JP6225047B2 - アルミニウムを導電パターンとしたプリント配線基板、及びその製造方法 - Google Patents
アルミニウムを導電パターンとしたプリント配線基板、及びその製造方法 Download PDFInfo
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- JP6225047B2 JP6225047B2 JP2014044055A JP2014044055A JP6225047B2 JP 6225047 B2 JP6225047 B2 JP 6225047B2 JP 2014044055 A JP2014044055 A JP 2014044055A JP 2014044055 A JP2014044055 A JP 2014044055A JP 6225047 B2 JP6225047 B2 JP 6225047B2
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- Prior art keywords
- aluminum plate
- printed wiring
- film
- wiring board
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 190
- 229910052782 aluminium Inorganic materials 0.000 title claims description 187
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 239000010408 film Substances 0.000 claims description 152
- 238000007747 plating Methods 0.000 claims description 128
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 83
- 229910052802 copper Inorganic materials 0.000 claims description 79
- 239000010949 copper Substances 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 79
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- 229910052709 silver Inorganic materials 0.000 claims description 58
- 239000004332 silver Substances 0.000 claims description 58
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 57
- 229920002120 photoresistant polymer Polymers 0.000 claims description 37
- 239000004020 conductor Substances 0.000 claims description 33
- 238000005530 etching Methods 0.000 claims description 30
- 238000004070 electrodeposition Methods 0.000 claims description 20
- AGVXRMIPDLFTHE-UHFFFAOYSA-N 3h-dithiole;triazine Chemical class C1SSC=C1.C1=CN=NN=C1 AGVXRMIPDLFTHE-UHFFFAOYSA-N 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 19
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- 239000004641 Diallyl-phthalate Substances 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 10
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
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- UZHLUVWLBCLCGW-UHFFFAOYSA-N C(C)O[Si](OCC)(OCC)CCCC1=C(C(=NN=N1)S)S Chemical compound C(C)O[Si](OCC)(OCC)CCCC1=C(C(=NN=N1)S)S UZHLUVWLBCLCGW-UHFFFAOYSA-N 0.000 claims description 4
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- KCZIUKYAJJEIQG-UHFFFAOYSA-N 1,3,5-triazin-2-amine Chemical compound NC1=NC=NC=N1 KCZIUKYAJJEIQG-UHFFFAOYSA-N 0.000 claims 1
- JILNIZGVLASAPX-UHFFFAOYSA-N 2,3-bis(sulfanylmethyl)but-2-ene-1,4-dithiol Chemical compound SCC(CS)=C(CS)CS JILNIZGVLASAPX-UHFFFAOYSA-N 0.000 claims 1
