CN113140489A - Special chip packaging hardware of computer - Google Patents
Special chip packaging hardware of computer Download PDFInfo
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- CN113140489A CN113140489A CN202110433499.5A CN202110433499A CN113140489A CN 113140489 A CN113140489 A CN 113140489A CN 202110433499 A CN202110433499 A CN 202110433499A CN 113140489 A CN113140489 A CN 113140489A
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- chip
- chip packaging
- packaging apparatus
- post
- packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a special chip packaging device for a computer, which comprises a chip, wherein the chip is arranged on a supporting platform, and a pressing assembly is arranged on the supporting platform; the pressing assembly comprises a pressing plate, and the distance between the pressing plate and the upper end of the chip can be changed; the pressure plate is communicated with a delivery pipe, and the other end of the delivery pipe is connected with the packaging liquid tank through a pipeline; the pressing assembly further comprises a supporting seat, the supporting seat is mounted on the supporting platform, a sliding arm is connected onto the supporting seat in a sliding mode, and the sliding arm is fixedly connected with the conveying pipe; the invention is convenient for keeping the flatness of the packaging material at the end face of the chip.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a special chip packaging device for a computer.
Background
The prior application No. 202021115943.6 discloses a chip packaging structure, which comprises a packaging cover and a chip packaging box body, wherein the packaging cover is arranged at the upper end of the chip packaging box body, the four corners of the packaging cover are respectively provided with a buckle, the packaging cover is connected with the chip packaging box body in a clamping way through the buckles, air holes are formed in the outer surface of the packaging cover, a fixed block is arranged at the lower end of the packaging cover, a fixed part comprises a hinge, a rotating plate and a pressing plate, the pressing plate is arranged at one end of the rotating plate and is connected with the inner wall of the chip packaging box body through the hinge, the packaging cover can be packaged on the chip packaging box body by rotating the four buckles during packaging, the packaging cover is simple, convenient and firm, convenient and convenient to disassemble, can be repeatedly used, is simple, firm, can improve the working efficiency of workers, the chip can dissipate heat through the air holes during working, and moisture-proof paint can absorb moisture in the packaging box, therefore, heat can be dissipated in the working process, and moisture resistance can be achieved; however, the utility model is not convenient for keeping the flatness of the packaging material at the end face of the chip.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a special chip packaging apparatus for a computer, which facilitates maintenance of flatness of a packaging material at a chip end surface.
The invention provides a special chip packaging device for a computer, which comprises a chip, wherein the chip is arranged on a supporting platform, and a pressing assembly is arranged on the supporting platform.
After the chip is clamped on the supporting table, the pressing component moves towards the direction close to the chip, packaging materials are sprayed on the chip, the pressing component presses the packaging materials and the chip, and the outer end of the packaging materials keeps the flatness of the end face of the chip under the action of the packaging materials.
The pressing assembly comprises a pressing plate, and the distance between the pressing plate and the upper end of the chip can be changed.
By moving the pressing plate in a direction close to or away from the chip, the effect that the packaging material sprayed on the chip is leveled by the pressing plate can be realized.
The pressing plate is communicated with a conveying pipe, and the other end of the conveying pipe is connected with the packaging liquid tank through a pipeline.
The conveyer pipe is installed on the clamp plate to the conveyer pipe runs through the clamp plate, and the one end and the clamp plate parallel and level of conveyer pipe, this kind of design can make encapsulating material pass through the conveyer pipe spraying to the chip on, thereby improve the efficiency of carrying out spraying encapsulating material to the chip.
The pressing assembly further comprises a supporting seat, the supporting seat is installed on the supporting platform, a sliding arm is connected to the supporting seat in a sliding mode, and the sliding arm is fixedly connected with the conveying pipe.
The design of supporting seat and cursor slide plays and carries out spacing effect to the conveyer pipe to be convenient for control the clamp plate, steady effect when making the removal clamp plate improves.
And a detachable square plate is arranged on the supporting table.
When the device is used, the chip is placed on the square plate for use.
The invention has the beneficial effects that:
after the chip is clamped on the supporting table, the pressing component moves towards the direction close to the chip, packaging materials are sprayed on the chip, the pressing component presses the packaging materials and the chip, and the outer end of the packaging materials keeps the flatness of the end face of the chip under the action of the packaging materials.
