CN112420570A - Wave rail driven lifting reciprocating type IC card packaging robot - Google Patents
Wave rail driven lifting reciprocating type IC card packaging robot Download PDFInfo
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- CN112420570A CN112420570A CN202011207177.0A CN202011207177A CN112420570A CN 112420570 A CN112420570 A CN 112420570A CN 202011207177 A CN202011207177 A CN 202011207177A CN 112420570 A CN112420570 A CN 112420570A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J5/00—Manipulators mounted on wheels or on carriages
- B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a wave track driven lifting reciprocating type IC card packaging robot, which comprises a rectangular rack, a reciprocating driving mechanism, a lifting vacuum carrier and a packaging assembly, wherein the lifting vacuum carrier is arranged on the rectangular rack; the rectangular rack is provided with a wave-shaped packaging guide track, and the packaging guide track comprises a wave section and two translation sections; the lifting vacuum carrier is arranged on the reciprocating driving mechanism and is movably matched with the packaging guide track, and the lifting vacuum carrier comprises a piezoelectric micromotion sheet; the reciprocating driving mechanism is arranged on the rectangular rack and is used for driving the lifting vacuum carrier to reciprocate; the packaging assembly comprises a pneumatic card distribution mechanism, an adhesive injection mechanism, a chip feeding mechanism, a cold pressing mechanism and a hot rolling mechanism which are sequentially arranged along the length direction of the rectangular rack, and the adhesive injection mechanism, the chip feeding mechanism, the cold pressing mechanism and the hot rolling mechanism respectively correspond to the wave crest positions of the packaging guide rails one by one; the invention realizes the centralized control of the feeding of the IC card on each packaging station, greatly simplifies the structure and saves the production cost.
Description
Technical Field
The invention relates to a wave track driven lifting reciprocating type IC card packaging robot.
Background
In the production and processing of IC cards, packaging of IC cards is an important step, and existing IC cards generally include an IC chip and an IC card base.
The existing packaging equipment adopts a cylinder or an electric push rod to drive processes such as card dispensing, chip discharging, cold pressing, hot pressing and the like to carry out pressing in the IC card packaging operation process, so that multi-terminal distributed control is formed, the structure is complex, and the hardware cost is high.
Disclosure of Invention
The invention aims to overcome the defects and provide a wave track driven lifting reciprocating type IC card packaging robot.
In order to achieve the purpose, the invention adopts the following specific scheme:
a wave track driven lifting reciprocating type IC card packaging robot comprises a rectangular rack, a reciprocating driving mechanism, a lifting vacuum carrier and a packaging assembly;
two sides of the rectangular rack are respectively provided with a wavy packaging guide track, the packaging guide track comprises a wavy section and two translation sections, and two ends of the wavy section are respectively connected corresponding to the two translation sections;
the lifting vacuum carrier is arranged on the reciprocating driving mechanism, two ends of the lifting vacuum carrier are respectively and movably embedded into the packaging guide rail correspondingly, the lifting vacuum carrier comprises a piezoelectric micromotion piece, and the piezoelectric micromotion piece is used for finely adjusting the longitudinal displacement of the IC card;
the reciprocating driving mechanism is arranged on the rectangular rack and is used for driving the lifting vacuum carrier to reciprocate;
the encapsulation subassembly includes that pneumatic card distribution mechanism, injecting glue mechanism, chip feed mechanism, cold pressing mechanism and the hot rolling mechanism that set gradually along rectangle frame length direction, just injecting glue mechanism, chip feed mechanism, cold pressing mechanism, hot rolling mechanism are the orbital crest position of encapsulation direction of one-to-one respectively.
The quantity of encapsulation subassembly is two sets of, two sets of the mutual central symmetry setting of injecting glue mechanism, chip feed mechanism, cold pressing mechanism, the hot rolling mechanism of encapsulation subassembly just distributes on the both sides of rectangle frame, and is two sets of the pneumatic card distribution mechanism of encapsulation subassembly corresponds the end of locating the rectangle frame respectively.
