CN112466774B - Etching equipment - Google Patents

Etching equipment Download PDF

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Publication number
CN112466774B
CN112466774B CN201910842526.7A CN201910842526A CN112466774B CN 112466774 B CN112466774 B CN 112466774B CN 201910842526 A CN201910842526 A CN 201910842526A CN 112466774 B CN112466774 B CN 112466774B
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China
Prior art keywords
tank
liquid
roller conveyor
alkali
roller
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CN201910842526.7A
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Chinese (zh)
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CN112466774A (en
Inventor
郭梦龙
鲁伟明
刘瑞珉
李华
刘继宇
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Taizhou Longi Solar Technology Co Ltd
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Taizhou Longi Solar Technology Co Ltd
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Priority to CN201910842526.7A priority Critical patent/CN112466774B/en
Publication of CN112466774A publication Critical patent/CN112466774A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The application discloses etching equipment, which comprises a roller conveyor, wherein a first alkali liquid tank and a first washing tank are sequentially arranged along the conveying direction of the roller conveyor, and the first alkali liquid tank and the first washing tank are positioned below the roller conveyor; the first alkali liquid tank and the first washing tank are provided with a first spraying device therebetween, the first spraying device is positioned below the roller conveyor and is provided with a plurality of first liquid spraying openings which are upwards arranged. According to the scheme, residual alkali liquor can be prevented from crystallizing on the battery piece and the roller of the roller conveyor, and the problems that subsequent washing cannot be thoroughly washed due to crystallization and the roller conveyor is damaged by the crystallization on the roller are avoided.