Drawings
The following drawings are only intended to illustrate and explain the invention schematically, wherein:
FIG. 1 is a schematic structural diagram of a first embodiment of a pallet of the present invention;
FIG. 2 is a schematic structural diagram of a second embodiment of a pallet of the present invention;
FIG. 3 is a schematic structural view of a post according to the present invention;
FIG. 4 is a schematic view of the locking block of the present invention;
FIG. 5 is a schematic view of the construction of the splint of the present invention;
FIG. 6 is a schematic structural diagram of a chip case according to the present invention;
FIG. 7 is a schematic structural diagram of a swing table of the present invention;
FIG. 8 is a schematic view of the swing arm of the present invention;
FIG. 9 is a schematic structural diagram of a touch bar of the present invention;
fig. 10 is a schematic structural view of the sizing plate and the molding plate of the present invention.
In the figure:
a pallet 01;
a chip 02;
a support base 03;
a slider arm 04;
a delivery pipe 05;
a press plate 06;
a seal box 07;
an exhaust pipe 08;
inserting the column 09;
an insert plate 10;
a sink groove 11;
a fitting post 12;
a locking block 13;
a U-shaped block 14;
a clamping plate 15;
a toothed block 16;
a chip case 17;
a swing table 18;
a support frame 19;
a delivery wheel 20;
a swing arm 21;
a base plate 22;
a reduction motor 23;
a touch bar 24;
a connecting arm 25;
a sizing plate 26;
and a forming plate 27.
Detailed Description
The following describes embodiments of the present invention with reference to specific examples.
As shown in FIG. 1:
the packaging material sprayed on the chip 02 can be a viscous material, so that a shell can be conveniently arranged on the outer side of the chip 02;
when the sticky packaging material is selected, the pressing component levels the packaging material on the end face of the chip 02, so that when the shell is installed on the outer side of the chip 02, the adhesion between the shell and the chip 02 is improved;
a clamp can be arranged on the support table 01, and the chip 02 is arranged on the support table 01 through the clamp, so that the effect of packaging the chip 02 by the device is improved;
when the end parts of the chip 02 except the bottom part need to be packaged, the bottom part of the chip 02 can be firmly attached to the supporting platform 01 when the chip 02 is installed on the supporting platform 01.
The pressing plate 06 can be configured as a leak box with a groove shape, the lower part of the leak box is opened, and when the pressing plate 06 is controlled to move towards the direction close to the chip 02 sprayed with the packaging material, the leveling effect of the packaging material on a plurality of surfaces of the end part of the chip 02 can be improved.
When the packaging material is sprayed on the chip 02 by using the conveying pipe 05, the other end of the conveying pipe 05 is required to be connected with a packaging liquid tank through a pipeline, and a conveying pump can be arranged on the pipeline;
further, when the conveying pipe 05 is used for spraying the packaging material on the chip 02, the other end of the conveying pipe 05 needs to be connected with a packaging liquid tank through a pipeline, and a sealing gas injection pipe can be communicated with the upper end of the packaging liquid tank, so that the packaging material conveying effect is achieved.
Electric putter is installed to the extension section of accessible bottom supporting seat 03 to make electric putter's stiff end and supporting seat 03 fixed connection, make electric putter's expansion end and cursor 04 fixed connection, stretch out and draw back through starting electric putter this moment, can realize that control clamp plate 06 removes to the direction of being close to or keeping away from chip 02, thereby realize carrying out the processing of encapsulation to chip 02.
See FIGS. 1-3 for the following:
the device can cause the pollution to the whole tray table 01 when being used for a long time, and at the moment, the square plate can be detached from the tray table 01, and the square plate for placing the chip 02 is cleaned independently, so that the cleaning effect of the device when being used is improved.
The square plate is provided with an air hole, and the lower end of the air hole is provided with a suction assembly.
The air at the upper end of the air hole is sucked away through the sucking assembly, so that the chip 02 placed at the upper end of the air hole has a tendency of moving downwards under the action of the sucking assembly, the bonding effect between the chip 02 and the supporting platform 01 is improved, and the air hole needs to be completely covered by the chip 02 at the moment;
a plurality of air holes can be arranged, the lower end of each air hole is provided with an independent absorbing component, and the corresponding absorbing component is started according to the size of the chip 02, so that the chip 02 is installed on the pallet 01;
the air holes are controlled through the independent absorbing assembly, so that the absorbing effect of the absorbing assembly on the chip 02 is improved.
