CN107768770A - A kind of cooling device - Google Patents
A kind of cooling device Download PDFInfo
- Publication number
- CN107768770A CN107768770A CN201710947350.2A CN201710947350A CN107768770A CN 107768770 A CN107768770 A CN 107768770A CN 201710947350 A CN201710947350 A CN 201710947350A CN 107768770 A CN107768770 A CN 107768770A
- Authority
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- China
- Prior art keywords
- thermal insulation
- wire
- cooling device
- insulation layer
- diffusion sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims abstract description 63
- 238000009413 insulation Methods 0.000 claims abstract description 51
- 239000004065 semiconductor Substances 0.000 claims abstract description 39
- 238000009792 diffusion process Methods 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 4
- 239000000378 calcium silicate Substances 0.000 claims description 3
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 3
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 208000021760 high fever Diseases 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000007743 anodising Methods 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- CUZMQPZYCDIHQL-VCTVXEGHSA-L calcium;(2s)-1-[(2s)-3-[(2r)-2-(cyclohexanecarbonylamino)propanoyl]sulfanyl-2-methylpropanoyl]pyrrolidine-2-carboxylate Chemical group [Ca+2].N([C@H](C)C(=O)SC[C@@H](C)C(=O)N1[C@@H](CCC1)C([O-])=O)C(=O)C1CCCCC1.N([C@H](C)C(=O)SC[C@@H](C)C(=O)N1[C@@H](CCC1)C([O-])=O)C(=O)C1CCCCC1 CUZMQPZYCDIHQL-VCTVXEGHSA-L 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6567—Liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
- H01M10/6572—Peltier elements or thermoelectric devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/658—Means for temperature control structurally associated with the cells by thermal insulation or shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of cooling device is disclosed, including：Semiconductor chilling plate, including chill surface and heating face, are connected with wire；Radiator, contacted with the heating face of semiconductor chilling plate；Thermal insulation layer, positioned at the periphery of semiconductor chilling plate, including wire guide, wherein, wire passes through the wire guide so that wire is at least partially disposed at outside thermal insulation layer, the distribution corresponding with the edge of thermal insulation board of the wire outside thermal insulation layer.The both ends of wire pass the thermal insulation board by wire guide respectively, are connected with power supply.Semiconductor chilling plate is multiple, array distribution, and is serially connected by wire.Also include diffusion sheet, it is plate-like, on the chill surface of semiconductor chilling plate so that thermal insulation layer is between diffusion sheet and radiator.Wire through thermal insulation layer can be located at outside thermal insulation layer, can strengthen the degree of heat radiation of wire, make the reliability of cooling device strengthen, extend its service life, so that it has highly reliable, technique is simple, it is easy for installation the characteristics of.
Description
Technical field
The present invention relates to water-cooling system field, relates more specifically to a kind of cooling device.
Background technology
Energy shortage and environmental pollution are that two that World Auto Industry development now faces challenge greatly, the development of electric automobile
One of Main way as automobile industry development in recent years, government vigorously supporting and promoting, and inter-industry competition is me with cooperation
Certain basis has been established in the development of state's electric automobile, and pure electric automobile is by the extensive favor of various circles of society, and electric automobile
Development, largely by battery core technology, battery management system, three big technology maturity system of driving control system for electric machine
About.As the critical component of electric automobile, electrokinetic cell has significant impact to vehicle dynamic property, economy and security.Electricity
The security performance of cell system is particularly important, and power battery thermal management system carries monitoring and the tune to battery core temperature
Section, to improve security performance and service life, radiates frequently with water-cooling system to electrokinetic cell.
Electric automobile power battery uses the compressor-type cooling by water mode of prior art, and cooling system is typically by condensing
The devices such as device, compressor, expansion valve, coldplate, electric water pump and water tank form, and are related to that device is more, and associated chiller part accounts for
It is big with spatial volume, the weight vehicle course continuation mileage of corresponding device, and manufacturing process is complicated, protective treatment requirement is strict,
Failure risk is high, and cost is higher.
