CN112475667B - Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof - Google Patents
Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof Download PDFInfo
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- CN112475667B CN112475667B CN202011269960.XA CN202011269960A CN112475667B CN 112475667 B CN112475667 B CN 112475667B CN 202011269960 A CN202011269960 A CN 202011269960A CN 112475667 B CN112475667 B CN 112475667B
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- copper
- powder
- filler metal
- brazing filler
- magnesium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Abstract
The invention discloses a metal brazing active brazing filler metal for a ceramic copper-clad substrate and a manufacturing process thereof, wherein the metal brazing active brazing filler metal comprises a substrate body, a copper layer and a composite brazing filler metal layer, the copper layer is arranged at the upper end of the substrate body, the composite brazing filler metal layer is arranged at the lower end of the copper layer, the composite brazing filler metal layer is prepared by using the active brazing filler metal, and the active brazing filler metal specifically comprises the following materials: the active brazing filler metal comprises copper, barium, calcium, magnesium, sodium and titanium, and the active brazing filler metal comprises the following components in parts by mass: 60-80% of copper, 1-5% of barium, 5-10% of calcium, 3-7% of magnesium, 4-9% of sodium and 8-15% of titanium. The invention avoids using gold and silver materials, saves cost and has certain application value.
Description
Technical Field
The invention relates to the technical field of ceramic substrates, in particular to a metal brazing active brazing filler metal for a ceramic copper-clad substrate and a manufacturing process thereof.
Background
The copper-clad ceramic is also called as a copper-clad ceramic substrate, and is an electronic base material prepared by directly sintering copper foil on the surface of ceramic by using a DCB (direct chemical vapor deposition) technology. The copper-clad ceramic substrate has the characteristics of excellent thermal cyclicity, stable shape, good rigidity, high thermal conductivity and high reliability, the copper-clad surface can be etched to form various patterns, the copper-clad ceramic substrate is a pollution-free and nuisanceless green product, the use temperature is quite wide, the temperature can be from-55 ℃ to 850 ℃, the thermal expansion coefficient is close to silicon, and the copper-clad ceramic substrate has quite wide application fields: the high-power semiconductor power supply can be used in a plurality of industrial electronic fields such as semiconductor refrigerators, electronic heaters, high-power semiconductor modules, power control circuits, power hybrid circuits, intelligent power components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace and military electronic components, solar panel components, telecommunication private exchanges, receiving systems, lasers and the like.
When the existing silver-based brazing diamond is used, the manufacturing cost is high and the actual application value is poor due to the fact that a large amount of gold and silver materials are contained. Therefore, the invention provides a metal brazing active solder for a ceramic copper-clad substrate and a manufacturing process thereof, and aims to solve the problems.
Disclosure of Invention
The invention aims to provide a metal brazing active solder for a ceramic copper-clad substrate and a manufacturing process thereof, and aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the metal brazing active brazing filler metal for the ceramic copper-clad substrate comprises a substrate body, a copper layer and a composite brazing filler metal layer, wherein the copper layer is arranged at the upper end of the substrate body, and the composite brazing filler metal layer is arranged at the lower end of the copper layer.
As a further scheme of the invention: the active solder is specifically composed of the following materials: copper, barium, calcium, magnesium, sodium and titanium.
As a still further scheme of the invention: the mass of the active solder is specifically composed of the following components by mass: 60-80% of copper, 1-5% of barium, 5-10% of calcium, 3-7% of magnesium, 4-9% of sodium and 8-15% of titanium.
As a still further scheme of the invention: the mass of the active solder is specifically composed of the following components by mass: 67% of copper, 3% of barium, 8% of calcium, 5% of magnesium, 7% of sodium and 10% of titanium.
As a still further scheme of the invention:
the manufacturing process of the active solder comprises the following specific steps:
firstly, weighing copper, barium, calcium, magnesium, sodium and titanium according to a proportion for later use, and putting the copper, barium, calcium, magnesium, sodium and titanium materials into a grinder for grinding to obtain copper powder, barium powder, calcium powder, magnesium powder, sodium powder and titanium powder;
secondly, putting the copper powder and the magnesium powder obtained in the first step into a vacuum crucible, and heating to 1500-1700 ℃ to mix and smelt the copper powder and the magnesium powder;
thirdly, standing and cooling the mixture of the copper powder and the magnesium powder obtained in the second step, adding calcium powder and titanium powder into a crucible, continuously heating to 1200-1300 ℃, and cooling to 150-200 ℃;
and step four, finally, adding sodium powder into the crucible in the step three, continuously heating to 400-600 ℃, and injecting the obtained alloy into a mold to obtain the active brazing filler metal.
As a still further scheme of the invention: in the second step, the heating time in the vacuum crucible was 0.5 hour.
As a still further scheme of the invention: and in the third step, the temperature for standing and cooling the mixture of the copper powder and the magnesium powder is 500-600 ℃.