As shown in fig. 3:
the absorption assembly comprises a seal box 07 and an exhaust pipe 08, the seal box 07 is installed at the lower end of the supporting platform 01, the seal box 07 is communicated with the exhaust pipe 08, and the lower end of the seal box 07 is hinged with an access cover.
The design of the seal box 07 and the air exhaust pipe 08 can realize the simultaneous air suction of a plurality of air holes, and at the moment, the chip 02 is adsorbed on the support table 01 under the action of the air holes, so that the effect of mounting the chip 02 on the support table 01 is realized;
when the air holes are sucked by using the sealing box 07 and the air suction pipe 08, the chip 02 is required to completely cover all the air holes;
the design of the seal box 07 and the air exhaust pipe 08 can improve the convenience and the economy when the device is used;
the design of the access cover is convenient for cleaning and maintaining the seal box 07;
furthermore, due to the design of the access cover, sundries mistakenly entering the seal box 07 can be conveniently removed.
At least one inserting plate 10 is installed at the lower end of the supporting platform 01, inserting columns 09 are connected in the inserting plate 10 in a sliding mode, the inserting columns 09 are installed on the sealing box 07, fixing plates are installed on the inserting columns 09, and locking plates are connected to the tail ends of the inserting columns 09 in a threaded mode.
The fixing piece is fixedly connected to the inserting column 09, the inserting column 09 is installed on the sealing box 07, then the inserting column 09 is inserted into the inserting plate 10, and the locking piece is in threaded connection with the tail end of the inserting column 09, so that the fixing piece and the locking piece can be respectively attached to two ends of the inserting plate 10 by rotating the locking piece, the sealing box 07 is attached to the pallet 01, the sealing effect is improved, and the stabilizing effect of installing the chip 02 on the pallet 01 is further improved;
the insert column 09 and the insert plate 10 may be provided in plural, and a plurality of the insert column 09 and insert plate 10 combinations are installed on the same side of the hermetic container 07.
See FIGS. 3-4 for an illustration:
the utility model discloses a locking device, including square plate, laminating post 12, check cover, latch segment 13 cover, fastener lock between latch segment 13 and the laminating post 12, the interior sliding connection of gas pocket on the square plate has laminating post 12, and laminating post 12 runs through and forms the perforation behind the check cover, and the check cover is last to be installed latch segment 13, and the latch segment 13 cover is in the outside of laminating post 12, locks through the fastener between latch segment 13 and the laminating post 12.
The design of the fitting column 12 can plug the air hole, so that the square plate on the support table 01 can adapt to chips 02 of various sizes, and the firmness of the chips 02 mounted on the support table 01 through the absorbing assembly is improved;
when the chip 02 cannot completely cover all the air holes, the air holes are blocked by the bonding columns 12, and the bonding columns 12 penetrate through the through holes on the access cover to keep the sealing box 07 in a sealing state, so that when the air in the sealing box 07 is extracted outwards by the air extraction pipes 08, the chip 02 and the pallet 01 can be kept locked.
As shown in fig. 4:
a sunken groove 11 is formed in a through hole in the access cover, and a locking block 13 is inserted into the sunken groove 11.
The design of the sunken groove 11 can improve the alignment effect and the locking effect between the locking block 13 and the access cover;
when the locking block 13 is installed, the attaching column 12 and the locking block 13 can be sequentially locked from inside to outside.
See FIGS. 5-6 for an illustration:
the packaging device further comprises U-shaped blocks 14, clamping plates 15, toothed blocks 16 and a chip shell 17, the two U-shaped blocks 14 are symmetrically mounted on the pressing plate 06, the clamping plates 15 are connected with the U-shaped blocks 14 in a sliding mode, the two clamping plates 15 are symmetrically mounted, the toothed blocks 16 are arranged on the clamping plates 15, the chip shell 17 can be sleeved at the upper end of the chip 02, gaps are formed in the side portions of the chip shell 17, the toothed blocks 16 are matched with the two sides of the chip shell 17, and a material conveying hole communicated with the conveying pipe 05 is formed in the chip shell 17.
