CN112474737B - Intelligent chip disassembling device - Google Patents
Intelligent chip disassembling device Download PDFInfo
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- CN112474737B CN112474737B CN202011306909.1A CN202011306909A CN112474737B CN 112474737 B CN112474737 B CN 112474737B CN 202011306909 A CN202011306909 A CN 202011306909A CN 112474737 B CN112474737 B CN 112474737B
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- 230000007246 mechanism Effects 0.000 claims abstract description 313
- 238000005520 cutting process Methods 0.000 claims abstract description 130
- 238000001514 detection method Methods 0.000 claims abstract description 59
- 238000003825 pressing Methods 0.000 claims description 26
- 239000002699 waste material Substances 0.000 claims description 14
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000004809 Teflon Substances 0.000 claims description 6
- 229920006362 Teflon® Polymers 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 230000002457 bidirectional effect Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Processing Of Solid Wastes (AREA)
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Abstract
The invention discloses an intelligent chip disassembling device which comprises a first conveying mechanism, a width measuring mechanism, a second conveying mechanism, two fixing mechanisms, a chip detecting mechanism, a controller and a cutting mechanism, wherein the first conveying mechanism is used for conveying chips to a first die; the width measuring mechanism is used for pushing the circuit board conveyed by the first conveying mechanism to one side of the first conveying mechanism so as to measure the width of the circuit board; the controller is respectively connected with the width measuring mechanism and the second conveying mechanism in a signal way; the second conveying mechanism is sequentially provided with a detection position and a cutting position along the conveying direction of the circuit board; the controller is also connected with the chip detection mechanism and the cutting mechanism respectively, and is also used for controlling the action of the cutting mechanism according to the chip position and the chip size detected by the chip detection mechanism so that the cutting mechanism cuts the chip. The invention can automatically convey the circuit board, effectively detect the width of the circuit board and carry out self-adaptive adjustment, intelligently identify the position and the outline dimension of the chip, automatically adjust the cutting position to be quickly disassembled, and has high automation degree and working efficiency.
Description
Technical Field
The invention belongs to the technical field of electronic element recycling equipment, and relates to an intelligent chip disassembling device.
Background
The circuit board is used as the most active electronic component, almost contained in most electronic products, and has a high proportion in computers, large-scale communication equipment and military products. Since the circuit board contains a large number of electronic chips, the number of waste electronic chips increases sharply as the number of waste circuit boards increases. The electronic chip of the abandoned circuit board is comprehensively treated, so that the natural environment can be protected, and certain resources can be recycled, thereby achieving the purpose of reducing the manufacturing cost of components.
At present, the resource recycling technology for treating wastes such as electronic chips in China is divided into the following categories: firstly, a recovery technology based on a manual processing method, wherein a chip on a circuit board is manually removed by using tools such as a nipper pliers and the like; and secondly, a processing technology based on a physical method. Both of these methods are generally inefficient and can cause harm to the human body and the environment.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides an intelligent chip disassembling device which can automatically convey a circuit board, effectively detect the width of the circuit board and carry out self-adaptive adjustment, intelligently identify the position and the outline dimension of a chip, automatically adjust the cutting position to quickly disassemble, and has high automation degree and high working efficiency.
In order to solve the technical problems, the technical scheme of the invention is as follows: the intelligent chip disassembling device comprises a first conveying mechanism, a width measuring mechanism, a second conveying mechanism, 2 fixing mechanisms, a chip detecting mechanism, a cutting mechanism and a controller; wherein,
the width measuring mechanism is used for pushing the circuit board conveyed by the first conveying mechanism to one side of the first conveying mechanism along the conveying direction perpendicular to the circuit board so as to measure the width of the circuit board;
the controller is respectively connected with the width measuring mechanism and the second conveying mechanism in a signal way and is used for controlling the second conveying mechanism to act according to the width measured by the width measuring mechanism so that the second conveying mechanism is adjusted to a state matched with the width of the circuit board to receive and convey the circuit board of the first conveying mechanism;
the second conveying mechanism is sequentially provided with a detection position and a cutting position along the conveying direction of the circuit board, one of the 2 fixing mechanisms is used for fixing the circuit board at the detection position, and the other fixing mechanism is used for fixing the circuit board at the cutting position;
the chip detection mechanism is used for detecting the chip position and the chip size of the circuit board positioned at the detection position, the cutting mechanism is used for cutting the circuit board positioned at the cutting position, and the controller is also respectively connected with the chip detection mechanism and the cutting mechanism in a signal manner and is used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism so that the cutting mechanism cuts the chip.
Further in order to conveniently receive the material to the chip, chip intelligence disassembling device still includes the chip receiving mechanism that is located the cutting position below in order to accept the chip.
Further for facilitating the collection of circuit board waste, a waste receiving mechanism is located at the tail end of the second conveying mechanism for receiving the circuit board from which the chips are cut.
There is further provided a specific structure of a width measuring mechanism, the width measuring mechanism comprising:
the clamping mechanism comprises a push plate, a fixed plate fixed on the frame of the first conveying mechanism and a push plate moving driving mechanism connected with the push plate to drive the push plate to move in a conveying direction perpendicular to the circuit board so that at least the push plate and the fixed plate clamp the circuit board;
the grating ruler is fixed in position of the scale grating and extends along the moving direction of the pushing plate, and the grating ruler reading head is fixed on the pushing plate to move along with the pushing plate and is matched with the scale grating to read the reading of the scale grating so as to obtain the distance between the pushing plate and the fixed plate.
There is further provided a specific structure of a second conveying mechanism including:
2 conveyor belt modules for conveying the circuit boards together;
a conveyor belt module moving driving mechanism connected with one of the conveyor belt modules to drive the conveyor belt module to move towards or away from the other conveyor belt module; wherein,
The controller is in signal connection with the conveyor belt module moving driving mechanism and is used for controlling the movement of the conveyor belt module moving driving mechanism according to the width measured by the width measuring mechanism so that the distance between 2 conveyor belt modules is matched with the width of the circuit board.
The conveyor belt module comprises a frame body, a driving wheel, a driven wheel and a second conveyor belt, wherein the driving wheel and the driven wheel are respectively rotatably supported on the frame body, the second conveyor belt is tensioned between the driving wheel and the driven wheel, and the driving wheel can be driven to rotate so as to drive the second conveyor belt to move; the driving wheels of the 2 conveyor belt modules are in transmission connection through a first spline shaft, the driving wheels of the movable conveyor belt modules can be sleeved on the first spline shaft in a sliding manner along the axial direction of the first spline shaft, and the first spline shaft is connected with a second motor so as to drive the first spline shaft to rotate through the second motor.
