CN201715996U - Interlayer offset measuring device - Google Patents
Interlayer offset measuring device Download PDFInfo
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- CN201715996U CN201715996U CN2010202487809U CN201020248780U CN201715996U CN 201715996 U CN201715996 U CN 201715996U CN 2010202487809 U CN2010202487809 U CN 2010202487809U CN 201020248780 U CN201020248780 U CN 201020248780U CN 201715996 U CN201715996 U CN 201715996U
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Abstract
The utility model discloses an interlayer offset measuring device which comprises an aligning target arranged on an object to be tested, at least one testing probe, a grounding probe, at least one alarming module and a load, wherein the aligning target is provided with a plurality of layer bodies corresponding to the object to be tested, each layer body is provided with a conductive layer at the aligning target, the aligning target is provided with at least one plated through hole and a grounding hole at each conductive layer, the conductive layers are contacted with the grounding holes and opposite to the plated through holes at an interval, the testing probe can extend into and contact the corresponding plated through holes, the grounding probe can extend into and contact the corresponding grounding holes, the alarming module is electrically connected with the testing probe, the load forms the alarming module and is electrically connected with the grounding probe, and when one layer body offsets, the conductive layer of the layer body and the plated through hole form short circuit to enable the corresponding alarming module to be electrified to give an alarm so as to judge whether the object to be tested is good or defective.
Description
Technical field
The relevant a kind of interlayer offset measurement device of the utility model aims to provide a kind of multi-sheet printed electric degree plate that is applied to, and comprises the interlayer offset measurement device that level to level alignment degree such as hardboard, soft board, rigid-flex, high density interconnect plate detect.
Background technology
Traditional printing circuit board (Printed Circuit Board; PCB) detection method adopts manpower range estimation mode more, it is sent printed circuit board (PCB) to be measured in the detection system to, and by the contraposition target on the acquisition of the camera function in the detection system printed circuit board (PCB), and then the image printing of obtained contraposition target come out or be presented on the display, utilize measuring tool at last again, with the manpower mode to the target image that prints or show detect, and judge that according to testing result this printed circuit board (PCB) to be measured is good plate or flaw plate.
Use the detection mode of aforementioned printed circuit board (PCB), not only operating efficiency is poor for it, simultaneously also difficultly guarantees the degree of accuracy that detects, therefore, in detecting the printed circuit board (PCB) program,, and cause the flaw plate on subsequent applications, to cause loss greatly often because the flaw version does not detect.
Along with the progress of science and technology, the detection system of printed circuit board (PCB) can utilize the drive of motor that printed circuit board (PCB) to be measured is sent in the system, and sees through the image that color monitor shows the contraposition target, so that the saving of manpower to be provided.Yet, though aforesaid detection mode has the consumption that has improved above traditional manpower, still need detect the target image by the manpower mode, be good plate or flaw plate to judge this printed circuit board (PCB) to be measured according to testing result.Therefore, still none cover has high precision, reaches robotization, hommization, the printed circuit board detecting method that has both function such as easy to operate at a high speed the user now.
And device with the X-ray check printed circuit board (PCB) also appears planting in addition on the market, judge the yield of a printed circuit board (PCB) to be measured with robotization, in order to improve the shortcoming of tradition with the manpower detection mode; It mainly utilizes the contraposition target on the X-ray photographic printing circuit board, and to obtain an X-ray image data, wherein, this contraposition target is by stacking composition of a registration holes of this each layer of printed circuit board (PCB) body.Come again, carry out the search in an expectation zone (ROI), from this X-ray image data, choose a sensing range.Then, capture X-ray image comparison data in this sensing range.The X-ray image comparison data of this printed circuit board (PCB) of comparison calculation and one are preset testing conditions respectively again.At last, according to the result of comparison calculation, the prompting interface in window shows the deflection of contraposition target.
Only, utilize in the device of this kind X-ray check printed circuit board (PCB), not only X-ray has radioactivity, and measurement speed is slower; Moreover, utilize X-ray when shooting, produce halation because of overexposure easily, causing can't identification or identification mistake, the reduction interpretation effect.
The utility model content
It is a kind of in being applied to multi-sheet printed electric degree plate that the technical matters that the utility model solved is to provide, and comprises the interlayer offset measurement device that level to level alignment degree such as hardboard, soft board, rigid-flex, high density interconnect plate detect.
The technical solution of the utility model is: the interlayer offset measurement device in the utility model includes at least: be located at the contraposition target on the determinand, at least one test probe, one grounded probe, an at least one warning component and a load, this contraposition target is provided with and the corresponding plural layer body of this determinand, each layer body is provided with conductive layer in this contraposition target place, this contraposition target is provided with an at least one plated-through-hole and a ground hole in the conductive layer place, this conductive layer contacts with this ground hole, and isolate relative with this plated-through-hole, this test probe can stretch into the corresponding plated-through-hole of contact, this grounded probe can stretch into the corresponding ground hole of contact, this warning component and test probe form and electrically connect, and this load constitutes this warning component and this grounded probe forms electric connection.