The utility model discloses a lift vacuum carrier, including carrier underframe and carrier underframe, including the carrier underframe, the carrier underframe is equipped with the venthole that feeds through with the cavity, and the carrier underframe is equipped with the venthole that feeds through with the cavity.
The reciprocating driving mechanism comprises a driving motor and a driving screw rod, the two ends of the driving screw rod are respectively connected to the two ends of the rectangular rack in a rotating mode, the driving motor is fixed to one end of the rectangular rack and is in transmission connection with the driving screw rod, a transmission nut is embedded into the sliding sleeve seat, and the transmission nut is in threaded connection with the driving screw rod.
The pneumatic card distributing mechanism comprises a pneumatic distributing seat and a card material rail, wherein one end of the top surface of the pneumatic distributing seat is provided with a pre-distributing groove, one end of the bottom surface of the pneumatic distributing seat is provided with a card discharging groove matched with the pre-distributing groove in shape, the pre-distributing groove and the card discharging groove are distributed in a diagonal line mode, the bottom surface of the pre-distributing groove is provided with a plurality of supporting air holes distributed in a matrix array mode, one end of the pre-distributing groove is provided with a plurality of material blowing air holes distributed in a straight line mode, the pre-distributing groove and the card discharging groove are communicated through a discharging channel, the thickness of the discharging channel is matched with the thickness of a single IC card, and the card material rail is fixed on the pneumatic distributing seat and communicated with the pre-distributing groove.
The chip feeding mechanism comprises a first support, a chip feeding seat and a chip feeding rail, the first support is fixed on the rectangular rack, the chip feeding seat is fixed on the first support, the chip feeding rail is fixed on the first support and matched with the chip feeding seat, and two piezoelectric clamping sheets used for oppositely clamping or loosening the IC chip are arranged in the chip feeding seat.
The hot rolling mechanism comprises a second support, a rolling support and a hot rolling shaft, the second support is fixed on the rectangular rack, the rolling support is movably connected onto the second support, a compression spring is connected between the rolling support and the second support, and the hot rolling shaft is rotatably connected onto the rolling support.
The invention has the beneficial effects that: according to the invention, under the joint linkage of the reciprocating driving mechanism and the packaging guide rail on the rectangular frame, the lifting vacuum carrier drives the IC card to realize transverse material moving movement and longitudinal feeding movement, and the longitudinal fine adjustment of the lifting vacuum carrier is matched, so that the centralized control of the IC card feeding on each packaging station is realized, the structure is greatly simplified, and the production cost is saved; meanwhile, the IC card is closest to each packaging station only at the position of a wave crest under the action of the packaging guide rail and is not in contact with each packaging station, so that the risk that the IC card is scratched in the moving process is avoided.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of another aspect of the present invention;
FIG. 3 is a perspective view of the lift vacuum carrier of the present invention;
FIG. 4 is a cross-sectional view of the lift vacuum carrier of the present invention;
FIG. 5 is a cross-sectional view of the pneumatic card dispensing mechanism of the present invention;
FIG. 6 is a schematic view of the pneumatic dispensing base of the present invention;
FIG. 7 is a cross-sectional view of a die feed mechanism of the present invention;
FIG. 8 is a perspective view of a heated rolling mechanism of the present invention;
description of reference numerals: a rectangular frame-1; packaging the guide rail-11; a drive motor-21; a drive screw-22; lifting the vacuum carrier-3; piezoelectric micromotion piece-31; a sliding sleeve seat-32; a lifting seat-33; a carrier bottom frame-34; carrier upper frame-35; a roller-36; a drive nut-37; package assembly-4; a pneumatic card dispensing mechanism-41; a pneumatic dispensing station-411; card rail-412; pre-dispense slot-413; a card discharge chute-414; a support air hole-415; a blowing gas hole-416; outlet channel-417; a glue injection mechanism-42; chip feeding mechanism-43; a first bracket-431; a chip loading base-432; chip material rail-433; a piezoelectric clamping sheet-434; cold pressing means-44; a hot rolling mechanism-45; a second bracket-451; rolling the support-452; hot rolling shaft-453; compressing spring-454.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific examples, without limiting the scope of the invention.
