CN112430072A - 一种共烧叠层多孔陶瓷发热体及其制备方法 - Google Patents
一种共烧叠层多孔陶瓷发热体及其制备方法 Download PDFInfo
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Abstract
本发明涉及多孔陶瓷发热体技术领域,具体涉及一种共烧叠层多孔陶瓷发热体及其制备方法,该共烧叠层多孔陶瓷发热体的制备方法,包括如下步骤:原料球磨、流延成型、切割、印刷线路、叠合等静压成型、脱脂排胶和共烧成型。发热线路与流延陶瓷基片共烧的方式,保证发热线路与流延陶瓷基片的同步收缩,延长了使用寿命,该制备方法操作简单,控制方便,生产效率高,生产成本低,可用于大规模生产。
Description
技术领域
本发明涉及多孔陶瓷发热体技术领域,具体涉及一种共烧叠层多孔陶瓷发热体及其制备方法。
背景技术
目前电子烟用多孔陶瓷发热体主要有两种:一种是多孔陶瓷插入金属发热丝,进行低温烧结,这种产品由于金属发热丝不耐高温,一般在600-700℃下烧结,因此其结构强度低,同时金属发热丝在成型过程中容易变形,或者线路布置比较疏宽,影响了发热的均匀性;另一种是厚膜印刷型外部发热体,这种产品是先烧结出多孔陶瓷基材,然后在多孔陶瓷基材表面印刷发热线路,再烧结发热线路,因为多孔陶瓷基材是先烧制好的产品,所以只能在产品外表面印刷进行二次烧结,由于在烧结过程中发热线路与多孔陶瓷基材的膨胀收缩不一样,发热线路容易剥离,导致糊芯问题,降低了多孔陶瓷发热体的使用寿命。
发明内容
为了克服现有技术中存在的缺点和不足,本发明的目的在于提供一种共烧叠层多孔陶瓷发热体的制备方法,发热线路与流延陶瓷基片共烧的方式,保证发热线路与流延陶瓷基片的同步收缩,延长了使用寿命,该制备方法操作简单,控制方便,生产效率高,生产成本低,可用于大规模生产。
本发明的另一目的在于提供一种共烧叠层多孔陶瓷发热体,实现产品的多样化,如平板状的内部发热体、圆柱状的内侧发热体、浴缸状的内部发热体、平板状的外部发热体、圆柱状的外侧发热体或浴缸状的外部发热体等,同时采用本发明的制备方法保证了发热线路与流延陶瓷基片的同步收缩,避免了发热线路剥离导致使用时糊芯。
本发明的目的通过下述技术方案实现:一种共烧叠层多孔陶瓷发热体的制备方法,包括如下步骤:
按重量份取100份陶瓷粉、10-40份造孔剂和20-70份PVB胶粘剂混合后球磨,得到球磨料;
将所述球磨料经流延成型后,得到流延陶瓷基片;
将所述流延陶瓷基片切割后,再印刷发热线路,得到印刷陶瓷基片;
将多个所述印刷陶瓷基片叠合后,经等静压成型,得到陶瓷基体;
将所述陶瓷基体在300-600℃温度条件下脱脂排胶后,在800-1300℃温度条件下烧结成型,即得共烧叠层多孔陶瓷发热体。
本发明的共烧叠层多孔陶瓷发热体的制备方法,采用陶瓷粉、造孔剂和PVB胶粘剂制得流延陶瓷基片后再印刷发热线路,经叠合、等静压成型、共烧的方式,保证发热线路与流延陶瓷基片的同步收缩,延长了使用寿命,该制备方法操作简单,控制方便,生产效率高,生产成本低,可用于大规模生产。其中,在得到陶瓷基体的步骤中,叠合的方式有多种,可使发热线路埋设于所述陶瓷基体内或使发热线路显露于所述陶瓷基体外,优选的,将多个所述印刷陶瓷基片叠合使发热线路埋设于所述陶瓷基体内。经800-1300℃温度条件下烧结,陶瓷基体的造孔剂挥发以形成微孔,仅一次烧结即得共烧叠层多孔陶瓷发热体,成本更低。进一步的,每份所述PVB胶粘剂的制备方法包括如下步骤:按重量份取聚乙烯醇缩丁醛5-15份、乙基纤维素1-4份、邻苯二甲酸二丁酯2-9份、蓖麻油2-9份和松油醇63-90份在60-90℃温度条件下混合均匀,即可。
