CN207281250U - A kind of detection module for the level to level alignment degree for being used to detect PCB - Google Patents
A kind of detection module for the level to level alignment degree for being used to detect PCB Download PDFInfo
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- CN207281250U CN207281250U CN201721283476.6U CN201721283476U CN207281250U CN 207281250 U CN207281250 U CN 207281250U CN 201721283476 U CN201721283476 U CN 201721283476U CN 207281250 U CN207281250 U CN 207281250U
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- measuring point
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- alignment degree
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Abstract
The utility model discloses a kind of detection module for the level to level alignment degree for being used to detect PCB, PCB has multilayer line, detection module has eight groups of measure loops, every group of measure loop all includes multiple detection circuits of the multilayer line with layer for being located at PCB respectively connected up and down, each circuit upper-lower position in design that detects with group measure loop corresponds to, each measure loop all includes first, second external measuring point, first, second conducting bar and 9 auxiliary measuring points, 4 in 9 auxiliary measuring points turn on bar positioned at first and are connected by it with the first external measuring point, remaining 5 turn on bar positioned at second and are connected by it with the second external measuring point, there is interval between adjacent auxiliary measuring point.The utility model external circuits, whether by the conducting of testing measure loop, detect the level to level alignment degree situation of PCB, in the case of the interlayer offset of PCB, moreover it is possible to determine degrees of offset, can realize the qualitative and quantitative detecting of the level to level alignment degree of PCB.
Description
Technical field
The technology for producing field of PCB is the utility model is related to, more particularly to a kind of interlayer pair for being used to detect PCB
The detection module of accuracy.
Background technology
With the development of PCB, high-layer PCB (printed wiring board) increasingly becomes mainstream, particularly in 4G, the 5G epoch,
Each router, switch design manufacturer, its PCB layer number designed is more than 20 layers, to complete the wiring board of such high level,
Requirement to level to level alignment degree is also higher and higher, there is a little offset, can cause scrapping for whole PCB.Therefore need a process
The level to level alignment degree of monitoring means advance notice engineering staff PCB, or collect such Aligning degree information and manufactured for next time
Data are provided to support.Previous detection multi-layer PCB level to level alignment degree be using X-ray equipment, randomly choose in plate any hole into
Row checks that examined hole is separate wells.
X-ray inspection principles：Each hole has orifice ring in internal layer, and orifice ring is realized with connection between each layer again
Conducting and communication.X-ray is imaged copper by transmitting x-ray, and when interlayer does not deviate, the orifice ring of each layer can overlap.
When the quantity with the raising of the number of plies, orifice ring is consequently increased, if each interlayer has interlayer offset, had after X-ray imagings more
A ghost image, so that influence to judge, while X-ray is only provided qualitatively as a result, quantitative data for analytical can not be provided.
In order to overcome drawbacks described above, the positive innovation research of those skilled in the art is a kind of for detecting PCB to create
Level to level alignment degree detection module.
Utility model content
In view of the problems of the existing technology, the utility model provides a kind of level to level alignment degree for being used to detect PCB
Detection module, external circuits, whether by the conducting of testing measure loop, detect the level to level alignment degree situation of PCB, and by right
The rational design of the width of eight groups of dead ring, in the case of the interlayer offset of PCB, moreover it is possible to determine its degrees of offset, i.e., not
It is only capable of realizing the qualitative detecting of the level to level alignment degree of PCB, moreover it is possible to realize the quantitative detecting of the level to level alignment degree of PCB, and detect
Process is easy to operate, quick, it is easy to accomplish.
