in a narrow space. Even if high heat-generating parts are mounted in the surrounding area, the influence of heat of the high heat-generating parts can be avoided by providing the temperature sensor 5 on the windward side.

Embodiment 2
FIG. 2 is a plan view of a temperature measuring device for an electronic device unit according to Embodiment 2 of the present invention. A mounting component 6 is mounted on the printed board 4 in the electronic device unit 7 and the intake side of the printed board 4 or The extended portions 4d and 4e of the printed board 4 are provided on the exhaust side, and the device type temperature sensor 5 is mounted on the extended portions 4d and 4e. Further, the connection parts 4f and 4g between the printed board 4 and the extended parts 4d and 4e are areas through which the wiring pattern connecting the temperature sensor 5 and the circuit formed on the printed board 4 only passes.

  In the second embodiment, a wiring pattern for connecting the temperature sensor 5 and a circuit formed on the printed board 4 to the connection portions 4f and 4g between the printed board 4 and the expansion portions 4d and 4e on the intake side or the exhaust side thereof is provided. Since the area only passes through, the thermal resistance between the printed board 4 and the extended portions 4d and 4e becomes very large, and even if a high heat generating component is mounted in the vicinity, the heat generated by conduction from the component The temperature sensor 5 can accurately measure the ambient air temperature. Further, the device type temperature sensor 5 can be mounted on a machine and is inexpensive, and the ambient air temperature can be measured accurately at low cost. Further, if the temperature sensor 5 is provided in the extended portion 4d on the intake side, it can be provided on the windward side of the high heat generating component, and the temperature sensor 5 is not affected by the heat of the high heat generating component, and the ambient air temperature is accurately measured. It can be measured well. Further, if the temperature sensor 5 is provided in the extended portion 4e on the exhaust side, it is provided on the leeward side of the high heat generating component. However, since it is provided in the path of the wind, the cooling effect is good, and the heat of the high heat generating component is still good. Little affected. In addition, the same effects as in the first embodiment are obtained.

Embodiment 3
3A and 3B show a plan view of a printed board and a state in which a small printed board is mounted on the main printed board in the temperature measuring device for an electronic device unit according to the third embodiment, and is shown in FIG. In this way, the main printed board 8 and the small printed board 9 are integrally manufactured, and the mounting component 6 is mounted on the main printed board 8 and the device type temperature sensor 5 is mounted on the small printed board 9. The small printed board 9 is provided with leads 10. Here, the main printed board 8 and the small printed board 9 are separated, and the portion 8a to be a discarded board is also separated. Next, as shown in FIG. 3B, the lead 10 is soldered to the main printed board 8, and the small printed board 9 is mounted on the main printed board 8. Here, the lead 10 of the small printed board 9 is connected to the main printed board 8.
In order to increase the thermal resistance between the temperature sensor 5 and the temperature sensor 5, a long and thin shape is used.

  In the third embodiment, since the small printed board 9 is mounted on the main printed board 8 through the elongated leads 10, the thermal resistance between the temperature sensor 5 mounted on the small printed board 9 and the main printed board 8 is reduced. The temperature sensor 5 becomes almost unaffected by the heat of the mounting component 6 mounted on the main printed board 8, and the ambient air temperature can be accurately measured using the inexpensive device type temperature sensor 5. . In addition, the same effects as in the first embodiment are obtained.

Embodiment 4
FIGS. 4 to 6 are explanatory diagrams for explaining a temperature monitoring method for an electronic device unit according to the fourth embodiment. FIG. 4 shows an electronic device unit on one side of the printed board 4 mounted in the electronic device unit 7. FIG. 5 shows a case where the printed board is vertically mounted with the other side being the upper exhaust side of the electronic device unit 7, and FIG. The case where the board 4 is mounted horizontally is shown. In the case of FIG. 4, a temperature sensor 11a is provided on one side (upper exhaust side) of the vertically mounted printed board 4, and a temperature sensor 11b is provided on the other side (lower intake side) of the printed board 4. Is provided. In the case of FIG. 5, the temperature sensor 11a is provided on one side (lower intake side) of the vertically mounted printed board 4, and the temperature is provided on the other side (upper exhaust side) of the printed board 4. A sensor 11b is provided. Further, in the case of FIG. 6, a temperature sensor 11a is provided on one side (intake side or exhaust side) of the printed board 4 mounted horizontally, and on the other side (exhaust side or intake side) of the printed board 4. A temperature sensor 11b is provided.

  Here, the measured temperatures of the temperature sensors 11a and 11b are Ta and Tb, the temperature difference ΔT is calculated by the equation ΔT = Ta−Tb, and the mounting direction is determined based on ΔT. That is, when ΔT is positive, it is determined that one side of the printed board 4 is vertically mounted on the upper exhaust side as shown in FIG. 4, and when ΔT is negative, the printed board is shown as shown in FIG. 4 is determined to be the vertical mounting on the upper exhaust side, and when ΔT is substantially zero, it is determined that the printed board 4 is horizontally mounted as shown in FIG. In the case of FIG. 4, that is, when one side of the printed board 4 is vertically mounted on the exhaust side on the upper side, the vertical mounting maximum allowable exhaust temperature (maximum when the internal component specification temperature is satisfied), which is the judgment value, It is determined whether or not the exhaust side temperature Ta <Tvamax, where Tvamax is the temperature. Further, in the case of FIG. 5, that is, when the other side of the printed board 4 is vertically mounted on the exhaust side on the upper side, whether the exhaust side temperature Tb <Tvbmax is set, where Tvbmax is the maximum allowable exhaust temperature for vertical mounting as the determination value. Determine whether or not. Further, in the case of FIG. 6, that is, when the printed board 4 is horizontally mounted, it is determined whether or not the exhaust side temperature Ta or Tb <Thamax, where the maximum allowable exhaust temperature for vertical mounting as the determination value is Thamax. Thus, in each case, the exhaust side temperature is lower than the maximum allowable exhaust temperature for each mounting direction, so that the temperature in the electronic device unit 7 is determined to be within the allowable temperature.

