CN112004306B - Detection method for high-multilayer board circuit and electric milling precision - Google Patents
Detection method for high-multilayer board circuit and electric milling precision Download PDFInfo
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- CN112004306B CN112004306B CN202010627028.3A CN202010627028A CN112004306B CN 112004306 B CN112004306 B CN 112004306B CN 202010627028 A CN202010627028 A CN 202010627028A CN 112004306 B CN112004306 B CN 112004306B
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- circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The invention discloses a method for detecting the circuit and electric milling precision of a high-density multilayer board, which comprises the following steps: s1, installing monitoring equipment, wherein the monitoring equipment comprises a collecting camera and a display, and the collecting camera is electrically connected with the display; s2, installing a circuit main board, wherein the circuit main board comprises six or more layers of circuit boards, the circuit boards at the top layer and the bottom layer are signal layers, and each spacing layer of the circuit main board is respectively provided with a power supply layer and a grounding layer; s3, setting a line Kebang; s4, electric milling Kebang; according to the detection method for the high-multilayer board circuit and the electric milling precision, provided by the invention, the camera and the display are adopted, the distance between the layers is increased along a certain rule for the corresponding points by matching with the settings of the circuit Kobang and the electric milling Kobang, the offset of holes and patterns is observed by monitoring, and the variation is measured by matching with a detection tool, so that the circuit and the electric milling precision are effectively ensured, the operation is simple and rapid, and the voltage-resistant target of the high-multilayer board is ensured.
Description
Technical Field
The invention belongs to the technical field of line detection, and particularly relates to a method for detecting high-multilayer board lines and electric milling precision.
Background
Printed Circuit Boards (PCBs), also known as printed circuit boards, are important electronic components, as support bodies for electronic components, and also as carriers for electrical connections of electronic components. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit boards.
In the case of a multilayer printed circuit board, detection of the interlayer misalignment is an essential detection step, and is also generally referred to as printed circuit board alignment detection. In the prior art, a universal meter is generally adopted for alignment detection. Because two contraposition kebang are designed on each plate, the contraposition condition of the plate is reflected. The alignment detection pattern is generally called kebang in the field of printed circuit boards. The alignment detection pattern comprises a conduction bonding pad which is conducted with the inner core board and detection bonding pads corresponding to nine alignment conditions from 3mil to 7 mil. The traditional measurement adopts the universal meter to detect, whether short circuit confirms the counterpoint condition through the universal meter detection between pad and each detection pad of switching on. If the interlayer alignment condition of the PCB is 5mil, the lines between the 5mil detection bonding pads and the conducting bonding pads are open circuits, and the lines between the detection bonding pads and the conducting bonding pads which are smaller than 5mil are short circuits. However, since there are 9 measuring points for 3mil, 3.5mil. And when recording data after the measurement, the red and black pen-type meters of the universal meter need to be put down first, and the red and black pen-type meters need to be taken out and detected repeatedly during the continuous measurement, so that the detection is inconvenient, the time consumption is long, the circuit precision and the electric milling precision are not guaranteed, and the voltage-resistant target cannot be guaranteed.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a method for detecting the circuit and the electric milling precision of a high-multilayer board.
In order to achieve the purpose, the invention provides the following technical scheme:
1. a method for detecting the circuit and electric milling precision of a high-speed multilayer board comprises the following steps:
s1, installing monitoring equipment, wherein the monitoring equipment comprises a collecting camera and a display, and the collecting camera is electrically connected with the display;
s2, installing a circuit main board, wherein the circuit main board comprises six or more than six layers of circuit boards, the circuit boards at the top layer and the bottom layer are signal layers, and form a signal transmission circuit and a control circuit with electronic elements inserted at two sides of the circuit main board, and each spacing layer of the circuit main board is respectively provided with a power supply layer and a grounding layer;
s3, arranging circuit family bonds, designing four groups of circuit family bonds on the edge of a board, making intervals between adjacent different layers, increasing the interval to a circular pattern of 0.15mm by 0.0125mm, monitoring the interlayer alignment degree and the lamination offset degree in the process, respectively designing 0.05mm and starting to increase the interval to 0.15mm by 0.0125mm, if the pattern or the hole has offset, calculating the offset by using a universal meter or a flying probe tester from GND to which hole short circuit can be carried out in the simplest test without slice confirmation;
s4, designing four groups of electric milling kebang at plate edges, making a rectangular pattern with the distance of 0.165mm from a forming edge between layers, and monitoring the electric milling precision in the process, wherein the data calculation method comprises the steps of 0.125mm of appearance tolerance, 0.1-0.06 mm of layer deviation tolerance and visual copper exposure if the electric milling is deviated.