优选的,在得到所述球磨料的步骤中,球磨的时间为1-4h;在得到所述陶瓷基体的步骤中,所述叠合的方式包括绕曲叠合成筒状结构或者叠合成层状结构,所述等静压成型为温水等静压压合成型。
采用上述技术方案,球磨时间控制在1-4h,粉碎陶瓷粉和造孔剂降低球磨料的细度,更有利于流延成型。绕曲叠合成筒状结构或者叠合成层状结构,实现共烧叠层多孔陶瓷发热体的多样化,满足不同电子烟的需求。采用温水等静压压合成型,实现对陶瓷基体等压力压制,保证层与层之间密度分布均匀一致。
优选的,所述脱脂排胶是在空气气氛窑炉中进行脱脂排胶;所述烧结成型是在氢气炉中进行烧结。
采用上述技术方案,更有利于共烧叠层多孔陶瓷发热体脱脂排胶,避免残留而影响其发热性能以及应用于电子烟中对人体产生危害。烧结过程在氢气炉中进行,避免了空气杂质引入到共烧叠层多孔陶瓷发热体导致发热性能降低。
优选的,每份所述陶瓷粉包括如下重量份的原料:氧化铝1-10份、石英砂60-89份和玻璃粉10-30份。
采用上述技术方案,氧化铝、石英砂和玻璃粉以特定组分混合的陶瓷粉,与造孔剂结合效果更好,得到的共烧叠层多孔陶瓷发热体的空隙率为30%-60%,提高了共烧叠层多孔陶瓷发热体的烟油雾化速率和烟雾量。其中,控制氧化铝在1-10份,在保证其共烧叠层多孔陶瓷发热体的机械强度外,形成的膜结构提高了共烧叠层多孔陶瓷发热体的导热性能;控制石英砂在60-89份,使流延陶瓷基片与发热线路在共烧和冷却过程中的伸缩程度趋于相同,防止流延陶瓷基片与发热线路的伸缩不一致导致发热线路剥离而影响发热性能,另外,加入的石英砂对共烧叠层多孔陶瓷发热体的光泽度有促进作用,以提高共烧叠层多孔陶瓷发热体的品质。控制玻璃粉在10-30份,与氧化铝共同作用,提高共烧叠层多孔陶瓷发热体的硬度、抗弯强度和结合性,其呈白色粉末且有助于共烧叠层多孔陶瓷发热体的表面亮度,使共烧叠层多孔陶瓷发热体的色相更柔和,进一步提高共烧叠层多孔陶瓷发热体的品质。更优选的,所述玻璃粉的玻璃软化温度为600-1300℃,所述玻璃粉的粒径大小为400目-1000目;所述石英砂的粒径大小为100目-800目。
优选的,所述造孔剂的粒径为10-100μm;所述造孔剂为淀粉、酵母粉、聚甲基丙烯酸甲酯、碳酸氢铵、尿素、聚乙烯吡咯烷酮、聚乙二醇或聚乙烯醇。
采用上述技术方案,控制造孔剂的用量在10-40重量份且粒径为10-100μm,经烧结后使共烧叠层多孔陶瓷发热体的微孔孔径大小在2-50μm,应用于电子烟中,有利于提升烟油雾化速率和烟雾量,电子烟使用口感更好。优选的,所述造孔剂为淀粉,经烧结后充分挥发造孔,降低共烧叠层多孔陶瓷发热体的杂质,提高其导油、导热发热效果。
优选的,所述共烧叠层多孔陶瓷发热体的空隙率为30%-60%,所述共烧叠层多孔陶瓷发热体的微孔孔径大小为2-100μm。
采用上述技术方案,该共烧叠层多孔陶瓷发热体应用于电子烟中,促进该共烧叠层多孔陶瓷发热体导油,有利于提升烟油雾化速率和烟雾量,电子烟使用口感更好。
优选的,在得到所述印刷陶瓷基片的步骤中,发热线路是采用镍铬电阻浆料印刷于所述流延陶瓷基片而成。
