CN112490852A - Laser beam combining device - Google Patents

Laser beam combining device Download PDF

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Publication number
CN112490852A
CN112490852A CN202011451607.3A CN202011451607A CN112490852A CN 112490852 A CN112490852 A CN 112490852A CN 202011451607 A CN202011451607 A CN 202011451607A CN 112490852 A CN112490852 A CN 112490852A
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CN
China
Prior art keywords
laser
laser beam
tube
single tube
heat sink
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011451607.3A
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Chinese (zh)
Inventor
牛奔
陈欣
张强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Thermal Stimulation Optical Technology Co ltd
Original Assignee
Zhejiang Thermal Stimulation Optical Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Zhejiang Thermal Stimulation Optical Technology Co ltd filed Critical Zhejiang Thermal Stimulation Optical Technology Co ltd
Priority to CN202011451607.3A priority Critical patent/CN112490852A/en
Publication of CN112490852A publication Critical patent/CN112490852A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0085Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for modulating the output, i.e. the laser beam is modulated outside the laser cavity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4075Beam steering

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention discloses a laser beam combining device, comprising: a heat sink; the single tubes are arranged on the heat sink in a row, and light emitting points of the single tubes in the corresponding row are positioned on the same straight line; the collimation module is used for collimating the laser emitted by the single tube so as to enable the laser to be emitted towards a preset direction; and the reflecting module comprises a plurality of single-tube reflecting mirrors, each single-tube reflecting mirror is arranged on the heat sink and is in one-TO-one correspondence with each single tube, the distance between the corresponding single tube and the single-tube reflecting mirror is the incident distance, the incident distance is linear change, the single-tube reflecting mirror reflects the laser emitted by the single tube towards the preset direction TO form a first laser beam combination, so that the whole structure is smaller, and the single tube beam combination for TO encapsulation is facilitated.