Preferably, the cameras can be divided into two categories, namely digital cameras and analog cameras; the digital camera can convert an analog video signal generated by the video acquisition equipment into a digital signal and then store the digital signal in the computer; the digital camera can directly capture images and then transmits the images to a computer through a serial port, a parallel port or a USB interface; the cameras in the computer market are mainly digital cameras, and the camera in the S1 is a digital infrared camera with the model number of DS-2CD3T46FWDA3-I, so that the penetration rate of infrared light is increased.
Preferably, the display in S1 is a CRT display or an LCD display.
Preferably, the multimeter in S2 is a 3244-60 card type digital multimeter, which can measure dc current, dc voltage, ac voltage, resistance, audio level, etc., and can also measure ac current, capacitance, inductance, and some parameters of semiconductor.
Preferably, the flying probe tester in S1 is an EMMA cooperative 6 th generation OS probe socket, and is an instrument mainly used for testing a PCB (printed circuit board) with high element arrangement density, multiple layers, high wiring density and small test point distance, and mainly used for testing insulation and conduction values of the PCB. The tester generally adopts a 'true value comparison positioning method', can monitor the test process and fault points in real time, and ensures the accuracy of the test.
Preferably, the PCB electric milling is one of the PCB forming methods, especially, the PCB electric milling is applied to a punch press, because the punch press needs to make a mold, and the formed board edge is rough, or the minimum number of the mold can not be opened, the electric milling forming method is generally adopted; the electric milling can better meet the requirements of plate edge smoothness and the like.
Preferably, the electric milling in the step S4 controls the balance of the rotor to be 65mg, and the requirement for controlling the axial and radial magnetic ring runout is less than 0.05 mm.
The invention has the technical effects and advantages that: according to the detection method for the circuit and the electric milling precision of the high-multilayer board, provided by the invention, the camera and the display are adopted, the distance between the boards is increased along a certain rule for the corresponding points by matching with the arrangement of the circuit Kopa and the electric milling Kopa, the offset of the holes and the patterns is observed by monitoring, and the variation is measured by matching with a detection tool, so that the circuit and the electric milling precision are effectively ensured, the operation is simple and rapid, and the voltage-resistant target of the high-multilayer board is ensured.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Example 1
A method for detecting high multilayer board circuit and electric milling precision comprises the following steps:
s1, installing monitoring equipment, wherein the monitoring equipment comprises a collecting camera and a display, and the collecting camera is electrically connected with the display;
s2, installing a circuit main board, wherein the circuit main board comprises six or more than six layers of circuit boards, the circuit boards at the top layer and the bottom layer are signal layers, and form a signal transmission circuit and a control circuit with electronic elements inserted at two sides of the circuit main board, and each spacing layer of the circuit main board is respectively provided with a power supply layer and a grounding layer;
s3, arranging line Cobs, designing four groups of line Cobs on the edge of a plate, making a distance between adjacent different layers, increasing the distance to a circular pattern of 0.15mm by a distance of 0.0125mm, monitoring the interlayer alignment degree and the lamination offset degree in the process, respectively designing 0.05mm and increasing the distance to 0.15mm by a distance of 0.0125mm, if the pattern or the hole has offset, calculating the offset by using a universal meter or a flying probe tester from GND to which hole short circuit occurs in the simplest test, and not needing slice confirmation;
s4, designing four groups of electric milling kebang at plate edges, making a rectangular pattern with the distance of 0.165mm from a forming edge between layers, and monitoring the electric milling precision in the process, wherein the data calculation method comprises the steps of 0.125mm of appearance tolerance, 0.1-0.06 mm of layer deviation tolerance and visual copper exposure if the electric milling is deviated.