The beneficial effects of the utility model are: can be applicable to multi-sheet printed electric degree plate, comprise determinands such as hardboard, soft board, rigid-flex, high density interconnect plate, if wherein there be layer body to produce skew, make the conductive layer and the plated-through-hole of this layer body form short circuit, making corresponding warning component energising send caution, is non-defective unit or faulty materials to judge this determinand.
Description of drawings
Fig. 1 is the structural representation of measurement mechanism in the utility model;
Fig. 2 is the structural perspective of contraposition target in the utility model;
Fig. 3 is the structural representation of contraposition target in the utility model;
Fig. 4 does not have the structural representation of interlayer skew for determinand in the utility model;
Fig. 5 is the structural representation that determinand produces the interlayer skew in the utility model.
[figure number explanation]
Interlayer offset measurement device 1 contraposition target 10
First plated-through-hole, 131 second plated-through-holes 132
The 3rd plated-through-hole 133 the 4th plated-through-hole 134
The 5th plated-through-hole 135 the 6th plated-through-hole 136
Embodiment
The utility model interlayer offset measurement device, as shown in Figures 1 to 4, it includes this interlayer offset measurement device 1 at least:
One contraposition target 10, be located on the determinand, this contraposition target 10 is provided with and the corresponding plural layer body 11 of this determinand, each layer body 11 is provided with conductive layer 12 in these contraposition target 10 places, this contraposition target 10 is provided with an at least one plated-through-hole and a ground hole in conductive layer 12 places, among the embodiment as shown in the figure, this contraposition target 10 is provided with first in regular turn in conductive layer 12 places, second, the 3rd, the 4th, the the 5th and the 6th plated-through-hole 131,132,133,134,135,136 and one ground hole 137, this conductive layer 12 contacts with this ground hole 137, and with each plated-through-hole 131,132,133,134,135,136 isolate relatively, wherein, this conductive layer 12 can be in regular turn with first, second, the 3rd, the 4th, the the 5th and the 6th plated-through-hole 131,132,133,134,135,136 are formed with 1 respectively, 2,3,4,5, the spacing 14 of 6mil;
At least one test probe 20, this test probe 20 can stretch into each corresponding plated-through-hole 131,132,133,134,135,136 of contact;
One grounded probe 30, this grounded probe 30 can stretch into the corresponding ground hole 137 of contact;
At least one warning component 40, this warning component 40 form with test probe 20 and electrically connect, and this warning component 40 can be light emitting diode; And
One load 50, this load 50 constitutes this warning component 40 and forms electric connection with this grounded probe 137, this load 50 can be direct supply, and this load 50 forms with each warning component 40 and is connected in parallel, and each warning component 40 respectively and 50 of loads and further be provided with resistance 51.
Each test probe and grounded probe can be arranged on the detection platform 61 in the utility model, as shown in Figure 1, and each warning component 40 is arranged on the panel 62, when desire utilizes the utility model to measure, the contraposition target 10 of this determinand is positioned on this detection platform 61, make this test probe 20 can stretch into each corresponding plated-through-hole 131 of contact, 132,133,134,135,136, and this grounded probe 30 can stretch into the corresponding ground hole 137 of contact, if each layer body 11 there is no skew in this contraposition target 10, and each plated-through-hole 131,132,133,134,135,136 keep with the conductive layer 12 of each layer body and to isolate relative state, then 40 no current circulations of this warning component, and can not produce the caution effect, can judge according to this that then this determinand is a non-defective unit.
Otherwise, if there be certain layer of body to form skew in this contraposition target, as shown in Figure 5, this contraposition target 10 is provided with first, second, the 3rd, the 4th layer of body 11a, 11b, 11c, 11d, wherein this second layer body 11b forms and is offset 2mil to the right, this moment, the conductive layer 12 of this second layer body can be respectively with first, second plated-through-hole 131,132 contacts, and the conductive layer 12 and the 3rd of this second layer body, the 4th, the the 5th and the 6th plated-through-hole 133,134,135,136 keep the relative state of isolation, and with first, second plated-through-hole 131,132 warning components that connect 40 form short circuit, dotted line as shown in the figure is a conductive current path, allow the electric current of load 50 form circulation, warn effect and produce, for example form light-emitting caution, can judge according to this that then this determinand is faulty materials.
What deserves to be mentioned is, the utility model is by simple in structure and lower-cost measurement mechanism, can fast detecting go out determinand (multi-sheet printed electric degree plate, comprise hardboard, soft board, rigid-flex, high density interconnect plate etc.) Aligning degree of interlayer, and can judge according to this that this determinand is non-defective unit or faulty materials.
Claims (9)
1. interlayer offset measurement device is characterized in that it includes at least:
One contraposition target, be located on the determinand, this contraposition target is provided with and the corresponding plural layer body of this determinand, each layer body is provided with conductive layer in this contraposition target place, this contraposition target is provided with an at least one plated-through-hole and a ground hole in the conductive layer place, this conductive layer contacts with this ground hole, and isolates relative with this plated-through-hole;
At least one test probe, this test probe can stretch into the corresponding plated-through-hole of contact;
One grounded probe, this grounded probe can stretch into the corresponding ground hole of contact;
At least one warning component, this warning component and test probe form and electrically connect; And
One load, this load constitute this warning component and this grounded probe forms electric connection.