As shown in fig. 1 to 8, the wave rail driving lifting reciprocating IC card packaging robot of the present embodiment includes a rectangular frame 1, a reciprocating driving mechanism, a lifting vacuum carrier 3 and a packaging assembly 4;
two sides of the rectangular rack 1 are respectively provided with a wave-shaped packaging guide rail 11, the packaging guide rail 11 comprises a wave section and two translation sections, and two ends of the wave section are respectively connected corresponding to the two translation sections;
the lifting vacuum carrier 3 is arranged on the reciprocating driving mechanism, two ends of the lifting vacuum carrier are respectively and movably embedded into the packaging guide rail 11 correspondingly, the lifting vacuum carrier 3 comprises a piezoelectric micro-motion plate 31, and the piezoelectric micro-motion plate 31 is used for finely adjusting the longitudinal displacement of the IC card;
the reciprocating driving mechanism is arranged on the rectangular rack 1 and is used for driving the lifting vacuum carrier 3 to reciprocate;
the packaging assembly 4 comprises a pneumatic card distributing mechanism 41, a glue injection mechanism 42, a chip feeding mechanism 43, a cold pressing mechanism 44 and a hot rolling mechanism 45 which are sequentially arranged along the length direction of the rectangular rack 1, and the glue injection mechanism 42, the chip feeding mechanism 43, the cold pressing mechanism 44 and the hot rolling mechanism 45 respectively correspond to the wave crest positions of the packaging guide rail 11 one by one.
The working mode of the embodiment is as follows: when the integrated circuit packaging machine works, the reciprocating driving mechanism drives the lifting vacuum carrier 3 to be matched with the translation section of the packaging guide rail 11 and move to be corresponding to the card distributing mechanism of the packaging assembly 4, then the card distributing mechanism places an IC card base on the lifting vacuum carrier 3, then the reciprocating driving mechanism drives the lifting vacuum carrier 3 to be sequentially matched with the glue injecting mechanism 42, the chip feeding mechanism 43, the cold pressing mechanism 44 and the hot rolling mechanism 45 under the guiding action of the wave section of the packaging guide rail 11, the glue injecting mechanism 42 injects glue into a chip accommodating groove on the IC card base, the chip feeding mechanism 43 places an IC chip in the chip accommodating groove after glue injection, then the cold pressing mechanism 44 carries out cold pressing treatment, the hot rolling mechanism 45 carries out hot rolling treatment, in the process, the longitudinal displacement of the IC card is slightly adjusted through the piezoelectric micro-acting sheet 31 on the lifting vacuum carrier 3, so that the centralized control of the feeding of the IC card on each packaging station is realized, thus, the encapsulation of the IC card is completed, and then the encapsulated IC card is taken out from the lifting vacuum carrier 3 by an external manipulator, so that the encapsulation operation of the IC card is continuously carried out under the driving of the forward and reverse rotation of the reciprocating driving mechanism.
In the embodiment, the reciprocating driving mechanism and the packaging guide rail 11 on the rectangular frame 1 are linked together, so that the lifting vacuum carrier 3 drives the IC card to realize transverse material moving movement and longitudinal feeding movement, and the longitudinal fine adjustment of the lifting vacuum carrier 3 is matched, thereby realizing the centralized control of the IC card feeding on each packaging station, greatly simplifying the structure and saving the production cost; meanwhile, the IC card is closest to each packaging station under the action of the packaging guide rail 11 only at the wave crest position and is not in contact with each packaging station, so that the risk that the IC card is scratched in the moving process is avoided.
And this embodiment integrates the degree higher for the circulating overall arrangement of gyration, and the structure is compacter, reduces to produce the line and occupies the volume.