Description

Laser beam combining device
Technical Field
The invention relates to the field of lasers, in particular to a laser beam combining device.
Background
The blue-light semiconductor laser is gradually applied TO the processing of materials such as copper and aluminum, but the output power of a single tube of a single semiconductor laser is relatively low, the highest single tube output is about 5W at present, and the package of the current mature blue-light semiconductor single tube laser is in a TO package form, so that in order TO obtain high-power blue-light output, the light beams of the single tubes of a plurality of blue-light semiconductor lasers are combined TO obtain higher-power blue-light output.
The existing single-tube beam combining device for the semiconductor laser generally processes steps on a heat sink or realizes single-tube installation of a plurality of semiconductor lasers by inclining the heat sink, so that laser beams emitted by the single tubes of the semiconductor lasers are combined. However, the method is not easy TO be used for installing the TO-packaged single blue-light semiconductor laser tube, and is easy TO make the whole structure bulky, high in processing requirement, high in difficulty and high in manufacturing cost.
Disclosure of Invention
The invention provides a laser beam combining device which is used for solving at least one technical problem in the prior art.
To solve the above problems, the present invention provides: a laser beam combining device, comprising:
a heat sink;
the single tubes are arranged on the heat sink in a row, and light emitting points of the single tubes in the corresponding row are positioned on the same straight line;
the collimation module is used for collimating the laser emitted by the single tube so as to enable the laser to be emitted towards a preset direction; and
the reflecting module comprises a plurality of single-tube reflecting mirrors, each single-tube reflecting mirror is installed on the heat sink and is in one-to-one correspondence with each single tube, the distance between the corresponding single tube and the corresponding single-tube reflecting mirror is an incident distance, the incident distance is linearly changed, and the single-tube reflecting mirrors reflect the laser emitted by the single tube towards a preset direction to form a first laser beam combination.
The invention has the beneficial effects that: compared with the prior art, the distance between the single tube and the single tube reflector corresponding to each group is changed linearly (namely the single tube reflector and the corresponding single tube are arranged in a far-near staggered manner on the heat sink), so that when the laser combiner is used, laser emitted by the single tube is collimated by the collimating module and then emitted to the single tube reflector, and each single tube reflector reflects the laser emitted by the single tube towards the same direction and the same angle, so that the laser emitted by each single tube forms a first laser beam combination. The laser beam combining device provided by the embodiment of the invention has the advantages that the spatial beam combination of a plurality of single-tube light spots is realized through the linear distance change between the single tubes and the single-tube reflector, and steps are not required TO be arranged on a heat sink, so that the overall structure of the laser beam combining device provided by the embodiment of the invention is smaller, the combined beam formation of TO-packaged single tubes is facilitated, the processing is convenient, and the manufacturing cost is low.
As a further improvement of the above technical solution, the collimating module includes a fast axis collimating lens and a slow axis collimating lens, the fast axis collimating lens is installed at the light exit point of the single tube to collimate the laser in the first direction, the slow axis collimating lens is installed on the heat sink, and the slow axis collimating lens is located between the fast axis collimating lens and the single tube reflector to collimate the laser in the second direction.
As a further improvement of the technical scheme, the single tube and the fast axis collimating lens are designed in an integrated manner.
As a further improvement of the above technical solution, at least one row of mounting holes is provided on the heat sink, and the single tube is mounted in the mounting holes.
As a further improvement of the above technical solution, the laser beam combining device further includes a pressing sheet for assisting the single tube to be mounted in the mounting hole.
As a further improvement of the above technical solution, the laser beam combining device further includes a positioning sheet for positioning the single tube in the mounting hole.
As a further improvement of the technical scheme, two rows of mounting holes are symmetrically formed in the heat sink, and the single tubes are mounted in the mounting holes.
As a further improvement of the above technical solution, the reflective module further includes a plurality of linear array reflectors, each of the linear array reflectors is disposed in a staggered manner and has the same reflective direction, and each of the linear array reflectors is configured to reflect each of the first laser beams in a predetermined direction to form a second laser beam.
As a further improvement of the above technical solution, the reflection module further includes a half-wave plate, a polarizing plate, and an area array mirror, the half-wave plate is located between the linear array mirror and the polarizing plate and is configured to rotate a part of P-polarization laser to S-polarization to the polarizing plate, the polarizing plate is configured to reflect S-polarization laser, the area array mirror is configured to reflect another part of laser reflected by the linear array mirror, and the laser reflected by the area array mirror coincides with the laser reflected by the polarizing plate.
As a further improvement of the above technical solution, the laser beam combining apparatus further includes a water-passing bottom plate, and the heat sink, the linear array reflector, the half-wave plate, the polarizer and the area array reflector are all mounted on the water-passing bottom plate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a laser beam combining device according to an embodiment of the present invention;