The content of the invention
Technical problem solved by the invention is to provide a kind of cooling device, through thermal insulation layer wire can be located at it is heat-insulated
Layer is outer, and corresponding with the edge of thermal insulation layer, on the premise of manufacture craft simplicity, can strengthen the degree of heat radiation of wire, make
The reliability enhancing of cooling device, so as to extend its service life.
According to a kind of cooling device provided by the invention, it is characterised in that including：Semiconductor chilling plate, including chill surface
And heating face, it is connected with wire；Radiator, contacted with the heating face of the semiconductor chilling plate；Thermal insulation layer, positioned at described half
The periphery of conductor cooling piece, including wire guide, wherein, the wire passes through the wire guide so that the wire is at least partly
Outside the thermal insulation layer, the wire distribution corresponding with the edge of the thermal insulation board outside the thermal insulation layer.
Preferably, the both ends of the wire pass the thermal insulation board by the wire guide respectively, are connected with power supply.
Preferably, the semiconductor chilling plate is multiple, array distribution, and is serially connected by the wire.
Preferably, in addition to diffusion sheet, it is plate-like, on the chill surface of the semiconductor chilling plate so that institute
Thermal insulation layer is stated between the diffusion sheet and the radiator.
Preferably, the diffusion sheet and the radiator include mutually corresponding first mounting hole and the second installation respectively
Hole, the thermal insulation layer include through hole corresponding with first mounting hole and second mounting hole, the diffusion sheet, described
Thermal insulation layer and the radiator pass through rivet interlacement or bolt connection.
Preferably, the diffusion sheet and the radiator are respectively adopted aluminum alloy materials and are made, wherein the diffusion sheet
For aluminium alloy extruded shaping.
Preferably, heat-conducting silicone grease is smeared respectively on the chill surface of the semiconductor chilling plate and the heating face.
Preferably, the thermal insulation layer is made of calcium silicate board with microporous.
Preferably, in addition to：Water tank, the diffusion sheet on the outside of the water tank with fitting.
Preferably, the radiator also includes multiple radiating fins.
According to the present invention cooling device, freezed by semiconductor chilling plate, semiconductor chilling plate by wire with it is low
Press dc source connection so that semiconductor includes chill surface and heating face.The wire being connected with semiconductor chilling plate, through position
Thermal insulation layer wire guide in semiconductor chilling plate periphery so that most wires are located at outside thermal insulation layer, and arrangement of conductors with
Thermal insulation layer edge is corresponding.The influence that thermal insulation layer can be avoided to radiate electrified wire, make electrified wire proper heat reduction.Making work
Skill is easy, it is easy for installation on the premise of, the degree of heat radiation of wire can be strengthened, make the reliability of cooling device strengthen, so as to prolong
Its long service life.
Meanwhile the diffusion sheet on the chill surface of semiconductor chilling plate is in the form of sheets, respectively with outside chill surface and water tank
Side is bonded.Diffusion sheet is made of aluminum alloy materials, and is extrusion forming.It is not only simple in structure, it is easy for installation, and can be with
Increase the refrigeration area of device for cooling, accelerate the cooling velocity of liquid in water tank, so as to improve operating efficiency.
In addition, semiconductor chilling plate of the present invention is connected with low-voltage dc power supply, the peace of the refrigerating plant can be not only improved
Overall coefficient, and make control circuit simple, so as to reduce cost of manufacture.
In a word, the structure of cooling device of the invention is simple, and involved device is less, in light weight, so that making stream
Journey is easy, low manufacture cost.The cooling device of the present invention does not have a compressor simultaneously, no freon, have it is noiseless, it is without friction,
No leakage, the advantages that Environmental Safety.
Brief description of the drawings
By the description to the embodiment of the present invention referring to the drawings, above-mentioned and other purposes of the invention, feature and
Advantage will be apparent from.
