CN112428126A

CN112428126A - Polishing equipment for semiconductor crystal production

Info

Publication number: CN112428126A
Application number: CN202011281170.3A
Authority: CN
Inventors: 逯占文; 尹嘉琦; 李俣; 王胜军; 李健
Original assignee: Linton Kayex Technology Co Ltd
Current assignee: Linton Kayex Technology Co Ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-03-02
Anticipated expiration: 2040-11-16
Also published as: CN112428126B

Abstract

The invention discloses polishing equipment for semiconductor crystal production, which comprises a bracket, a positioning and clamping structure, a fixed point start-stop structure, a fixed frame, a cylinder, a polishing motor, a sliding block and a guide rail, wherein the fixed point start-stop structure is arranged on the bracket; the utility model discloses a crystal rod polishing machine, including support, fixed point start-stop structure, location clamping structure, first piston rod, second piston rod, scale, first piston rod operation, guarantee that the crystal rod is under the state of stabilizing the centre gripping, can not produce the extrusion trace on the surface of crystal rod, guarantee that the crystal rod surface is intact, three gasbag simultaneous operation of group simultaneously, when can realizing fixing the crystal rod, the axle center of crystal rod is the same with the pivot axle center of polishing motor, can be to more even of crystal rod terminal surface polishing, through setting up location clamping structure, under the cooperation of gasbag, realize the centre gripping to the crystal rod, when the pressurization, the inside synchronous pressurization of scalar cylinder, the second piston rod is under atmospheric pressure, promote the scalar pointer, under the cooperation of scale, can be according to the parameter that the scalar pointer corresponds, stop first piston rod operation.

Description

Polishing equipment for semiconductor crystal production

Technical Field

The invention relates to the technical field of semiconductors, in particular to polishing equipment for semiconductor crystal production.

Background

Semiconductor materials are a cornerstone of the modern semiconductor industry and the microelectronics industry. Physically, it refers to a class of materials that have electrical conductivity properties intermediate between those of conductors and insulators.

Semiconductor materials are widely classified into three types, i.e., inorganic semiconductor crystals, organic semiconductor materials, and amorphous semiconductors. Currently, amorphous semiconductor materials have great application prospects in solar cells. But from an overall perspective, inorganic semiconductor crystals still predominate in the semiconductor material;

the application publication No. CN 111168552A is a polishing device for semiconductor wafer production, which has a limit function through a limit slot plate, so that the polishing device can not slide during polishing, and can adapt to materials of different sizes through an adjustable polishing rod, thereby being more convenient, and meanwhile, the upper surface of a semiconductor material can be polished more finely through the mutual matching of an auxiliary polishing sheet and a main buckle disc;

when a wafer or a crystal bar is polished, the wafer or the crystal bar is generally clamped by a mechanical clamp, and when the wafer or the crystal bar is clamped, clamping marks are easily generated on the side surface of the wafer, so that the side surface of the wafer is deformed, and the normal use of the wafer is influenced.

Disclosure of Invention

The invention aims to provide polishing equipment for semiconductor crystal production, which can ensure that a crystal bar cannot generate extrusion traces on the surface of the crystal bar in a stable clamping state, ensure that the surface of the crystal bar is intact, simultaneously operate three groups of air bags simultaneously, and can realize that when the crystal bar is fixed, the axis of the crystal bar is the same as the axis of a rotating shaft of a polishing motor, and the end face of the crystal bar can be polished more uniformly.

In order to achieve the purpose, the invention adopts the following technical scheme:

a polishing device for semiconductor crystal production comprises a bracket, a positioning and clamping structure, a fixed point start-stop structure, a fixed frame, a cylinder, a polishing motor, a sliding block and a guide rail; the utility model discloses a polishing machine, including support, fixed point, mount, cylinder, guide rail, slider cooperation lock-in, polishing motor, location clamping structure is installed to the top side one end of support, the avris of support is installed the fixed point and is opened the start-stop structure, the mount welds the dress at the top side other end of support, the side of mount is fixed with the cylinder, the top side at the support is fixed to the guide rail, slider cooperation lock-in is on the guide rail, the polishing motor cooperation is installed on the slider, the pneumatic rod and.

