CN112444676A - Resistance detection method and device, resistance detector and readable storage medium - Google Patents
Resistance detection method and device, resistance detector and readable storage medium Download PDFInfo
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- CN112444676A CN112444676A CN201910796958.9A CN201910796958A CN112444676A CN 112444676 A CN112444676 A CN 112444676A CN 201910796958 A CN201910796958 A CN 201910796958A CN 112444676 A CN112444676 A CN 112444676A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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Abstract
The invention discloses a resistance detection method, a resistance detection device, a resistance detector and a readable storage medium, wherein the method comprises the following steps: extracting two test points corresponding to an object to be detected; the two test points and the object to be detected are positioned in a first network; the two test points comprise a first test point positioned on the first surface of the circuit board where the object to be detected is positioned and a second test point positioned on the second surface of the circuit board; extracting a plated through hole on the circuit board; the plated through holes are positioned in other networks except the first network; electrically connecting the first test point to the corresponding plated through hole; and detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole. By implementing the method, when two test points of the object to be detected are positioned on different surfaces, the detection connecting line of the voltage detection loop is shortest under possible conditions, so that the possibility that the resistance detection result of the object to be detected has larger errors due to external electromagnetic interference can be greatly reduced.
Description
Technical Field
The invention relates to the technical field of PCB slave test, in particular to a resistance detection method, a resistance detection device, a resistance detector and a readable storage medium.
Background
In the existing PCB manufacturing process, after an outer layer circuit is completed, whether the circuit is conducted or not and whether the resistance value is abnormal or not usually need to be detected, at present, a common resistance measurement method includes two types, namely a two-wire test method and a four-wire test method, wherein the two-wire test only has one test loop, and the measured resistance value is actually the sum of the resistance value of a feeder line and the resistance value of the circuit to be measured, that is, the resistance value of the circuit to be measured cannot be accurately measured; the four-wire test is characterized in that a current supply loop and a voltage measuring loop are arranged for each line to be tested, the current loop and the voltage loop are independent, and the internal impedance of the voltmeter is very high, so that almost all current passes through the line to be tested, and the measured resistance value is almost similar to the resistance value of the line to be tested.
However, when the four-wire inspection is used to inspect the object to be inspected (for example, to inspect the resistance of the plated through hole on the circuit board), the pads at the two ends of the plated through hole are used as the test points of the plated through hole, and the pads at the two ends of the plated through hole are respectively located on the two surfaces of the circuit board, so that the two test points of the plated through hole are located on the two surfaces of the circuit board, and two inspection connecting wires of one measurement circuit (voltage measurement circuit and current measurement circuit) can be collected to the measurement device only after passing through the whole circuit board or even the circuit board test fixture, which results in a great extension of the inspection connecting wires and a great increase of the possibility of being subjected to external electromagnetic interference, and since the self resistance of the object to be inspected on the circuit board is generally very small, that is, the voltage of the object to be inspected is very, therefore, external electromagnetic interference can cause a larger error of the voltage measurement result, and thus a larger error exists in the resistance detection result of the object to be detected.
Disclosure of Invention
In view of this, embodiments of the present invention provide a resistance detection method, a resistance detection device, a resistance detection machine, and a readable storage medium, so as to solve the problem that a detection connection line of a voltage detection loop is greatly extended and the possibility of being subjected to external electromagnetic interference is increased due to two test points of an object to be detected being located on two surfaces of a circuit board, so that a voltage detection result, that is, a resistance detection result, may have a large error.
According to a first aspect, an embodiment of the present invention provides a resistance detection method, including the following steps: extracting two test points corresponding to an object to be detected; the two test points and the object to be detected are positioned in a first network; the two test points comprise a first test point positioned on the first surface of the circuit board where the object to be detected is positioned and a second test point positioned on the second surface of the circuit board; extracting a plated through hole on the circuit board; the plated through holes are positioned in other networks except the first network; electrically connecting the first test point to the corresponding plated through hole; and detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.
