CN112469209B - 一种pcb铝基板孔内金属层与非金属层同步金属化的方法 - Google Patents

一种pcb铝基板孔内金属层与非金属层同步金属化的方法 Download PDF

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Publication number
CN112469209B
CN112469209B CN202011288123.1A CN202011288123A CN112469209B CN 112469209 B CN112469209 B CN 112469209B CN 202011288123 A CN202011288123 A CN 202011288123A CN 112469209 B CN112469209 B CN 112469209B
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China
Prior art keywords
aluminum substrate
sodium
hole
layer
steps
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Chinese (zh)
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CN112469209A (zh
Inventor
张亚锋
夏国伟
潘湛昌
陈涛
王斌
赵启祥
胡光辉
王辉
施世坤
崔子雅
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Guangdong University of Technology
Victory Giant Technology Huizhou Co Ltd
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Guangdong University of Technology
Victory Giant Technology Huizhou Co Ltd
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Priority to CN202011288123.1A priority Critical patent/CN112469209B/zh
Priority to JP2022515939A priority patent/JP7285370B2/ja
Priority to PCT/CN2020/134593 priority patent/WO2022104942A1/zh
Publication of CN112469209A publication Critical patent/CN112469209A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202011288123.1A 2020-11-17 2020-11-17 一种pcb铝基板孔内金属层与非金属层同步金属化的方法 Active CN112469209B (zh)

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Application Number Priority Date Filing Date Title
CN202011288123.1A CN112469209B (zh) 2020-11-17 2020-11-17 一种pcb铝基板孔内金属层与非金属层同步金属化的方法
JP2022515939A JP7285370B2 (ja) 2020-11-17 2020-12-08 Ｐｃｂアルミニウム基板孔内の金属層及び非金属層を同期して金属化する方法
PCT/CN2020/134593 WO2022104942A1 (zh) 2020-11-17 2020-12-08 一种pcb铝基板孔内金属层与非金属层同步金属化的方法

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CN202011288123.1A CN112469209B (zh) 2020-11-17 2020-11-17 一种pcb铝基板孔内金属层与非金属层同步金属化的方法

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CN112469209A CN112469209A (zh) 2021-03-09
CN112469209B true CN112469209B (zh) 2021-10-26

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JP (1) JP7285370B2 (ja)
CN (1) CN112469209B (ja)
WO (1) WO2022104942A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7409941B2 (ja) 2020-03-31 2024-01-09 極東開発工業株式会社 荷役車両
CN114134491A (zh) * 2021-12-03 2022-03-04 广东工业大学 一种提高铝基覆铜板孔内粗糙度的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating
CN104928658A (zh) * 2015-05-13 2015-09-23 电子科技大学 一种活化pcb电路表面实现化学镀镍的方法
CN109898115A (zh) * 2019-03-25 2019-06-18 广东工业大学 一种快速的铝基板上电镀铜前处理方法
CN109989078A (zh) * 2019-03-25 2019-07-09 广东工业大学 一种铝基材上电镀铜前处理的Ag活化方法及电镀铜的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5566921B2 (ja) 2011-01-17 2014-08-06 名東電産株式会社 アルミニウムを導電パターンとしたプリント配線基板の製造方法
JP6225047B2 (ja) 2014-03-06 2017-11-01 名東電産株式会社 アルミニウムを導電パターンとしたプリント配線基板、及びその製造方法
US9875984B2 (en) * 2014-12-05 2018-01-23 National Tsing Hua University Substrate surface metallization method and substrate having metallized surface manufactured by the same
CN105050324B (zh) * 2015-07-01 2018-06-12 广东光华科技股份有限公司 铜表面粗化处理液及其处理方法
CN111334784B (zh) * 2020-04-15 2022-08-05 深圳市欣茂鑫实业有限公司 一种铝合金表面镀镍工艺
CN111763930B (zh) * 2020-07-14 2022-04-19 赤壁市聚茂新材料科技有限公司 一种非钯活化镀铜工艺及其敏化剂、活化剂

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating
CN104928658A (zh) * 2015-05-13 2015-09-23 电子科技大学 一种活化pcb电路表面实现化学镀镍的方法
CN109898115A (zh) * 2019-03-25 2019-06-18 广东工业大学 一种快速的铝基板上电镀铜前处理方法
CN109989078A (zh) * 2019-03-25 2019-07-09 广东工业大学 一种铝基材上电镀铜前处理的Ag活化方法及电镀铜的方法

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JP2023505921A (ja) 2023-02-14
WO2022104942A1 (zh) 2022-05-27
CN112469209A (zh) 2021-03-09
JP7285370B2 (ja) 2023-06-01

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