The belt module moving driving mechanism comprises at least one synchronous belt module which is perpendicular to the conveying direction of the circuit board and is connected with one of the belt modules to drive the belt module to move towards or back to the other belt module when the belt module moves.
The chip detection mechanism comprises an industrial camera for shooting image information of a circuit board positioned at a detection position and a graphic processor which is in signal connection with the industrial camera and is used for processing the image information shot by the industrial camera to obtain the chip position and the chip size of the circuit board, and the graphic processor is in signal connection with the controller.
The fixing mechanism comprises at least one fixing component, the fixing component comprises a pressing cylinder and a pressing plate, a cylinder rod of the pressing cylinder is connected with the pressing plate to drive the pressing plate to move downwards so as to press the circuit board on the conveyor belt module, and at least one pressing contact used for being in contact with the circuit board is arranged on the lower surface of the pressing plate.
There is further provided a specific structure of a cutting mechanism comprising:
the cutting mechanism main body is used for carrying out bilateral cutting on the chip;
the rotary driving mechanism is connected with the cutting mechanism main body and is used for driving the cutting mechanism to rotate by 90 degrees;
and the triaxial mechanical arm is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism and the cutting mechanism main body to realize three-dimensional movement.
There is further provided a specific structure of a cutting mechanism body comprising:
a cutting frame;
the power mechanism comprises a second spline shaft rotatably supported on the cutting frame and a third motor connected with the second spline shaft to drive the second spline shaft to rotate;
the 2 cutting assemblies comprise a cutter seat and a blade, the cutter seat can move along the axial direction of the second spline shaft and is sleeved on the second spline shaft in a synchronous rotation mode along with the second spline shaft, and the blade is arranged on the cutter seat;
the cutter holders are in one-to-one correspondence with the cutter holders, and the cutter holders are rotatably arranged in the corresponding cutter holders through rolling bearings;
the cutter sleeve moving driving mechanism is connected with 2 cutter sleeves to drive the 2 cutter sleeves to move oppositely or back to adjust the distance between the 2 blades.
There is further provided a specific structure of a rotary drive mechanism including a rotary cylinder.
The three-axis mechanical arm is a three-axis linear module, and the three-axis linear module comprises an X-axis linear module, a Y-axis linear module and a Z-axis linear module; further on
The Y-axis linear module is arranged on the X-axis linear module to drive the X-axis linear module to move along the X axis;
The Z-axis linear module is arranged on the Y-axis linear module to drive the Y-axis linear module to move along the Y axis;
the rotary driving mechanism is arranged on the Z-axis linear module to drive the Z-axis linear module to move along the Z axis.
Further provided is a specific structure of a cutter sleeve movement driving mechanism, comprising:
the two-way screw rod is rotatably supported on the cutting frame, the 2 cutter sleeves are respectively and slidably arranged on the cutting frame, one cutter sleeve is in threaded connection with one end part of the two-way screw rod, and the other cutter sleeve is in threaded connection with the other end part of the two-way screw rod;
and the fourth motor is connected with the bidirectional screw rod to drive the bidirectional screw rod to rotate.
The chip receiving mechanism comprises a chip conveying mechanism and a dust collector, wherein a conveying belt of the chip conveying mechanism is a Teflon grid conveying belt, and the dust collector is used for sucking cutting scraps from below the Teflon grid conveying belt.
Further provided is a specific structure of a waste receiving mechanism comprising a waste frame.
Further in order to be transferred to the width measurement position after the circuit board, first transport mechanism can the automatic stop action, and push pedal removal actuating mechanism can the automatic drive push pedal be moved towards the fixed plate, and chip intelligence detaching device still includes:
A first detection device adapted to detect that the circuit board enters the width measurement region to generate a measurement preparation signal; the controller is also respectively connected with the first detection device, the first conveying mechanism and the push plate movement driving mechanism in a signal manner, and is suitable for receiving a measurement preparation signal to simultaneously control the first conveying mechanism to stop acting and the push plate movement driving mechanism to drive the push plate to move towards the fixed plate.
Further in order to prevent that the push pedal from removing actuating mechanism and stop work when not driving the push pedal to remove in place towards the fixed plate, also in order to prevent push pedal transition extrusion circuit board, chip intelligence dismounting device still includes:
at least one tension pressure sensor which is installed on the push plate and is in contact with the circuit board in the process of pushing the circuit board by the push plate, and is suitable for detecting the pressure value applied by the circuit board; the controller is also respectively connected with the pull pressure sensor and the push plate movement driving mechanism in a signal way, and is suitable for controlling the push plate movement driving mechanism to stop working when the received pressure value exceeds a preset value.
Further in order to guarantee that the push pedal can automatic stop remove after resetting in place to guarantee that the push pedal can all move to the same position in dorsad fixed plate at every turn, chip intelligence disassembling device still includes:
The limit switch is suitable for detecting that the push plate moves to the right position back to the fixed plate so as to generate a reset signal; the controller is also respectively connected with the limit switch and the push plate movement driving mechanism in a signal manner and is suitable for receiving a reset signal to control the push plate movement driving mechanism to stop working.
Further in order to make the fixed establishment who is located the detection position and chip detection mechanism can automatic operation in suitable opportunity, chip intelligence detaching device still includes:
a second detecting device adapted to detect that the circuit board enters the detecting position to generate a circuit board detection signal; the controller is also respectively connected with the second detection device, the second conveying mechanism, the fixing mechanism positioned at the detection position and the chip detection mechanism in a signal way, and is suitable for receiving the detection signal of the circuit board to control the second conveying mechanism to stop working and control the fixing mechanism positioned at the detection position to act, and then control the chip detection mechanism to act.
Further in order to make the fixed establishment and the cutting mechanism that are located the cutting position can automatic work in suitable opportunity, chip intelligence detaching device still includes:
a third detecting device adapted to detect that the circuit board enters the cutting position to generate a circuit board cutting signal; the controller is also respectively connected with the third detection device, the second conveying mechanism, the fixing mechanism positioned at the cutting position and the cutting mechanism in a signal manner, and is suitable for receiving the cutting signal of the circuit board to control the second conveying mechanism to stop working and control the fixing mechanism positioned at the cutting position to act, and then control the cutting mechanism to act.