采用上述技术方案,镍铬电阻浆料与本发明的特定流延陶瓷基片的收缩率趋于相同,烧结后结合强度好,防止流延陶瓷基片与发热线路的伸缩不一致导致发热线路剥离而影响发热性能。
本发明的另一目的通过下述技术方案实现:一种共烧叠层多孔陶瓷发热体,采用上述的共烧叠层多孔陶瓷发热体的制备方法制得。
优选的,所述共烧叠层多孔陶瓷发热体包括多个印刷陶瓷基片叠合共烧成的多孔陶瓷基体,所述印刷陶瓷基片的表面印刷有发热线路。
采用上述技术方案,实现产品的多样化,如平板状的内部发热体、圆柱状的内侧发热体、浴缸状的内部发热体、平板状的外部发热体、圆柱状的外侧发热体或浴缸状的外部发热体等,同时采用本发明的制备方法保证了发热线路与流延陶瓷基片的同步收缩,避免了发热线路剥离导致使用时糊芯。
本发明的有益效果在于:本发明的共烧叠层多孔陶瓷发热体的制备方法,发热线路与流延陶瓷基片共烧的方式,保证发热线路与流延陶瓷基片的同步收缩,延长了使用寿命,该制备方法操作简单,控制方便,生产效率高,生产成本低,可用于大规模生产。
本发明的共烧叠层多孔陶瓷发热体,实现产品的多样化,如平板状的内部发热体、圆柱状的内侧发热体、浴缸状的内部发热体、平板状的外部发热体、圆柱状的外侧发热体或浴缸状的外部发热体等,实现曲面或者多层多孔陶瓷发热体的需求,同时采用本发明的制备方法保证了发热线路与流延陶瓷基片的同步收缩,避免了发热线路剥离导致使用时糊芯。
附图说明
图1是本发明共烧叠层多孔陶瓷发热体呈圆柱状内侧发热体的结构示意图;
图2是本发明共烧叠层多孔陶瓷发热体呈平板状外部发热体的结构示意图;
图3是本发明共烧叠层多孔陶瓷发热体呈浴缸状内部发热体的结构示意图。
具体实施方式
为了便于本领域技术人员的理解,下面结合实施例及附图对本发明作进一步的说明,实施方式提及的内容并非对本发明的限定。
实施例1
一种共烧叠层多孔陶瓷发热体的制备方法,包括如下步骤:
按重量份取100份陶瓷粉、25份造孔剂和45份PVB胶粘剂混合后球磨2h,得到球磨料;
将所述球磨料经流延成型后,得到流延陶瓷基片;
将所述流延陶瓷基片切割后,再采用镍铬电阻浆料印刷发热线路,得到印刷陶瓷基片;
将多个所述印刷陶瓷基片叠合成层状结构后,经温水等静压压合成型,得到陶瓷基体;
将所述陶瓷基体在500℃温度条件下在空气气氛窑炉中进行脱脂排胶后,在1000℃温度条件下在氢气炉中进行烧结成型,即得共烧叠层多孔陶瓷发热体。
每份所述PVB胶粘剂的制备方法包括如下步骤:按重量份取聚乙烯醇缩丁醛10份、乙基纤维素2份、邻苯二甲酸二丁酯6份、蓖麻油6份和松油醇75份在75℃温度条件下混合均匀,即可。
所述镍铬电阻浆料选自专利申请号为CN200410040647.3的可在空气中烧结的含镍铬基电阻材料及其制备方法中,说明书实施例一调配成的电阻浆料。
每份所述陶瓷粉包括如下重量份的原料:氧化铝5份、石英砂75份和玻璃粉20份。
所述玻璃粉的玻璃软化温度为900℃,所述玻璃粉的粒径大小为700目;所述石英砂的粒径大小为400目。
所述造孔剂的粒径为50μm;所述造孔剂为淀粉。
所述共烧叠层多孔陶瓷发热体的空隙率为45%,所述共烧叠层多孔陶瓷发热体的微孔孔径大小为25μm。
一种共烧叠层多孔陶瓷发热体,采用上述的共烧叠层多孔陶瓷发热体的制备方法制得。