Description

Etching equipment
Technical Field
The application relates to the technical field of photovoltaics in general, in particular to etching equipment.
Background
Currently, back contact solar cells, such as IBC (Interdigitated Back Contact; referred to as cross back contact), MWT (Metallization Wrap Through; metal perforation winding), EWT (Emitter Wrap Through; emitter wrap through) solar cells, are widely used, and since the front side of the solar cells has no main grid line, even no electrode pattern, the positive and negative electrodes are disposed on the back side of the solar cells, the shading of the solar cells is reduced, so that the short circuit current of the solar cells is effectively increased, the energy conversion efficiency of the solar cells is improved, and the solar cells are research hot spots of high-efficiency photovoltaic cell assemblies.
The production process of the solar cell is generally as follows: etching, diffusion, etching, coating, printing sintering, testing and sorting and the like, wherein plasma etching, wet acid etching or wet alkali etching can be adopted for etching to remove the phosphosilicate glass on the side surface and the back surface. When wet alkali etching is carried out, especially for a back contact solar cell, the required alkali concentration is larger than that of a conventional solar cell, and the alkali temperature is far higher than that of the alkali etching alkali of the conventional solar cell, so that high-concentration alkali left on the surface of a cell after alkali etching is easily crystallized due to temperature reduction after the cell is discharged from an alkali tank, the alkali residue cannot be completely removed in the subsequent water washing process, and the appearance and performance of the cell are adversely affected.
Disclosure of Invention
In view of the above-mentioned drawbacks or shortcomings in the prior art, it is desirable to provide an etching apparatus for solving the problem that in the prior art, residual alkali solution on the surface of a battery piece after alkali etching is easy to crystallize, so that the alkali solution residue cannot be completely removed in the subsequent water washing process.
The application provides etching equipment, which comprises a roller conveyor, wherein a first alkali liquid tank and a first washing tank are sequentially arranged along the conveying direction of the roller conveyor, and the first alkali liquid tank and the first washing tank are positioned below the roller conveyor;
the first alkali liquid tank and the first washing tank are provided with a first spraying device therebetween, the first spraying device is positioned below the roller conveyor and is provided with a plurality of first liquid spraying openings which are upwards arranged.
Further, a solution collecting tank is arranged below the first spraying device.
Further, a closing groove wall bent into the first alkali liquor groove is arranged at the top of the side wall of the first alkali liquor groove, which is close to one side of the first water washing groove, and the closing groove wall is at least formed into the groove bottom of the solution collecting groove.
Further, the bottom of the solution collecting tank is connected with a liquid storage tank through a pipeline.
Further, the device also comprises a second alkali liquid tank, wherein the tank bottom of the first alkali liquid tank is provided with a liquid inlet and a liquid return port, the liquid inlet is positioned in the middle of the tank bottom, the liquid return port is positioned at the edge of the tank bottom, the liquid inlet is connected with the second alkali liquid tank through a pumping pipeline, and the liquid return port is connected with the second alkali liquid tank through a liquid return pipeline.
Further, a plurality of the first liquid spraying ports are arranged along a roller axis of the roller conveyor.
Further, the spray pipe comprises spray pipes, each first liquid spraying port is arranged on the liquid spraying pipe, a plurality of first liquid spraying ports are distributed along the axis of the liquid spraying pipe, and a water quantity adjusting valve is connected to the liquid inlet end of the spray pipe.
Further, a second spraying device is arranged above the roller conveyor and is opposite to the first washing tank, the second spraying device is provided with a plurality of second liquid spraying openings which are downwards arranged, and the second liquid spraying openings are at least arranged in a row along the axis of the roller conveyor.
Further, an acid tank and a second washing tank are sequentially arranged along the conveying direction of the roller conveyor, and the acid tank and the second washing tank are positioned in front of the first washing tank in the conveying direction.
Further, an air drying device is arranged above and/or below the roller conveyor, the air drying device is provided with an air outlet extending along the axis of the roller conveyor, the air outlet is opposite to the roller conveyor, and the air outlet is positioned in front of the second washing tank in the conveying direction.
According to the scheme provided by the application, the first spraying device is arranged between the first alkali liquid tank and the first washing tank, deionized water is sprayed out of the solar cell after alkali etching and before washing, so that the residual alkali liquid on the solar cell is diluted and removed, the residual alkali liquid is prevented from crystallizing on the cell and the roller of the roller conveyor, and the problems that the subsequent washing cannot be thoroughly washed due to crystallization and the roller conveyor is damaged due to crystallization on the roller are avoided. Along with the reduction of the solubility of the residual alkali liquor on the battery piece, the requirement on subsequent water washing, such as the reduction of the time of water washing, and the like, can be reduced, thereby being beneficial to improving the production efficiency.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of an etching apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of an etching apparatus according to another embodiment of the present application.
Detailed Description
The application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the application are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
As shown in fig. 1, the etching apparatus provided by the embodiment of the application comprises a roller conveyor, wherein a first alkali liquid tank 1 and a first washing tank 8 are sequentially arranged along the conveying direction of the roller conveyor, and the first alkali liquid tank 1 and the first washing tank 8 are positioned below the roller conveyor; a first spraying device 5 is arranged between the first alkali liquid tank 1 and the first washing tank 8, the first spraying device 5 is positioned below the roller conveyor, and the first spraying device 5 is provided with a plurality of first liquid spraying openings which are upwards arranged.
According to the scheme, the first spraying device 5 is arranged between the first alkali liquid tank 1 and the first washing tank 8, deionized water is sprayed out of the solar cell 2 through the first spraying device 5 before washing after alkali etching, residual alkali liquid on the solar cell 2 is diluted and removed, the residual alkali liquid is prevented from crystallizing on the cell and the roller of the roller conveyor, the problem that subsequent washing cannot be thoroughly performed due to crystallization, and damage to the roller conveyor due to crystallization on the roller is avoided. Along with the reduction of the solubility of the residual alkali liquor on the battery piece, the requirement on subsequent water washing, such as the reduction of the time of water washing, and the like, can be reduced, thereby being beneficial to improving the production efficiency.
In practical use, the roller conveyor may include a plurality of rollers 7 arranged side by side, and the rollers 7 may be driven independently, i.e. each roller 7 is connected to a driving motor, or may be driven in a non-independent manner, i.e. a plurality of rollers 7 may be driven in a gear drive or chain drive manner. The battery sheet to be subjected to the etching, washing, and the like is placed on the roller conveyor to be conveyed in one direction.
In general, the lowest point of each roller 7 is located below the liquid level of the first alkaline liquid tank 1 and the first washing tank 8, and the liquid in the first alkaline liquid tank 1 and the first washing tank 8 is continuously carried to the back surface of the solar cell 2 during the rotation of the roller 7. In addition, the highest point of each roller is positioned above the top surfaces of the first alkaline liquid tank 1 and the first washing tank 8, so that the solar cell 2 is smoothly transported, and the clamping stagnation at the edges of the first alkaline liquid tank 1 and the first washing tank 8 is avoided.
Preferably, the first spraying device 5 should be as close to the first alkaline liquid tank 1 as possible, so that after the solar cell 2 is output by the roller conveyor within the range of the first alkaline liquid tank 1, the solar cell 2 is sprayed by the first spraying device 5 at the first time, so as to reduce the concentration of the alkaline liquid remained on the solar cell 2 in the fastest time, and prevent crystallization caused by temperature reduction. In the following, it will be described in one of the possible configurations how the first shower device 5 is as close as possible to the first alkaline liquid bath 1.