The first test point on the first surface of the circuit board is electrically connected with the corresponding plated through hole, so that the plated through hole is indirectly positioned in the first network, and the plated through hole can replace the corresponding first test point to be used as a test point of the object to be detected; meanwhile, as the plated through holes penetrate through the first surface and the second surface of the circuit board, the first test point is electrically connected with the corresponding plated through hole, so that the first test point on the first surface of the circuit board can be converted to the second surface through the plated through holes, so that when the resistance of the object to be detected is detected based on the first test point, the second test point and the plated through hole, the second test point and the plated through hole (pad located on the second surface) can be used as the connection point of the voltage detection device (in this case, the second surface is the voltage test surface), so that the detection connecting line for detecting the voltage of the object to be detected does not need to cross the whole circuit board or even cross the test fixture and then is collected to the voltage measuring device, the detection connecting line can be shortest under possible conditions, therefore, the possibility that the detection connecting line is subjected to external electromagnetic interference and the voltage detection result, namely the resistance detection result of the object to be detected has larger error can be greatly reduced.
With reference to the first aspect, in a first implementation manner of the first aspect, the step of extracting two test points corresponding to an object to be detected includes: extracting a network information file of a first network; network names and test point information in each network are recorded in the network information file; and extracting two test points corresponding to the object to be detected from the network information file of the first network.
The test point corresponding to the object to be detected is extracted from the network information file directly according to the network name of the first network where the object to be detected is located, so that the method in the embodiment of the invention can be automatically executed, and the resistance detection efficiency of the method is improved.
With reference to the first aspect or the first embodiment of the first aspect, in a second embodiment of the first aspect, the step of electrically connecting the first test points to the corresponding plated through holes includes: controlling a first probe and a second probe corresponding to the first surface of the circuit board to move to a first test point position and a plated through hole position respectively; the first probe and the second probe are electrically connected; and controlling the first probe and the second probe to be close to the circuit board until the first probe and the second probe are respectively and electrically connected with the first test point and the plated through hole.
With reference to the second embodiment of the first aspect, in the third embodiment of the first aspect, the step of detecting the resistance of the object to be detected based on the first test point, the second test point, and the plated through hole includes: controlling a third probe corresponding to the first surface of the circuit board to move to the position of the first test point, and controlling a fourth probe corresponding to the second surface of the circuit board to move to the position of the second test point; the third probe and the fourth probe are electrically connected with the current supply loop; controlling the third probe and the fourth probe to be close to the circuit board until the third probe is electrically connected with the first test point and the fourth probe is electrically connected with the second test point; controlling a fifth probe and a sixth probe corresponding to the second surface of the circuit board to move to the position of the second test point and the position of the plated through hole respectively; the fifth probe and the sixth probe are electrically connected with the voltage testing loop; and controlling the fifth probe and the sixth probe to be close to the circuit board until the fifth probe and the sixth probe are respectively electrically connected with the second test point and the plated through hole, and detecting the resistance of the object to be detected.
With reference to the first aspect, in a fourth embodiment of the first aspect, the plated through hole is a plated through hole within a predetermined range around the first test point.
With reference to the first aspect, in a fifth embodiment of the first aspect, the plated through hole is a plated through hole closest to the first test point on the circuit board.
According to a second aspect, an embodiment of the present invention provides a resistance detection apparatus, including: the first extraction module is used for extracting two test points corresponding to the object to be detected; the two test points and the object to be detected are positioned in a first network; the two test points comprise a first test point positioned on the first surface of the circuit board where the object to be detected is positioned and a second test point positioned on the second surface of the circuit board; the second extraction module is used for extracting the plated through holes on the circuit board; the plated through holes are positioned in other networks except the first network; the electric connection module is used for electrically connecting the first test point to the corresponding plated through hole; and the resistance detection module is used for detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.