As a still further scheme of the invention: in the third step, the interval time for adding the calcium powder and the titanium powder is 1-1.5 hours.
As a still further scheme of the invention: in the fourth step, sodium powder is added into the crucible and heated for 2-3 hours.
As a still further scheme of the invention: the active solder is used for manufacturing a ceramic copper-clad substrate.
Compared with the prior art, the invention has the beneficial effects that: the invention avoids using gold and silver materials, saves cost and has certain application value.
Drawings
Fig. 1 is a schematic structural diagram of a ceramic copper-clad substrate.
In the figure: 1. a substrate body; 2. a copper layer; 3. and compounding an active brazing filler metal layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Example one
Referring to fig. 1, in an embodiment of the present invention, a ceramic copper-clad substrate includes a substrate body 1, a copper layer 2, and a composite active solder layer 3, wherein the copper layer 2 is disposed at an upper end of the substrate body 1, and the composite active solder layer 3 is disposed at a lower end of the copper layer 2.
The active solder is specifically composed of the following materials: copper, barium, calcium, magnesium, sodium and titanium.
The mass of the active solder is specifically composed of the following components by mass: 60-80% of copper, 1-5% of barium, 5-10% of calcium, 3-7% of magnesium, 4-9% of sodium and 8-15% of titanium.
The mass of the active solder is specifically composed of the following components by mass: 67% of copper, 3% of barium, 8% of calcium, 5% of magnesium, 7% of sodium and 10% of titanium, wherein the active brazing filler metal is used for a ceramic copper-clad substrate.
The manufacturing process of the active solder comprises the following specific steps:
firstly, weighing copper, barium, calcium, magnesium, sodium and titanium according to a proportion for later use, and putting the copper, barium, calcium, magnesium, sodium and titanium materials into a grinder for grinding to obtain copper powder, barium powder, calcium powder, magnesium powder, sodium powder and titanium powder;
secondly, placing the copper powder and the magnesium powder obtained in the first step into a vacuum crucible, and heating to 1500 ℃ to mix and melt the copper powder and the magnesium powder, wherein the heating time in the vacuum crucible is 0.5 hour;
thirdly, standing and cooling the mixture of the copper powder and the magnesium powder obtained in the second step, adding calcium powder and titanium powder into a crucible, continuously heating to 1200 ℃, cooling to 150 ℃, wherein the standing and cooling temperature of the mixture of the copper powder and the magnesium powder is 500 ℃, and the interval time of adding the calcium powder and the titanium powder is 1 hour;
and fourthly, finally, adding sodium powder into the crucible in the third step, continuously heating to 400 ℃, injecting the obtained alloy into a mold to obtain the active brazing filler metal, wherein the time for adding the sodium powder into the crucible and heating is 2 hours.
Example two
Referring to fig. 1, in an embodiment of the present invention, a ceramic copper-clad substrate includes a substrate body 1, a copper layer 2, and a composite active solder layer 3, wherein the copper layer 2 is disposed at an upper end of the substrate body 1, and the composite active solder layer 3 is disposed at a lower end of the copper layer 2.
The active solder is specifically composed of the following materials: copper, barium, calcium, magnesium, sodium and titanium.
The mass of the active solder is specifically composed of the following components by mass: 60-80% of copper, 1-5% of barium, 5-10% of calcium, 3-7% of magnesium, 4-9% of sodium and 8-15% of titanium.
The mass of the active solder is specifically composed of the following components by mass: 67% of copper, 3% of barium, 8% of calcium, 5% of magnesium, 7% of sodium and 10% of titanium, wherein the active solder is used for a ceramic copper-clad substrate.
The manufacturing process of the active solder comprises the following specific steps:
firstly, weighing copper, barium, calcium, magnesium, sodium and titanium according to a proportion for later use, and putting the copper, barium, calcium, magnesium, sodium and titanium materials into a grinder for grinding to obtain copper powder, barium powder, calcium powder, magnesium powder, sodium powder and titanium powder;
secondly, placing the copper powder and the magnesium powder obtained in the first step into a vacuum crucible, and heating to 1700 ℃ to mix and melt the copper powder and the magnesium powder, wherein the heating time in the vacuum crucible is 0.5 hour;
thirdly, standing and cooling the mixture of the copper powder and the magnesium powder obtained in the second step, adding calcium powder and titanium powder into a crucible, continuously heating to 1300 ℃, cooling to 200 ℃, wherein the standing and cooling temperature of the mixture of the copper powder and the magnesium powder is 600 ℃, and the interval time of adding the calcium powder and the titanium powder is 1.5 hours;
and fourthly, finally, adding sodium powder into the crucible in the third step, continuously heating to 600 ℃, injecting the obtained alloy into a mold to obtain the active brazing filler metal, and adding the sodium powder into the crucible and heating for 3 hours.
