CN112466761A - Row-type rail lifting IC card packaging robot whole machine - Google Patents
Row-type rail lifting IC card packaging robot whole machine Download PDFInfo
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- CN112466761A CN112466761A CN202011207769.2A CN202011207769A CN112466761A CN 112466761 A CN112466761 A CN 112466761A CN 202011207769 A CN202011207769 A CN 202011207769A CN 112466761 A CN112466761 A CN 112466761A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Abstract
The invention discloses a robot whole machine of a row-connected type rail lifting IC card packaging machine, which comprises a machine table, a conveying mechanism arranged on the machine table, a plurality of packaging robot units which are arranged on the conveying mechanism at equal intervals and are arranged in a direction vertical to the conveying direction of the conveying mechanism, a discharging mechanism arranged on the conveying mechanism and a collecting chute arranged at one end part of the conveying mechanism, wherein the conveying mechanism is arranged on the machine table; the discharging mechanism is used for simultaneously transferring the IC cards which are packaged by the plurality of packaging robot units to the conveying mechanism, and the packaging robot units are used for carrying out IC card packaging operation; the packaging robot unit comprises a rectangular rack provided with a wavy packaging guide rail, a reciprocating driving mechanism, a lifting vacuum carrier and a packaging assembly; the invention realizes the centralized control of the feeding of the IC card on each packaging station, greatly simplifies the structure, saves the production cost, forms batch type synchronous packaging operation, realizes mechanical operation and greatly improves the production efficiency of IC card packaging.
Description
Technical Field
The invention relates to a robot whole machine of a row-connected type rail lifting IC card packaging machine.
Background
In the production and processing of IC cards, packaging of IC cards is an important step, and existing IC cards generally include an IC chip and an IC card base.
The existing packaging equipment adopts a cylinder or an electric push rod to drive processes such as card dispensing, chip discharging, cold pressing, hot pressing and the like to carry out pressing in the IC card packaging operation process, so that multi-terminal distributed control is formed, the structure is complex, and the hardware cost is high.
Disclosure of Invention
The invention aims to overcome the defects and provide a robot whole machine for a linkage-row type rail lifting IC card packaging machine.
In order to achieve the purpose, the invention adopts the following specific scheme:
a row-connected type rail lifting integrated robot machine for an IC card packaging machine comprises a machine table, a conveying mechanism arranged on the machine table, a plurality of packaging robot units which are arranged on the conveying mechanism at equal intervals and are arranged in a direction perpendicular to the conveying direction of the conveying mechanism, a discharging mechanism arranged on the conveying mechanism and a collecting chute arranged at one end of the conveying mechanism; the discharging mechanism is used for simultaneously transferring the IC cards which are packaged by the plurality of packaging robot units to the conveying mechanism, and the packaging robot units are used for carrying out IC card packaging operation.
The packaging robot unit comprises a rectangular rack, a reciprocating driving mechanism, a lifting vacuum carrier and a packaging assembly;
two ends of the rectangular rack are respectively and correspondingly fixed on two sides of the conveying mechanism, wave-shaped packaging guide rails are respectively arranged on two sides of the rectangular rack, each packaging guide rail comprises a wave section and two translation sections, and two ends of the wave section are respectively connected corresponding to the two translation sections;
the lifting vacuum carrier is arranged on the reciprocating driving mechanism, two ends of the lifting vacuum carrier are respectively and movably embedded into the packaging guide rail correspondingly, the lifting vacuum carrier comprises a piezoelectric micromotion piece, and the piezoelectric micromotion piece is used for finely adjusting the longitudinal displacement of the IC card;
the reciprocating driving mechanism is arranged on the rectangular rack and is used for driving the lifting vacuum carrier to reciprocate;
the encapsulation subassembly includes that pneumatic card distribution mechanism, injecting glue mechanism, chip feed mechanism, cold pressing mechanism and the hot rolling mechanism that set gradually along rectangle frame length direction, just injecting glue mechanism, chip feed mechanism, cold pressing mechanism, hot rolling mechanism are the orbital crest position of encapsulation direction of one-to-one respectively.
The quantity of encapsulation subassembly is two sets of, two sets of the mutual central symmetry setting of injecting glue mechanism, chip feed mechanism, cold pressing mechanism, the hot rolling mechanism of encapsulation subassembly just distributes on the both sides of rectangle frame, and is two sets of the pneumatic card distribution mechanism of encapsulation subassembly corresponds the end of locating the rectangle frame respectively.