Based on the above embodiment, further, the number of the package assemblies 4 is two, the glue injection mechanisms 42, the chip loading mechanisms 43, the cold press mechanisms 44, and the hot rolling mechanisms 45 of the two sets of package assemblies 4 are arranged in a central symmetry manner and distributed on two sides of the rectangular rack 1, and the pneumatic card distributing mechanisms 41 of the two sets of package assemblies 4 are respectively and correspondingly arranged at the ends of the rectangular rack 1.
When in actual use, the IC card bases to be packaged are sequentially stacked on the pneumatic card distributing mechanism 41, the placing directions of the IC card bases on the two pneumatic card distributing mechanisms 41 are opposite, namely the left and right IC card bases are centrosymmetric, when the lifting vacuum carrier 3 moves from the right end to the left end, the lifting vacuum carrier 3 is sequentially matched with the glue injection mechanism 42, the chip loading mechanism 43, the cold pressing mechanism 44 and the hot rolling mechanism 45 which are positioned on the same side of the chip containing groove of the IC card base under the linkage and matching of the reciprocating driving mechanism and the packaging guide rail 11 to complete the packaging operation, then the packaged IC cards are taken out by an external manipulator, the lifting vacuum carrier 3 is driven by the reciprocating driving mechanism to move to be matched with the card distributing mechanism at the left end, the IC card base is placed on the lifting vacuum carrier 3 by the card distributing mechanism at the left end, then the reciprocating driving mechanism is driven reversely, make lift vacuum carrier 3 remove to the right-hand member from the left end under the guide effect of encapsulation guide rail 11, lift vacuum carrier 3 this moment lies in injecting glue mechanism 42 with the chip storage tank of IC-card base in proper order with the same side, chip feed mechanism 43, cold press mechanism 44, the encapsulation operation is accomplished in the cooperation of hot rolling mechanism 45, then get back to the right-hand member again, so accomplish a reciprocal process, so make lift vacuum carrier 3 all be in the encapsulation operation state at journey and return stroke in-process, and then improve the utilization ratio of encapsulation subassembly 4, the production efficiency improves greatly, overall structure is also more compact.
Based on the above embodiment, further, the lifting vacuum carrier 3 further includes a sliding sleeve seat 32, a lifting seat 33, a carrier bottom frame 34 and a carrier upper frame 35, the sliding sleeve seat 32 is connected to the reciprocating driving mechanism, the lifting seat 33 is movably clamped on the sliding sleeve seat 32 and can slide up and down relative to the sliding sleeve seat 32, two ends of the lifting seat 33 are respectively provided with a roller 36, two rollers 36 are respectively embedded in the package guiding rail 11, the carrier bottom frame 34 is arranged on the lifting seat 33, the piezoelectric micro-motion plates 31 are arranged between the carrier bottom frame 34 and the lifting seat 33, preferably, the number of the piezoelectric micro-motion plates 31 is four, the four piezoelectric micro-motion plates 31 are distributed in a rectangular shape, so that the longitudinal feeding of the IC card is more balanced, the carrier upper frame 35 is arranged on the carrier bottom frame 34 and forms a cavity with the carrier bottom frame 34, the carrier upper frame 35 is provided with a card containing position, the card containing positions are provided with a plurality of micro holes communicated with the cavity in a matrix array, and the carrier bottom frame 34 is provided with air outlet holes communicated with the cavity.
During the practical use, the card distributing mechanism places the IC card base on the card of carrier upper frame 35 holds the position, then carry out evacuation processing through the pore pair cavity of giving vent to anger of carrier underframe 34, thereby make the IC card base adsorb on carrier upper frame 35 under negative pressure state, then under reciprocating drive mechanism's drive, whole lift vacuum carrier 3 lateral shifting, two gyro wheels 36 roll along encapsulation guide rail 11 respectively, when gyro wheel 36 rolls gradually to the crest position of encapsulation guide rail 11, two gyro wheels 36 are under encapsulation guide rail 11's effect, lift seat 33 lifting, make lift seat 33 relative sliding sleeve seat 32 rebound, thereby realize the lateral shifting and the vertical feed motion of lift vacuum carrier 3 through a reciprocating drive mechanism.