EXAMPLE III
Referring to fig. 1, in an embodiment of the present invention, a ceramic copper-clad substrate includes a substrate body 1, a copper layer 2, and a composite active solder layer 3, wherein the copper layer 2 is disposed at an upper end of the substrate body 1, and the composite active solder layer 3 is disposed at a lower end of the copper layer 2.
The active solder is specifically composed of the following materials: copper, barium, calcium, magnesium, sodium and titanium.
The mass of the active solder is specifically composed of the following components by mass: 60-80% of copper, 1-5% of barium, 5-10% of calcium, 3-7% of magnesium, 4-9% of sodium and 8-15% of titanium.
The mass of the active solder is specifically composed of the following components by mass: 67% of copper, 3% of barium, 8% of calcium, 5% of magnesium, 7% of sodium and 10% of titanium, wherein the active brazing filler metal is used for a ceramic copper-clad substrate.
The manufacturing process of the active solder comprises the following specific steps:
firstly, weighing copper, barium, calcium, magnesium, sodium and titanium according to a proportion for later use, and putting the copper, barium, calcium, magnesium, sodium and titanium materials into a grinder for grinding to obtain copper powder, barium powder, calcium powder, magnesium powder, sodium powder and titanium powder;
secondly, placing the copper powder and the magnesium powder obtained in the first step into a vacuum crucible, and heating to 1600 ℃ to mix and smelt the copper powder and the magnesium powder, wherein the heating time in the vacuum crucible is 0.5 hour;
thirdly, standing and cooling the mixture of the copper powder and the magnesium powder obtained in the second step, adding calcium powder and titanium powder into a crucible, continuously heating to 1150 ℃, cooling to 170 ℃, wherein the standing and cooling temperature of the mixture of the copper powder and the magnesium powder is 550 ℃, and the interval time of adding the calcium powder and the titanium powder is 1.25 hours;
and fourthly, finally, adding sodium powder into the crucible in the third step, continuously heating to 500 ℃, injecting the obtained alloy into a mold to obtain the active brazing filler metal, and adding the sodium powder into the crucible and heating for 2.5 hours.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (2)
1. A ceramic copper-clad substrate comprises a substrate body (1), a copper layer (2) and a composite active brazing filler metal layer (3), and is characterized in that the copper layer (2) is arranged at the upper end of the substrate body (1), and the composite active brazing filler metal layer (3) is arranged at the lower end of the copper layer (2); the active solder used by the composite active solder layer is prepared from the following components in percentage by mass: 60-80% of copper, 1-5% of barium, 5-10% of calcium, 3-7% of magnesium, 4-9% of sodium and 8-15% of titanium.
2. The ceramic copper-clad substrate according to claim 1, wherein the active solder is prepared from the following components in percentage by mass: 67% of copper, 3% of barium, 8% of calcium, 5% of magnesium, 7% of sodium and 10% of titanium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011269960.XA CN112475667B (en) | 2020-11-13 | 2020-11-13 | Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011269960.XA CN112475667B (en) | 2020-11-13 | 2020-11-13 | Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof |
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| Publication Number | Publication Date |
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| CN112475667A CN112475667A (en) | 2021-03-12 |
| CN112475667B true CN112475667B (en) | 2023-03-21 |
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Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4077888B2 (en) * | 1995-07-21 | 2008-04-23 | 株式会社東芝 | Ceramic circuit board |
| JP3559458B2 (en) * | 1998-11-25 | 2004-09-02 | 京セラ株式会社 | Brazing material |
| CN102554385B (en) * | 2011-12-13 | 2013-09-04 | 河南科技大学 | Brazing and casting process of metal ceramic composite lining board |
| TR201908097T4 (en) * | 2015-01-22 | 2019-06-21 | Saxonia Technical Mat Gmbh | Brazing alloy. |
| CN106238962A (en) * | 2016-08-30 | 2016-12-21 | 郑州机械研究所 | A kind of active solder alloy |
| CN106271211A (en) * | 2016-09-29 | 2017-01-04 | 中国科学院高能物理研究所 | Solder and method for welding for ceramic/metal soldering |
| CN106624443A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Yellow brass brazing filler metal alloy |
| CN107350655B (en) * | 2017-08-07 | 2020-05-12 | 北京科技大学 | Copper/tin nano composite powder active solder and preparation method thereof |
| JP6928507B2 (en) * | 2017-08-24 | 2021-09-01 | 古河電気工業株式会社 | Material for metal bonding |
| CN109465568A (en) * | 2018-12-29 | 2019-03-15 | 郑州机械研究所有限公司 | A kind of diamond grinding tool soldering copper based active solder |
| CN109465567A (en) * | 2018-12-29 | 2019-03-15 | 郑州机械研究所有限公司 | A kind of diamond abrasive tool soldering active solder |
| CN109865961B (en) * | 2019-03-05 | 2021-07-20 | 苏州昆腾威新材料科技有限公司 | Copper-based spherical powder material and preparation method and application thereof |
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