Specifically, the cameras can be divided into two categories, namely digital cameras and analog cameras; the digital camera can convert an analog video signal generated by the video acquisition equipment into a digital signal and then store the digital signal in the computer; the digital camera can directly capture images and then transmits the images to a computer through a serial port, a parallel port or a USB interface; the cameras in the computer market are mainly digital cameras, the camera in the S1 adopts a digital infrared camera, the model number of the digital infrared camera is DS-2CD3T46FWDA3-I, and the penetration rate of infrared light is increased.
Specifically, the display in S1 is a CRT display or an LCD display.
Specifically, the multimeter in S2 adopts a 3244-60 card-type digital multimeter, which can measure dc current, dc voltage, ac voltage, resistance, audio level, and the like, and some of them can also measure ac current, capacitance, inductance, and some parameters of semiconductors.
Specifically, the electric milling of the PCB is one of the PCB forming modes, and particularly, the electric milling forming mode is generally adopted when the punch press needs to manufacture a mold and the formed plate edge is rough or the minimum number of the mold can not be opened; the electric milling can better meet the requirements of plate edge smoothness and the like.
Specifically, the electric milling in S4 controls the balance of the rotor to be 65mg, and the runout of the axial and radial magnetic rings is required to be less than 0.05 mm.
Example 2
A method for detecting high multilayer board circuit and electric milling precision comprises the following steps:
s1, installing monitoring equipment, wherein the monitoring equipment comprises a collecting camera and a display, and the collecting camera is electrically connected with the display;
s2, installing a circuit main board, wherein the circuit main board comprises six or more than six layers of circuit boards, the circuit boards at the top layer and the bottom layer are signal layers, and form a signal transmission circuit and a control circuit with electronic elements inserted at two sides of the circuit main board, and each spacing layer of the circuit main board is respectively provided with a power supply layer and a grounding layer;
s3, arranging circuit family bonds, designing four groups of circuit family bonds on the edge of a board, making intervals between adjacent different layers, increasing the interval to a circular pattern of 0.15mm by 0.0125mm, monitoring the interlayer alignment degree and the lamination offset degree in the process, respectively designing 0.05mm and starting to increase the interval to 0.15mm by 0.0125mm, if the pattern or the hole has offset, calculating the offset by using a universal meter or a flying probe tester from GND to which hole short circuit can be carried out in the simplest test without slice confirmation;
s4, designing four groups of electric milling kebang at plate edges, making a rectangular pattern with the distance of 0.165mm from a forming edge between layers, and monitoring the electric milling precision in the process, wherein the data calculation method comprises the steps of 0.125mm of appearance tolerance, 0.1-0.06 mm of layer deviation tolerance and visual copper exposure if the electric milling is deviated.
Specifically, the cameras can be divided into two categories, namely digital cameras and analog cameras; the digital camera can convert an analog video signal generated by the video acquisition equipment into a digital signal and then store the digital signal in the computer; the digital camera can directly capture images and then transmit the images to a computer through a serial port, a parallel port or a USB interface; the cameras in the computer market are mainly digital cameras, the camera in the S1 adopts a digital infrared camera, the model number of the digital infrared camera is DS-2CD3T46FWDA3-I, and the penetration rate of infrared light is increased.
Specifically, the display in S1 is a CRT display or an LCD display.
Specifically, the flying probe tester in S1 is an EMMA cooperative 6 th generation OS needle stand, and is an instrument mainly used for testing a PCB (printed circuit board) with high element arrangement density, multiple layers, high wiring density and small test point distance, and mainly used for testing insulation and conduction values of the PCB. The tester generally adopts a true value comparison positioning method, can monitor the test process and fault points in real time, and ensures the accuracy of the test.