According to a third aspect, an embodiment of the present invention provides an electronic device, including: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing therein computer instructions, and the processor executing the computer instructions to perform the resistance detection method according to the first aspect or any one of the embodiments of the first aspect.
According to a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, which stores computer instructions for causing a computer to execute the resistance detection method described in the first aspect or any one of the implementation manners of the first aspect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of an application scenario according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method of resistance detection according to an embodiment of the present invention;
FIG. 3 is a flow chart of another method of a resistance detection method according to an embodiment of the present invention;
fig. 4 is a schematic block diagram of a resistance detection apparatus according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a hardware structure of a resistance detector according to an embodiment of the present invention;
description of reference numerals:
1-a circuit board;
21-current supply means; 22-voltage detection means; 23-a fourth probe; 24-a fifth probe; 25-a sixth probe; 26-a first transmission mechanism;
31-a first probe; 32-a second probe; 33-a third probe; 34-second transmission mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Fig. 1 is a schematic view of an application scenario of an embodiment of the present invention, in which a resistance detection fixture is shown, including: a circuit board 1 (i.e. a circuit board where an object to be detected is located), a workbench (not shown in the figure) for fixing the circuit board 1, an upper detection jig and a lower detection jig.
Go up detection jig and correspond to the second surface of circuit board 1 (also to wait to detect the test face of circuit board 1), should go up detection jig and include: the testing apparatus includes a current supply device 21, a voltage detection device 22, a fourth probe 23, a fifth probe 24 and a sixth probe 25, wherein one of the three probes (for example, the fourth probe 23) is electrically connected to one end of the current supply device 21, and the other two probes (for example, the fifth probe 24 and the sixth probe 25) are electrically connected to the voltage detection device 22, specifically, when the fourth probe 23 is electrically connected to one end, i.e., the second test point, of the object to be tested (the third probe 33 in the lower testing jig is electrically connected to the other end, i.e., the first test point, of the object to be tested), a current supply loop of the object to be tested is formed, when the fifth probe 24 and the sixth probe 25 are respectively connected to the test points at two ends of the object to be tested, i.e., the second test point and a plating through hole (at this time, the plating through hole passes through the first probe 31 and the second probe, electrically connected with the first test point), a voltage detection loop of the object to be detected is formed.
The first transmission mechanism 26 is arranged above the fourth probe 23, the fifth probe 24 and the sixth probe 25, the first transmission mechanism 26 can move under the control instruction of the controller, so that the corresponding probe can move to any position of the second surface of the corresponding circuit board 1, and meanwhile, the probe can be controlled to move up and down according to the instruction of the controller, so that the corresponding probe can be close to the second surface of the circuit board 1 until being electrically connected with the test point on the second surface, or the corresponding probe is far away from the second surface of the circuit board 1, and is electrically disconnected with the test point on the second surface, thereby entering the preparation state of the next resistance detection. The form of the first transmission structure and the mutual matching relationship between the device and the corresponding probe are not particularly limited in the present application.
The lower detection jig corresponds to the first surface of the circuit board 1 and comprises a first probe 31, a second probe 32 and a third probe 33, wherein the first probe 31 and the second probe 32 are electrically connected with each other, when one of the first probe 31 and the second probe 32 is electrically connected with the first test point and the other one is electrically connected with the corresponding plated through hole, an electrical connection circuit between the first test point and the corresponding plated through hole is formed, and the first test point on the first surface of the circuit board 1 can be converted to the second surface through the plated through hole.
The second transmission mechanisms 33 are arranged above the first probe 31, the second probe 32 and the third probe 33, the second transmission mechanisms 33 can move under the control instruction of the controller, so that the corresponding probes can move to any position of the first surface of the corresponding circuit board 1, and meanwhile, the probes can be controlled to move up and down according to the instruction of the controller, so that the corresponding probes can be close to the first surface of the circuit board 1 until the corresponding probes are electrically connected with the first test points or the plated through holes on the first surface, or the corresponding probes are far away from the first surface of the circuit board 1, and the corresponding probes are electrically connected with the first test points or the plated through holes on the second surface, so that the next resistance detection preparation state is achieved. The form of the second transmission structure and the mutual matching relationship between the device and the corresponding probe are not particularly limited in the present application.