After the technical scheme is adopted, the circuit board is placed on the first conveying mechanism in the process of disassembling the circuit board chip, when the circuit board is conveyed to the position of the width measuring mechanism, the width measuring mechanism pushes the circuit board to one side of the first conveying mechanism and measures the width of the circuit board, the second conveying mechanism carries out self-adaptive adjustment according to the width of the circuit board, so that the circuit board is adjusted to a state adapting to the width of the circuit board, after entering the second conveying mechanism, the circuit board is sequentially conveyed to the measuring position and the cutting position, when the circuit board is conveyed to the measuring position, the circuit board is firstly fixed at the measuring position by one fixing mechanism, then the chip position and the chip size of the circuit board are detected by the chip detecting mechanism, when the circuit board is conveyed to the cutting position, the circuit board is firstly fixed at the cutting position by the other fixing mechanism, and the circuit board is cut by the cutting mechanism according to the chip position and the chip size to cut the lower chip.
Drawings
FIG. 1 is a schematic diagram of an intelligent chip disassembling device according to the present invention;
FIG. 2 is a schematic view of the first conveying mechanism and the width measuring mechanism of the present invention;
FIG. 3 is a front view of FIG. 2;
fig. 4 is an enlarged view of a portion a of fig. 3;
FIG. 5 is a right side view of FIG. 2;
fig. 6 is an enlarged view of a portion B of fig. 5;
FIG. 7 is a schematic diagram of a second conveying mechanism according to the present invention;
FIG. 8 is a schematic structural view of a fixing mechanism according to the present invention;
FIG. 9 is a schematic view of a cutting mechanism according to the present invention;
fig. 10 is a schematic structural view of the cutting mechanism body of the present invention after a part of the side plate of the cutting frame is removed.
Fig. 11 is a schematic diagram of a method for obtaining a width of a circuit board by an intelligent chip disassembling device according to an embodiment of the invention.
Detailed Description
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
As shown in fig. 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10, an intelligent chip disassembling device comprises a first conveying mechanism 1, a width measuring mechanism 2, a second conveying mechanism 3, two fixing mechanisms 8, a chip detecting mechanism 4 and a cutting mechanism; wherein,
the width measuring mechanism 2 is used for pushing the circuit board conveyed by the first conveying mechanism 1 to one side of the first conveying mechanism 1 along the conveying direction perpendicular to the circuit board so as to measure the width of the circuit board;
The controller is respectively connected with the width measuring mechanism 2 and the second conveying mechanism 3 in a signal way, and is used for controlling the second conveying mechanism 3 to act according to the width measured by the width measuring mechanism 2 so that the second conveying mechanism 3 is adjusted to a state matched with the width of the circuit board to receive and convey the circuit board of the first conveying mechanism 1;
the second conveying mechanism 3 is sequentially provided with a detection position and a cutting position along the conveying direction of the circuit board, one fixing mechanism 8 is used for fixing the circuit board at the detection position, and the other fixing mechanism 8 is used for fixing the circuit board at the cutting position;
the chip detection mechanism 4 is used for detecting the chip position and the chip size of the circuit board positioned at the detection position, the cutting mechanism is used for cutting the circuit board positioned at the cutting position, the controller is also respectively connected with the chip detection mechanism 4 and the cutting mechanism in a signal manner, and the controller is also used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism 4 so that the cutting mechanism cuts down the chip.
In this embodiment, the chip detection mechanism 4 includes an industrial camera for capturing image information of the circuit board located at the detection position, and a graphics processor in signal connection with the industrial camera for processing the image information captured by the industrial camera to obtain the chip position and the chip size of the circuit board, and the graphics processor is in signal connection with the controller.
Specifically, in the process of disassembling the circuit board chip, the circuit board is placed on the first conveying mechanism 1, when the circuit board is conveyed to the position of the width measuring mechanism 2, the width measuring mechanism 2 pushes the circuit board to one side of the first conveying mechanism 1 and measures the width of the circuit board, the second conveying mechanism 3 carries out self-adaptive adjustment according to the width of the circuit board, so that the circuit board is adjusted to a state adapting to the width of the circuit board, after entering the second conveying mechanism 3, the circuit board is conveyed to the measuring position and the cutting position in sequence, when the circuit board is conveyed to the measuring position, the circuit board is fixed at the measuring position by one fixing mechanism 8, then the chip position and the chip size of the circuit board are detected by the chip detecting mechanism 4, when the circuit board is conveyed to the cutting position, the circuit board is fixed at the cutting position by the other fixing mechanism 8, and the circuit board is cut by the cutting mechanism according to the chip position and the chip size, the circuit board can be automatically conveyed to a state adapting to the width of the circuit board, the circuit board can be effectively detected, the circuit board width is automatically adjusted in a self-adaptive mode, the chip position and the chip size is automatically recognized, the chip position and the chip size is automatically adjusted, and the chip size is not damaged by workers, and the chip can be quickly disassembled, and the working efficiency is high.
As shown in fig. 1, for facilitating the material collection of the chips, the intelligent chip disassembling device further includes a chip receiving mechanism located below the cutting position to receive the chips.
In this embodiment, the chip receiving mechanism includes a chip conveying mechanism 51 and a dust collector 52, the conveyor belt of the chip conveying mechanism 51 is a teflon mesh conveyor belt, and the dust collector 52 is used for sucking cutting scraps from below the teflon mesh conveyor belt.
As shown in fig. 1, to facilitate collection of the circuit board waste, the chip intelligent disassembling device further comprises a waste receiving mechanism 6 located at the tail end of the second conveying mechanism 3 to receive the circuit board from which the chips are cut.
In this embodiment, the waste receiving means 6 comprises a waste frame.
As shown in fig. 1, 2, 3, 4, 5, 6, the width measuring mechanism 2 includes:
a clamping mechanism including a push plate 21, a fixing plate 22 fixed to a frame of the first conveying mechanism 1, and a push plate movement driving mechanism connected to the push plate 21 to drive the push plate 21 to move in a conveying direction perpendicular to the circuit board so as to at least cause the push plate 21 and the fixing plate 22 to clamp the circuit board;
the grating ruler is characterized in that the position of the scale grating 23 is fixed and extends along the moving direction of the push plate 21, and the grating ruler reading head 24 is fixed on the push plate 21 to move along with the push plate 21 and is matched with the scale grating 23 to read the reading of the scale grating 23 so as to obtain the distance between the push plate 21 and the fixed plate 22.