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- 239000011734 sodium Substances 0.000 description 8
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 8
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- 239000003795 chemical substances by application Substances 0.000 description 7
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- 238000003672 processing method Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 6
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- 230000000052 comparative effect Effects 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
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- 239000013585 weight reducing agent Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 229910001961 silver nitrate Inorganic materials 0.000 description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 description 4
- 235000010288 sodium nitrite Nutrition 0.000 description 4
- 239000003115 supporting electrolyte Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
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Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1415—Applying catalyst after applying plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
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- Manufacturing Of Printed Wiring (AREA)
Description
コア用アルミニウム板と、前記コア用アルミニウム板の少なくとも一方の表面に積層されるプリプレグと、前記プリプレグの表面に積層される回路形成用アルミニウム板と、を有するプリント配線基板において、
前記回路形成用アルミニウム板は、エッチングにより導電パターンが形成され、
前記導電パターンの表面の少なくとも一部は、吹き付けにより析出した無電解銀めっき皮膜が形成され、
前記無電解銀めっき皮膜の表面に前記電着フォトレジスト皮膜が形成された後、スルーホール及び導体上のハンダ付けの必要な部位のみ前記電着フォトレジスト皮膜が除去されて電解銅めっきが形成されていることを特徴とする。
表面粗さRaが0.05μm以下のコア用アルミニウム板のスルーホール形成領域の少なくとも一部に穴明けした後、穴埋めインクで穴埋めする穴埋工程と、
前記コア用アルミニウム板及び回路形成用アルミニウム板の表面を分子接着法で表面改質する表面改質工程と、
前記コア用アルミニウム板及び回路形成用アルミニウム板の間に絶縁機能を有するプリプリグを積層して熱圧着する熱圧着工程と、
前記回路形成用アルミニウム板にエッチングにより導電パターンを形成する導電パターン形成工程と、
穴明け後に、表裏のアルミニウム及び樹脂表面、穴明けしたスルーホール穴壁のアルミニウム及び樹脂表面に分子接合法で表面処理する表面改質工程と、
前記導電パターンの表面の少なくとも一部は、吹き付けにより無電解銀めっき皮膜を形成する無電解銀めっき皮膜形成工程と、
前記無電解銀めっき皮膜の表面に電着フォトレジスト皮膜を形成する電着フォトレジスト皮膜形成工程と、
スルーホール及び導体上のハンダ付けが必要な部位のみ電着フォトレジスト皮膜を除去する電着フォトレジスト皮膜除去工程と、
電着フォトレジスト皮膜が除去された部位に電解銅めっきを形成する電解銅めっき形成工程と、
残りの電着フォトレジスト皮膜を除去する第2電着フォトレジスト皮膜除去工程と、
酸水溶液で、無電解銀めっき薄膜を除去する無電解銀めっき皮膜除去工程と、
を含むことを特徴とする。
実施例1のプリント配線基板に対し、スルーホール11、13の内壁には、チオール基反応性アルコキシシラン化合物からなる第2分子接合剤による分子接合処理を行わなかった。回路形成用アルミニウム板31、21の導電パターンの表面を、第1分子接合剤として分子中にジチオールトリアジニル基とトリエトキシシリル基を有する6−(3−トリエトキシシリルプロピルアミノ)−1,3,5−トリアジン−2,4−ジチオールモノソジウム塩(TES)を使用して分子接合処理を1回行った。その他は、実施例1と同様である。