The first liquid spraying opening is arranged upwards, and can be arranged upwards or obliquely. The general can set up to the syncline, and its incline direction can be to the inside slope of first alkali cistern 1, adopts the mode that this slope set up, on the one hand, solar wafer 2 can be sprayed after going out first alkali cistern 1, reduces the possibility of alkali lye crystallization, on the other hand, spray the liquid on solar wafer 2 back, when falling under the action of gravity, can not fall on the hydrojet route of first hydrojet mouth, prevent the liquid of falling to influence the travel route of the spun liquid of first hydrojet mouth, also prevent that the liquid of falling from polluting the problem that reduces the spraying effect to the spun liquid.
When the etching process is performed, the alkali solution contained in the first alkali solution tank 1 can be KOH solution, and the back surface of the solar cell 2 is polished when the solar cell 2 passes through the first alkali solution tank 1 so as to remove PN junctions on the back surface of the solar cell 2. During etching, the solar cell 2 is located on the roller 7, and the highest point of the roller 7 is located above the liquid level, so that the solar cell 2 is in a floating state on the transmission roller when the back surface of the solar cell 2 is polished, and the front surface of the solar cell 2 is not etched by alkali liquor.
In order to achieve a better back polishing effect, the mass concentration of the KOH solution can be between 5 and 30 percent, and the temperature of the KOH solution can be between 60 and 90 ℃. For example, the mass concentration of the KOH solution is 15%, and the temperature of the KOH solution is 80 ℃. The reaction rate can be increased by using the KOH hot solution with high concentration.
The arrow above the roller conveyor in fig. 1 indicates the conveying direction.
Further, in order to prevent the alkaline solution dropped after spraying from polluting the working environment, a solution collecting tank 4 is provided below the first spraying device 5, and the solution collecting tank 4 is used for receiving the alkaline solution dropped during spraying.
Further, in order to make the first shower device 5 as close to the first alkaline liquid tank 1 as possible, a closing-in tank wall 3 bent into the first alkaline liquid tank 1 is provided at the top of the side wall of the first alkaline liquid tank 1 close to the first washing tank 8 side, and the closing-in tank wall 3 is formed at least as the tank bottom of the solution collecting tank 4. That is, a solution collecting tank 4 is formed in the first alkali liquid tank 1, and the solution collecting tank 4 is located at one side of the solar cell 2 where the solar cell 2 is conveyed out of the first alkali liquid tank 1, and based on the solution collecting tank 4 being located below the first spraying device 5, that is, the first spraying device 5 is also located in the first alkali liquid tank 1, so that the solar cell 2 is sprayed by the first spraying device 5 at the fastest speed after being separated from the liquid in the first alkali liquid tank 1. The term "range of the first alkaline solution tank 1" as used herein means a range of the outermost boundary of the first alkaline solution tank 1 in a plan view.
Further, in order to collect and reuse the sprayed and dropped alkali liquor, the bottom of the solution collecting tank 4 is connected with the liquid storage tank 9 through a pipeline, and the dropped solution collected by the solution collecting tank 4 is conveyed to the liquid storage tank 9 for reuse.
Further, the device also comprises a second alkali liquid tank 12, the tank bottom of the first alkali liquid tank 1 is provided with a liquid inlet and a liquid return port, the liquid inlet is positioned in the middle of the tank bottom, the liquid return port is positioned at the edge of the tank bottom, the liquid inlet is connected with the second alkali liquid tank 12 through a pumping pipeline 11, and the liquid return port is connected with the second alkali liquid tank 12 through a liquid return pipeline 10.
The second alkaline solution tank 12 may be, but is not limited to being, located below the first alkaline solution tank 1. The pumping line 11 may include a transfer pump and a transfer pipe connected to the transfer pump. The conveying pump is used for pumping the alkali liquor in the second alkali liquor tank 12 into the first alkali liquor tank 1 upwards through the conveying pipe, so that the concentration of the first alkali liquor tank 1 is stabilized, the liquid level in the middle of the first alkali liquor tank 1 is ensured to have enough height, and the lowest point of the roller can be contacted.
When the alkali liquor in the second alkali liquor tank 12 is pumped to the first alkali liquor tank 1 by the pumping pipeline, the pressure in the second alkali liquor tank 12 is reduced, the alkali liquor in the first alkali liquor tank 1 flows back to the second alkali liquor tank 12 through a liquor return port at the edge of the tank bottom, and the liquor level at the edge is reduced by a certain amount compared with the liquor level in the middle part because the liquor return port is positioned at the edge, so that the overflow of the alkali liquor from the first alkali liquor tank 1 can be prevented, the area where the liquor level is reduced can be called a buffer zone, and the width of the buffer zone can be generally between 3-10 rollers 7. The size of the buffer zone may be determined by the pressure drop between the first and second alkaline solution tanks 1 and 12, the size of the liquid return port, etc.
In FIG. 1, arrows in the first and second alkaline baths 1 and 12 indicate the flow direction of the alkaline solution.
Further, in order to be able to sufficiently spray the solar cell 2, a plurality of first liquid spray openings are arranged along the axis of the roller 7 of the roller conveyor. Generally, the axial length of the solar cell 2 and the roller 7 is smaller than the axial length of the roller 7, so that the solar cell 2 can be fully sprayed in the axial direction of the roller by distributing a plurality of first liquid spraying openings along the axial direction of the roller 7 to reduce the concentration of the residual alkali liquor of the solar cell 2.
Further, the spray pipe is further provided with a spray pipe, each first spray nozzle is arranged on the spray pipe, the plurality of first spray nozzles are distributed along the axis of the spray pipe, and the liquid inlet end of the spray pipe is connected with a water quantity regulating valve. The spray pipe has the advantages of simple structure, high use reliability, long service life and low processing cost. In addition, be connected with the water yield governing valve on the feed liquor end of shower, through the regulation to the water yield governing valve, can control the flow and the velocity of flow of the liquid that spray, prevent to make the battery piece position take place to move because of the too big liquid flowmeter velocity of flow of spraying, cause adverse effect to follow-up technology. In addition, the consumption of pure water can be saved.
Further, in order to improve the quality and efficiency of the washing, a second spraying device 6 is arranged above the roller conveyor, the second spraying device 6 is opposite to the first washing tank 8, the second spraying device 6 is provided with a plurality of second liquid spraying openings which are downwards arranged, and the second liquid spraying openings are at least arranged in a row along the axis of the roller 7 of the roller conveyor. The second spraying device 6 is used for spraying and cleaning the upper surface of the solar cell 2.
Further, as shown in fig. 2, an acid tank 13 and a second washing tank 14 are sequentially provided along the conveying direction of the roller conveyor, and the acid tank 13 and the second washing tank 14 are located in front of the first washing tank 8 in the conveying direction. The acid tank 13 is used for holding hydrofluoric acid/hydrochloric acid and removing phosphosilicate glass on the front surface of the battery piece. The second washing tank 14 is used for containing pure water to wash out hydrofluoric acid/hydrochloric acid remained on the solar cell 2.
Further, an air-drying device 15 is disposed above and/or below the roller conveyor, preferably, the air-drying device 15 is disposed above and below the roller conveyor, the air-drying device 15 has an air outlet extending along the axis of the roller conveyor, the air outlet faces the roller conveyor, and the air outlet is located in front of the second rinsing tank 14 in the conveying direction. The air outlet can blow out high-speed high-pressure air flow for blowing off water on the surface of the battery piece so as to dry the surface of the solar battery piece 2 and prepare for the subsequent coating process.
The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the application referred to in the present application is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.