In order to solve the above technical problems, the technical solution that the utility model uses is：There is provided a kind of for detecting PCB
Level to level alignment degree detection module, PCB has a multilayer line, and the detection module is arranged on PCB, and the detection module has eight
Group measure loop, every group of measure loop all include multiple detection lines of the multilayer line with layer for being located at PCB respectively connected up and down
Road, corresponds to, it is external that each measure loop all includes first with each circuit upper-lower position in design that detects for organizing measure loop
Measuring point, the second external measuring point, the first conducting bar, the second conducting bar and 9 auxiliary measuring points, described 94 positions aided in measuring point
It is connected in the described first conducting bar and by the first conducting bar with the described first external measuring point, remaining 5 are located at described the
Two turn on bars and are connected by the second conducting bar with the described second external measuring point, have interval between adjacent auxiliary measuring point,
When being connected with external circuit, the first external measuring point, the first conducting bar, auxiliary measuring point, second are turned on outside bar and described second
Connect measuring point and form measure loop；
Each auxiliary measuring point all includes PTH (via hole) at its center and positioned at the exhausted of the periphery of the PTH
Edge ring, in design, the corresponding PTH of adjacent layer upper-lower position should connect conducting；
The width of dead ring in eight groups of measure loops be respectively 3mil, 4mil, 5mil, 6mil, 7mil, 8mil,
9mil and 10mi；
The first external measuring point and the second external measuring point are all included positioned at the measuring point hole at center and positioned at the survey
The PAD (pad) of the periphery of spot hole.
Further say, the PAD is circle, and a diameter of 3-5mm of the PAD, the aperture in the measuring point hole is 0.8-
1.2mm。
Further say, a diameter of 4mm of the PAD, the aperture in the measuring point hole is 1.0mm.
Further say, the aperture of the PTH is 8mm.
Further say, the detection module is rectangle, and is arranged on one jiao of PCB, the adjacent both sides of the detection module
Side is connected with PCB, and the junction of the two forms and is easy to break the V-type grooving removed.
Further say, every PCB at least has a detection module.
Further say, the PCB is printed wiring board in flakes.
Further say, the arrangement mode of the measure loop is equipped with four groups for left side, and right side is equipped with four groups.
The beneficial effects of the utility model are：
The utility model is equipped with eight groups of measure loops, and every group of measure loop all includes the first external measuring point, the second external survey
Point, the first conducting bar, the second conducting bar and 9 auxiliary measuring points, 94 aided in measuring points are positioned at the first conducting bar and pass through
It is connected with the first external measuring point, remaining 5 positioned at second conducting bar and extend to the internal layer of PCB and by its with outside second
Connect measuring point connection, there is between adjacent auxiliary measuring point interval, by external circuits, by test the conducting of measure loop with
It is no, the level to level alignment degree situation of PCB, and the rational design of the width by the dead ring to eight groups are detected, it is inclined in the interlayer of PCB
In the case of shifting, moreover it is possible to determine its degrees of offset, i.e., can not only realize the qualitative detecting of the level to level alignment degree of PCB, moreover it is possible to realize
The quantitative detecting of the level to level alignment degree of PCB, and it is easy to operate, quick to detect process, it is easy to accomplish；
Wherein, 4 in 9 auxiliary measuring points with first external measuring point are connected positioned at the first conducting bar and by it, remaining
5 bar and extend to the internal layer of PCB positioned at the second conducting and be connected by it with the second external measuring point, 4 and 5 are respectively adopted
, design is reasonable, very few, easily surveys by mistake, accurately fixed low；Excessively, waste, increase difficulty of processing；
And connected between detection module and PCB by V-type grooving, level to level alignment degree was detected, needs to go when making finished product
Except the module, using V-type grooving, easy to the removal of the module, one is only needed to break, it is light, convenient, fast；
More preferably, the arrangement mode of measure loop is equipped with four groups for left side, and right side is equipped with four groups, realizes space optimization.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand the skill of the utility model
Art means, and being practiced according to the content of specification, with the preferred embodiment of the utility model and coordinate attached drawing detailed below
Describe in detail bright as after.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the partial enlarged view in the A portions of Fig. 1；
Fig. 3 is position view of the utility model in PCB；
Fig. 4 is the utility model and the structure diagram of the junction of PCB；
Each several part mark is as follows in attached drawing：
Detection module 1, measure loop 2, the first external measuring point 21, the second external conducting of measuring point 22, first bar 23, second are led
Poker 24, auxiliary measuring point 25, PCB3, PTH251, dead ring 252, the width w of dead ring, measuring point hole 211, PAD212 and V-type are cut
Groove 4.