実施例1のプリント配線基板に対し、コア用アルミニウム板10のスルーホール11、13の内壁には、チオール基反応性アルコキシシラン化合物からなる第2分子接合剤による分子接合処理を行わなかった。回路形成用アルミニウム板31、21の導電パターンの表面を、第1分子接合剤として分子中にジチオールトリアジニル基とトリエトキシシリル基を有する6−(3−トリエトキシシリルプロピルアミノ)−1,3,5−トリアジン−2,4−ジチオールモノソジウム塩(TES)を使用して分子接合処理を2回行った。その他は、実施例1と同様である。
21、22...プリプレグ、30...回路形成用アルミニウム板、
31、32...回路形成用アルミニウム板、33...導電パターン、
50...無電解銀めっき皮膜、60...電解銅めっき皮膜、
90...ソルダーレジスト、95...穴埋め用絶縁樹脂、100...プリント配線基板
Claims (11)
- コア用アルミニウム板と、前記コア用アルミニウム板の少なくとも一方の表面に積層されるプリプレグと、前記プリプレグの表面に積層される回路形成用アルミニウム板と、を有するプリント配線基板の作製方法において、
前記回路形成用アルミニウム板は、エッチングにより導電パターンが形成され、
前記導電パターンの表面の少なくとも一部は、吹き付けにより析出した無電解銀めっき皮膜が形成され、
前記無電解銀めっき皮膜の表面に電着フォトレジスト皮膜が形成された後、スルーホール及び導体上のハンダ付けの必要な部位のみ前記電着フォトレジスト皮膜が除去されて電解銅めっきが形成されることを特徴とするプリント配線基板の作製方法。 - 前記コア用アルミニウム板は、少なくとも一方の表面を分子接合法で表面改質された表面粗さRaが0.05μm以下のアルミニウム板からなり、
前記回路形成用アルミニウム板は、積層面を分子接合法で表面改質されたアルミニウム板からなることを特徴とする請求項1に記載のプリント配線基板の作製方法。 - 前記分子接合法による表面改質は、トリアジンジチオール誘導体の電解重合膜の形成であることを特徴とする請求項2に記載のプリント配線基板の作製方法。
- 前記コア用アルミニウム板と前記回路形成用アルミニウム板の間に前記プリプレグを挟んで積層したプリント配線基板の穴明け後に、表裏のアルミニウム導電パターン及びプリプレグ樹脂表面、穴明けしたスルーホール穴壁のアルミニウム及び樹脂表面に分子接合法で表面改質することを特徴とする請求項1から3のいずれか1項に記載のプリント配線基板の作製方法。
- 前記分子接合法による表面改質は、トリアジンジチオール誘導体の電解重合膜の形成であることを特徴とする請求項4に記載のプリント配線基板の作製方法。
- 前記分子接合法による表面改質は、トリエトキシシリルプロピルトリアジンジチオール(TESTD)、トリトリメトキシシランプロピルメルカタプタン(TMSPM)、6−トリメトキシシランデシルアミノ−1,3,5−トリアジン-2,4-ジチオール(TMSHTD)、6−ジメチルメトキシシランプロピルアミノ−1,3,5−トリアジン-2,4-ジチオール(DMMTD)、6−ジ(トリエトキシシランプロピル)アミノ−1,3,5−トリアジン-2,4-ジチオール(DTESTD)のいずれかの電解重合膜であることを特徴とする請求項2から5のいずれか1項に記載のプリント配線基板の作製方法。
- 前記表裏のアルミニウム導電パターン及び樹脂表面、穴明けしたスルーホール穴壁のアルミニウム及び樹脂表面に吹き付けにより析出した無電解銀めっき皮膜を形成することを特徴とする請求項4又は5に記載のプリント配線基板の作製方法。
- 前記コア用アルミニウム板は、前記スルーホールが形成される位置に穴明けされた後、さらに穴埋め用インクをスクリーン印刷機で充填された後、余分な穴埋めインクが研磨されてなることを特徴とする請求項1から7のいずれか1項に記載のプリント配線基板の作製方法。
- 前記プリプレグ又は前記穴埋め用インクは、組成がジアリルフタレート80〜95重量%にエポキシ樹脂20〜5重量%を含有した樹脂の樹脂量に対して、アルミナを30〜90重量%添加した混合物であることを特徴とする請求項8に記載のプリント配線基板の作製方法。
- 前記電解銅めっきが形成された後に、前記電着フォトレジスト皮膜が剥離され、酸水溶液で前記無電解銀めっき皮膜が除去されることを特徴とする請求項1から9のいずれか1項に記載のプリント配線基板の作製方法。
- 表面粗さRaが0.05μm以下のコア用アルミニウム板のスルーホール形成領域の少なくとも一部に穴明けした後、穴埋めインクで穴埋めする穴埋工程と、
前記コア用アルミニウム板及び回路形成用アルミニウム板の表面を分子接合法で表面改質する表面改質工程と、
前記コア用アルミニウム板及び回路形成用アルミニウム板の間に絶縁機能を有するプリプリグを積層して熱圧着する熱圧着工程と、
前記回路形成用アルミニウム板にエッチングにより導電パターンを形成する導電パターン形成工程と、
穴明け後に、表裏のアルミニウム及び樹脂表面、穴明けしたスルーホール穴壁のアルミニウム及び樹脂表面に分子接合法で表面処理する表面改質工程と、
前記導電パターンの表面の少なくとも一部は、吹き付けにより無電解銀めっき皮膜を形成する無電解銀めっき皮膜形成工程と、
前記無電解銀めっき皮膜の表面に電着フォトレジスト皮膜を形成する電着フォトレジスト皮膜形成工程と、
スルーホール及び導体上のハンダ付けが必要な部位のみ電着フォトレジスト皮膜を除去する電着フォトレジスト皮膜除去工程と、
電着フォトレジスト皮膜が除去された部位に電解銅めっきを形成する電解銅めっき形成工程と、
残りの電着フォトレジスト皮膜を除去する第2電着フォトレジスト皮膜除去工程と、
酸水溶液で、無電解銀めっき薄膜を除去する無電解銀めっき皮膜除去工程と、
を含むことを特徴とするプリント配線基板の作製方法。
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