Preferably, the positioning and clamping structure comprises a fixed disc, a limiting cylinder, a telescopic air pipe, a connecting pipe, an air bag, an air inlet cylinder, a first piston rod, a communicating pipe, a scalar cylinder, a scalar pointer, a graduated scale, a second piston rod and an expansion spring, wherein three limiting cylinders are fixed on one side of the fixed disc in an annular office array, the telescopic air pipe is mounted inside the limiting cylinder in a pasting mode, one end of the telescopic air pipe is connected with the connecting pipe in a matching mode, the air bag is fixed at the other end of the connecting pipe, the air inlet cylinder is welded on the circumferential surface top side of the fixed disc, the first piston rod is mounted in the air inlet cylinder, the communicating pipe is fixedly connected to the bottom end of the air inlet cylinder, the communicating pipe is respectively communicated with the three telescopic air pipes, the scalar cylinder is welded on the other side of the fixed disc, the second piston rod penetrates through the cylinder, and an expansion spring is sleeved outside the other end of the second piston rod, and a graduated scale is welded on the cylinder wall at one end of the scalar cylinder.

Preferably, the bottom of the scalar cylinder is communicated with the communicating pipe, and the graduated scale is arranged in parallel with the second piston rod.

Preferably, a one-way valve is installed at the connecting position of the communicating pipe and the air inlet cylinder, a pressure release valve is installed in the middle of the communicating pipe, an air inlet pipe is installed on the other side of the bottom of the air inlet cylinder, and the one-way valve is installed on the air inlet pipe.

Preferably, the fixed disk is welded on the top side of the bracket, and the central shaft of the fixed disk and the central shaft of the rotating shaft of the polishing motor are on the same straight line.

Preferably, the fixed point start-stop structure comprises a slide rail, a limiting rod, a contact plate, a movable plate, a return spring, a positioning pin, a slide fastener, a warning buzzer, a first mounting plate, an electrode ball, a first conductive shifting sheet, a second conductive shifting sheet and a second mounting plate, a slide fastener is arranged on the slide rail in a matching and buckling manner, a limiting rod is arranged on the slide fastener, a rod hole is arranged in the movable plate, the limiting rod is arranged in the rod hole in a penetrating way, the reset spring is sleeved outside one end of the limiting rod, the contact plate and the first conductive shifting sheet are respectively arranged at the upper end and the lower end of one side of the movable plate, the second mounting plate is welded at one end of the bottom side of the slide fastener, the second conductive shifting piece is fixed at one side of the second mounting plate, the first mounting plate is welded in the middle of the bottom side of the slide fastener, electrode balls are mounted on the opposite surfaces of the first mounting plate and the movable plate, and the warning buzzer is mounted on the other side surface of the first mounting plate.

Preferably, the slide fastener is provided with a positioning pin in a penetrating manner through threaded fit, and the end face of the positioning pin is tangent to the surface of the slide rail.

Preferably, the first conductive shifting piece, the second conductive shifting piece, the polishing motor and the power supply are connected with the series circuit through leads, and the two electrode balls, the warning buzzer and the storage battery are connected with the series circuit through leads.

Preferably, the slider is provided with a scalar line, and the side surface of the bracket is provided with a scale mark.

Preferably, a touch rod is installed on one side of the sliding block, the touch rod is arranged in parallel with the contact plate, and the contact plate is 1mm thicker than the first conductive shifting sheet.