Example 1
Fig. 2 shows a flowchart of a resistance detection method according to an embodiment of the present invention, which may be used in the resistance detection fixture shown in fig. 1 for detecting the resistance of an object to be detected on a circuit board. As shown in fig. 2, the method may include the steps of:
s201: and extracting two test points corresponding to the object to be detected. Here, the two test points and the object to be detected are located in the first network, and the two test points include a first test point located on a first surface of the circuit board where the object to be detected is located, and a second test point located on a second surface of the circuit board.
Here, one network includes all test points (also called pads) where the circuit boards are mutually communicated, and specifically, taking an object to be detected as a plated through hole as an example, the extraction of two test points corresponding to the object to be detected can be achieved by extracting two pads which are located on two surfaces of the circuit board and are mutually communicated, and which correspond to the plated through hole on the circuit board. In addition, when the circuit board has multiple layers, the object to be detected can also be a line crossing all layers of the circuit board, and at this time, the extraction of the two test points corresponding to the object to be detected can be realized by acquiring end points of the line on the layers where the two surfaces of the circuit board are located and extracting two mutually communicated bonding pads corresponding to the end points.
Here, two test points corresponding to the object to be detected and the plated through hole in step S202 may be extracted from the circuit board design file or the circuit board information file recorded with the connection relationship between all the pads of the circuit board, which is formed after the circuit board preparation is completed.
S202: and extracting the plated through holes on the circuit board. Here, the plated through holes are located in a network other than the first network. Here, when no other test point communicating with the test point corresponding to the object to be detected can be extracted from the first network, the method in the embodiment of the present invention is performed, and a plated through hole corresponding to the first test point is selected from the circuit board (therefore, the selected plated through hole is obviously located in a network other than the first network), so that the first test point can be subsequently transferred from the first surface to the second surface through the plated through hole.
Here, for convenience of operation and shortening of the length of the electrical connection line between the first test point and the plated through hole, one plated through hole in a predetermined range around the first test point may be selected as the plated through hole corresponding to the first test point, or the plated through hole closest to the first test point on the circuit board may be selected as the plated through hole corresponding to the first test point.
S203: the first test points are electrically connected to the corresponding plated through holes.
Here, when the method is applied to the resistance detection jig of fig. 1, the first test point may be electrically connected to the corresponding plated through hole by controlling the first probe and the second probe on the lower jig corresponding to the first surface to move to positions corresponding to the first test point and the plated through hole, respectively, and then controlling the probe to move toward the first surface of the circuit board until the probe is electrically connected to the first test point and the plated through hole after contacting the first test point and the plated through hole, respectively.
Of course, the method may also be applied to other resistance testing jigs, for example, the first testing point may be electrically connected to the plated through hole by controlling the manipulator to grasp two probes electrically connected to each other at the initial position, and move the two probes to the positions of the first testing point and the plated through hole, respectively, so as to be electrically connected to the first testing point and the plated through hole, which is not limited herein.
S204: and detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole. Here, the first test point and the second test point are electrically connected to the current supply circuit, and the second test point and the plated through hole (pad on the second surface) are electrically connected to the voltage detection circuit, so that the resistance of the object to be detected is detected.