Claims (8)

1. The etching equipment is characterized by comprising a roller conveyor, wherein a first alkali liquid tank and a first washing tank are sequentially arranged along the conveying direction of the roller conveyor, and the first alkali liquid tank and the first washing tank are positioned below the roller conveyor;
a first spraying device is arranged between the first alkali liquid tank and the first washing tank, the first spraying device is positioned below the roller conveyor, and the first spraying device is provided with a plurality of first liquid spraying openings which are upwards arranged;
a solution collecting tank is arranged below the first spraying device;
the top of the side wall of the first alkali liquor tank, which is close to one side of the first water washing tank, is provided with a closing-in tank wall bent into the first alkali liquor tank, and the closing-in tank wall is at least formed into the tank bottom of the solution collecting tank.
2. The etching apparatus according to claim 1, wherein the bottom of the solution collection tank is connected to a liquid storage tank through a pipe.
3. The etching device according to claim 1, further comprising a second alkali liquid tank, wherein a liquid inlet and a liquid return port are arranged at the bottom of the first alkali liquid tank, the liquid inlet is positioned in the middle of the bottom of the tank, the liquid return port is positioned at the edge of the bottom of the tank, the liquid inlet is connected with the second alkali liquid tank through a pumping pipeline, and the liquid return port is connected with the second alkali liquid tank through a liquid return pipeline.
4. The etching apparatus according to claim 1, wherein a plurality of the first liquid ejection ports are arranged along a roller axis of the roller conveyor.
5. The etching apparatus according to claim 4, further comprising a shower pipe, each of the first liquid spraying ports being provided on the shower pipe, a plurality of the first liquid spraying ports being arranged along an axis of the shower pipe, a water amount adjusting valve being connected to a liquid inlet end of the shower pipe.
6. The etching apparatus according to claim 1, wherein a second shower device is provided above the roller conveyor, the second shower device facing the first washing tank, the second shower device having a plurality of second liquid spraying ports provided downward, the plurality of second liquid spraying ports being arranged at least in a row along a roller axis of the roller conveyor.
7. The etching apparatus according to claim 1, wherein an acid tank and a second washing tank are further provided in order along a conveyance direction of the roller conveyor, the acid tank and the second washing tank being located in front of the first washing tank in the conveyance direction.
8. Etching apparatus according to claim 7, wherein an air-drying device is provided above and/or below the roller conveyor, the air-drying device having an air outlet extending along the roller axis of the roller conveyor, the air outlet being directly opposite the roller conveyor, the air outlet being located in front of the second rinsing bath in the conveying direction.
CN201910842526.7A 2019-09-06 2019-09-06 Etching equipment Active CN112466774B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910842526.7A CN112466774B (en) 2019-09-06 2019-09-06 Etching equipment