The chip shell 17 is sleeved on the chip 02, so that the packaging effect of the device on the chip 02 is improved;
a bidirectional electric push rod is arranged on the press plate 06, the fixed end of the bidirectional electric push rod is fixedly connected with the press plate 06, the two movable ends of the bidirectional electric push rod are respectively fixedly connected with the two clamping plates 15, at this time, the bidirectional electric push rod is started to extend and retract, the two clamping plates 15 can move towards the directions close to or away from each other, so that the clamping plates 15 slide in the U-shaped block 14, then the chip shell 17 is clamped through the two clamping plates 15, and the chip shell 17 and the chip 02 can be kept in an aligned state;
due to the design of the toothed block 16, the clamping stability of the two clamping plates 15 when clamping the chip shell 17 can be improved, and the anti-skid and anti-falling effects can be improved;
the chip shell 17 is provided with a material conveying hole communicated with the conveying pipe 05, and the design can improve the spraying effect of the packaging material on the chip 02.
See FIGS. 7-9 for an illustration:
the packaging device further comprises a swing table 18, support frames 19, conveying wheels 20 and contact strips 24, the swing table 18 is symmetrically and fixedly connected with the two support frames 19, the conveying wheels 20 are installed between the two support frames 19, the conveying wheels 20 are hinged to the two support frames 19, the contact strips 24 are connected in the swing table 18 in a sliding mode, the contact strips 24 are matched with the conveying wheels 20, and the end portions of the contact strips 24 are clamped in gaps between the chip shell 17 and the side portions of the chip 02.
The swing table 18 is arranged on the supporting table 01, the conveying wheel 20 rotates by taking the axis of the conveying wheel 20 as an axis, the conveying wheel 20 can drive the contact strip 24 to move towards the position close to the chip 02, and the contact strip 24 forms a pin on the chip 02;
the depth of the chip case 17 is made smaller than the height of the chip 02, so that the leveling effect between the pins mounted on the chip 02 and the bottom of the chip 02 is improved;
the end of the contact strip 24 can be processed into an L shape, the contact strip 24 is firstly attached to the side of the chip 02, then the chip 02 is sprayed with a packaging material, and finally the chip shell 17 is buckled on the chip 02 to complete packaging of the chip 02.
As shown in fig. 8:
the packaging device further comprises a swing arm 21, a bottom plate 22 and a speed reducing motor 23, the lower end of the swing table 18 is hinged with four swing arms 21, three of the four swing arms 21 are hinged with the bottom plate 22, the speed reducing motor 23 is installed on the bottom plate 22, and an output shaft of the speed reducing motor 23 is fixedly connected with one swing arm 21.
Starting the speed reducing motor 23 to rotate, so that an output shaft of the speed reducing motor 23 drives one swing arm 21 to rotate, and then the plurality of swing arms 21 are driven to rotate together, so that the swing table 18 swings, and the end part of the flat touch strip 24 is convenient to bend;
the oscillating table 18, the plurality of oscillating arms 21, and the base plate 22 form a parallelogram mechanism, thereby improving the stabilizing effect of the oscillating table 18.
As shown in fig. 10:
packaging hardware still includes linking arm 25, stereotype 26 and shaping plate 27, and linking arm 25 installs on bottom plate 22, and fixedly connected with stereotype 26 on the linking arm 25, and the articulated shaping plate 27 that is connected with on the stereotype 26, stereotype 26 and the cooperation of touch strip 24, shaping plate 27 and the cooperation of touch strip 24.
Connecting arm 25 plays the effect of connecting stereotype 26 and bottom plate 22, rotates between relatively stereotype 27 and the stereotype 26, can make the tip of touch strip 24 buckle into the L type to improve the fastness of installation between touch strip 24 and the chip 02, thereby make the fastness of the pin of touch strip 24 formation on chip 02 improve.
Claims (10)
1. A computer special chip packaging apparatus comprising a chip (02), characterized in that: the chip (02) is arranged on the support table (01), and the support table (01) is provided with a pressing assembly.
2. The computer specific chip packaging apparatus according to claim 1, wherein: the pressing assembly comprises a pressing plate (06), and the distance between the pressing plate (06) and the upper end of the chip (02) can be changed.
3. The computer specific chip packaging apparatus according to claim 2, wherein: the pressing plate (06) is communicated with a conveying pipe (05), and the other end of the conveying pipe (05) is connected with a packaging liquid tank through a pipeline.