FIG. 2 is a schematic view of a portion of the enlarged structure at A in FIG. 1;
FIG. 3 shows a schematic optical path diagram of the laser beam combining device of FIG. 1;
fig. 4 is a schematic structural diagram of another laser beam combining device provided in the embodiment of the present invention;
FIG. 5 shows a schematic optical path diagram of the laser beam combining device of FIG. 4;
fig. 6 shows another optical path diagram of the laser beam combining device of fig. 4.
Description of the main element symbols:
10-heat sink; 20-mounting holes; 30-single tube; 40-a collimation module; 41-fast axis collimating lens; 42-slow axis collimating lens; 50-a reflection module; 51-single tube mirror; 52-linear array reflector; 53-half wave plate; 54-a polarizer; 55-area array reflector; 60-water through bottom plate; 71-first laser beam combination; 72-second laser beam.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings.
The foregoing relative terms are merely for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise specifically indicated and limited.
For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship.
The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate.
And the first feature "over", "above" and "on" the second feature may be directly over or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Examples
As shown in fig. 1, fig. 2 and fig. 3, a laser beam combining apparatus according to an embodiment of the present invention will now be described. The laser related TO the laser beam combining device is a semiconductor solid-state laser, and is not limited TO a TO-packaged blue-light semiconductor laser.
The laser beam combining device comprises:
a heat sink 10;
the single tubes 30 are used for emitting laser, each single tube 30 is arranged on the heat sink 10 in a row, and light emergent points of the single tubes 30 in the corresponding row are positioned on the same straight line;
the collimation module 40, the collimation module 40 is used for collimating the laser emitted from the single tube 30, so that the laser is emitted towards a predetermined direction; and
reflection module 50, reflection module 50 include a plurality of single tube speculum 51, and each single tube speculum 51 all installs on heat sink 10 and sets up with each single tube 30 one-to-one, and the distance between the single tube 30 that corresponds and the single tube speculum 51 is the incident distance, and the incident distance is linear change, and single tube speculum 51 all reflects towards the predetermined direction with the laser that single tube 30 sent and forms first laser beam combination 71.
Compared with the prior art, the laser beam combining device of the embodiment of the invention has the advantages that the distance between the single tube 30 and the single tube reflector 51 corresponding to each group is changed linearly (that is, the single tube reflector 51 is arranged on the heat sink 10 in a far-near staggered manner with the corresponding single tube 30), so that when the device is used, the laser emitted by the single tube 30 is collimated by the collimation module 40 and then emitted to the single tube reflector 51, and the single tube reflectors 51 reflect the laser emitted by the single tube 30 towards the same direction and the same angle, so that the laser emitted by the single tubes 30 forms the first laser beam combination 71. The single tube reflectors 51 are arranged on the heat sink 10 side by side and are all located on the same straight line, and spatial beam combination of a plurality of single tubes 30 of light spots is realized through linear distance change between the single tubes 30 and the single tube reflectors 51 without arranging steps on the heat sink 10, so that the laser beam combination device provided by the embodiment of the invention has a smaller overall structure, is beneficial TO beam combination formation of TO-packaged single tubes 30, and is convenient TO process and low in manufacturing cost.
Further, water cooling channels are distributed on the heat sink 10, which facilitates heat dissipation of the single tube 30.
In an embodiment of the present invention, as shown in fig. 1, 2 and 3, the collimating module 40 includes a fast axis collimating lens 41 and a slow axis collimating lens 42, the fast axis collimating lens 41 is installed at the light exit point of the single tube 30 to collimate the laser light in the first direction (X direction in fig. 3), the slow axis collimating lens 42 is installed on the heat sink 10, and the slow axis collimating lens 42 is located between the fast axis collimating lens 41 and the single tube reflector 51 to collimate the laser light in the second direction (Z direction in fig. 3).
Specifically, the fast axis collimating lens 41 may collimate the laser light emitted from the single tube 30 in a first direction to reduce scattering of the laser light in the first direction, thereby reducing power loss of the laser light; then, the laser emitted from the single tube 30 can be collimated in the second direction to reduce the scattering of the laser in the second direction, so as to further reduce the power loss of the laser, which can effectively ensure that the laser emitted from the single tube 30 can be emitted to the single tube mirror 51 in a concentrated manner for reflection.
In one embodiment of the present invention, as shown in FIG. 2, the monotube 30 is of a unitary design with a fast axis collimating lens 41. Therefore, the laser emitted by the single tube 30 can be directly collimated through the fast axis collimating lens 41, so that the divergence propagation condition in the first direction when the laser is emitted is reduced to the maximum extent, the laser is directly collimated after being emitted, and the laser is concentrated.
In one embodiment of the present invention, as shown in fig. 1 and 4, the heat sink 10 is provided with at least one row of mounting holes 20, and the single tubes 30 are mounted in the mounting holes 20.