The invention has the beneficial effects that:

according to the invention, by arranging the positioning clamping structure, the crystal rod is clamped under the matching of the air bags, when the crystal rod is pressurized, the inside of the scalar cylinder is synchronously pressurized, the second piston rod pushes the scalar pointer under the air pressure, and under the matching of the graduated scale, the operation of the first piston rod can be stopped according to the parameter corresponding to the scalar pointer, so that the crystal rod is ensured not to generate extrusion traces on the surface of the crystal rod under the stable clamping state, the surface of the crystal rod is ensured to be intact, and simultaneously, the three groups of air bags operate simultaneously, when the crystal rod is fixed, the axis of the crystal rod is the same as the axis of the rotating shaft of the polishing motor, so that the end face of the crystal rod can be polished more uniformly;

open through setting up the fixed point and stop the structure, terminal surface parallel position after setting up the terminal surface of contact plate and polishing, when the polishing, cylinder and polishing motor synchronous operation, can realize polishing the crystal bar terminal surface, after reacing the polishing and setting up the position, the touch bar promotes the contact plate, the fly leaf produces the displacement, the fly leaf slides along the gag lever post, first electrically conductive plectrum and the separation of the electrically conductive plectrum of second, polishing motor stops the polishing operation, two electrode ball contacts simultaneously, can realize alarm calling organ circular telegram, warning operating personnel that can be timely, guarantee that the polished surface degree of depth is more accurate, reduce the fault operation simultaneously, guarantee the effect of polishing operation.

Drawings

FIG. 1 is a perspective view of the entire polishing apparatus for semiconductor crystal production according to the present invention;

FIG. 2 is a view showing the structure of the area A in FIG. 1 in the entirety of the polishing apparatus for semiconductor crystal production in the present invention;

FIG. 3 is a front view of the entire polishing apparatus for semiconductor crystal production according to the present invention;

FIG. 4 is a view showing a structure of a positioning jig in the polishing apparatus for semiconductor crystal production according to the present invention;

FIG. 5 is a view showing the structure of the region B in FIG. 3 in the polishing apparatus for semiconductor crystal production according to the present invention;

illustration of the drawings:

1. a support; 2. positioning and clamping the structure; 3. a fixed point start-stop structure; 4. a fixed mount; 5. a cylinder; 6. polishing the motor; 7. a slider; 8. a guide rail; 21. fixing the disc; 22. a limiting cylinder; 23. a telescopic air pipe; 24. a connecting pipe; 25. an air bag; 26. an air intake cylinder; 27. a first piston rod; 28. a communicating pipe; 29. a scalar cylinder; 210. a scalar pointer; 211. a graduated scale; 212. a second piston rod; 213. an expansion spring; 31. a slide rail; 32. a limiting rod; 33. a contact plate; 34. a movable plate; 35. a return spring; 36. positioning pins; 37. sliding and buckling; 38. a siren; 39. a first mounting plate; 310. an electrode ball; 311. a first conductive paddle; 312. a second conductive paddle; 313. a second mounting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Specific examples are given below.

Referring to fig. 1 to 5, a polishing apparatus for semiconductor crystal production comprises a support 1, a positioning and clamping structure 2, a fixed point start-stop structure 3, a fixed frame 4, a cylinder 5, a polishing motor 6, a slider 7 and a guide rail 8; location clamping structure 2 is installed to the top side one end of support 1, the avris of support 1 is installed the fixed point and is opened and stop structure 3, the mount 4 welds the top side other end of dress at support 1, the side of mount 4 is fixed with cylinder 5, guide rail 8 is fixed in the top side of

support

1, 7 cooperation spiral-lock of slider are on

guide rail

8, 6 cooperations of polishing motor are installed on slider 7, the pneumatic stem of cylinder 5 passes through welded connection with polishing motor 6.