Here, when the method is applied to the resistance detection jig shown in fig. 1, the resistance of the object to be detected can be detected based on the first test point, the second test point and the plated through hole by electrically connecting the third probe in the lower jig corresponding to the first surface of the circuit board and the fourth probe in the upper jig corresponding to the second surface of the circuit board (the third probe and the fourth probe are electrically connected to the current supply loop) to the first test point and the second test point respectively, electrically connecting the fifth probe and the sixth probe in the upper jig corresponding to the second surface of the circuit board (the fifth probe and the sixth probe are electrically connected to the voltage test loop) to the second test point and the plated through hole (the pad on the second surface), and then detecting the resistance of the object to be detected. The specific electrical connection manner between the probe and the test point can be understood by referring to the content described in step S203, and is not described herein again.
Of course, the method may also be applied to other resistance testing jigs, for example, the manipulator may be controlled to grasp two probes electrically connected to the current supply device at the initial position, move the two probes to the positions of the first test point and the second test point, and be electrically connected to the first test point and the second test point, and control the manipulator to grasp two probes electrically connected to the voltage detection device at the initial position, move the two probes to the positions of the second test point and the plated through hole (pad on the second surface), and be electrically connected to the second test point and the plated through hole (pad on the second surface), so as to implement the detection of the resistance of the object to be detected based on the first test point, the second test point and the plated through hole, which is not limited herein.
In the embodiment of the invention, the first test point positioned on the first surface of the circuit board is electrically connected with the corresponding plated through hole, so that the plated through hole is indirectly positioned in the first network, and the plated through hole can replace the corresponding first test point to be used as the test point of the object to be detected; meanwhile, as the plated through holes penetrate through the first surface and the second surface of the circuit board, the first test point is electrically connected with the corresponding plated through hole, so that the first test point on the first surface of the circuit board can be converted to the second surface through the plated through holes, so that when the resistance of the object to be detected is detected based on the first test point, the second test point and the plated through hole, the second test point and the plated through hole (pad located on the second surface) can be used as the connection point of the voltage detection device (in this case, the second surface is the voltage test surface), so that the detection connecting line for detecting the voltage of the object to be detected does not need to cross the whole circuit board or even cross the test fixture and then is collected to the voltage measuring device, the detection connecting line can be shortest under possible conditions, therefore, the possibility that the detection connecting line is subjected to external electromagnetic interference and the voltage detection result, namely the resistance detection result of the object to be detected has larger error can be greatly reduced.
Fig. 3 shows a flowchart of a resistance detection method according to another embodiment of the present invention, which may be used in the resistance detection fixture shown in fig. 1 for detecting the resistance of an object to be detected on a circuit board. As shown in fig. 3, the method may include the steps of:
s301: a network information file of a first network is extracted. Here, the network information file records a network name and test point information in each network, and specifically, the test point information includes names and position information of all test points (i.e., pads) where the circuit boards are connected to each other. Here, the network information file refers to a network information file in a circuit board design file.
S302: and extracting two test points corresponding to the object to be detected from the network information file of the first network. The specific content of this step can be understood by referring to step S201 described above, and will not be described herein again.
S303: and extracting the plated through holes on the circuit board. Here, the plated through holes are located in a network other than the first network. The specific content of this step can be understood by referring to step S202, which is not described herein again.
S304: and controlling the first probe and the second probe corresponding to the first surface of the circuit board to move to the first test point position and the plated through hole position respectively. Here, the first probe and the second probe are electrically connected.
Here, as shown in fig. 1, the first probe and the second probe are both disposed on the lower detection fixture, and the second transmission mechanism drives the first probe and the second probe to move to a position corresponding to the first test point and a position corresponding to the plated through hole (the pad on the first surface), respectively, where the first test point and the plated through hole are located in a path of up and down movement of the corresponding probe.
S305: and controlling the first probe and the second probe to be close to the circuit board until the first probe and the second probe are respectively and electrically connected with the first test point and the plated through hole.
S306: and controlling the third probe corresponding to the first surface of the circuit board to move to the position of the first test point, and controlling the fourth probe corresponding to the second surface of the circuit board to move to the position of the second test point. Here, the third probe and the fourth probe are electrically connected to the current supply circuit.