The stereogram and stereogram exploded view of water-cooling system of the embodiment of the present invention is shown respectively in Fig. 1 and Fig. 2；
Fig. 3 shows the semiconductor chilling plate of cooling device of the embodiment of the present invention and the stereogram of thermal insulation layer
Fig. 4 shows the stereogram of the semiconductor chilling plate of cooling device of the embodiment of the present invention；
Fig. 5 shows the stereogram of the thermal insulation layer of cooling device of the embodiment of the present invention；
Fig. 6 shows the stereogram of the diffusion sheet of cooling device of the embodiment of the present invention；
Fig. 7 shows the stereogram of the radiator of cooling device of the embodiment of the present invention.
Embodiment
The present invention is more fully described hereinafter with reference to accompanying drawing.In various figures, identical element is using similar attached
Icon is remembered to represent.For the sake of clarity, the various pieces in accompanying drawing are not necessarily to scale.In addition, it may not show in figure
Go out some known parts.
It describe hereinafter many specific details of the present invention, such as the structure of part, material, size, processing work
Skill and technology, to be more clearly understood that the present invention.But just as the skilled person will understand, it can not press
The present invention is realized according to these specific details.
It should be appreciated that when describing the structure of part, it is referred to as when by a floor, a region positioned at another floor, another area
When domain " above " or " top ", can refer to above another layer, another region, or its with another layer, it is another
Other layers or region are also included between individual region.Also, if by part turnover, this layer, a region will be located at it is another
Layer, another region " following " or " lower section ".
Fig. 1 shows the stereogram of water-cooling system of the embodiment of the present invention.The present invention water-cooling system include cooling device 100 with
And water tank 900.Cooling device 100 can be located at the outside of water tank 900, wherein the bottom or side of water tank 900 can be placed in, and and water
Fitted on the outside of case 900 or water pipe.Cooling device 100 and water tank 900 can open to unload fixation, e.g. bolt connection or
Person other is suitably fixedly connected with.The water tank 900 of wherein water-cooling system can also be water pipe, or other suitable water receptacles.
Above-mentioned water-cooling system can be the cooling system of the electrokinetic cell of electric automobile, positioned at electric automobile chassis leg space ventilation position,
It is easy to radiate.
Fig. 2 shows the stereogram exploded view of water-cooling system of the embodiment of the present invention.The cooling device 100 of the present invention includes partly leading
Body cooling piece 110, radiator 120, thermal insulation layer 130, diffusion sheet 150 and wire 140.Wherein semiconductor chilling plate 110 includes
Chill surface and heating face, chill surface can realize the refrigerating function of semiconductor chilling plate 110.Diffusion sheet 150 is located at semiconductor system
On the chill surface of cold 110, fitted with chill surface, for the refrigeration area of the device to be expanded.Radiator 120, which is located at, partly leads
On the heating face of body cooling piece 110, heat sinking function can be achieved.Thermal insulation layer 130, positioned at the periphery of semiconductor chilling plate 110, and
Between diffusion sheet 150 and radiator 120, for diffusion sheet 150 and radiator 120 to be spaced, avoid diffusion sheet 150 and dissipate
The heat transfer of hot device 120.Diffusion sheet 150 fits with semiconductor chilling plate 110, the outside of water tank 900 respectively simultaneously, can make system
Huyashi-chuuka (cold chinese-style noodles) product increase, so that the liquid in water tank 900 quickly cools down, barrier propterty can be not only improved, and improve cooling
Efficiency.
Fig. 3 shows the semiconductor chilling plate of cooling device of the embodiment of the present invention and the stereogram of thermal insulation layer, Fig. 4 and Fig. 5
The semiconductor chilling plate of cooling device of the embodiment of the present invention and the stereogram of thermal insulation layer is shown respectively.The semiconductor refrigerating of the present invention
Piece 110 can be multiple, and array distribution, be serially connected by wire 140, the both ends of wire 140 are connected with power supply, power supply
It can be low-voltage dc power supply.Multiple semiconductor chilling plates 110 of series connection to form its chill surface and system by being connected with power supply
Hot face, not only make it that control circuit is simple, and safety coefficient is high in process of refrigerastion, while the system of refrigeration system can be reduced
Cause this.Uniformly attachment heat conductive silica gel, the heat conductive silica gel have high fever respectively for the chill surface of semiconductor chilling plate 110 and heating face
Rate, chill surface can be accelerated or heat the temperature diffusion in face, so as to improve the refrigeration of the refrigerating plant.