The lifting vacuum carrier further comprises a sliding sleeve seat, a lifting seat, a carrier bottom frame and a carrier upper frame, wherein the sliding sleeve seat is connected to a reciprocating driving mechanism, the lifting seat is movably clamped on the sliding sleeve seat and can slide up and down relative to the sliding sleeve seat, two ends of the lifting seat are respectively provided with a roller, the two rollers are respectively and correspondingly embedded in a packaging guide track, the carrier bottom frame is arranged on the lifting seat, a piezoelectric micro-motion sheet is arranged between the carrier bottom frame and the lifting seat, the carrier upper frame is arranged on the carrier bottom frame and forms a cavity with the carrier bottom frame, the carrier upper frame is provided with a card containing position, a plurality of micro-holes communicated with the cavity are arranged on the card containing position in a matrix array mode, and the carrier bottom frame is provided with air outlet holes communicated with the cavity; the reciprocating driving mechanism comprises a driving motor and a driving screw rod, the two ends of the driving screw rod are respectively connected to the two ends of the rectangular rack in a rotating mode, the driving motor is fixed to one end of the rectangular rack and is in transmission connection with the driving screw rod, a transmission nut is embedded into the sliding sleeve seat, and the transmission nut is in threaded connection with the driving screw rod.
The pneumatic card distributing mechanism comprises a pneumatic distributing seat and a card material rail, wherein one end of the top surface of the pneumatic distributing seat is provided with a pre-distributing groove, one end of the bottom surface of the pneumatic distributing seat is provided with a card discharging groove matched with the pre-distributing groove in shape, the pre-distributing groove and the card discharging groove are distributed in a diagonal line mode, the bottom surface of the pre-distributing groove is provided with a plurality of supporting air holes distributed in a matrix array mode, one end of the pre-distributing groove is provided with a plurality of material blowing air holes distributed in a straight line mode, the pre-distributing groove and the card discharging groove are communicated through a discharging channel, the thickness of the discharging channel is matched with the thickness of a single IC card, and the card material rail is fixed on the pneumatic distributing seat and communicated with the pre-distributing groove.
The chip feeding mechanism comprises a first support, a chip feeding seat and a chip feeding rail, the first support is fixed on the rectangular rack, the chip feeding seat is fixed on the first support, the chip feeding rail is fixed on the first support and matched with the chip feeding seat, and two piezoelectric clamping sheets used for oppositely clamping or loosening the IC chip are arranged in the chip feeding seat.
The hot rolling mechanism comprises a second support, a rolling support and a hot rolling shaft, the second support is fixed on the rectangular rack, the rolling support is movably connected onto the second support, a compression spring is connected between the rolling support and the second support, and the hot rolling shaft is rotatably connected onto the rolling support.
Wherein the discharging mechanism comprises two discharging guide brackets, a discharging sliding plate, a first air cylinder, a second air cylinder and a discharging lifting plate, the two discharging guide brackets are respectively arranged at two ends of the conveying mechanism at intervals and oppositely, two discharging guide rods which are distributed at intervals are connected between the two discharging guide brackets, the discharging sliding plate is connected on the two discharging guide rods in a sliding manner, the first air cylinder is fixed on the discharging guide bracket far away from the collecting chute, the second cylinder is fixed on the discharging sliding plate, the discharging lifting plate is arranged below the discharging sliding plate and is connected with the discharging sliding plate in a sliding way, the output end of the second air cylinder penetrates through the discharging sliding plate downwards and then is fixedly connected with the discharging lifting plate, and the unloading lifting plate is provided with an electrostatic chuck for grabbing the IC card after the packaging operation is finished corresponding to each packaging robot unit.
The invention has the beneficial effects that: according to the invention, under the joint linkage of the reciprocating driving mechanism and the packaging guide rail on the rectangular frame, the lifting vacuum carrier drives the IC card to realize transverse material moving movement and longitudinal feeding movement, and the longitudinal fine adjustment of the lifting vacuum carrier is matched, so that the centralized control of the IC card feeding on each packaging station is realized, the structure is greatly simplified, and the production cost is saved; meanwhile, the IC card is closest to each packaging station only at the position of a wave crest under the action of the packaging guide rail and is not in contact with each packaging station, so that the risk that the IC card is scratched in the moving process is avoided.