所述共烧叠层多孔陶瓷发热体包括多个印刷陶瓷基片叠合共烧成的多孔陶瓷基体,所述印刷陶瓷基片的表面印刷有发热线路。
实施例2
一种共烧叠层多孔陶瓷发热体的制备方法,包括如下步骤:
按重量份取100份陶瓷粉、10份造孔剂和20份PVB胶粘剂混合后球磨1h,得到球磨料;
将所述球磨料经流延成型后,得到流延陶瓷基片;
将所述流延陶瓷基片切割后,再采用镍铬电阻浆料印刷发热线路,得到印刷陶瓷基片;
将多个所述印刷陶瓷基片绕曲叠合成筒状结构后,经温水等静压压合成型,得到陶瓷基体;
将所述陶瓷基体在300℃温度条件下在空气气氛窑炉中进行脱脂排胶后,在800℃温度条件下在氢气炉中进行烧结成型,即得共烧叠层多孔陶瓷发热体。
每份所述PVB胶粘剂的制备方法包括如下步骤:按重量份取聚乙烯醇缩丁醛5份、乙基纤维素1份、邻苯二甲酸二丁酯2份、蓖麻油2份和松油醇63份在60℃温度条件下混合均匀,即可。
所述镍铬电阻浆料选自专利申请号为CN200410040647.3的可在空气中烧结的含镍铬基电阻材料及其制备方法中,说明书实施例二调配成的电阻浆料。
每份所述陶瓷粉包括如下重量份的原料:氧化铝1份、石英砂60份和玻璃粉10份。
所述玻璃粉的玻璃软化温度为600℃,所述玻璃粉的粒径大小为400目;所述石英砂的粒径大小为100目。
所述造孔剂的粒径为10μm;所述造孔剂为酵母粉。
所述共烧叠层多孔陶瓷发热体的空隙率为30%,所述共烧叠层多孔陶瓷发热体的微孔孔径大小为2μm。
一种共烧叠层多孔陶瓷发热体,采用上述的共烧叠层多孔陶瓷发热体的制备方法制得。
所述共烧叠层多孔陶瓷发热体包括多个印刷陶瓷基片叠合共烧成的多孔陶瓷基体,所述印刷陶瓷基片的表面印刷有发热线路。
实施例3
一种共烧叠层多孔陶瓷发热体的制备方法,包括如下步骤:
按重量份取100份陶瓷粉、40份造孔剂和70份PVB胶粘剂混合后球磨4h,得到球磨料;
将所述球磨料经流延成型后,得到流延陶瓷基片;
将所述流延陶瓷基片切割后,再采用镍铬电阻浆料印刷发热线路,得到印刷陶瓷基片;
将多个所述印刷陶瓷基片叠合成层状结构后,经温水等静压压合成型,得到陶瓷基体;
将所述陶瓷基体在600℃温度条件下在空气气氛窑炉中进行脱脂排胶后,在1300℃温度条件下在氢气炉中进行烧结成型,即得共烧叠层多孔陶瓷发热体。
每份所述PVB胶粘剂的制备方法包括如下步骤:按重量份取聚乙烯醇缩丁醛15份、乙基纤维素4份、邻苯二甲酸二丁酯9份、蓖麻油9份和松油醇90份在90℃温度条件下混合均匀,即可。
所述镍铬电阻浆料选自专利申请号为CN200410040647.3的可在空气中烧结的含镍铬基电阻材料及其制备方法中,说明书实施例一调配成的电阻浆料。
每份所述陶瓷粉包括如下重量份的原料:氧化铝10份、石英砂89份和玻璃粉30份。
所述玻璃粉的玻璃软化温度为1300℃,所述玻璃粉的粒径大小为1000目;所述石英砂的粒径大小为800目。
所述造孔剂的粒径为100μm;所述造孔剂为碳酸氢铵。
所述共烧叠层多孔陶瓷发热体的空隙率为60%,所述共烧叠层多孔陶瓷发热体的微孔孔径大小为100μm。
一种共烧叠层多孔陶瓷发热体,采用上述的共烧叠层多孔陶瓷发热体的制备方法制得。
所述共烧叠层多孔陶瓷发热体包括多个印刷陶瓷基片叠合共烧成的多孔陶瓷基体,所述印刷陶瓷基片的表面印刷有发热线路。
实施例4
一种共烧叠层多孔陶瓷发热体的制备方法,包括如下步骤:
按重量份取100份陶瓷粉、30份造孔剂和40份PVB胶粘剂混合后球磨2h,得到球磨料;