Specifically, when the single tubes 30 are mounted in the mounting holes 20 of the heat sink 10, the single tubes 30 are correspondingly disposed in the mounting holes 20, and the laser light emitted by the single tubes 30 in each row is collimated by the collimating module 40 and reflected by the single tube reflector 51 to form a first laser combined beam 71.
In one embodiment of the present invention, the laser beam combining apparatus further includes a pressing plate (not shown) for assisting the single tube 30 to be mounted in the mounting hole 20.
Specifically, the pressing pieces fix the single pipe 30 positioned in the mounting hole 20, so that the single pipe 30 is stably mounted.
In one embodiment of the present invention, the laser beam combining apparatus further includes a positioning piece (not shown) for positioning the single tube 30 in the installation hole 20.
Specifically, the positioning sheet positions the single tube 30 to ensure that the laser emitted from the single tube 30 can be emitted in a specific direction to combine the laser beams.
In one embodiment of the present invention, as shown in fig. 4, two rows of mounting holes 20 are symmetrically formed on the heat sink 10, and the single tubes 30 are mounted in the mounting holes 20.
Specifically, two first laser beams 71 may be symmetrically formed on each heatsink 10 by symmetrically disposing two rows of the mounting holes 20 for mounting the single tubes 30 on the heatsink 10. In practical use, the N heat sinks 10 may be arranged side by side, so that 2N first laser beams 71 may be obtained simultaneously, and further beam combination of the first laser beams 71 may be performed subsequently, so as to obtain laser with a larger power, and the structure is more compact.
In an embodiment of the present invention, as shown in fig. 4, 5 and 6, the reflective module 50 further includes a plurality of line mirrors 52, each line mirror 52 is disposed in a staggered manner and has the same reflective direction, and each line mirror 52 is used for reflecting each first laser beam 71 towards a predetermined direction to form a second laser beam 72.
Specifically, when the plurality of heat sinks 10 are arranged side by side so that the first laser beams 71 formed by the single tubes 30 in each row on each heat sink 10 are emitted in parallel in the same direction, a plurality of line mirrors 52 are correspondingly arranged in the direction in which the first laser beams 71 are emitted, and each line mirror 52 is arranged in a similar step shape in the same reflection direction so that the first laser beams 71 are reflected in the same direction to form the second laser beams 72.
In one embodiment of the present invention, as shown in fig. 4 and 5, the reflection module 50 further includes a half-wave plate 53, a polarizer 54 and an area mirror 55, the half-wave plate 53 is located between the linear mirror 52 and the polarizer 54 and is configured to rotate a portion of the P-polarized laser light to the polarizer 54, the polarizer 54 is configured to reflect the S-polarized laser light, the area mirror 55 is configured to reflect another portion of the laser light reflected by the linear mirror 52, and the laser light reflected by the area mirror 55 is overlapped with the laser light reflected by the polarizer 54.
Specifically, after each first laser combination 71 is reflected by each linear array mirror 52 to form a second laser combination 72, a part of the P-polarized laser light in the second laser combination 72 is rotated into S-polarized state by the half-wave plate 53, so that the part of the laser light emitted to the polarizer 54 is S-polarized state, the polarizer 54 is located between the half-wave plate 53 and the planar array mirror 55, and since the polarizer 54 can only transmit the P-polarized laser light, the S-polarized state is reflected at the polarizer 54 toward a predetermined direction. Then, the area array mirror 55 reflects the other part of the second laser beam 72, and the area array mirror 55 and the polarizer 54 are both arranged at 45 ° and have the same reflection direction, so that the part of the second laser beam 72 penetrates through the polarizer 54 and coincides with the laser reflected by the polarizer 54, thereby effectively reducing the size of the light spot of the second laser beam 72, that is, under the condition that the size of the light spot is not changed, the second laser beam 72 can have higher power, and the use is facilitated.
Further, the half-wave plate 53 may rotate the P-polarized laser light in half of the second laser beam 72 into the S-polarized state, so that the polarizing plate 54 is reflected. Then, the area array mirror 55 reflects the other half of the second laser beam combination 72, so that the laser beams reflected by the polarizer 54 and the area array mirror 55 are completely overlapped, thereby reducing the size of half of the light spot, or reducing the size of the laser beam combination device on the premise of realizing the same laser beam combination power.
In one embodiment of the present invention, as shown in fig. 4, 5 and 6, the laser beam combining apparatus further includes a water bottom plate 60, and the heat sink 10, the linear mirror 52, the half-wave plate 53, the polarizing plate 54 and the area mirror 55 are all mounted on the water bottom plate 60.
Specifically, when the heat sinks 10 are arranged side by side, the heat sinks 10 may be connected side by side to a water-through bottom plate 60, and then the linear reflectors 52, the half-wave plate 53, the polarizing plate 54, and the area-array reflector 55 are all mounted on the water-through bottom plate 60, at this time, the laser beams emitted from the single tubes 30 on the heat sink 10 are emitted toward the water-through bottom plate 60, and then are combined to form the first laser combined beam 71 after the single-tube reflector 51 is generated, at this time, the first laser combined beam 71 is emitted toward the linear reflector 52 on the water-through bottom plate 60, and after the laser beams are reflected by the linear reflectors 52, the second laser combined beam 72 with a smaller light spot is formed after the laser beams are combined by the half-wave plate 53, the polarizing plate 54, and the area-array reflector 55.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention.
In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example.
Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (10)