The invention forms batch type synchronous packaging operation, realizes mechanized operation, and greatly improves the production efficiency of IC card packaging.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the discharge mechanism of the present invention;
FIG. 3 is a perspective view of the packaging robot unit of the present invention;
FIG. 4 is a perspective view of another perspective of the packaging robot unit of the present invention;
FIG. 5 is a perspective view of the lift vacuum carrier of the present invention;
FIG. 6 is a cross-sectional view of the lift vacuum carrier of the present invention;
FIG. 7 is a cross-sectional view of the pneumatic card dispensing mechanism of the present invention;
FIG. 8 is a schematic view of the pneumatic dispensing base of the present invention;
FIG. 9 is a cross-sectional view of a die feed mechanism of the present invention;
FIG. 10 is a perspective view of a heated rolling mechanism of the present invention;
description of reference numerals: machine-a 1; transport mechanism-a 2; encapsulating robot cell-a 3; discharge mechanism-a 4; collection chute-a 5;
a rectangular frame-1; packaging the guide rail-11; a drive motor-21; a drive screw-22; lifting the vacuum carrier-3; piezoelectric micromotion piece-31; a sliding sleeve seat-32; a lifting seat-33; a carrier bottom frame-34; carrier upper frame-35; a roller-36; a drive nut-37; package assembly-4; a pneumatic card dispensing mechanism-41; a pneumatic dispensing station-411; card rail-412; pre-dispense slot-413; a card discharge chute-414; a support air hole-415; a blowing gas hole-416; outlet channel-417; a glue injection mechanism-42; chip feeding mechanism-43; a first bracket-431; a chip loading base-432; chip material rail-433; a piezoelectric clamping sheet-434; cold pressing means-44; a hot rolling mechanism-45; a second bracket-451; rolling the support-452; hot rolling shaft-453; a hold-down spring-454;
a discharge guide support-10; a discharge slide plate-20; a first cylinder-30; a second cylinder-40; a discharging lifting plate-50; a discharge guide bar-60; electrostatic chuck-70.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific examples, without limiting the scope of the invention.
As shown in fig. 1 to 10, the robot whole machine for a gang rail lifting IC card packaging machine according to this embodiment includes a machine table a1, a conveying mechanism a2 disposed on the machine table, a plurality of packaging robot units a3 disposed on the conveying mechanism a2 at equal intervals and perpendicular to the conveying direction of the conveying mechanism a2, a discharging mechanism a4 disposed on the conveying mechanism a2, and a collecting chute a5 disposed at one end of the conveying mechanism a 2; the discharging mechanism a4 is used for simultaneously transferring the IC cards which are packaged by a plurality of packaging robot units a3 to the conveying mechanism a2, and the packaging robot units a3 are used for carrying out IC card packaging operation.
When the packaging robot unit a3 works, the packaging robot unit a3 starts to perform IC card packaging operation synchronously, after the packaging robot unit a3 completes the IC card packaging operation, the unloading mechanism a4 simultaneously grabs the packaged IC cards from the packaging robot unit a3 and transfers the IC cards to the conveying mechanism a2, then the conveying mechanism a2 conveys the IC cards to the collecting chute a5, and the collecting chute a5 transfers the IC cards out of a working area, so that batch type synchronous packaging operation is formed, mechanical operation is performed, and the production efficiency of IC card packaging is greatly improved.
Based on the above embodiment, further, the packaging robot unit a3 includes a rectangular frame 1, a reciprocating driving mechanism, a lifting vacuum carrier 3 and a packaging assembly 4;
two ends of the rectangular rack 1 are respectively and correspondingly fixed on two sides of the conveying mechanism a1, two sides of the rectangular rack 1 are respectively provided with a wavy packaging guide rail 11, the packaging guide rail 11 comprises a wave section and two translation sections, and two ends of the wave section are respectively connected corresponding to the two translation sections;
the lifting vacuum carrier 3 is arranged on the reciprocating driving mechanism, two ends of the lifting vacuum carrier are respectively and movably embedded into the packaging guide rail 11 correspondingly, the lifting vacuum carrier 3 comprises a piezoelectric micro-motion plate 31, and the piezoelectric micro-motion plate 31 is used for finely adjusting the longitudinal displacement of the IC card;
the reciprocating driving mechanism is arranged on the rectangular rack 1 and is used for driving the lifting vacuum carrier 3 to reciprocate;
the packaging assembly 4 comprises a pneumatic card distributing mechanism 41, a glue injection mechanism 42, a chip feeding mechanism 43, a cold pressing mechanism 44 and a hot rolling mechanism 45 which are sequentially arranged along the length direction of the rectangular rack 1, and the glue injection mechanism 42, the chip feeding mechanism 43, the cold pressing mechanism 44 and the hot rolling mechanism 45 respectively correspond to the wave crest positions of the packaging guide rail 11 one by one.