Based on the above embodiment, further, the reciprocating driving mechanism includes a driving motor 21 and a driving screw 22, two ends of the driving screw 22 are respectively and correspondingly connected to two ends of the rectangular frame 1 in a rotating manner, the driving motor 21 is fixed at one end of the rectangular frame 1 and is in transmission connection with the driving screw 22, a transmission nut 37 is embedded in the sliding sleeve seat 32, and the transmission nut 37 is in threaded connection with the driving screw 22. During practical use, the driving motor 21 drives the driving screw 22 to rotate, the driving screw 22 is matched with the transmission nut 37 in the sliding sleeve seat 32, so that the whole lifting vacuum carrier 3 is driven to move transversely, and meanwhile, the lifting vacuum carrier 3 is ensured not to move when moving to the wave crest position of the packaging guide rail 11 by utilizing the self-locking characteristic of the matching of the driving screw 22 and the transmission nut 37, so that the normal operation of IC card packaging operation is ensured.
Based on the above embodiment, further, the pneumatic card distributing mechanism 41 includes a pneumatic distributing base 411 and a card rail 412, a pre-distributing groove 413 is formed at one end of the top surface of the pneumatic distributing base 411, a card discharging groove 414 adapted to the shape of the pre-distributing groove 413 is formed at one end of the bottom surface of the pneumatic distributing base 411, the pre-distributing groove 413 and the card discharging groove 414 are distributed diagonally, a plurality of supporting air holes 415 arranged in a matrix array are formed in the bottom surface of the pre-distributing groove 413, a plurality of blowing air holes 416 arranged in a straight line are formed at one end of the pre-distributing groove 413, the pre-distributing groove 413 and the card discharging groove 414 are communicated through a discharging channel 417, the thickness of the discharging channel 417 is adapted to the thickness of a single IC card, and the card rail 412 is fixed on the pneumatic distributing base 411 and is communicated with the pre-distributing groove 413.
In actual use, the IC card base is placed in the card track 412, the IC card base at the bottom enters the pre-distributing groove 413 of the pneumatic distributing seat 411, and when the lifting vacuum carrier 3 moves to the lower side of the card discharging groove 414, the air is fed to the blowing air hole 416 and the supporting air hole 415 of the pneumatic distributing seat 411, so that the IC card base at the bottommost layer enters the card discharging groove 414 through the discharging channel 417 and falls into the card containing position of the lifting vacuum carrier 3, and single feeding of the cards is completed.
Based on the above embodiment, further, the chip feeding mechanism 43 includes a first bracket 431, a chip feeding base 432 and a chip rail 433, the first bracket 431 is fixed on the rectangular rack 1, the chip feeding base 432 is fixed on the first bracket 431, the chip rail 433 is fixed on the first bracket 431 and is matched with the chip feeding base 432, and two piezoelectric clamping sheets 434 for clamping or releasing the IC chip in opposite directions are arranged in the chip feeding base 432.
During practical use, the lifting vacuum carrier 3 bearing the IC card base moves below the chip feeding seat 432, the piezoelectric micro-moving pieces 31 of the lifting vacuum carrier 3 lift the height of the IC card base, then the two piezoelectric clamping pieces 434 in the chip feeding seat 432 loosen the IC chip, so that the IC chip at the bottommost layer falls into the chip accommodating groove of the IC card base under the self-weight, then the two piezoelectric clamping pieces 434 clamp the IC chip in the chip feeding seat 432 oppositely, then the piezoelectric micro-moving pieces 31 drive the IC card base bearing the IC chip to descend, friction on the IC chip in the chip feeding seat 432 is avoided, the IC chip is damaged, and therefore feeding of the IC chip is completed.