  Furthermore, in the case of the vertical mounting shown in FIGS. 4 and 5, the absolute value of ΔT needs to be smaller than the maximum allowable temperature rise value ΔTmax, which is a determination value, so that there is no internal mounting abnormality or abnormal operation. Is determined.

  In the fourth embodiment, temperature sensors 11a and 11b are provided on one side and the other side of the printed board 4, and the measured temperatures are Ta and Tb, respectively. When the temperature difference ΔT is positive, one side is It can be determined that the upper exhaust side is vertically mounted, and if it is negative, the other side can be determined as the upper exhaust side vertical mounting, and if it is almost zero, it can be determined as horizontal mounting. . Further, since the exhaust side temperature is lower than the maximum allowable exhaust temperature in each mounting direction, it is determined that the temperature in the electronic device unit 7 is within the allowable temperature, and the absolute value of the temperature difference is maximum in the case of vertical mounting. When the temperature is smaller than the allowable temperature increase value, it is determined that there is no internal mounting abnormality or operation abnormality in the electronic device unit 7. When all of these conditions are satisfied, it is determined that the inside of the electronic device unit 7 is within the allowable range in terms of temperature.

  As described above, it is possible to monitor and control the temperature of the natural air-cooled electronic device unit 7 in which the possible directions are multi-directional, and by setting the exhaust side temperature in each mounting direction as the determination temperature, By suppressing the load, it can be used in an environment with a higher ambient temperature, and detailed temperature control and monitoring according to the mounting direction becomes possible, improving reliability. Further, it is possible to detect a temperature abnormality caused by a mounting abnormality or an internal component abnormality that was not found in the prior art.

It is the top view of the temperature measuring apparatus of the electronic device unit by Embodiment 1 of this invention, and its principal part enlarged view. It is a top view of the temperature measuring apparatus of the electronic device unit by Embodiment 2 of this invention. It is a figure which shows the state which mounts the top view of a printed circuit board and the small printed circuit board in the main printed circuit board in the temperature measuring apparatus of the electronic device unit by Embodiment 3 of this invention. It is explanatory drawing of the temperature monitoring method of the electronic device unit by Embodiment 4. FIG. It is explanatory drawing of the temperature monitoring method of the electronic device unit by Embodiment 4. FIG. It is explanatory drawing of the temperature monitoring method of the electronic device unit by Embodiment 4. FIG. It is a front view of the temperature measuring apparatus of the conventional electronic device unit. It is a figure which shows the top view of the conventional device type temperature sensor, and the state which mounts this temperature sensor on a printed circuit board. FIG. 6 is a relationship diagram between unit load and unit allowable ambient temperature.

Explanation of symbols

DESCRIPTION OF SYMBOLS 4 ... Printed board 4b ... Wiring pattern passage area 4c ... Notch groove 4d, 4e ... Expansion part 4f, 4g ... Connection part 5 ... Device type temperature sensor 6 ... Mounting component 7 ... Electronic equipment unit 8 ... Main printed board 9 ... Small Print board 10 ... Lead

11a, 11b ... temperature sensor

Claims (4)

  A device type temperature sensor is mounted on the printed board of the electronic device unit, and an area through which the wiring pattern connecting the temperature sensor and the circuit formed on the printed board passes around the part of the printed board where the temperature sensor is mounted. A temperature measuring device for an electronic device unit, wherein a notch groove is provided.   An extended portion of the printed board is provided on the intake side or the exhaust side of the printed board of the electronic device unit, a device type temperature sensor is mounted on the extended portion, and a connection portion between the printed board and the extended portion is a temperature sensor and the printed board. An apparatus for measuring a temperature of an electronic device unit, characterized in that an area through which a wiring pattern for connecting to a circuit formed on the substrate only passes is provided.   Device type temperature sensor is mounted on a small printed board manufactured by taking together with the main printed board of the electronic equipment unit, and the small printed board is mounted on the main printed board through leads. apparatus. Temperature sensors are provided on one side and the other side of the printed board mounted in the electronic device unit, respectively, and the temperature difference between one side and the other side is positive, negative, almost zero, and one side is the upper side. Determine whether the exhaust side vertical mounting or the other side is the upper exhaust side vertical mounting or horizontal mounting, and the exhaust side temperature in each mounting direction is lower than the maximum allowable exhaust temperature set for each mounting direction, and A temperature monitoring method for an electronic device unit, wherein in the case of vertical mounting, the absolute value of the temperature difference is smaller than the maximum allowable temperature rise value, so that the electronic device unit is determined to be within an allowable temperature range.

Images