When the integrated circuit packaging machine works, the reciprocating driving mechanism drives the lifting vacuum carrier 3 to be matched with the translation section of the packaging guide rail 11 and move to be corresponding to the card distributing mechanism of the packaging assembly 4, then the card distributing mechanism places an IC card base on the lifting vacuum carrier 3, then the reciprocating driving mechanism drives the lifting vacuum carrier 3 to be sequentially matched with the glue injecting mechanism 42, the chip feeding mechanism 43, the cold pressing mechanism 44 and the hot rolling mechanism 45 under the guiding action of the wave section of the packaging guide rail 11, the glue injecting mechanism 42 injects glue into a chip accommodating groove on the IC card base, the chip feeding mechanism 43 places an IC chip in the chip accommodating groove after glue injection, then the cold pressing mechanism 44 carries out cold pressing treatment, the hot rolling mechanism 45 carries out hot rolling treatment, in the process, the longitudinal displacement of the IC card is slightly adjusted through the piezoelectric micro-acting sheet 31 on the lifting vacuum carrier 3, so that the centralized control of the feeding of the IC card on each packaging station is realized, the IC card is thus completely packaged, and the unloading mechanism a4 takes out the packaged IC card from the elevating vacuum carrier 3, so that the IC card packaging operation is continuously performed by the forward and reverse rotation driving of the reciprocating driving mechanism.
In the embodiment, the reciprocating driving mechanism and the packaging guide rail 11 on the rectangular frame 1 are linked together, so that the lifting vacuum carrier 3 drives the IC card to realize transverse material moving movement and longitudinal feeding movement, and the longitudinal fine adjustment of the lifting vacuum carrier 3 is matched, thereby realizing the centralized control of the IC card feeding on each packaging station, greatly simplifying the structure and saving the production cost; meanwhile, the IC card is closest to each packaging station under the action of the packaging guide rail 11 only at the wave crest position and is not in contact with each packaging station, so that the risk that the IC card is scratched in the moving process is avoided.
And this embodiment integrates the degree higher for the circulating overall arrangement of gyration, and the structure is compacter, reduces to produce the line and occupies the volume.
Based on the above embodiment, further, the number of the package assemblies 4 is two, the glue injection mechanisms 42, the chip loading mechanisms 43, the cold press mechanisms 44, and the hot rolling mechanisms 45 of the two sets of package assemblies 4 are arranged in a central symmetry manner and distributed on two sides of the rectangular rack 1, and the pneumatic card distributing mechanisms 41 of the two sets of package assemblies 4 are respectively and correspondingly arranged at the ends of the rectangular rack 1.
In practical use, the IC card bases to be packaged are sequentially stacked on the pneumatic card distributing mechanism 41, the placing directions of the IC card bases on the two pneumatic card distributing mechanisms 41 are opposite, namely the left and right IC card bases are centrosymmetric, when the lifting vacuum carrier 3 moves from the right end to the left end, the lifting vacuum carrier 3 is sequentially matched with the glue injection mechanism 42, the chip loading mechanism 43, the cold pressing mechanism 44 and the hot rolling mechanism 45 which are positioned on the same side of the chip containing groove of the IC card base under the linkage and matching of the reciprocating driving mechanism and the packaging guide rail 11 to complete the packaging operation, then the packaged IC card is taken out at the discharging mechanism a4, the lifting vacuum carrier 3 is driven by the reciprocating driving mechanism to move to be matched with the card distributing mechanism at the left end, the IC card distributing mechanism at the left end places the IC card base on the lifting vacuum carrier 3, and then the reciprocating driving mechanism is driven reversely, make lift vacuum carrier 3 remove to the right-hand member from the left end under the guide effect of encapsulation guide rail 11, lift vacuum carrier 3 this moment lies in injecting glue mechanism 42 with the chip storage tank of IC-card base in proper order with the same side, chip feed mechanism 43, cold press mechanism 44, the encapsulation operation is accomplished in the cooperation of hot rolling mechanism 45, then get back to the right-hand member again, so accomplish a reciprocal process, so make lift vacuum carrier 3 all be in the encapsulation operation state at journey and return stroke in-process, and then improve the utilization ratio of encapsulation subassembly 4, the production efficiency improves greatly, overall structure is also more compact.