As an embodiment of the present invention, the positioning and clamping structure 2 includes a fixed plate 21, a position-limiting cylinder 22, a telescopic air tube 23, a connecting tube 24, an air bag 25, an air inlet cylinder 26, a first piston rod 27, a communicating tube 28, a scalar air cylinder 29, a scalar pointer 210, a scale 211, a second piston rod 212 and an expansion spring 213, three position-limiting cylinders 22 are fixed to one side of the fixed plate 21 in a circular array, the telescopic air tube 23 is mounted to the position-limiting cylinder 22 in a sticking manner, the connecting tube 24 is connected to one end of the telescopic air tube 23 in a matching manner, the air bag 25 is fixed to the other end of the connecting tube 24, the air inlet cylinder 26 is welded to the top side of the circumferential surface of the fixed plate 21, the first piston rod 27 is mounted in the air inlet cylinder 26, the communicating tube 28 is connected to and fixed to the bottom end of the air inlet cylinder 26, the communicating tubes 28 are respectively, the second piston rod 212 is arranged in the cylinder wall at one end of the scalar cylinder 29 in a penetrating manner, a scalar pointer 210 is fixed at one end of the second piston rod 212, an expansion spring 213 is sleeved outside the other end of the second piston rod 212, and a graduated scale 211 is welded on the cylinder wall at one end of the scalar cylinder 29.

As an embodiment of the present invention, the bottom of the scalar cylinder 29 is communicated with a communicating pipe 28, the scale 211 is arranged in parallel with the second piston rod 212, a one-way valve is installed at the connecting position of the communicating pipe 28 and the air inlet cylinder 26, a pressure relief valve is installed in the middle of the communicating pipe 28, an air inlet pipe is installed at the other side of the bottom of the air inlet cylinder 26, a one-way valve is installed on the air inlet pipe, the fixed disk 21 is welded on the top side of the bracket 1, the central axis of the fixed disk 21 and the central axis of the rotating shaft of the polishing motor 6 are on the same straight line, during operation, the three telescopic air pipes 23 synchronously expand to push the connecting pipe 24 to slide along the inner wall of the limiting cylinder 22, clamping of the crystal rod is realized under the cooperation of the air bag 25, during pressurization, the inside of the scalar cylinder 29 is synchronously pressurized, the second piston rod 212 pushes, the operation of the first piston rod 27 can be stopped according to the parameter corresponding to the scalar pointer 210, so that the crystal bar is guaranteed not to produce extrusion traces on the surface of the crystal bar in a stable clamping state, the surface of the crystal bar is guaranteed to be intact, and meanwhile, the three groups of air bags 25 operate simultaneously, so that when the crystal bar is fixed, the axis of the crystal bar is the same as the axis of a rotating shaft of the polishing motor 6, and the end face of the crystal bar can be polished more uniformly.

As an embodiment of the present invention, the fixed point start/stop structure 3 includes a slide rail 31, a limit rod 32, a contact plate 33, a movable plate 34, a return spring 35, a positioning pin 36, a slide fastener 37, a warning buzzer 38, a first mounting plate 39, an electrode ball 310, a first conductive shifting piece 311, a second conductive shifting piece 312, and a second mounting plate 313, the slide rail 31 is fittingly fastened with the slide fastener 37, the slide fastener 37 is provided with the limit rod 32, the movable plate 34 is provided with a rod hole, the limit rod 32 is inserted into the rod hole, the return spring 35 is sleeved outside one end of the limit rod 32, the contact plate 33 and the first conductive shifting piece 311 are respectively mounted at the upper and lower ends of one side of the movable plate 34, the second mounting plate 313 is welded at one end of the bottom side of the slide fastener 37, the second conductive shifting piece 312 is fixed at one side of the second mounting plate 313, the first mounting plate 39 is welded at the bottom side of the slide fastener 37, all install electrode ball 310 on the opposite face of first mounting panel 39 and fly leaf 34, warning calling organ 38 is installed on the another side of first mounting panel 39, wear to be equipped with locating pin 36 through screw-thread fit on the thread slipping 37, the terminal surface of locating pin 36 is tangent with the surface of slide rail 31, in operation, through sliding the thread slipping 37 along slide rail 31, with the terminal surface parallel position after the terminal surface setting of contact plate 33 and polishing, during the polishing, cylinder 5 and polishing motor 6 synchronous operation can realize polishing the crystal bar terminal surface, after arriving the polishing and setting up the location, the touch bar promotes contact plate 33, fly leaf 34 produces the displacement, fly leaf 34 slides along gag lever post 32, first electrically conductive plectrum 311 and the separation of second electrically conductive plectrum 312, polishing motor 6 stops the polishing operation, guarantee that the polished surface degree of depth is more accurate, reduce the error operation simultaneously.