2. interlayer offset measurement device as claimed in claim 1, it is characterized in that, this contraposition target is provided with first, second, third, fourth, fifth and sixth plated-through-hole in regular turn in the conductive layer place, and this conductive layer is formed with 1,2,3,4,5 respectively with each plated-through-hole in regular turn, the spacing of 6mil.
3. interlayer offset measurement device as claimed in claim 1 or 2 is characterized in that this warning component is a light emitting diode.
4. interlayer offset measurement device as claimed in claim 1 or 2, it is characterized in that this load and each warning component form and be connected in parallel.
5. interlayer offset measurement device as claimed in claim 1 or 2 is characterized in that this warning component is a light emitting diode, and this load and the formation of each warning component are connected in parallel.
6. interlayer offset measurement device as claimed in claim 1 or 2 is characterized in that this warning component is a light emitting diode, and this load and each warning component form and be connected in parallel, and each warning component is respectively and between load and further be provided with resistance.
7. interlayer offset measurement device as claimed in claim 1 or 2 is characterized in that, this determinand is multi-sheet printed electric degree plate, and it comprises hardboard, soft board, rigid-flex, high density interconnect plate.
8. interlayer offset measurement device as claimed in claim 1 or 2 is characterized in that this load is a direct supply.
9. interlayer offset measurement device as claimed in claim 1 or 2 it is characterized in that each test probe and grounded probe are arranged on the detection platform, and each warning component is arranged on the panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202487809U CN201715996U (en) | 2010-07-06 | 2010-07-06 | Interlayer offset measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202487809U CN201715996U (en) | 2010-07-06 | 2010-07-06 | Interlayer offset measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201715996U true CN201715996U (en) | 2011-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202487809U Expired - Lifetime CN201715996U (en) | 2010-07-06 | 2010-07-06 | Interlayer offset measuring device |
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| Country | Link |
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| CN (1) | CN201715996U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254220A (en) * | 2011-04-13 | 2011-11-23 | 致茂电子(苏州)有限公司 | Probe deviation detection system and method thereof of LED die point measurement machine |
| CN102445140A (en) * | 2011-09-21 | 2012-05-09 | 东莞生益电子有限公司 | Device and method for testing aligning degree of multi-layer circuit board |
| CN109443194A (en) * | 2018-12-06 | 2019-03-08 | 奥士康科技股份有限公司 | The device and method of quantization detection blind via bottom Aligning degree |
| CN111157879A (en) * | 2020-01-03 | 2020-05-15 | 深圳市景旺电子股份有限公司 | Layer deviation detection method and layer deviation detection structure of printed circuit board |
| CN112004306A (en) * | 2020-07-02 | 2020-11-27 | 深圳市博敏电子有限公司 | Detection method for high-multilayer board circuit and electric milling precision |
| CN112504183A (en) * | 2020-11-07 | 2021-03-16 | 奥士康科技股份有限公司 | Hole deviation detection method |
| CN112623836A (en) * | 2020-12-14 | 2021-04-09 | 武汉文睿锡科技有限公司 | Multifunctional plastic film conveying and detecting equipment |
-
2010
- 2010-07-06 CN CN2010202487809U patent/CN201715996U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102254220A (en) * | 2011-04-13 | 2011-11-23 | 致茂电子(苏州)有限公司 | Probe deviation detection system and method thereof of LED die point measurement machine |
| CN102445140A (en) * | 2011-09-21 | 2012-05-09 | 东莞生益电子有限公司 | Device and method for testing aligning degree of multi-layer circuit board |
| CN109443194A (en) * | 2018-12-06 | 2019-03-08 | 奥士康科技股份有限公司 | The device and method of quantization detection blind via bottom Aligning degree |
| CN109443194B (en) * | 2018-12-06 | 2023-05-12 | 奥士康科技股份有限公司 | Device and method for quantitatively detecting blind hole bottom alignment degree |
| CN111157879A (en) * | 2020-01-03 | 2020-05-15 | 深圳市景旺电子股份有限公司 | Layer deviation detection method and layer deviation detection structure of printed circuit board |
| CN112004306A (en) * | 2020-07-02 | 2020-11-27 | 深圳市博敏电子有限公司 | Detection method for high-multilayer board circuit and electric milling precision |
| CN112004306B (en) * | 2020-07-02 | 2022-07-15 | 深圳市博敏电子有限公司 | Detection method for high-multilayer board circuit and electric milling precision |
| CN112504183A (en) * | 2020-11-07 | 2021-03-16 | 奥士康科技股份有限公司 | Hole deviation detection method |
| CN112623836A (en) * | 2020-12-14 | 2021-04-09 | 武汉文睿锡科技有限公司 | Multifunctional plastic film conveying and detecting equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110119 |