Based on the above embodiment, further, the lifting vacuum carrier 3 further includes a sliding sleeve seat 32, a lifting seat 33, a carrier bottom frame 34 and a carrier upper frame 35, the sliding sleeve seat 32 is connected to the reciprocating driving mechanism, the lifting seat 33 is movably clamped on the sliding sleeve seat 32 and can slide up and down relative to the sliding sleeve seat 32, two ends of the lifting seat 33 are respectively provided with a roller 36, two rollers 36 are respectively embedded in the package guiding rail 11, the carrier bottom frame 34 is arranged on the lifting seat 33, the piezoelectric micro-motion plates 31 are arranged between the carrier bottom frame 34 and the lifting seat 33, preferably, the number of the piezoelectric micro-motion plates 31 is four, the four piezoelectric micro-motion plates 31 are distributed in a rectangular shape, so that the longitudinal feeding of the IC card is more balanced, the carrier upper frame 35 is arranged on the carrier bottom frame 34 and forms a cavity with the carrier bottom frame 34, the carrier upper frame 35 is provided with a card containing position, the card containing positions are provided with a plurality of micro holes communicated with the cavity in a matrix array, and the carrier bottom frame 34 is provided with air outlet holes communicated with the cavity.
During the practical use, the card distributing mechanism places the IC card base on the card of carrier upper frame 35 holds the position, then carry out evacuation processing through the pore pair cavity of giving vent to anger of carrier underframe 34, thereby make the IC card base adsorb on carrier upper frame 35 under negative pressure state, then under reciprocating drive mechanism's drive, whole lift vacuum carrier 3 lateral shifting, two gyro wheels 36 roll along encapsulation guide rail 11 respectively, when gyro wheel 36 rolls gradually to the crest position of encapsulation guide rail 11, two gyro wheels 36 are under encapsulation guide rail 11's effect, lift seat 33 lifting, make lift seat 33 relative sliding sleeve seat 32 rebound, thereby realize the lateral shifting and the vertical feed motion of lift vacuum carrier 3 through a reciprocating drive mechanism.
Based on the above embodiment, further, the reciprocating driving mechanism includes a driving motor 21 and a driving screw 22, two ends of the driving screw 22 are respectively and correspondingly connected to two ends of the rectangular frame 1 in a rotating manner, the driving motor 21 is fixed at one end of the rectangular frame 1 and is in transmission connection with the driving screw 22, a transmission nut 37 is embedded in the sliding sleeve seat 32, and the transmission nut 37 is in threaded connection with the driving screw 22. During practical use, the driving motor 21 drives the driving screw 22 to rotate, the driving screw 22 is matched with the transmission nut 37 in the sliding sleeve seat 32, so that the whole lifting vacuum carrier 3 is driven to move transversely, and meanwhile, the lifting vacuum carrier 3 is ensured not to move when moving to the wave crest position of the packaging guide rail 11 by utilizing the self-locking characteristic of the matching of the driving screw 22 and the transmission nut 37, so that the normal operation of IC card packaging operation is ensured.
Based on the above embodiment, further, the pneumatic card distributing mechanism 41 includes a pneumatic distributing base 411 and a card rail 412, a pre-distributing groove 413 is formed at one end of the top surface of the pneumatic distributing base 411, a card discharging groove 414 adapted to the shape of the pre-distributing groove 413 is formed at one end of the bottom surface of the pneumatic distributing base 411, the pre-distributing groove 413 and the card discharging groove 414 are distributed diagonally, a plurality of supporting air holes 415 arranged in a matrix array are formed in the bottom surface of the pre-distributing groove 413, a plurality of blowing air holes 416 arranged in a straight line are formed at one end of the pre-distributing groove 413, the pre-distributing groove 413 and the card discharging groove 414 are communicated through a discharging channel 417, the thickness of the discharging channel 417 is adapted to the thickness of a single IC card, and the card rail 412 is fixed on the pneumatic distributing base 411 and is communicated with the pre-distributing groove 413.
In actual use, the IC card base is placed in the card track 412, the IC card base at the bottom enters the pre-distributing groove 413 of the pneumatic distributing seat 411, and when the lifting vacuum carrier 3 moves to the lower side of the card discharging groove 414, the air is fed to the blowing air hole 416 and the supporting air hole 415 of the pneumatic distributing seat 411, so that the IC card base at the bottommost layer enters the card discharging groove 414 through the discharging channel 417 and falls into the card containing position of the lifting vacuum carrier 3, and single feeding of the cards is completed.