As an embodiment of the present invention, the first conductive dial piece 311, the second conductive dial piece 312, the polishing motor 6 and the power source are connected to a series circuit through wires, the two electrode balls 310, the warning buzzer 38 and the storage battery are connected to the series circuit through wires, the slide fastener 37 is provided with a scalar line, the side surface of the bracket 1 is provided with a scale line, one side of the slider 7 is provided with a touch rod, the touch rod is arranged in parallel with the contact plate 33, the contact plate 33 is thicker than the first conductive dial piece 311 by 1mm, when the polishing set position is reached, the touch rod pushes the contact plate 33, the movable plate 34 is displaced, the movable plate 34 slides along the limiting rod 32, the first conductive dial piece 311 is separated from the second conductive dial piece 312, the polishing motor 6 stops polishing operation, the two electrode balls 310 are simultaneously contacted, the warning buzzer 38 can be powered on, and an operator can be warned in time, guarantee that the polishing surface degree of depth is more accurate, reduce the error operation simultaneously, guarantee the effect of polishing operation.

The working principle is as follows: when polishing is carried out, a crystal rod is placed among the three air bags 25, then the first piston rod 27 is pulled, air is admitted through the air inlet pipe, air is admitted to the telescopic air pipe 23 through the communicating pipe 28, the three telescopic air pipes 23 synchronously expand, the connecting pipe 24 is pushed to slide along the inner wall of the limiting cylinder 22, clamping of the crystal rod is realized under the matching of the air bags 25, when pressurization is carried out, the inside of the scalar cylinder 29 is synchronously pressurized, the second piston rod 212 pushes the scalar pointer 210 under air pressure, under the matching of the graduated scale 211, the operation of the first piston rod 27 can be stopped according to the corresponding parameter of the scalar pointer 210, the crystal rod is ensured to be free from extrusion marks on the surface of the crystal rod under the stable clamping state, the surface of the crystal rod is ensured to be intact, simultaneously three groups of air bags 25 operate simultaneously, and when the crystal rod is fixed, the axis of the crystal rod is the same as the, the end face of the crystal rod can be polished more uniformly;

when the crystal bar is polished, the slide fastener 37 slides along the slide rail 31, the end face of the contact plate 33 is arranged at a position parallel to the polished end face, when the crystal bar is polished, the air cylinder 5 and the polishing motor 6 synchronously operate to polish the end face of the crystal bar, when the polished end face reaches a polishing set position, the touch rod pushes the contact plate 33, the movable plate 34 generates displacement, the movable plate 34 slides along the limiting rod 32, the first conductive shifting piece 311 is separated from the second conductive shifting piece 312, the polishing motor 6 stops polishing operation, meanwhile, the two electrode balls 310 are in contact, the alarm 38 can be powered on, operators can be warned timely, the depth of a polished surface is guaranteed to be more accurate, error operation is reduced, and the effect of polishing operation is guaranteed.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. A polishing device for semiconductor crystal production is characterized by comprising a bracket (1), a positioning and clamping structure (2), a fixed point start-stop structure (3), a fixed frame (4), a cylinder (5), a polishing motor (6), a slide block (7) and a guide rail (8); location clamping structure (2) are installed to the top side one end of support (1), the avris of support (1) is installed the fixed point and is opened and stop structure (3), mount (4) are welded the dress and are being put the top side other end in support (1), the side of mount (4) is fixed with cylinder (5), the top side at support (1) is fixed in guide rail (8), slider (7) cooperation spiral-lock is on guide rail (8), polishing motor (6) cooperation is installed on slider (7), the pneumatic rod and the polishing motor (6) of cylinder (5) pass through welded connection.