Embodiment
Illustrate specific embodiment of the present utility model below by way of particular specific embodiment, those skilled in the art can
The advantages of the utility model is understood by content disclosed in the present specification easily and effect.The utility model can also it is other not
Same mode is practiced, i.e. under the scope of revealed without departing substantially from the utility model, can give different modification and change.
Embodiment：A kind of detection module for the level to level alignment degree for being used to detect PCB, as shown in Fig. 1 to Fig. 4, PCB3 has
Multilayer line, the detection module 1 are arranged on PCB, and the detection module has eight groups of measure loops 2, and every group of measure loop all wraps
The multilayer line positioned at PCB respectively connected up and down is included with multiple detection circuits of layer, the same each detection line for organizing measure loop
Road upper-lower position in design corresponds to, and each measure loop is all led including the first external measuring point 21, the second external measuring point 22, first
Poker 23, second turn on bar 24 and 9 auxiliary measuring points 25, it is described 9 auxiliary measuring point in 4 positioned at described first conducting bar and
Be connected by the first conducting bar with the described first external measuring point, remaining 5 are located at described second and turn on bar and pass through second
Conducting bar is connected with the described second external measuring point, has interval, when being connected with external circuit, institute between adjacent auxiliary measuring point
State the first external measuring point, the first conducting bar, auxiliary measuring point, the second conducting bar and the second external measuring point and form measure loop；
Each auxiliary measuring point 25 all includes PTH 251 at its center and the insulation positioned at the periphery of the PTH
Ring 252, in design, the corresponding PTH of adjacent layer upper-lower position should connect conducting；
The width w of dead ring in eight groups of measure loops be respectively 3mil, 4mil, 5mil, 6mil, 7mil, 8mil,
9mil and 10mi；
The first external measuring point and the second external measuring point are all included positioned at the measuring point hole 211 at center and positioned at described
The PAD212 of the periphery in measuring point hole.
The PAD is circle, and a diameter of 3-5mm of the PAD, the aperture in the measuring point hole is 0.8-1.2mm.
In the present embodiment, it is preferred that a diameter of 4mm of the PAD, the aperture in the measuring point hole is 1.0mm.
The aperture of the PTH is 8mm.
The detection module is rectangle, and arranged on one jiao of PCB, the adjacent two sides of the detection module are connected with PCB,
And the junction of the two forms and is easy to break the V-type grooving 4 removed.
Every PCB at least has a detection module.
The PCB is printed wiring board in flakes.
The arrangement mode of the measure loop is equipped with four groups for left side, and right side is equipped with four groups.
The course of work and operation principle of the utility model are as follows：
Detection module is equipped with eight groups of measure loops, every group of measure loop all include the first external measuring point, the second external measuring point,
First conducting bar, second conducting bar and 9 auxiliary measuring points, 9 auxiliary measuring points in 4 positioned at first conducting bar and by its with
First external measuring point connection, remaining 5 positioned at the second conducting bar and extend to the internal layer of PCB and by itself and the second external survey
Point connects, and has interval between adjacent auxiliary measuring point；During detection, only need to use external circuits, for example the cathode of universal meter and bear
Pole be aligned first, second detection hole, at this time, the first external measuring point, first conducting bar, auxiliary measuring point, second conducting bar and
Second external measuring point forms measure loop, and the detection method of short circuit is opened by electrical property, can detect PTH and external measuring point
Short-circuit condition is opened, the expression PTH of circuit short circuit is contacted with dead ring, shows that PTH is deviated, i.e., Aligning degree is inadequate, circuit open circuit
Represent PTH with dead ring not in contact with that is, Aligning degree meets the requirements, and finally draws the general alignment degrees of data of PCB；
Such as when using the width of dead ring as the circuit of 3mil, if circuit is opened a way, then it represents that the offset of the interlayer of PCB
Less than 3mil, Aligning degree meets the requirements；If circuit is short-circuit, then it represents that the offset of the interlayer of PCB is more than 3mil, uses again at this time
The width of dead ring is the circuit of 4mil, if circuit is opened a way, represents the offset of interlayer of PCB between 3mil and 4mil, if
Circuit short circuit, then it represents that the offset of the interlayer of PCB is more than 4mil, and lower primary Ioops measurement is selected according still further to aforesaid way.