Based on the above embodiment, further, the hot rolling mechanism 45 includes a second support 451, a rolling support 452, and a hot rolling shaft 453, the second support 451 is fixed on the rectangular frame 1, the rolling support 452 is movably connected to the second support 451, a pressing spring 454 is connected between the rolling support 452 and the second support 451, and the hot rolling shaft 453 is rotatably connected to the rolling support 452. During actual use, the height of the carrier upper frame 35 is raised by the piezoelectric micromotor 31, so that the IC chip is in contact with the hot rolling shaft 453, meanwhile, the hot rolling shaft 453 keeps the pressing force on the IC chip under the action of the pressing spring 454, and then the driving motor 21 drives the lifting vacuum carrier 3 to reciprocate on the station of the hot rolling mechanism 45, so that the hot rolling shaft 453 repeatedly rolls and presses the position of the chip, and the IC chip is heated more uniformly.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present patent application are included in the protection scope of the present patent application.
Claims (8)
1. A wave track driven lifting reciprocating type IC card packaging robot is characterized by comprising a rectangular rack (1), a reciprocating driving mechanism, a lifting vacuum carrier (3) and a packaging assembly (4);
two sides of the rectangular rack (1) are respectively provided with a wavy packaging guide track (11), the packaging guide track (11) comprises a wavy section and two translation sections, and two ends of the wavy section are respectively connected corresponding to the two translation sections;
the lifting vacuum carrier (3) is arranged on the reciprocating driving mechanism, two ends of the lifting vacuum carrier are respectively and movably embedded into the packaging guide rail (11) correspondingly, the lifting vacuum carrier (3) comprises a piezoelectric micro-actuating piece (31), and the piezoelectric micro-actuating piece (31) is used for finely adjusting the longitudinal displacement of the IC card;
the reciprocating driving mechanism is arranged on the rectangular rack (1) and is used for driving the lifting vacuum carrier (3) to reciprocate;
the packaging assembly (4) comprises a pneumatic card distribution mechanism (41), a glue injection mechanism (42), a chip feeding mechanism (43), a cold pressing mechanism (44) and a hot rolling mechanism (45) which are sequentially arranged along the length direction of the rectangular rack (1), and the glue injection mechanism (42), the chip feeding mechanism (43), the cold pressing mechanism (44) and the hot rolling mechanism (45) respectively correspond to the peak positions of the packaging guide rails (11) in a one-to-one mode.
2. The wave rail driving lifting reciprocating type IC card packaging robot as claimed in claim 1, wherein the number of the packaging assemblies (4) is two, the glue injection mechanisms (42), the chip loading mechanisms (43), the cold press mechanisms (44) and the hot rolling mechanisms (45) of the two packaging assemblies (4) are arranged in a mutually central symmetry manner and are distributed on two sides of the rectangular rack (1), and the pneumatic card distribution mechanisms (41) of the two packaging assemblies (4) are respectively correspondingly arranged at the ends of the rectangular rack (1).
3. The wave-track-driven lifting reciprocating type IC card packaging robot according to claim 1, wherein the lifting vacuum carrier (3) further comprises a sliding sleeve seat (32), a lifting seat (33), a carrier bottom frame (34) and a carrier upper frame (35), the sliding sleeve seat (32) is connected to the reciprocating driving mechanism, the lifting seat (33) is movably clamped on the sliding sleeve seat (32) and can slide up and down relative to the sliding sleeve seat (32), two ends of the lifting seat (33) are respectively provided with a roller (36), the two rollers (36) are respectively embedded in the packaging guide track (11), the carrier bottom frame (34) is arranged on the lifting seat (33), the piezoelectric micromotion piece (31) is arranged between the carrier bottom frame (34) and the lifting seat (33), the carrier upper frame (35) is arranged on the carrier bottom frame (34) and a cavity is formed between the carrier bottom frame (34), the carrier upper frame (35) is provided with a card containing position, a plurality of micro holes communicated with the cavity are arranged on the card containing position in a matrix array mode, and the carrier bottom frame (34) is provided with air outlet holes communicated with the cavity.