2. The polishing equipment for semiconductor crystal production according to claim 1, wherein the positioning and clamping structure (2) comprises a fixed disk (21), three limiting cylinders (22) are fixed on one side of the fixed disk (21) in a circular local array, telescopic air pipes (23) are mounted inside the limiting cylinders (22) in a sticking mode, one ends of the telescopic air pipes (23) are connected with connecting pipes (24) in a matching mode, air bags (25) are fixed on the other ends of the connecting pipes (24), air inlet cylinders (26) are welded on the top side of the circumferential surface of the fixed disk (21), first piston rods (27) are mounted in the air inlet cylinders (26), communicating pipes (28) are fixedly connected to the bottom ends of the air inlet cylinders (26), the communicating pipes (28) are respectively communicated with the three telescopic air pipes (23), and scalar air cylinders (29) are welded on the other side of the fixed disk (21), the second piston rod (212) penetrates through the cylinder wall at one end of the scalar cylinder (29), a scalar pointer (210) is fixed at one end of the second piston rod (212), an expansion spring (213) is sleeved outside the other end of the second piston rod (212), and a graduated scale (211) is welded on the cylinder wall at one end of the scalar cylinder (29).

3. The polishing apparatus for semiconductor crystal production according to claim 2, wherein the bottom of the scalar cylinder (29) communicates with a communicating tube (28), and the scale (211) is disposed in parallel with the second piston rod (212).

4. The polishing equipment for semiconductor crystal production according to claim 2, wherein a one-way valve is installed at the connecting position of the communicating pipe (28) and the air inlet cylinder (26), a pressure relief valve is installed in the middle of the communicating pipe (28), an air inlet pipe is installed at the other side of the bottom of the air inlet cylinder (26), and a one-way valve is installed on the air inlet pipe.

5. The polishing apparatus for semiconductor crystal production as set forth in claim 2, wherein said holding pan (21) is welded to the top side of the frame (1), and the central axis of said holding pan (21) is aligned with the central axis of the rotating shaft of the polishing motor (6).

6. The polishing equipment for semiconductor crystal production according to claim 1, wherein the fixed point start-stop structure (3) comprises a slide rail (31), a slide fastener (37) is buckled on the slide rail (31), a limit rod (32) is erected on the slide fastener (37), a rod hole is formed in the movable plate (34), the limit rod (32) is arranged in the rod hole in a penetrating manner, a reset spring (35) is sleeved outside one end of the limit rod (32), a contact plate (33) and a first conductive shifting sheet (311) are respectively arranged at the upper end and the lower end of one side of the movable plate (34), a second mounting plate (313) is welded at one end of the bottom side of the slide fastener (37), a second conductive shifting sheet (312) is fixed at one side of the second mounting plate (313), a first mounting plate (39) is welded at the middle part of the bottom side of the slide fastener (37), electrode balls (310) are arranged on the opposite surfaces of the first mounting plate (39) and the movable plate (34), a warning buzzer (38) is mounted on the other side of the first mounting plate (39).

7. The polishing equipment for semiconductor crystal production according to claim 6, wherein the slide fastener (37) is provided with a positioning pin (36) through thread fit, and the end face of the positioning pin (36) is tangential to the surface of the slide rail (31).

8. The polishing apparatus for semiconductor crystal production as set forth in claim 6, wherein said first conductive pick-up (311), second conductive pick-up (312), polishing motor (6) and power supply are connected in series by a wire, and said two electrode balls (310), alarm buzzer (38) and reservoir battery are connected in series by a wire.

9. The polishing apparatus for semiconductor crystal production according to claim 6, wherein scalar lines are provided on the slider (37) and scale lines are provided on the side of the carrier (1).

10. The polishing apparatus for semiconductor crystal production according to claim 6, wherein a touch lever is mounted to one side of the slider (7), the touch lever being disposed in parallel with a contact plate (33), the contact plate (33) being thicker than the first conductive paddle (311) by 1 mm.