Here, as shown in fig. 1, the third probe is disposed on the lower detection fixture, the fourth probe is disposed on the upper detection fixture, the second transmission mechanism drives the third probe to move to a position corresponding to the first test point, at this time, the first test point is located in a path of the third probe moving up and down, the first transmission mechanism drives the fourth probe to move to a position corresponding to the second test point, at this time, the second test point is located in a path of the fourth probe moving up and down.
S307: and controlling the third probe and the fourth probe to be close to the circuit board until the third probe is electrically connected with the first test point and the fourth probe is electrically connected with the second test point.
S308: and controlling the fifth probe and the sixth probe corresponding to the second surface of the circuit board to move to the second test point position and the plated through hole position respectively. Here, the fifth probe and the sixth probe are electrically connected to the voltage test circuit.
Here, as shown in fig. 1, the fifth probe and the sixth probe are both disposed on the upper detection fixture, and the first transmission mechanism drives the fifth probe and the sixth probe to move to a position corresponding to the second test point and a position corresponding to the plated through hole (the pad on the second surface), respectively, where the second test point and the plated through hole are located in a path of up and down movement of the corresponding probe.
S309: and controlling the fifth probe and the sixth probe to be close to the circuit board until the fifth probe and the sixth probe are respectively electrically connected with the second test point and the plated through hole, and detecting the resistance of the object to be detected.
In the embodiment of the invention, the test point corresponding to the object to be detected is extracted from the network information file directly according to the network name of the first network in which the object to be detected is located, and the probe is controlled to be electrically connected with the corresponding test point through the first transmission mechanism and the second rotation mechanism controlled by the controller, so that the method in the embodiment of the invention can be automatically executed, and the resistance detection efficiency of the method is improved.
Example 2
Fig. 4 shows a schematic block diagram of a resistance detection apparatus according to an embodiment of the present invention, which may be used to implement the resistance detection method described in embodiment 1 or any optional implementation manner thereof. As shown in fig. 4, the apparatus includes a first extraction module 10, a second extraction module 20, an electrical connection module 30, and a resistance detection module 40.
The first extraction module 10 is used for extracting two test points corresponding to an object to be detected; the two test points and the object to be detected are positioned in a first network; the two test points comprise a first test point positioned on the first surface of the circuit board where the object to be detected is positioned and a second test point positioned on the second surface of the circuit board.
The second extraction module 20 is used to extract plated through holes on the circuit board. Here, the plated through holes are located in a network other than the first network.
The electrical connection module 30 is used to electrically connect the first test point to the corresponding plated through hole.
The resistance detection module 40 is configured to detect the resistance of the object to be detected based on the first test point, the second test point, and the plated through hole.
An embodiment of the present invention further provides a resistance detector, as shown in fig. 5, the resistance detector may include a processor 51 and a memory 52, where the processor 51 and the memory 52 may be connected by a bus or in another manner, and fig. 5 takes the connection by the bus as an example.
In some embodiments, the resistance sensing machine further comprises: for a detailed description of the current supply device, the voltage detection device, the first transmission mechanism, the second transmission mechanism, and the first probe to the sixth probe, refer to fig. 1 and the description of the application scenario before embodiment 1.
The processor 51 may be a Central Processing Unit (CPU). The Processor 51 may also be other general purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components, or combinations thereof.
The memory 52, as a non-transitory computer readable storage medium, can be used for storing non-transitory software programs, non-transitory computer executable programs, and modules, such as program instructions/modules corresponding to the resistance detection method in the embodiment of the present invention (for example, the first extraction module 10, the second extraction module 20, the electrical connection module 30, and the resistance detection module 40 shown in fig. 4). The processor 51 executes various functional applications and data processing of the processor by running non-transitory software programs, instructions and modules stored in the memory 52, that is, implements the resistance detection method in the above method embodiment.