4. The wave-track-driven lifting reciprocating type IC card packaging robot according to claim 3, wherein the reciprocating driving mechanism comprises a driving motor (21) and a driving screw (22), two ends of the driving screw (22) are respectively and correspondingly connected to two ends of the rectangular frame (1) in a rotating mode, the driving motor (21) is fixed to one end of the rectangular frame (1) and is in transmission connection with the driving screw (22), a transmission nut (37) is embedded in the sliding sleeve seat (32), and the transmission nut (37) is in threaded connection with the driving screw (22).
5. The wave track driving lifting reciprocating type IC card packaging robot according to claim 1, wherein the pneumatic card distributing mechanism (41) comprises a pneumatic distributing seat (411) and a card material track (412), one end of the top surface of the pneumatic distributing seat (411) is provided with a pre-distributing groove (413), one end of the bottom surface of the pneumatic distributing seat (411) is provided with a card discharging groove (414) matched with the shape of the pre-distributing groove (413), the pre-distributing groove (413) and the card discharging groove (414) are distributed in a diagonal manner, the bottom surface of the pre-distributing groove (413) is provided with a plurality of supporting air holes (415) arranged in a matrix array, one end of the pre-distributing groove (413) is provided with a plurality of blowing air holes (416) arranged in a straight manner, and the pre-distributing groove (413) and the card discharging groove (414) are communicated through a discharging channel (417), the thickness of the discharge channel (417) is matched with the thickness of a single IC card, and the card material rail (412) is fixed on the pneumatic distribution base (411) and is communicated with the pre-distribution groove (413).
6. The wave-track-driven lifting reciprocating type IC card packaging robot as claimed in claim 1, wherein the chip loading mechanism (43) comprises a first bracket (431), a chip loading seat (432) and a chip loading rail (433), the first bracket (431) is fixed on the rectangular frame (1), the chip loading seat (432) is fixed on the first bracket (431), the chip loading rail (433) is fixed on the first bracket (431) and matched with the chip loading seat (432), and two piezoelectric clamping sheets (434) for oppositely clamping or loosening the IC chip are arranged in the chip loading seat (432).
7. The wavy track driving lifting reciprocating type IC card packaging robot as claimed in claim 1, wherein the hot rolling mechanism (45) comprises a second bracket (451), a rolling bracket (452) and a hot rolling shaft (453), the second bracket (451) is fixed on the rectangular rack (1), the rolling bracket (452) is movably connected on the second bracket (451), a compression spring (454) is connected between the rolling bracket (451) and the second bracket (451), and the hot rolling shaft (453) is rotatably connected on the rolling bracket (452).
8. The wavy track driving lifting reciprocating type IC card packaging robot as claimed in claim 1, wherein the hot rolling mechanism (45) comprises a second bracket (451), a rolling bracket (452) and a hot rolling shaft (453), the second bracket (451) is fixed on the rectangular rack (1), the rolling bracket (452) is movably connected on the second bracket (451), a compression spring (454) is connected between the rolling bracket (451) and the second bracket (451), and the hot rolling shaft (453) is rotatably connected on the rolling bracket (452).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011207177.0A CN112420570A (en) | 2020-11-03 | 2020-11-03 | Wave rail driven lifting reciprocating type IC card packaging robot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011207177.0A CN112420570A (en) | 2020-11-03 | 2020-11-03 | Wave rail driven lifting reciprocating type IC card packaging robot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112420570A true CN112420570A (en) | 2021-02-26 |
Family
ID=74828760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011207177.0A Withdrawn CN112420570A (en) | 2020-11-03 | 2020-11-03 | Wave rail driven lifting reciprocating type IC card packaging robot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112420570A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115283200A (en) * | 2022-09-01 | 2022-11-04 | 昆山博瀛智能科技有限公司 | Dispensing machine |
-
2020
- 2020-11-03 CN CN202011207177.0A patent/CN112420570A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115283200A (en) * | 2022-09-01 | 2022-11-04 | 昆山博瀛智能科技有限公司 | Dispensing machine |
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Application publication date: 20210226 |