Based on the above embodiment, further, the chip feeding mechanism 43 includes a first bracket 431, a chip feeding base 432 and a chip rail 433, the first bracket 431 is fixed on the rectangular rack 1, the chip feeding base 432 is fixed on the first bracket 431, the chip rail 433 is fixed on the first bracket 431 and is matched with the chip feeding base 432, and two piezoelectric clamping sheets 434 for clamping or releasing the IC chip in opposite directions are arranged in the chip feeding base 432.
During practical use, the lifting vacuum carrier 3 bearing the IC card base moves below the chip feeding seat 432, the piezoelectric micro-moving pieces 31 of the lifting vacuum carrier 3 lift the height of the IC card base, then the two piezoelectric clamping pieces 434 in the chip feeding seat 432 loosen the IC chip, so that the IC chip at the bottommost layer falls into the chip accommodating groove of the IC card base under the self-weight, then the two piezoelectric clamping pieces 434 clamp the IC chip in the chip feeding seat 432 oppositely, then the piezoelectric micro-moving pieces 31 drive the IC card base bearing the IC chip to descend, friction on the IC chip in the chip feeding seat 432 is avoided, the IC chip is damaged, and therefore feeding of the IC chip is completed.
Based on the above embodiment, further, the hot rolling mechanism 45 includes a second support 451, a rolling support 452, and a hot rolling shaft 453, the second support 451 is fixed on the rectangular frame 1, the rolling support 452 is movably connected to the second support 451, a pressing spring 454 is connected between the rolling support 452 and the second support 451, and the hot rolling shaft 453 is rotatably connected to the rolling support 452. During actual use, the height of the carrier upper frame 35 is raised by the piezoelectric micromotor 31, so that the IC chip is in contact with the hot rolling shaft 453, meanwhile, the hot rolling shaft 453 keeps the pressing force on the IC chip under the action of the pressing spring 454, and then the driving motor 21 drives the lifting vacuum carrier 3 to reciprocate on the station of the hot rolling mechanism 45, so that the hot rolling shaft 453 repeatedly rolls and presses the position of the chip, and the IC chip is heated more uniformly.
Based on the above embodiment, further, the discharging mechanism a4 includes two discharging guide brackets 10, a discharging sliding plate 20, a first air cylinder 30, a second air cylinder 40 and a discharging lifting plate 50, the two discharging guide brackets 10 are respectively disposed at two ends of the conveyor a1 at intervals and oppositely, two discharging guide rods 60 are connected between the two discharging guide brackets 10, the discharging sliding plate 20 is slidably connected to the two discharging guide rods 60, the first air cylinder 30 is fixed on the discharging guide bracket 10 far from the collecting chute a5, the second air cylinder 40 is fixed on the discharging sliding plate 20, the discharging lifting plate 50 is disposed below the discharging sliding plate 20 and slidably connected with the discharging sliding plate 20, the output end of the second air cylinder 40 passes through the discharging sliding plate 20 downwards and then is fixedly connected with the discharging lifting plate 50, the discharging lifting plate 50 is provided with an electrostatic chuck 70 for grasping the IC card after the packaging operation corresponding to each packaging robot unit a 3.
In this embodiment, in order to better cooperate with two groups of encapsulation components 4, the number of the unloading lifting plates 50 is two, correspondingly, the number of the second cylinders 40 is also two, two the unloading lifting plates 50 are arranged side by side and respectively correspond to the upper parts of the two ends of the encapsulation robot unit a3, and two the second cylinders 40 are respectively connected with two unloading lifting plates 50.
In practical use, when the packaging robot unit a3 completes IC card packaging operation from one end to the other end, the corresponding second cylinder 40 drives the corresponding unloading lifting plate 50 to move downwards, then the electrostatic chuck 70 of the unloading lifting plate 50 is used to adsorb the IC card packaged by each packaging robot unit a3, then the second cylinder 40 drives the unloading lifting plate 50 to move upwards, then the first cylinder 30 drives the unloading sliding plate 20 to slide, so that the electrostatic chuck 70 adsorbed with the IC card moves to the outer side of the packaging robot unit a3, then the electrostatic chuck 70 releases the IC card, so that the IC card drops to the lower conveying mechanism a2, and then the conveying mechanism a2 transfers the IC card to the collecting chute a 5; when the packaging robot unit a3 finishes IC card packaging operation from the other end to one end, the other second cylinder 40 correspondingly drives the other unloading lifting plate 50 to move downwards to grab the IC card and transfer the IC card to the conveying mechanism a 2; therefore, synchronous discharging of the plurality of packaging robot units a3 is realized, and the efficiency is high.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present patent application are included in the protection scope of the present patent application.