The memory 52 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created by the processor 51, and the like. Further, the memory 52 may include high speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory 52 may optionally include memory located remotely from the processor 51, and these remote memories may be connected to the processor 51 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The one or more modules are stored in the memory 52 and, when executed by the processor 51, perform the resistance detection method as shown in fig. 2-3.
The details of the resistance detector can be understood by referring to the corresponding descriptions and effects in the embodiments shown in fig. 1 to fig. 3, and are not described herein again.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic Disk, an optical Disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a Flash Memory (Flash Memory), a Hard Disk (Hard Disk Drive, abbreviated as HDD), a Solid State Drive (SSD), or the like; the storage medium may also comprise a combination of memories of the kind described above.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (9)
1. A resistance detection method is characterized by comprising the following steps:
extracting two test points corresponding to an object to be detected; the two test points and the object to be detected are positioned in a first network; the two test points comprise a first test point positioned on the first surface of the circuit board where the object to be detected is positioned and a second test point positioned on the second surface of the circuit board;
extracting plated through holes on the circuit board; the plated through holes are located in a network other than the first network;
electrically connecting the first test point to the corresponding plated through hole;
and detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.
2. The resistance detection method according to claim 1, wherein the step of extracting two test points corresponding to the object to be detected includes:
extracting a network information file of the first network; network names and test point information in each network are recorded in the network information file;
and extracting two test points corresponding to the object to be detected from the network information file of the first network.
3. The resistance sensing method according to claim 1 or 2, wherein the step of electrically connecting the first test point to the corresponding plated through hole comprises:
controlling a first probe and a second probe corresponding to the first surface of the circuit board to move to a first test point position and a plated through hole position respectively; the first probe and the second probe are electrically connected;
and controlling the first probe and the second probe to be close to the circuit board until the first probe and the second probe are respectively and electrically connected with the first test point and the plated through hole.
4. The resistance detection method according to claim 3, wherein the step of detecting the resistance of the object to be detected based on the first test point, the second test point, and the plated through hole includes:
controlling a third probe corresponding to the first surface of the circuit board to move to a first test point position, and controlling a fourth probe corresponding to the second surface of the circuit board to move to a second test point position; the third probe and the fourth probe are electrically connected with a current supply loop;
controlling the third probe and the fourth probe to approach the circuit board until the third probe is electrically connected with the first test point and the fourth probe is electrically connected with the second test point;
controlling a fifth probe and a sixth probe corresponding to the second surface of the circuit board to move to the second test point position and the plated through hole position respectively; the fifth probe and the sixth probe are electrically connected with a voltage test loop;
and controlling the fifth probe and the sixth probe to approach the circuit board until the fifth probe and the sixth probe are respectively and electrically connected with the second test point and the plated through hole, and detecting the resistance of the object to be detected.
5. The resistance sensing method according to claim 1, wherein the plated through hole is a plated through hole within a predetermined range around the first test point.
6. The method of claim 1, wherein the plated through hole is the closest plated through hole on the circuit board to the first test point.
7. A resistance sensing device, comprising:
the first extraction module is used for extracting two test points corresponding to the object to be detected; the two test points and the object to be detected are positioned in a first network; the two test points comprise a first test point positioned on the first surface of the circuit board where the object to be detected is positioned and a second test point positioned on the second surface of the circuit board;
the second extraction module is used for extracting the plated through holes on the circuit board; the plated through holes are positioned in other networks except the first network, and correspond to the first test points;
the electric connection module is used for electrically connecting the first test points to the corresponding plated through holes;
and the resistance detection module is used for detecting the resistance of the object to be detected based on the first test point, the second test point and the plated through hole.
8. A resistance tester, comprising: a memory having computer instructions stored therein and a processor executing the computer instructions to perform the resistance detection method of any one of claims 1 to 6.
9. A computer-readable storage medium storing computer instructions for causing a computer to perform the resistance detection method of any one of claims 1 to 6.
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