4. The computer specific chip packaging apparatus according to claim 3, wherein: the pressing assembly further comprises a supporting seat (03), the supporting seat (03) is installed on the supporting platform (01), a sliding arm (04) is connected to the supporting seat (03) in a sliding mode, and the sliding arm (04) is fixedly connected with the conveying pipe (05).
5. The computer specific chip packaging apparatus according to claim 4, wherein: the supporting platform (01) is provided with a detachable square plate.
6. The computer specific chip packaging apparatus according to claim 5, wherein: the square plate is provided with an air hole, and the lower end of the air hole is provided with a suction assembly.
7. The computer specific chip packaging apparatus according to claim 6, wherein: the absorption assembly comprises a sealing box (07) and an exhaust tube (08), the sealing box (07) is installed at the lower end of the supporting platform (01), the sealing box (07) is communicated with the exhaust tube (08), and the lower end of the sealing box (07) is hinged to an access cover.
8. The computer specific chip packaging apparatus according to claim 7, wherein: at least one picture peg (10) is installed to the lower extreme of saddle (01), and sliding connection has in picture peg (10) inserts post (09), inserts post (09) and installs on seal box (07), inserts and installs the stationary blade on post (09), inserts the terminal threaded connection of post (09) and has the stay.
9. The computer specific chip packaging apparatus according to claim 8, wherein: the utility model discloses a wall-mounted roof panel, including square plate, side's gas pocket sliding connection has laminating post (12), forms the perforation behind laminating post (12) run through the access cover, and the access is covered and is installed latch segment (13), and latch segment (13) cover is in the outside of laminating post (12), locks through the fastener between latch segment (13) and laminating post (12).
10. The computer specific chip packaging apparatus according to claim 9, wherein: a sunken groove (11) is formed in a through hole in the access cover, and a locking block (13) is inserted into the sunken groove (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110433499.5A CN113140489B (en) | 2021-04-19 | 2021-04-19 | Special chip packaging hardware of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110433499.5A CN113140489B (en) | 2021-04-19 | 2021-04-19 | Special chip packaging hardware of computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113140489A true CN113140489A (en) | 2021-07-20 |
| CN113140489B CN113140489B (en) | 2023-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110433499.5A Active CN113140489B (en) | 2021-04-19 | 2021-04-19 | Special chip packaging hardware of computer |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208954941U (en) * | 2018-08-22 | 2019-06-07 | 深圳市鑫尚宁科技有限公司 | A kind of superchip plastic packaging equipment |
| CN111128765A (en) * | 2019-12-10 | 2020-05-08 | 广东佛智芯微电子技术研究有限公司 | Method for reducing fan-out type packaging stress and plastic packaging mold applied by same |
| CN111180368A (en) * | 2020-01-19 | 2020-05-19 | 钟健美 | Antistatic integrated circuit chip packaging hardware |
| CN111916373A (en) * | 2020-08-05 | 2020-11-10 | 东莞市翔飞智能装备科技有限公司 | Automatic semiconductor chip packaging device |
| CN112466761A (en) * | 2020-11-03 | 2021-03-09 | 宁波曼汶智能装备有限公司 | Row-type rail lifting IC card packaging robot whole machine |
-
2021
- 2021-04-19 CN CN202110433499.5A patent/CN113140489B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208954941U (en) * | 2018-08-22 | 2019-06-07 | 深圳市鑫尚宁科技有限公司 | A kind of superchip plastic packaging equipment |
| CN111128765A (en) * | 2019-12-10 | 2020-05-08 | 广东佛智芯微电子技术研究有限公司 | Method for reducing fan-out type packaging stress and plastic packaging mold applied by same |
| CN111180368A (en) * | 2020-01-19 | 2020-05-19 | 钟健美 | Antistatic integrated circuit chip packaging hardware |
| CN111916373A (en) * | 2020-08-05 | 2020-11-10 | 东莞市翔飞智能装备科技有限公司 | Automatic semiconductor chip packaging device |
| CN112466761A (en) * | 2020-11-03 | 2021-03-09 | 宁波曼汶智能装备有限公司 | Row-type rail lifting IC card packaging robot whole machine |
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| Publication number | Publication date |
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| CN113140489B (en) | 2023-07-04 |
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