Specifically, the width measuring mechanism 2 of the present invention employs a grating ruler, which has low cost and high measurement accuracy, the displacement of the push plate 21 or the distance between the fixing plate 22 and the push plate 21 is measured by the grating ruler, and then the width of the circuit board 100 (for example (see fig. 11) is obtained, the distance between the push plate 21 and the fixing plate 22 in the initial state (or the position where the limit switch 130 detects that the push plate 21 moves away from the fixing plate 22 and generates the reset signal) is the measured value L1, and the displacement L2 of the push plate 21 in the stroke from the start of the push plate 21 moving toward the fixing plate 22 to the clamping of the circuit board 100 by the push plate 21 and the fixing plate 22 is measured by the grating ruler, and the width D of the circuit board 100 is L1-L2).
In the present embodiment, the first conveying mechanism 1 includes:
a frame;
the roller set comprises a driving roller and a driven roller which are respectively rotatably supported on the frame;
a first conveyor belt tensioned between the drive roller and the driven roller;
a rotary drive member directly or indirectly connected to the drive roller for driving the drive roller in rotation.
In this embodiment, the push plate movement driving mechanism includes:
a mounting frame 25, on which the push plate 21 is slidably fitted to the mounting frame 25;
a screw-nut pair including a screw 26 rotatably supported on the mounting frame 25 and a nut block 27 screwed with the screw 26 and fixedly connected with the push plate 21;
A first motor 28 directly or indirectly connected to the screw 26 to drive the screw 26 to rotate; wherein,
at least one guide rail 291 is fixed to the mounting frame 25, and a guide block 292 corresponding to the guide rail 291 and slidably engaged with the corresponding guide rail 291 is fixed to the push plate 21.
Specifically, the push plate movement driving mechanism of the invention adopts a screw-nut pair, has high movement precision, and guides the movement of the push plate 21 through the cooperation of the guide rail 291 and the guide block 292, thereby enabling the push plate 21 to move stably.
As shown in fig. 1 and 7, the second conveying mechanism 3 includes:
two conveyor belt modules for conveying circuit boards together;
a conveyor belt module moving driving mechanism connected with one of the conveyor belt modules to drive the conveyor belt module to move towards or away from the other conveyor belt module; wherein,
the controller is used for controlling the movement driving mechanism of the conveyor belt module to act according to the width measured by the width measuring mechanism 2 so that the distance between the two conveyor belt modules is matched with the width of the circuit board.
As shown in fig. 1 and 7, the conveyor belt module comprises a frame 31, a driving wheel 32, a driven wheel 33 and a second conveyor belt, wherein the driving wheel 32 and the driven wheel 33 are respectively rotatably supported on the frame 31, the second conveyor belt is tensioned between the driving wheel 32 and the driven wheel 33, and the driving wheel 32 can be driven to rotate so as to drive the second conveyor belt to move; the driving wheels 32 of the two conveyor belt modules are in transmission connection through a first spline shaft 34, the driving wheels 32 of the movable conveyor belt modules can be sleeved on the first spline shaft 34 in a sliding manner along the axial direction of the first spline shaft 34, and the first spline shaft 34 is connected with a second motor 35 to drive the first spline shaft 34 to rotate through the second motor 35.
Specifically, the driving wheels 32 of the two conveyor belt modules are in transmission connection through the first spline shaft 34, so that the equal movement speed of the two conveyor belt modules can be well ensured while the movement of one conveyor belt module is not influenced, and the circuit board is ensured not to deviate in the process of being conveyed.
In this embodiment, in order to share the pressure applied to the second conveyor belt to prevent the second conveyor belt from being loosened or damaged due to long-term use, the conveyor belt module further includes a plurality of support wheels 38, the plurality of support wheels 38 being rotatably supported on the frame 31, between the driving wheel 32 and the driven wheel 33, and in contact with the lower surface of the upper half of the second conveyor belt to support the second conveyor belt, respectively. The frame 31 is fixed with a baffle 39 located outside the circuit board to prevent the circuit board from being deviated.
As shown in fig. 1 and 7, the belt module moving driving mechanism includes at least one synchronous belt module 36, where the synchronous belt module 36 is perpendicular to the conveying direction of the circuit board and is connected to one of the belt modules to drive the belt module to move toward or away from the other belt module when the belt module moves.
In this embodiment, the structure of the synchronous belt module 36 is identical to that of the conveyor belt module, and a mounting plate is fixed on the conveyor belt of the synchronous belt module 36 and is fixedly connected with the frame 31 of the movable conveyor belt module. In order to make the conveyor belt module movement driving mechanism work better, the synchronous belt modules 36 are arranged in parallel, and in order to ensure that the movement speeds of the two synchronous belt modules 36 are consistent, the driving wheels 32 of the two synchronous belt modules 36 are in transmission connection through a rotating shaft 37.
As shown in fig. 7 and 8, the fixing mechanism 8 includes at least one fixing assembly, the fixing assembly includes a pressing cylinder 81 and a pressing plate 82, a cylinder rod of the pressing cylinder 81 is connected with the pressing plate 82 to drive the pressing plate 82 to move downwards so as to press the circuit board on the conveyor module, and at least one pressing contact 83 for contacting the circuit board is mounted on the lower surface of the pressing plate 82. The pressing contact 83 can prevent the pressing plate 82 from pressing against the circuit board.
As shown in fig. 1, 9, 10, the cutting mechanism includes:
a dicing mechanism main body 7 for performing double-sided dicing on the chip;
a rotation driving mechanism connected to the cutting mechanism body 7 for driving the cutting mechanism to rotate by 90 °;
And the triaxial mechanical arm 9 is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism and the cutting mechanism main body 7 to realize three-dimensional movement.
In this embodiment, two fixing assemblies are oppositely arranged, and the cylinder body of each pressing cylinder 81 is fixed on the frame 31 of one conveyor belt module.
Specifically, in the process of working of the cutting mechanism, the three-axis mechanical arm 9 drives the rotary driving mechanism and the cutting mechanism main body 7 to move to a cutting position, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to move downwards to a preset cutting depth while the cutting mechanism main body 7 acts, then the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to move along the cutting direction, after the cutting mechanism main body 7 completes bilateral cutting in the process of moving along the cutting direction, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to reset, then the rotary driving mechanism drives the cutting mechanism main body 7 to rotate 90 degrees, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to move to another cutting position, and the cutting mechanism main body 7 is driven to reset by the three-axis mechanical arm 9 after the cutting is completed.