Thermal insulation layer 130 includes wire guide 131 and through hole 132.Wherein, wire guide 131 and wire 140 and semiconductor refrigerating
The position that piece 110 is connected is corresponding, and the wire 140 being connected with semiconductor chilling plate 110 can pass through wire guide 131, and put
In wire 140 outside thermal insulation layer 130, can be made except close to the part that is connected with semiconductor chilling plate 110, remaining most of wire
140 outside thermal insulation layer 130.Wire 140 simultaneously outside thermal insulation layer 130 is corresponding with the edge of thermal insulation layer 130.It can so keep away
Exempt from the influence that thermal insulation layer 130 radiates to electrified wire 140, make the proper heat reduction of electrified wire 140.In manufacture craft simplicity, installation
Under the premise of convenient, the degree of heat radiation of wire 140 can be strengthened, make the reliability of cooling device strengthen, so as to extend its use
Life-span.Meanwhile the thickness of thermal insulation layer 130 is equal to or less than the thickness of semiconductor chilling plate 110 so that chill surface and heating face
It is bonded respectively with diffusion sheet 150 and radiator 120.It is made in addition, thermal insulation layer 130 can adopt 132 of calcium silicate board with microporous, or
Other suitable materials.In a word, thermal insulation layer 130 ensure semiconductor chilling plate 110 be powered normal, radiating it is normal under the premise of,
The temperature conduction that can effectively completely cut off between diffusion sheet 150 and radiator 120, so as to ensure the validity of refrigerating plant.
Fig. 6 shows the stereogram of the diffusion sheet of cooling device of the embodiment of the present invention.Diffusion sheet 150 includes the first mounting hole
151, it is corresponding with the through hole 132 on thermal insulation layer 130.Diffusion sheet 150 uses aluminium alloy extruded shaping, plate-like, and surface is passed through
The processing of sandblasting hard anodizing, radiating efficiency can be made high, antiseptic power is strong.Simultaneously diffusion sheet 150 respectively with chill surface with
It is easy for installation and the outside of water tank 900 fits, and is not only simple in structure, and the refrigeration area of device for cooling can be increased, accelerate water
The cooling velocity of liquid in case 900, so as to improve operating efficiency.
Fig. 7 shows the stereogram of the radiator of cooling device of the embodiment of the present invention.Radiator 120 includes the second mounting hole
121 and multiple radiating fins 122.Wherein, the side of radiator 120 is bonded with heating face, and multiple radiating fins 122 are positioned at another
Side, it can not only increase heat-conducting area, and because the area of dissipation of multiple radiating fins 122 is big so that radiator 120
Radiating rate increases.Second mounting hole 121 is corresponding with the first mounting hole 151 positioned at diffusion sheet 150, can pass through the first installation
Diffusion sheet 150, thermal insulation layer 130 and radiator 120 are mutually permanently connected by hole 151, the second mounting hole 121 and through hole 132,
This is fixedly connected can be by rivet interlacement, bolt connection, or other suitable connections.Radiator 120 can use high fever
Conductivity material is made, such as aluminum alloy materials, or other suitable materials.
Meanwhile the size of diffusion sheet 150, thermal insulation layer 130 and radiator 120 can be corresponded to mutually；Diffusion sheet 150, every
The shape of thermosphere 130 and radiator 120 can be corresponding with the shape of the outer wall of water tank 900 or pipe outer wall, such as spreads
The binding face of piece 150 and radiator 120 can be rectangle, or other suitable shapes.The cooling device 100 of the present invention
The insulation processing between battery system and vehicle, it can so ensure to improve water cooling system without electric leakage risk during operation
The safety coefficient of system and electric automobile.