The above description is only the embodiments of the present invention, and not thereby the foregoing is merely the implementation of the utility model
Example, it does not limit the scope of the patent of the present invention, every made based on the specification and figures of the utility model
Equivalent structure, is directly or indirectly used in other related technical areas, and the patent for being similarly included in the utility model is protected
In the range of shield.
Claims (8)
1. a kind of detection module for the level to level alignment degree for being used to detect PCB, PCB (3) have multilayer line, it is characterised in that：Institute
State detection module (1) and be arranged on PCB, the detection module has eight groups of measure loops (2), and every group of measure loop all includes connecting up and down
The logical multilayer line positioned at PCB respectively with multiple detection circuits of layer, is being designed with each detection circuit for organizing measure loop
When upper-lower position correspond to, each measure loop all include the first external measuring point (21), the second external measuring point (22), first conducting bar
(23), the second conducting bar (24) and 9 auxiliary measuring points (25), described 94 aided in measuring point are positioned at the described first conducting bar
And be connected by the first conducting bar with the described first external measuring point, remaining 5 are located at described second and turn on article and by the
Two conducting bars are connected with the described second external measuring point, have interval between adjacent auxiliary measuring point, when being connected with external circuit,
The first external measuring point, the first conducting bar, auxiliary measuring point, the second conducting bar and the second external measuring point are formed and detected back
Road；
Each auxiliary measuring point (25) all includes PTH (251) and the dead ring positioned at the periphery of the PTH at its center
(252), in design, the corresponding PTH of adjacent layer upper-lower position should connect conducting；
The width (w) of dead ring in eight groups of measure loops be respectively 3mil, 4mil, 5mil, 6mil, 7mil, 8mil,
9mil and 10mil；
The first external measuring point and the second external measuring point are all included positioned at the measuring point hole (211) at center and positioned at the survey
The PAD (212) of the periphery of spot hole.
A kind of 2. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Institute
PAD is stated as circle, a diameter of 3-5mm of the PAD, the aperture in the measuring point hole is 0.8-1.2mm.
A kind of 3. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Institute
A diameter of 4mm of PAD is stated, the aperture in the measuring point hole is 1.0mm.
A kind of 4. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Institute
The aperture for stating PTH is 8mm.
A kind of 5. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Institute
It is rectangle to state detection module, and arranged on one jiao of PCB, the adjacent two sides of the detection module are connected with PCB, and the company of the two
The place of connecing forms and is easy to break the V-type grooving (4) removed.
A kind of 6. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Often
One PCB at least has a detection module.
A kind of 7. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Institute
PCB is stated as printed wiring board in flakes.
A kind of 8. detection module of level to level alignment degree for being used to detect PCB according to claim 1, it is characterised in that：Institute
The arrangement mode for stating measure loop is equipped with four groups for left side, and right side is equipped with four groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721283476.6U CN207281250U (en) | 2017-09-30 | 2017-09-30 | A kind of detection module for the level to level alignment degree for being used to detect PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721283476.6U CN207281250U (en) | 2017-09-30 | 2017-09-30 | A kind of detection module for the level to level alignment degree for being used to detect PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207281250U true CN207281250U (en) | 2018-04-27 |
Family
ID=61988626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721283476.6U Active CN207281250U (en) | 2017-09-30 | 2017-09-30 | A kind of detection module for the level to level alignment degree for being used to detect PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207281250U (en) |
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2017
- 2017-09-30 CN CN201721283476.6U patent/CN207281250U/en active Active
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