1. A laser beam combining apparatus, comprising:
a heat sink;
the single tubes are arranged on the heat sink in a row, and light emitting points of the single tubes in the corresponding row are positioned on the same straight line;
the collimation module is used for collimating the laser emitted by the single tube so as to enable the laser to be emitted towards a preset direction; and
the reflecting module comprises a plurality of single-tube reflecting mirrors, each single-tube reflecting mirror is installed on the heat sink and is in one-to-one correspondence with each single tube, the distance between the corresponding single tube and the corresponding single-tube reflecting mirror is an incident distance, the incident distance is linearly changed, and the single-tube reflecting mirrors reflect the laser emitted by the single tube towards a preset direction to form a first laser beam combination.
2. The laser beam combining device according to claim 1, wherein the collimating module includes a fast axis collimating lens and a slow axis collimating lens, the fast axis collimating lens is mounted at the light exit point of the single tube to collimate the laser in a first direction, the slow axis collimating lens is mounted on the heat sink, and the slow axis collimating lens is located between the fast axis collimating lens and the single tube reflector to collimate the laser in a second direction.
3. The laser beam combining device of claim 2, wherein the single tube is integrated with the fast axis collimating lens.
4. The laser beam combining device according to claim 1, wherein the heat sink has at least one row of mounting holes, and the single tube is mounted in the mounting holes.
5. The laser beam combining device of claim 4, further comprising a pressing piece for assisting the single tube to be mounted in the mounting hole.
6. The laser beam combining device of claim 4, further comprising a positioning plate for positioning the single tube within the mounting hole.
7. The laser beam combining device according to claim 1, wherein two rows of mounting holes are symmetrically formed on the heat sink, and the single tube is mounted in the mounting holes.
8. The laser beam combining device according to claim 1, wherein the reflection module further comprises a plurality of linear array reflectors, each of the linear array reflectors is disposed in a staggered manner and has the same reflection direction, and each of the linear array reflectors is configured to reflect each of the first laser beams toward a predetermined direction to form a second laser beam combination.
9. The device as claimed in claim 8, wherein the reflection module further comprises a half-wave plate, a polarizer and an area array mirror, the half-wave plate is located between the linear array mirror and the polarizer and is used to rotate part of the P-polarization laser to the S-polarization state, the polarizer is used to reflect S-polarization laser, the area array mirror is used to reflect another part of the laser reflected by the linear array mirror, and the laser reflected by the area array mirror is overlapped with the laser reflected by the polarizer.
10. The laser beam combining apparatus of claim 9, further comprising a water-passing base plate, wherein the heat sink, the linear array mirror, the half-wave plate, the polarizer, and the area array mirror are all mounted on the water-passing base plate.
CN202011451607.3A 2020-12-10 2020-12-10 Laser beam combining device Pending CN112490852A (en)

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Application Number Priority Date Filing Date Title
CN202011451607.3A CN112490852A (en) 2020-12-10 2020-12-10 Laser beam combining device

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Application Number Priority Date Filing Date Title
CN202011451607.3A CN112490852A (en) 2020-12-10 2020-12-10 Laser beam combining device

Publications (1)

Publication Number Publication Date
CN112490852A true CN112490852A (en) 2021-03-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114421279A (en) * 2022-03-30 2022-04-29 北京凯普林光电科技股份有限公司 Semiconductor laser device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114421279A (en) * 2022-03-30 2022-04-29 北京凯普林光电科技股份有限公司 Semiconductor laser device

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