The structure of the cooling device 100 of the present invention is simple, and involved device is less, in light weight, so that Making programme
Easy, low manufacture cost.The cooling device 100 of the present invention have a compressor simultaneously, no freon, without friction with noiseless,
No leakage, the advantages that Environmental Safety.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element.
According to embodiments of the invention as described above, these embodiments do not have all details of detailed descriptionthe, not yet
It is only described specific embodiment to limit the invention.Obviously, as described above, can make many modifications and variations.This explanation
Book is chosen and specifically describes these embodiments, is in order to preferably explain the principle and practical application of the present invention, so that affiliated
Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.The present invention is only by right
The limitation of claim and its four corner and equivalent.
Claims (10)
- A kind of 1. cooling device, it is characterised in that including：Semiconductor chilling plate, including chill surface and heating face, are connected with wire；Radiator, contacted with the heating face of the semiconductor chilling plate；Thermal insulation layer, positioned at the periphery of the semiconductor chilling plate, including wire guide,Wherein, the wire passes through the wire guide so that the wire is at least partially disposed at outside the thermal insulation layer, positioned at institute State the wire distribution corresponding with the edge of the thermal insulation board outside thermal insulation layer.
- 2. cooling device according to claim 1, it is characterised in that the both ends of the wire pass through the wire guide respectively The thermal insulation board is passed, is connected with power supply.
- 3. cooling device according to claim 1, it is characterised in that the semiconductor chilling plate is multiple, array distribution, And it is serially connected by the wire.
- 4. cooling device according to claim 1, it is characterised in that it is plate-like also including diffusion sheet, partly led positioned at described On the chill surface of body cooling piece so that the thermal insulation layer is between the diffusion sheet and the radiator.
- 5. cooling device according to claim 4, it is characterised in that the diffusion sheet and the radiator include respectively First mounting hole and the second mounting hole corresponding to mutually, the thermal insulation layer include and first mounting hole and second peace Through hole corresponding to hole is filled, the diffusion sheet, the thermal insulation layer and the radiator pass through rivet interlacement or bolt connection.
- 6. cooling device according to claim 4, it is characterised in that the diffusion sheet and the radiator are respectively adopted Aluminum alloy materials are made, wherein the diffusion sheet is aluminium alloy extruded shaping.
- 7. cooling device according to claim 1, it is characterised in that the chill surface of the semiconductor chilling plate and Heat-conducting silicone grease is smeared respectively on the heating face.
- 8. cooling device according to claim 1, it is characterised in that the thermal insulation layer is made of calcium silicate board with microporous.
- 9. cooling device according to claim 4, it is characterised in that the cooling device is used in water-cooling system, described Water-cooling system includes water tank, and the diffusion sheet on the outside of the water tank with fitting.
- 10. cooling device according to claim 1, it is characterised in that the radiator also includes multiple radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947350.2A CN107768770B (en) | 2017-10-12 | 2017-10-12 | Cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947350.2A CN107768770B (en) | 2017-10-12 | 2017-10-12 | Cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107768770A true CN107768770A (en) | 2018-03-06 |
| CN107768770B CN107768770B (en) | 2024-03-26 |
Family
ID=61267173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710947350.2A Active CN107768770B (en) | 2017-10-12 | 2017-10-12 | Cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107768770B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162342A (en) * | 2019-12-24 | 2020-05-15 | 汉腾汽车有限公司 | Power battery semiconductor cooling device |
| CN111628239A (en) * | 2019-02-28 | 2020-09-04 | 中天储能科技有限公司 | Battery pack and method of assembling the same |
| CN112492840A (en) * | 2020-11-13 | 2021-03-12 | 广州小马慧行科技有限公司 | Inertial measurement unit |
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| JP2017019170A (en) * | 2015-07-09 | 2017-01-26 | キヤノン株式会社 | Liquid discharge head |
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