Specifically, the PCB electric milling is one of the PCB forming methods, and is particularly applied to a punch press, because the punch press needs to manufacture a mold, and the formed plate edge is rough, or the minimum number of the mold can not be opened, the electric milling forming method is generally adopted; the electric milling can better meet the requirements of plate edge smoothness and the like.
Specifically, the electric milling in the step S4 controls the rotor balance to be 65mg, and the requirement for controlling the axial and radial magnetic ring runout is less than 0.05 mm.
The two embodiments differ from the detection tool chosen.
In conclusion: according to the detection method for the circuit and the electric milling precision of the high-multilayer board, provided by the invention, the camera and the display are adopted, the distance between the boards is increased along a certain rule for the corresponding points by matching with the arrangement of the circuit Kopa and the electric milling Kopa, the offset of the holes and the patterns is observed by monitoring, and the variation is measured by matching with a detection tool, so that the circuit and the electric milling precision are effectively ensured, the operation is simple and rapid, and the voltage-resistant target of the high-multilayer board is ensured.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications, substitutions and improvements can be made to the technical solutions described in the foregoing embodiments or to some of the technical features of the embodiments, and any modification, substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A detection method for high multilayer board circuit and electric milling precision is characterized by comprising the following steps: installing monitoring equipment, wherein the monitoring equipment comprises a collecting camera and a display, and the collecting camera is electrically connected with the display; installing a circuit main board, wherein the circuit main board comprises more than six layers of circuit boards, the circuit boards at the top layer and the bottom layer are signal layers, and form a signal transmission circuit and a control circuit with electronic elements inserted at two sides of the circuit main board, and each spacing layer of the circuit main board is respectively provided with a power supply layer and a ground layer; setting circuit Countries, designing four groups of circuit Countries on the plate edges, making intervals between every two adjacent different layers, gradually increasing the interval to 0.15mm by 0.0125mm to form a circular pattern, monitoring the interlayer alignment degree and the lamination offset degree in the process, respectively designing 0.05mm and gradually increasing the interval to 0.15mm by 0.0125mm, and if the pattern or the hole has offset, calculating the offset amount by a multimeter or a flying needle from GND to which hole is short-circuited without confirming by a slice tester; four groups of electric milling kebang are designed at the plate edges, rectangular patterns with the distance of 0.165mm from the forming edge are formed between layers, the data calculation method is that the shape tolerance of 0.125mm plus the layer deviation tolerance is 0.1-the unilateral compensation amount is 0.06mm, the electric milling precision in the process is monitored, and copper exposure can be seen visually if the electric milling is deviated.
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| CN112004306B true CN112004306B (en) | 2022-07-15 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61168293A (en) * | 1985-01-22 | 1986-07-29 | 日本電気株式会社 | Multilayer interconnection substrate |
| CN201715996U (en) * | 2010-07-06 | 2011-01-19 | 瀚宇博德股份有限公司 | Interlayer offset measuring device |
| CN102998309A (en) * | 2011-09-09 | 2013-03-27 | 深南电路有限公司 | Multilayer printed circuit board contraposition detection method |
| CN105302065A (en) * | 2014-07-28 | 2016-02-03 | 深南电路有限公司 | Circuit board drilling depth control method and device |
| CN106197250A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | The method of testing of pcb board internal layer off normal |
| CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
-
2020
- 2020-07-02 CN CN202010627028.3A patent/CN112004306B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61168293A (en) * | 1985-01-22 | 1986-07-29 | 日本電気株式会社 | Multilayer interconnection substrate |
| CN201715996U (en) * | 2010-07-06 | 2011-01-19 | 瀚宇博德股份有限公司 | Interlayer offset measuring device |
| CN102998309A (en) * | 2011-09-09 | 2013-03-27 | 深南电路有限公司 | Multilayer printed circuit board contraposition detection method |
| CN105302065A (en) * | 2014-07-28 | 2016-02-03 | 深南电路有限公司 | Circuit board drilling depth control method and device |
| CN106197250A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | The method of testing of pcb board internal layer off normal |
| CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
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