Claims (8)
1. The robot whole machine of the linked row type rail lifting IC card packaging machine is characterized by comprising a machine table (a 1), a conveying mechanism (a 2) arranged on the machine table, a plurality of packaging robot units (a 3) which are arranged on the conveying mechanism (a 2) at equal intervals and are perpendicular to the conveying direction of the conveying mechanism (a 2), a discharging mechanism (a 4) arranged on the conveying mechanism (a 2) and a collecting chute (a 5) arranged at one end of the conveying mechanism (a 2); the discharging mechanism (a 4) is used for simultaneously transferring a plurality of packaging robot units (a 3) to the conveying mechanism (a 2) after the packaging operation of the IC cards is completed, and the packaging robot units (a 3) are used for carrying out the packaging operation of the IC cards.
2. The gang rail elevating IC card packaging robot as claimed in claim 1, wherein the packaging robot unit (a 3) comprises a rectangular frame (1), a reciprocating drive mechanism, an elevating vacuum carrier (3) and a packaging assembly (4);
two ends of the rectangular rack (1) are respectively and correspondingly fixed on two sides of the conveying mechanism (a 1), two sides of the rectangular rack (1) are respectively provided with a wavy packaging guide track (11), the packaging guide track (11) comprises a wave section and two translation sections, and two ends of the wave section are respectively connected corresponding to the two translation sections;
the lifting vacuum carrier (3) is arranged on the reciprocating driving mechanism, two ends of the lifting vacuum carrier are respectively and movably embedded into the packaging guide rail (11) correspondingly, the lifting vacuum carrier (3) comprises a piezoelectric micro-actuating piece (31), and the piezoelectric micro-actuating piece (31) is used for finely adjusting the longitudinal displacement of the IC card;
the reciprocating driving mechanism is arranged on the rectangular rack (1) and is used for driving the lifting vacuum carrier (3) to reciprocate;
the packaging assembly (4) comprises a pneumatic card distribution mechanism (41), a glue injection mechanism (42), a chip feeding mechanism (43), a cold pressing mechanism (44) and a hot rolling mechanism (45) which are sequentially arranged along the length direction of the rectangular rack (1), and the glue injection mechanism (42), the chip feeding mechanism (43), the cold pressing mechanism (44) and the hot rolling mechanism (45) respectively correspond to the peak positions of the packaging guide rails (11) in a one-to-one mode.
3. The gang rail lifting IC card packaging robot as claimed in claim 2, wherein the number of the packaging assemblies (4) is two, the glue injection mechanisms (42), the chip loading mechanisms (43), the cold press mechanisms (44) and the hot rolling mechanisms (45) of the two groups of packaging assemblies (4) are arranged in a central symmetry manner and distributed on two sides of the rectangular rack (1), and the pneumatic card distribution mechanisms (41) of the two groups of packaging assemblies (4) are respectively arranged at the ends of the rectangular rack (1).
4. The integrated machine of claim 2, wherein the lifting vacuum carrier (3) further comprises a sliding sleeve seat (32), a lifting seat (33), a carrier bottom frame (34) and a carrier top frame (35), the sliding sleeve seat (32) is connected to the reciprocating driving mechanism, the lifting seat (33) is movably clamped on the sliding sleeve seat (32) and can slide up and down relative to the sliding sleeve seat (32), two ends of the lifting seat (33) are respectively provided with a roller (36), the two rollers (36) are respectively embedded in the packaging guide rail (11), the carrier bottom frame (34) is arranged on the lifting seat (33), the piezoelectric micromotion piece (31) is arranged between the carrier bottom frame (34) and the lifting seat (33), the carrier top frame (35) is arranged on the carrier bottom frame (34) and forms a cavity with the carrier bottom frame (34), the carrier upper frame (35) is provided with a card containing position, a plurality of micro holes communicated with the cavity are arranged on the card containing position in a matrix array, and the carrier bottom frame (34) is provided with air outlet holes communicated with the cavity; reciprocating drive mechanism includes driving motor (21) and driving screw (22), the both ends of driving screw (22) correspond respectively and rotate the both ends of connecting in rectangle frame (1), driving motor (21) are fixed in the one end of rectangle frame (1) and are connected with driving screw (22) transmission, the embedded driving nut (37) that is equipped with of sliding sleeve seat (32), driving nut (37) threaded connection is on driving screw (22).
