CN112423477A - High-precision stepped press connection hole machining method - Google Patents

High-precision stepped press connection hole machining method Download PDF

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Publication number
CN112423477A
CN112423477A CN202011173904.6A CN202011173904A CN112423477A CN 112423477 A CN112423477 A CN 112423477A CN 202011173904 A CN202011173904 A CN 202011173904A CN 112423477 A CN112423477 A CN 112423477A
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China
Prior art keywords
hole
drilling
pin
positioning
precision
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CN202011173904.6A
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CN112423477B (en
Inventor
范红
黄勇
李亚军
李军
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Aoshikang Technology Co Ltd
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Aoshikang Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/30—Nuclear fission reactors

Abstract

The invention discloses a high-precision stepped press connection hole machining method which comprises the following steps: firstly, punching a positioning hole; step two, measuring the expansion and contraction for the first time; thirdly, positioning the first pin; fourthly, mechanically drilling a through hole; fifthly, performing depth control drilling to obtain a depth control drilling hole, wherein the depth of the depth control drilling hole is the depth of the target conduction layer, and the depth control drilling hole is the inner diameter of the target through hole; step six, copper deposition; step seven, electroplating; step eight, forming electroplated PIN holes after electroplating the positioning holes, and testing the sizes of the electroplated PIN holes; ninth, positioning is carried out through a second PIN nail matched with the electroplated PIN hole and the electroplated PIN hole; and step ten, performing back drilling to obtain a back drilling hole. The invention reduces the influence of the deviation of the positioning point position and improves the accuracy of the back drilling hole position; the cutter diameter of the back drilling hole relative to the depth control drilling hole is only increased by 0.025 mm-0.1 mm, so that space waste caused by the larger diameter of the conventional back drilling hole is avoided; the allowable deviation precision of the finished hole position is smaller than the thickness of the hole copper, and the through hole is ensured to be a through hole.

Description

High-precision stepped press connection hole machining method
The technical field is as follows:
the invention belongs to the field of PCB (printed circuit board) manufacturing, and particularly relates to a high-precision stepped press connection hole machining method.
Background art:
with the development of 5G high-speed products, PCBs are moving toward high density and high integration, and particularly, the demand for high layer count, high wiring density and low stub (stub) is increasing. The company provides a method for improving the wiring density, which comprises the steps of back drilling by steps, depth control drilling by small holes, and back drilling diameter which is as large as or slightly larger than the depth control drilling diameter; compared with the conventional back drilling hole, the back drilling hole has larger diameter than the through hole, thereby causing the waste of space.
For example, a through hole of 0.4mm is taken as an example, a drill of 0.4mm is conventionally used, and a layer of copper is plated on the hole wall through copper deposition and electroplating; to control stub, it is generally necessary to back-drill from the back using a drill bit (0.6mm) 0.2mm larger than the through hole to ensure that the excess hole copper wall is drilled away. And a form of a step hole and a back drill is adopted; firstly, drilling a through hole of 0.2mm, then, controlling depth drilling by a drill bit of 0.4mm, drilling through a target conduction layer, and then, copper deposition and electroplating; carrying out back drilling after electroplating, wherein a drill bit (0.4mm) which is 0.2mm larger than the small hole is only needed; this can greatly reduce the back-drilled hole diameter and route the wiring closer to the hole.
However, when the step-hole cloth is processed, the drilling precision is influenced, the alignment of the inner drilling machine is calculated according to six sigma (+/-3 sigma), and the hole position precision is +/-0.075 mm. Therefore, the depth control hole and the back drilling hole are 0.075-0.125mm larger than the single side of the through hole. Although the diameter of the back drilling tool is larger than that of the through hole, the copper in the small hole can be completely removed, when the back drilling tool is larger than the deep hole, the following defects exist, when the back drilling tool deviates relative to the deep hole, according to the conventional back drilling stub control, a customer requires that the stub is less than 0.254mm in length, and the common board edge test coupon controls the stub to be about 0.127mm in median value; according to conventional control, when the plate edge back drill and the depth control drill have deviation at a certain position of a pattern, reliability risks such as open circuit of a welding ring and the like may occur.
To circumvent this risk of step back drilling, more precise depth control is required. The conventional back drilling cutter can cover the influence of hole position deviation of a drilling hole, the influenced factors mainly include plate thickness range, and the risk of not opening a circuit can be ensured when the stub is confirmed to be larger than the plate thickness range in a test coupoun slice; however, for step back drilling, in addition to the extreme difference in plate thickness, there is also the risk of hole deviation causing local open circuits.
The invention content is as follows:
the invention aims to provide a high-precision stepped press connection hole processing method, which reduces the influence of the deviation of the positioning point and improves the accuracy of the back drilling hole; the diameter of the back drilling hole relative to the depth control drilling hole is only increased by 0.025 mm-0.1 mm, so that space waste caused by the larger diameter of the conventional back drilling hole is avoided; the allowable deviation precision of the finished hole position is smaller than the thickness of the hole copper, and the through hole is ensured to be a through hole.
In order to solve the problems, the technical scheme of the invention is as follows:
a high-precision stepped crimping hole machining method comprises the following steps:
firstly, punching a positioning hole;
step two, measuring the expansion and contraction for the first time;
thirdly, positioning a first pin matched with the positioning hole on the positioning hole;
fourthly, mechanically drilling a through hole, wherein the inner diameter of the through hole is smaller than that of the target through hole;
fifthly, performing depth control drilling to obtain a depth control drilling hole, wherein the depth of the depth control drilling hole is the depth of the target conduction layer, and the depth control drilling hole is the inner diameter of the target through hole;
step six, copper deposition;
step seven, electroplating;
step eight, forming electroplated PIN holes after electroplating the positioning holes, and testing the sizes of the electroplated PIN holes;
ninth, positioning is carried out through a second PIN nail matched with the electroplated PIN hole and the electroplated PIN hole;
step ten, carrying out back drilling to obtain a back drilling hole, wherein the inner diameter R of the back drilling hole1Satisfies the following conditions: r1≥R+2(σ1-b); wherein R is the inner diameter of the depth-control drilled hole, sigma1Drilling precision deviation for back drilling; b ═ d1-d2) 2; d1 is the diameter of the first pin and d2 is the diameter of the second pin; and controls sigma2＝(R1-R)/2-σ1<b，σ2Representing the deviation of the back borehole wall from the depth-controlled borehole wall.
In a further improvement, in the step one, the positioning holes are obtained by Xray punching.
In a further improvement, in said step ten, R1＝R+2(σ1-b)。
In a further refinement, in said step ten, σ1<75μm。
In the tenth step, the value range of b is controlled to be 20-25 μm.
In a further improvement, in the step ten, R > R +150 μm is controlled, wherein R is the inner diameter of the through hole.
The invention has the advantages that:
1. after electroplating, electroplating a layer of copper in the positioning hole to reduce the aperture; calculating the theoretical hole copper thickness according to a theory, testing the aperture of the positioning hole by combining a needle gauge, and using the size of a pin corresponding to the maximum passable needle gauge; after the mirror image is carried out in the location of the locating hole, the influence of the deviation of the locating point is reduced, and the location precision of the back drilling hole is improved.
2. The diameter of the back drilling hole is only increased by 0.025 mm-0.1 mm relative to the diameter of the depth control drilling hole, so that space waste caused by the large diameter of the conventional back drilling hole is avoided.
3. The allowable deviation precision of the finished hole position is smaller than the thickness of the hole copper, and the through hole is ensured to be a through hole.
Description of the drawings:
FIG. 1 is a schematic structural view of a positioning hole;
FIG. 2 is a schematic structural view of a through hole, a depth control drilled hole and a back drilled hole;
FIG. 3 is a schematic view of a deviation of a borehole.
Wherein, locating hole 1, through-hole 2, accuse deep drilling 3, back drill 4.
The specific implementation mode is as follows:
the drilling process of the invention is as follows:
xray punching, measuring expansion and contraction, positioning an upper PIN nail, mechanically drilling a through hole, controlling depth drilling, depositing copper, electroplating, testing the size of an electroplated PIN hole, testing a high-precision PIN nail and back drilling.
The control is as follows: the thickness of the plate is set to be H, the diameter of the depth control drill bit is set to be R, and the back drill bit is set to be R1(ii) a The diameter of the small hole is r; back drillingDeviation of accuracy of sigma1The deviation between the back borehole wall and the depth-controlled borehole wall (containing no copper) is σ2(ii) a The thickness of the copper in the electroplating hole is b. The diameter of the first pin is d1(ii) a The diameter of the second pin is d2。
The main control requirements are as follows:
(1)d2＝d1the thickness of the (2 b, b) is generally 20 to 25 μm.
(2) The diameter relation is R > R +150 μm;
(3)σ2＝(R1-R)/2-σ1<b。
(4) precision sigma of general drilling machine1<75 μm, sigma can be achieved by using holes of the same pin nail1<25 μm, so there is R1≥R+2(σ1B) the alignment precision of the crimping holes can be met.
The step press connection hole can not deform and break when the component is inserted.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (6)