将所述球磨料经流延成型后,得到流延陶瓷基片;
将所述流延陶瓷基片切割后,再采用镍铬电阻浆料印刷发热线路,得到印刷陶瓷基片;
将多个所述印刷陶瓷基片叠合成层状结构后,经温水等静压压合成型,得到陶瓷基体;
将所述陶瓷基体在400℃温度条件下在空气气氛窑炉中进行脱脂排胶后,在900℃温度条件下在氢气炉中进行烧结成型,即得共烧叠层多孔陶瓷发热体。
每份所述PVB胶粘剂的制备方法包括如下步骤:按重量份取聚乙烯醇缩丁醛12份、乙基纤维素3份、邻苯二甲酸二丁酯4份、蓖麻油4份和松油醇80份在60-90℃温度条件下混合均匀,即可。
所述镍铬电阻浆料选自专利申请号为CN200410040647.3的可在空气中烧结的含镍铬基电阻材料及其制备方法中,说明书实施例一调配成的电阻浆料。
每份所述陶瓷粉包括如下重量份的原料:氧化铝8份、石英砂80份和玻璃粉18份。
所述玻璃粉的玻璃软化温度为1000℃,所述玻璃粉的粒径大小为600目;所述石英砂的粒径大小为600目。
所述造孔剂的粒径为80μm;所述造孔剂为尿素。
所述共烧叠层多孔陶瓷发热体的空隙率为40%,所述共烧叠层多孔陶瓷发热体的微孔孔径大小为30μm。
一种共烧叠层多孔陶瓷发热体,采用上述的共烧叠层多孔陶瓷发热体的制备方法制得。
所述共烧叠层多孔陶瓷发热体包括多个印刷陶瓷基片叠合共烧成的多孔陶瓷基体,所述印刷陶瓷基片的表面印刷有发热线路。
对比例1
本对比例与实施例1的区别在于:
所述造孔剂的重量份用量为50份。
对比例2
本对比例与实施例1的区别在于:
每份所述陶瓷粉包括如下重量份的原料:氧化铝15份、石英砂75份和玻璃粉20份。
对比例3
本对比例与实施例1的区别在于:
每份所述陶瓷粉包括如下重量份的原料:氧化铝5份、石英砂75份和玻璃粉40份。
对比例4
一种电子烟用多孔陶瓷发热体,取自专利申请号为CN201811488474.X的说明书实施例1。
实施例5
取实施例1、实施例3、实施例4和对比例1-4的多孔陶瓷发热体,测试其抗弯强度和导油性能,测试方法如下:
抗弯强度:依据《GBT6569-1986-工程陶瓷弯曲强度试验方法》,对试样的增压速度5N/s,跨距5.2mm,测试其断裂时的最大负荷,单位N;
导油性:取9mm*9mm*2mm的样板,在距离样板10mm高度滴入0.1ml的烟油,所述烟油为丙二醇:甘油按体积比1:1混合,记录烟油从接触样板至完全渗入样板的时间,单位为s。
测试结果如下表1所示:
表1
抗压强度/N | 导油时间/s | |
实施例1 | 19.6 | 1.5 |
实施例3 | 22.0 | 1.2 |
实施例4 | 20.3 | 1.4 |
对比例1 | 15.6 | 1.0 |
对比例2 | 21.5 | 2.0 |
对比例3 | 17.8 | 1.6 |
对比例4 | 15.8 | 1.8 |
由上表1可知,本发明的多孔陶瓷发热体以共烧叠层的方式制备,结合特定原料,并不影响其抗压强度和导油速率。与对比例1相比,实施例1的抗压强度更好,虽然加入造孔剂过多有利于发热体导油但容易导致抗压强度变弱。与对比例2相比,实施例1的导油效果更优异,陶瓷粉的体系中加入氧化铝过多容易受膜影响而降低导油效果。与对比例3相比,实施例1的抗压强度更好,导油效果更好,说明了加入玻璃粉过多对其抗压强度和导油效果有抑制作用。与对比例4相比,实施例1的抗压强度和导油效果更好,说明了本发明的多孔陶瓷发热体采用特定原料与共烧叠层的方式提高了多孔陶瓷发热体的抗压强度和导油性能。