5. The Row type rail lifting IC card packaging robot as claimed in claim 2, wherein the pneumatic card distributing mechanism (41) comprises a pneumatic distributing base (411) and a card material rail (412), one end of the top surface of the pneumatic distributing base (411) is provided with a pre-distributing groove (413), one end of the bottom surface of the pneumatic distributing base (411) is provided with a card discharging groove (414) matched with the pre-distributing groove (413) in shape, the pre-distributing groove (413) and the card discharging groove (414) are distributed diagonally, the bottom surface of the pre-distributing groove (413) is provided with a plurality of supporting air holes (415) arranged in a matrix array, one end of the pre-distributing groove (413) is provided with a plurality of blowing air holes (416) arranged in a straight line shape, the pre-distributing groove (413) and the card discharging groove (414) are communicated through a discharging channel (417), and the thickness of the discharging channel (417) is matched with the thickness of a single IC card, the card material rail (412) is fixed on the pneumatic distribution base (411) and is communicated with the pre-distribution groove (413).
6. The robot packaging machine of claim 2, wherein the chip loading mechanism (43) comprises a first bracket (431), a chip loading seat (432) and a chip loading rail (433), the first bracket (431) is fixed on the rectangular frame (1), the chip loading seat (432) is fixed on the first bracket (431), the chip loading rail (433) is fixed on the first bracket (431) and matched with the chip loading seat (432), and two piezoelectric clamping sheets (434) for clamping or releasing the IC chip oppositely are arranged in the chip loading seat (432).
7. The row type rail-lifting IC card packaging robot as claimed in claim 1, wherein the hot rolling mechanism (45) comprises a second bracket (451), a rolling bracket (452) and a hot rolling shaft (453), the second bracket (451) is fixed on the rectangular frame (1), the rolling bracket (452) is movably connected on the second bracket (451), a compression spring (454) is connected between the rolling bracket (451) and the second bracket (451), and the hot rolling shaft (453) is rotatably connected on the rolling bracket (452).
8. The row type rail-mounted lifting IC card packaging robot as claimed in claim 1, wherein the discharging mechanism (a 4) comprises two discharging guide brackets (10), a discharging sliding plate (20), a first air cylinder (30), a second air cylinder (40) and a discharging lifting plate (50), the two discharging guide brackets (10) are respectively arranged at two ends of the conveying mechanism (a 1) at intervals and oppositely, two discharging guide rods (60) are connected between the two discharging guide brackets (10) at intervals, the discharging sliding plate (20) is slidably connected to the two discharging guide rods (60), the first air cylinder (30) is fixed on the discharging guide bracket (10) far away from the collecting chute (a 5), the second air cylinder (40) is fixed on the discharging sliding plate (20), and the discharging lifting plate (50) is arranged below the discharging sliding plate (20), And is connected with the discharging sliding plate (20) in a sliding way, the output end of the second air cylinder (40) penetrates through the discharging sliding plate (20) downwards and then is fixedly connected with the discharging lifting plate (50), and the discharging lifting plate (50) is provided with an electrostatic chuck (70) used for grabbing the IC card after the packaging operation is finished corresponding to each packaging robot unit (a 3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011207769.2A CN112466761A (en) | 2020-11-03 | 2020-11-03 | Row-type rail lifting IC card packaging robot whole machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011207769.2A CN112466761A (en) | 2020-11-03 | 2020-11-03 | Row-type rail lifting IC card packaging robot whole machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112466761A true CN112466761A (en) | 2021-03-09 |
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ID=74834940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011207769.2A Withdrawn CN112466761A (en) | 2020-11-03 | 2020-11-03 | Row-type rail lifting IC card packaging robot whole machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112466761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140489A (en) * | 2021-04-19 | 2021-07-20 | 佳木斯大学 | Special chip packaging hardware of computer |
-
2020
- 2020-11-03 CN CN202011207769.2A patent/CN112466761A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140489A (en) * | 2021-04-19 | 2021-07-20 | 佳木斯大学 | Special chip packaging hardware of computer |
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Application publication date: 20210309 |