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Application Number Priority Date Filing Date Title
CN201910842526.7A CN112466774B (en) 2019-09-06 2019-09-06 Etching equipment

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CN112466774A CN112466774A (en) 2021-03-09
CN112466774B true CN112466774B (en) 2023-11-17

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11314072A (en) * 1998-05-07 1999-11-16 Dainippon Screen Mfg Co Ltd Substrate treatment device
JP2003322976A (en) * 2002-05-07 2003-11-14 Fuji Photo Film Co Ltd Method for atomizing liquid, method and device for developing substrate by using the same
CN102154648A (en) * 2010-02-12 2011-08-17 住友精密工业株式会社 Etching method
CN103361739A (en) * 2013-07-08 2013-10-23 浙江晶科能源有限公司 Method for implementing back polishing in crystalline silicon solar battery production
CN104051564A (en) * 2013-03-14 2014-09-17 北京北方微电子基地设备工艺研究中心有限责任公司 Wet etching process and equipment, and solar cell and manufacturing method thereof
CN104681471A (en) * 2015-03-12 2015-06-03 京东方科技集团股份有限公司 Wet etching equipment
WO2017089302A1 (en) * 2015-11-24 2017-06-01 Rct Solutions Gmbh Apparatus and method for the chemical treatment of a semiconductor substrate
CN107195730A (en) * 2017-06-29 2017-09-22 昊诚光电(太仓)有限公司 A kind of etching cleaning machine and water circulation method
CN109119338A (en) * 2018-08-06 2019-01-01 横店集团东磁股份有限公司 A kind of highback polishing and efficient single crystal process
CN110197802A (en) * 2019-05-16 2019-09-03 武汉华星光电半导体显示技术有限公司 Wet-method etching equipment

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11314072A (en) * 1998-05-07 1999-11-16 Dainippon Screen Mfg Co Ltd Substrate treatment device
JP2003322976A (en) * 2002-05-07 2003-11-14 Fuji Photo Film Co Ltd Method for atomizing liquid, method and device for developing substrate by using the same
CN102154648A (en) * 2010-02-12 2011-08-17 住友精密工业株式会社 Etching method
CN104051564A (en) * 2013-03-14 2014-09-17 北京北方微电子基地设备工艺研究中心有限责任公司 Wet etching process and equipment, and solar cell and manufacturing method thereof
CN103361739A (en) * 2013-07-08 2013-10-23 浙江晶科能源有限公司 Method for implementing back polishing in crystalline silicon solar battery production
CN104681471A (en) * 2015-03-12 2015-06-03 京东方科技集团股份有限公司 Wet etching equipment
WO2017089302A1 (en) * 2015-11-24 2017-06-01 Rct Solutions Gmbh Apparatus and method for the chemical treatment of a semiconductor substrate
CN107195730A (en) * 2017-06-29 2017-09-22 昊诚光电(太仓)有限公司 A kind of etching cleaning machine and water circulation method
CN109119338A (en) * 2018-08-06 2019-01-01 横店集团东磁股份有限公司 A kind of highback polishing and efficient single crystal process
CN110197802A (en) * 2019-05-16 2019-09-03 武汉华星光电半导体显示技术有限公司 Wet-method etching equipment

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