As shown in fig. 9 and 10, the cutting mechanism body 7 includes:
a cutting frame;
a power mechanism including a second spline shaft 72 rotatably supported on the cutter frame and a third motor 73 connected to the second spline shaft 72 to drive the second spline shaft 72 to rotate;
the two cutting assemblies comprise a cutter seat 74 which can move along the axial direction of the second spline shaft 72 and is sleeved on the second spline shaft 72 in a synchronous rotation way along with the second spline shaft 72, and a blade 75 arranged on the cutter seat 74;
the knife sleeves 76 are in one-to-one correspondence with the knife holders 74, and the knife holders 74 are rotatably arranged in the corresponding knife sleeves 76 through rolling bearings;
the knife sleeve moving driving mechanism is connected with the two knife sleeves 76 to drive the two knife sleeves 76 to move towards or away from each other so as to adjust the distance between the two knife blades 75.
Specifically, the distance between the two blades 75 can be adjusted through the cutter sleeve moving driving mechanism, so that the cutter sleeve moving driving mechanism can meet the cutting requirements of chips with different sizes, and the application range of the cutter sleeve moving driving mechanism is greatly expanded.
As shown in fig. 9, the rotary drive mechanism includes a rotary cylinder 10.
As shown in fig. 9, the tri-axial mechanical arm 9 is a tri-axial linear module, and the tri-axial linear module includes an X-axis linear module 91, a Y-axis linear module 92, and a Z-axis linear module 93; wherein,
The Y-axis linear module 92 is mounted on the X-axis linear module 91 to drive the X-axis linear module 91 to move along the X-axis;
the Z-axis linear module 93 is mounted on the Y-axis linear module 92 to drive the Y-axis linear module 92 to move along the Y-axis;
the rotation driving mechanism is installed on the Z-axis linear module 93 to drive the Z-axis linear module 93 to move along the Z-axis.
In this embodiment, in order to increase the moving stability of the Y-axis linear module 92, the tri-axial linear module further includes a sliding rail 95 parallel to the X-axis, one end of the Y-axis linear module 92 is mounted on the X-axis linear module 91, and the other end is provided with a sliding block in sliding fit with the sliding rail 95, and the sliding block is slidably mounted on the sliding rail 95.
In this embodiment, the X-axis linear module 91 is provided with a first mounting plate 911, and the y-axis linear module 92 is fixed on the first mounting plate 911; the Y-axis linear module 92 is provided with a second mounting plate 921, and the Z-axis linear module 93 is fixed on the second mounting plate 921; the Z-axis linear module 93 is provided with a third mounting plate 931, and a rotation driving mechanism is fixed to the third mounting plate 931.
In this embodiment, in order to protect the three-axis linear module, the organ covers 94 are respectively disposed at the positions of the X-axis linear module 91 on both sides of the first mounting plate 911, the Y-axis linear module 92 on both sides of the second mounting plate 921, and the Z-axis linear module 93 on both sides of the third mounting plate 931.
As shown in fig. 10, the knife pouch movement driving mechanism includes:
a bi-directional screw rod 77 rotatably supported on the cutting frame, two cutter housings 76 being slidably fitted on the cutting frame, respectively, one of the cutter housings 76 being screw-coupled to one end portion of the bi-directional screw rod 77, the other cutter housing 76 being screw-coupled to the other end portion of the bi-directional screw rod 77;
a fourth motor 78 connected to the bi-directional screw 77 to drive the bi-directional screw 77 to rotate;
in this embodiment, the cutting frame includes a box body 711 having an opening at the lower side and a partition 712 horizontally installed at the middle of the box body 711; wherein,
the second spline shaft 72 is located below the partition 712, and the bidirectional screw rod 77 is located above the partition 712;
the baffle 712 is provided with a strip-shaped groove parallel to the axial direction of the bidirectional screw rod 77, and the middle position of the cutter sleeve 76 is slidingly matched in the strip-shaped groove;
the third motor 73 is in transmission connection with the second spline shaft 72 through a transmission mechanism, the third motor 73 is in transmission connection with the bidirectional screw rod 77 through the transmission mechanism, and the machine bodies of the third motor 73 and the fourth motor 78 are respectively fixed on the upper surface of the partition 712.
Specifically, the cutting frame of such a structure is beautiful and reasonable in spatial arrangement, and cutting chips can be effectively prevented from splashing into the upper end portion of the cutting mechanism main body 7.
As shown in fig. 2 and 3, in order that the first conveying mechanism 1 may automatically stop after the circuit board is conveyed to the width measuring position, the pushing plate moving driving mechanism may automatically drive the pushing plate 21 to move toward the fixing plate 22, and the chip intelligent disassembling device further includes:
a first detection device 110 adapted to detect that the circuit board enters the width measurement region to generate a measurement preparation signal; the controller is also in signal connection with the first detecting device 110, the first conveying mechanism 1 and the push plate movement driving mechanism, respectively, and is adapted to receive a measurement preparation signal to simultaneously control the first conveying mechanism 1 to stop acting and the push plate movement driving mechanism to drive the push plate 21 to move towards the fixed plate 22.
Specifically, the present invention also automatically controls the first conveying mechanism 1 to stop moving when the first detecting device 110 detects that the circuit board enters the width measuring area, and controls the push plate moving driving mechanism to drive the push plate 21 to move toward the fixed plate 22, thereby improving the degree of automation, and effectively preventing the circuit board from being clamped between the fixed plate 22 and the push plate 21 in an inclined state due to the premature or too late pushing of the circuit board or the pushing of the circuit board in the moving process of the circuit board.
As shown in fig. 5 and 6, in order to prevent the push plate moving driving mechanism from stopping working when the push plate 21 is not driven to move toward the fixed plate 22 to a proper position, and also in order to prevent the push plate 21 from transitionally pressing the circuit board, the intelligent chip disassembling device further comprises:
At least one pull pressure sensor 120 mounted on the push plate 21 and contacting the circuit board during pushing of the circuit board by the push plate 21, adapted to detect a pressure value applied thereto by the circuit board; the controller is also in signal connection with the pull pressure sensor 120 and the push plate movement driving mechanism respectively, and is suitable for controlling the push plate movement driving mechanism to stop working when the received pressure value exceeds a preset value.
Specifically, the pressure sensor 120 is used for measuring the pressure between the push plate 21 and the circuit board, so that whether the push plate 21 moves in place is judged, the push plate 21 is effectively prevented from stopping too early or too late, the measuring accuracy of the width is further improved, and the circuit board is effectively prevented from being crushed.
As shown in fig. 3 and 4, in order to ensure that the pushing plate 21 can automatically stop moving after being reset in place and ensure that the pushing plate 21 can move to the same position away from the fixing plate 22 each time, the intelligent chip disassembling device further comprises:
a limit switch 130 adapted to detect movement of the push plate 21 back toward the fixed plate 22 into position to generate a reset in place signal; the controller is also respectively connected with the limit switch 130 and the push plate movement driving mechanism in a signal manner and is suitable for receiving a reset signal to control the push plate movement driving mechanism to stop working.