上述实施例为本发明较佳的实现方案,除此之外,本发明还可以其它方式实现,在不脱离本发明构思的前提下任何显而易见的替换均在本发明的保护范围之内。
Claims (10)
1.一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于,包括如下步骤:
按重量份取100份陶瓷粉、10-40份造孔剂和20-70份PVB胶粘剂混合后球磨,得到球磨料;
将所述球磨料经流延成型后,得到流延陶瓷基片;
将所述流延陶瓷基片切割后,再印刷发热线路,得到印刷陶瓷基片;
将多个所述印刷陶瓷基片叠合后,经等静压成型,得到陶瓷基体;
将所述陶瓷基体在300-600℃温度条件下脱脂排胶后,在800-1300℃温度条件下烧结成型,即得共烧叠层多孔陶瓷发热体。
2.根据权利要求1所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:在得到所述球磨料的步骤中,球磨的时间为1-4h;在得到所述陶瓷基体的步骤中,所述叠合的方式包括绕曲叠合成筒状结构或者叠合成层状结构,所述等静压成型为温水等静压压合成型。
3.根据权利要求1所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:所述脱脂排胶是在空气气氛窑炉中进行脱脂排胶;所述烧结成型是在氢气炉中进行烧结。
4.根据权利要求1所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:每份所述陶瓷粉包括如下重量份的原料:氧化铝1-10份、石英砂60-89份和玻璃粉10-30份。
5.根据权利要求4所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:所述玻璃粉的玻璃软化温度为600-1300℃,所述玻璃粉的粒径大小为400目-1000目;所述石英砂的粒径大小为100目-800目。
6.根据权利要求1所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:所述造孔剂的粒径为10-100μm;所述造孔剂为淀粉、酵母粉、聚甲基丙烯酸甲酯、碳酸氢铵、尿素、聚乙烯吡咯烷酮、聚乙二醇或聚乙烯醇。
7.根据权利要求1所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:所述共烧叠层多孔陶瓷发热体的空隙率为30%-60%,所述共烧叠层多孔陶瓷发热体的微孔孔径大小为2-100μm。
8.根据权利要求1所述的一种共烧叠层多孔陶瓷发热体的制备方法,其特征在于:在得到所述印刷陶瓷基片的步骤中,发热线路是采用镍铬电阻浆料印刷于所述流延陶瓷基片而成。
9.一种共烧叠层多孔陶瓷发热体,其特征在于:采用权利要求1-8任意一项所述的共烧叠层多孔陶瓷发热体的制备方法制得。
10.根据权利要求9所述的一种共烧叠层多孔陶瓷发热体,其特征在于:所述共烧叠层多孔陶瓷发热体包括多个印刷陶瓷基片叠合共烧成的多孔陶瓷基体,所述印刷陶瓷基片的表面印刷有发热线路。
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