As shown in fig. 7, in order to enable the fixing mechanism 8 and the chip detecting mechanism 4 located at the detecting position to automatically operate at a proper timing, a second detecting device 140 is adapted to detect that the circuit board enters the detecting position to generate a circuit board detecting signal; the controller is also respectively connected with the second detection device 140, the second conveying mechanism 3, the fixing mechanism 8 positioned at the detection position and the chip detection mechanism 4 in a signal manner, and is suitable for receiving the detection signal of the circuit board to control the second conveying mechanism 3 to stop working and the fixing mechanism 8 positioned at the detection position to act, and then control the chip detection mechanism 4 to act.
As shown in fig. 7, in order to enable the fixing mechanism 8 and the cutting mechanism at the cutting position to automatically operate at a proper timing, a third detecting device 150 is adapted to detect that the circuit board enters the cutting position to generate a circuit board cutting signal; the controller is also respectively connected with the third detecting device 150, the second conveying mechanism 3, the fixing mechanism 8 positioned at the cutting position and the cutting mechanism in a signal manner, and is suitable for receiving the cutting signal of the circuit board to control the second conveying mechanism 3 to stop working and the fixing mechanism 8 positioned at the cutting position to act, and then control the cutting mechanism to act.
In this embodiment, the first detecting device 110, the second detecting device 140 and the third detecting device 150 each include an emission end of the correlation sensor and a receiving end of the correlation sensor, which are matched with each other, one of the two is located on one side of the circuit board, and the other is located on the other side of the circuit board; the receiving end of the correlation sensor is in signal connection with the controller so as to send corresponding signals to the controller when the light beam between the receiving end of the correlation sensor and the emitting end of the correlation sensor is blocked by the circuit board.
In this embodiment, the limit switch 130 includes a photoelectric sensor and a light shielding sheet matched with the photoelectric sensor, one of the two is fixed at the origin of the push plate 21, and the other is connected with the push plate 21 to move synchronously with the push plate 21; wherein,
the photoelectric sensor is in signal connection with the controller so as to send a reset in-place signal to the controller when the photoelectric sensor senses the shading sheet.
The technical problems, technical solutions and advantageous effects solved by the present invention have been further described in detail in the above-described embodiments, and it should be understood that the above-described embodiments are only illustrative of the present invention and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the scope of protection of the present invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the connection between the push plate 21 and the slider may be indirect (for example, the connection between the push plate 21 and the slider may be indirect through an intermediate connection member, the intermediate connection member may be an L-shaped connection plate 101, the L-shaped connection plate 101 includes a horizontal plate portion and a vertical plate portion which are integrally formed, the vertical plate portion is connected with the slider, the horizontal plate portion of the L-shaped connection plate 101 is connected with the nut block 27, and the vertical plate portion is connected with the push plate 21 through the tension pressure sensor 120. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art in a specific case.
Claims (4)
1. An intelligent disassembling device for chips is characterized in that,
the device comprises a first conveying mechanism (1), a width measuring mechanism (2), a second conveying mechanism (3), 2 fixing mechanisms (8), a chip detecting mechanism (4), a cutting mechanism and a controller; wherein,
the width measuring mechanism (2) is used for pushing the circuit board conveyed by the first conveying mechanism (1) to one side of the first conveying mechanism (1) along the conveying direction perpendicular to the circuit board so as to measure the width of the circuit board;
the controller is respectively connected with the width measuring mechanism (2) and the second conveying mechanism (3) in a signal way, and is used for controlling the second conveying mechanism (3) to act according to the width measured by the width measuring mechanism (2) so that the second conveying mechanism (3) is adjusted to a state matched with the width of the circuit board to receive and convey the circuit board of the first conveying mechanism (1);
a detection position and a cutting position are sequentially arranged on the second conveying mechanism (3) along the conveying direction of the circuit board, one fixing mechanism (8) of the 2 fixing mechanisms (8) is used for fixing the circuit board at the detection position, and the other fixing mechanism (8) is used for fixing the circuit board at the cutting position;
the chip detection mechanism (4) is used for detecting the chip position and the chip size of the circuit board positioned at the detection position, the cutting mechanism is used for cutting the circuit board positioned at the cutting position, and the controller is also respectively connected with the chip detection mechanism (4) and the cutting mechanism in a signal manner and used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism (4) so that the cutting mechanism cuts the chip;
The width measuring mechanism (2) includes:
the clamping mechanism comprises a push plate (21), a fixed plate (22) fixed on the frame of the first conveying mechanism (1) and a push plate moving driving mechanism connected with the push plate (21) to drive the push plate (21) to move in a direction perpendicular to the conveying direction of the circuit board so as to at least enable the push plate (21) and the fixed plate (22) to clamp the circuit board;
the grating ruler is characterized in that the position of a ruler grating (23) is fixed and extends along the moving direction of the push plate (21), and a grating ruler reading head (24) is fixed on the push plate (21) to move along with the push plate (21) and is matched with the ruler grating (23) to read the reading of the ruler grating (23) so as to obtain the distance between the push plate (21) and the fixed plate (22);
the second transfer mechanism (3) includes:
2 conveyor belt modules for conveying the circuit boards together;
a conveyor belt module moving driving mechanism connected with one of the conveyor belt modules to drive the conveyor belt module to move towards or away from the other conveyor belt module; the controller is in signal connection with the conveyor belt module moving driving mechanism and is used for controlling the movement of the conveyor belt module moving driving mechanism according to the width measured by the width measuring mechanism (2) so that the distance between 2 conveyor belt modules is matched with the width of the circuit board;
The conveyor belt module comprises a frame body (31), a driving wheel (32), a driven wheel (33) and a second conveyor belt, wherein the driving wheel (32) and the driven wheel (33) are respectively rotatably supported on the frame body (31), the second conveyor belt is tensioned between the driving wheel (32) and the driven wheel (33), and the driving wheel (32) can be driven to rotate so as to drive the second conveyor belt to move; the driving wheels (32) of the 2 conveyor belt modules are in transmission connection through a first spline shaft (34), the driving wheels (32) of the movable conveyor belt modules are sleeved on the first spline shaft (34) in a sliding manner along the axial direction of the first spline shaft (34), and the first spline shaft (34) is connected with a second motor (35) so as to drive the first spline shaft (34) to rotate through the second motor (35);
the conveyor belt module moving driving mechanism comprises at least one synchronous belt module (36), wherein the synchronous belt module (36) is perpendicular to the conveying direction of the circuit board and is connected with one conveyor belt module to drive the conveyor belt module to move towards or away from the other conveyor belt module when the conveyor belt module moves;
the chip detection mechanism (4) comprises an industrial camera for shooting image information of the circuit board positioned at a detection position and a graphic processor which is in signal connection with the industrial camera and is used for processing the image information shot by the industrial camera to obtain the chip position and the chip size of the circuit board, and the graphic processor is in signal connection with the controller;
The fixing mechanism (8) comprises at least one fixing component, the fixing component comprises a pressing cylinder (81) and a pressing plate (82), a cylinder rod of the pressing cylinder (81) is connected with the pressing plate (82) to drive the pressing plate (82) to move downwards so as to press the circuit board on the conveyor belt module, and at least one pressing contact (83) used for being in contact with the circuit board is arranged on the lower surface of the pressing plate (82);
the cutting mechanism includes:
a cutting mechanism main body (7) for performing double-sided cutting on the chip;
a rotary driving mechanism connected with the cutting mechanism main body (7) for driving the cutting mechanism to rotate by 90 degrees;
the three-axis mechanical arm (9) is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism and the cutting mechanism main body (7) to realize three-dimensional movement;
the cutting mechanism body (7) includes:
a cutting frame;
a power mechanism including a second spline shaft (72) rotatably supported on the cutter frame and a third motor (73) connected to the second spline shaft (72) to drive the second spline shaft (72) to rotate;
2 cutting assemblies, which comprise a cutter holder (74) capable of moving along the axial direction of the second spline shaft (72) and synchronously rotating along with the second spline shaft (72) and sleeved on the second spline shaft (72) and a blade (75) mounted on the cutter holder (74);
The cutter holders (74) are in one-to-one correspondence with the cutter holders (76), and the cutter holders (74) are rotatably arranged in the corresponding cutter holders (76) through rolling bearings;
the cutter sleeve moving driving mechanism is connected with the 2 cutter sleeves (76) to drive the 2 cutter sleeves (76) to move oppositely or back to adjust the distance between the 2 blades (75);
the rotary driving mechanism comprises a rotary cylinder (10);
the triaxial mechanical arm (9) is a triaxial linear module;
the knife sleeve moving driving mechanism comprises:
the two-way screw rod (77) is rotatably supported on the cutting frame, 2 cutter sleeves (76) are respectively and slidably matched on the cutting frame, one cutter sleeve (76) is in threaded connection with one end part of the two-way screw rod (77), and the other cutter sleeve (76) is in threaded connection with the other end part of the two-way screw rod (77);
and a fourth motor (78) connected to the bi-directional screw (77) to drive the bi-directional screw (77) to rotate.
2. The intelligent chip disassembling device according to claim 1, wherein,
further comprises:
the chip receiving mechanism is positioned below the cutting position to receive chips;
and/or a waste receiving mechanism (6) positioned at the tail end of the second conveying mechanism (3) for receiving the circuit board from which the chips are cut.
3. The intelligent chip disassembling device according to claim 2, wherein,
the chip receiving mechanism comprises a chip conveying mechanism (51) and a dust collector (52), wherein the chip conveying mechanism (51) comprises a conveying belt, the conveying belt is a Teflon grid conveying belt, and the dust collector (52) is used for sucking cutting scraps from below the Teflon grid conveying belt;
and/or the waste receiving means (6) comprises a waste frame.
4. The intelligent chip disassembling device according to claim 1, wherein,
further comprises:
a first detection device (110) adapted to detect that the circuit board enters the width measurement area to generate a measurement preparation signal; the controller is also respectively connected with the first detection device (110), the first conveying mechanism (1) and the push plate movement driving mechanism in a signal manner and is used for receiving a measurement preparation signal to simultaneously control the first conveying mechanism (1) to stop acting and the push plate movement driving mechanism to drive the push plate (21) to move towards the fixed plate (22);
and/or at least one pull pressure sensor (120) mounted on the push plate (21) and contacting the circuit board during pushing of the circuit board by the push plate (21) for detecting a pressure value applied thereto by the circuit board; the controller is also respectively connected with the pull pressure sensor (120) and the push plate movement driving mechanism in a signal way and is used for controlling the push plate movement driving mechanism to stop working when the received pressure value exceeds a preset value;
And/or a limit switch (130) for detecting that the push plate (21) moves away from the fixed plate (22) into position to generate a reset-in-place signal; the controller is also respectively connected with the limit switch (130) and the push plate movement driving mechanism by signals, and is suitable for receiving a reset signal to control the push plate movement driving mechanism to stop working;
and/or a second detection device (140) for detecting the entry of the circuit board into the detection bit to generate a circuit board detection signal; the controller is also respectively connected with the second detection device (140), the second conveying mechanism (3), the fixing mechanism (8) positioned at the detection position and the chip detection mechanism (4) in a signal manner, and is used for receiving a circuit board detection signal to control the second conveying mechanism (3) to stop working and the fixing mechanism (8) positioned at the detection position to act firstly, and then control the chip detection mechanism (4) to act;
and/or a third detection device (150) for detecting the entry of the circuit board into the cutting station to generate a circuit board cutting signal; the controller is also respectively connected with the third detection device (150), the second conveying mechanism (3), the fixing mechanism (8) positioned at the cutting position and the cutting mechanism in a signal manner, and is used for receiving the cutting signal of the circuit board to control the second conveying mechanism (3) to stop working and the fixing mechanism (8) positioned at the cutting position to act, and then control the cutting mechanism to act.
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| CN202011306909.1A CN112474737B (en) | 2020-11-20 | 2020-11-20 | Intelligent chip disassembling device |
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Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000104126A (en) * | 1998-09-30 | 2000-04-11 | Shin Meiwa Ind Co Ltd | Recovering method of valuable metals containing copper from waste printed circuit board and system for recovery of valuable metal containing copper and separation of slag component from waste printed circuit board |
| KR200229056Y1 (en) * | 2000-12-09 | 2001-07-19 | 이호태 | multiple cutter |
| KR101075446B1 (en) * | 2011-06-20 | 2011-10-24 | 박정재 | Cutting machine for disassembling waste-battery and disassembling system for waste-battery comprising the same |
| WO2013111206A1 (en) * | 2012-01-27 | 2013-08-01 | パナソニック株式会社 | Electronic component separating/collecting method and electronic component separating/collecting apparatus |
| CN203292649U (en) * | 2013-06-26 | 2013-11-20 | 深圳市添正弘业科技有限公司 | Efficient dual in-line package (DIP) chip disassembling tool |
| CN104157927A (en) * | 2014-08-21 | 2014-11-19 | 广东邦普循环科技有限公司 | Novel waste power battery full-automatic dismantling device and method |
| CN104552397A (en) * | 2015-01-23 | 2015-04-29 | 苏州惠斯福自动化科技有限公司 | Corrugated pipe cut-off machine |
| CN206277522U (en) * | 2016-05-25 | 2017-06-27 | 肇庆市宏华电子科技有限公司 | A kind of electronic element high-speed intelligent cutting machine |
| KR20170126738A (en) * | 2016-05-10 | 2017-11-20 | 주식회사 씨엔제이 | Method and apparatus for manufacturing chip for recycling of flexible circuit board film |
| CN108080388A (en) * | 2016-11-20 | 2018-05-29 | 重庆龙健金属制造有限公司 | Each element recovery and treatment method of circuit board |
| CN207558773U (en) * | 2017-11-27 | 2018-06-29 | 天津康帝德科技有限公司 | A kind of normalizing device of solar battery sheet |
| FR3063919A1 (en) * | 2017-10-18 | 2018-09-21 | Adimas | MACHINE FOR SEPARATING MATERIALS IN THE WASTE OF A CHIP CARD, WITH DESTRUCTION OF CONFIDENTIAL ELEMENTS. |
| CN108907464A (en) * | 2018-08-28 | 2018-11-30 | 东莞仕群智能科技有限公司 | A kind of high-accuracy self-adaptation battery modules welding fixture |
| CN109672003A (en) * | 2018-12-18 | 2019-04-23 | 中国环境科学研究院 | A kind of device and disassembling method adapting to more specification rectangular lithium ion battery dismantlings |
| CN208873847U (en) * | 2018-11-21 | 2019-05-17 | 宁夏瑞银有色金属科技有限公司 | A kind of battery core separator and its separation equipment |
| CN110335833A (en) * | 2019-08-27 | 2019-10-15 | 郑州科技学院 | A kind of intelligence manufacture detection device |
| CN110943264A (en) * | 2019-12-20 | 2020-03-31 | 江苏理工学院 | Square power battery shell disassembling device |
| CN111069230A (en) * | 2019-12-05 | 2020-04-28 | 常州大学 | Waste circuit board high-value element recovery system |
| CN111168770A (en) * | 2020-03-19 | 2020-05-19 | 高密市瑞力特数控设备有限公司 | Intelligent preferred multi-blade saw |
| CN211192741U (en) * | 2019-07-08 | 2020-08-07 | 维卡新能源科技(南通)有限公司 | Power lithium ion battery module group clamping equipment |
| CN213826370U (en) * | 2020-11-20 | 2021-07-30 | 常州大学 | Intelligent chip disassembling device |
-
2020
- 2020-11-20 CN CN202011306909.1A patent/CN112474737B/en active Active
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000104126A (en) * | 1998-09-30 | 2000-04-11 | Shin Meiwa Ind Co Ltd | Recovering method of valuable metals containing copper from waste printed circuit board and system for recovery of valuable metal containing copper and separation of slag component from waste printed circuit board |
| KR200229056Y1 (en) * | 2000-12-09 | 2001-07-19 | 이호태 | multiple cutter |
| KR101075446B1 (en) * | 2011-06-20 | 2011-10-24 | 박정재 | Cutting machine for disassembling waste-battery and disassembling system for waste-battery comprising the same |
| WO2013111206A1 (en) * | 2012-01-27 | 2013-08-01 | パナソニック株式会社 | Electronic component separating/collecting method and electronic component separating/collecting apparatus |
| CN203292649U (en) * | 2013-06-26 | 2013-11-20 | 深圳市添正弘业科技有限公司 | Efficient dual in-line package (DIP) chip disassembling tool |
| CN104157927A (en) * | 2014-08-21 | 2014-11-19 | 广东邦普循环科技有限公司 | Novel waste power battery full-automatic dismantling device and method |
| CN104552397A (en) * | 2015-01-23 | 2015-04-29 | 苏州惠斯福自动化科技有限公司 | Corrugated pipe cut-off machine |
| KR20170126738A (en) * | 2016-05-10 | 2017-11-20 | 주식회사 씨엔제이 | Method and apparatus for manufacturing chip for recycling of flexible circuit board film |
| CN206277522U (en) * | 2016-05-25 | 2017-06-27 | 肇庆市宏华电子科技有限公司 | A kind of electronic element high-speed intelligent cutting machine |
| CN108080388A (en) * | 2016-11-20 | 2018-05-29 | 重庆龙健金属制造有限公司 | Each element recovery and treatment method of circuit board |
| FR3063919A1 (en) * | 2017-10-18 | 2018-09-21 | Adimas | MACHINE FOR SEPARATING MATERIALS IN THE WASTE OF A CHIP CARD, WITH DESTRUCTION OF CONFIDENTIAL ELEMENTS. |
| CN207558773U (en) * | 2017-11-27 | 2018-06-29 | 天津康帝德科技有限公司 | A kind of normalizing device of solar battery sheet |
| CN108907464A (en) * | 2018-08-28 | 2018-11-30 | 东莞仕群智能科技有限公司 | A kind of high-accuracy self-adaptation battery modules welding fixture |
| CN208873847U (en) * | 2018-11-21 | 2019-05-17 | 宁夏瑞银有色金属科技有限公司 | A kind of battery core separator and its separation equipment |
| CN109672003A (en) * | 2018-12-18 | 2019-04-23 | 中国环境科学研究院 | A kind of device and disassembling method adapting to more specification rectangular lithium ion battery dismantlings |
| CN211192741U (en) * | 2019-07-08 | 2020-08-07 | 维卡新能源科技(南通)有限公司 | Power lithium ion battery module group clamping equipment |
| CN110335833A (en) * | 2019-08-27 | 2019-10-15 | 郑州科技学院 | A kind of intelligence manufacture detection device |
| CN111069230A (en) * | 2019-12-05 | 2020-04-28 | 常州大学 | Waste circuit board high-value element recovery system |
| CN110943264A (en) * | 2019-12-20 | 2020-03-31 | 江苏理工学院 | Square power battery shell disassembling device |
| CN111168770A (en) * | 2020-03-19 | 2020-05-19 | 高密市瑞力特数控设备有限公司 | Intelligent preferred multi-blade saw |
| CN213826370U (en) * | 2020-11-20 | 2021-07-30 | 常州大学 | Intelligent chip disassembling device |
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