1. A high-precision stepped crimping hole machining method is characterized by comprising the following steps:
firstly, punching a positioning hole (1);
step two, measuring the expansion and contraction for the first time;
thirdly, positioning a first pin matched with the positioning hole (1) on the positioning hole (1);
fourthly, mechanically drilling a through hole (2), wherein the inner diameter of the through hole (2) is smaller than that of the target through hole;
fifthly, performing depth control drilling to obtain a depth control drilling hole (3), wherein the depth of the depth control drilling hole (3) is the depth of the target conduction layer, and the depth control drilling hole (3) is the inner diameter of the target through hole;
step six, copper deposition;
step seven, electroplating;
step eight, forming electroplated PIN holes after the positioning holes (1) are electroplated, and testing the sizes of the electroplated PIN holes;
ninth, positioning is carried out through a second PIN nail matched with the electroplated PIN hole and the electroplated PIN hole;
step ten, carrying out back drilling to obtain a back drilling hole (4), wherein the inner diameter R of the back drilling hole (4)1Satisfies the following conditions: r1≥R+2(σ1-b); wherein R is the inner diameter of the depth control drilling hole (3), sigma1Drilling precision deviation for back drilling; b ═ d1-d2)/2；d1Diameter of the first pin, d2Is the diameter of the second pin; and controls sigma2＝(R1-R)/2-σ1<b，σ2Representing the deviation of the back borehole wall from the depth-controlled borehole wall.
2. The high-precision step crimp hole processing method according to claim 1, wherein in the first step, the positioning hole (1) is obtained by Xray punching.
3. The method for forming a stepped press fit hole with high precision as set forth in claim 1, wherein R is the number of steps1＝R+2(σ1-b)。
4. The high-precision step crimp hole processing method according to claim 1, wherein σ in the tenth step is1<75μm。
5. The method for processing the high-precision stepped crimping hole according to claim 1, wherein in the tenth step, the value of b is controlled to be in a range of 20 to 25 μm.
6. The high-precision step press-fit hole processing method according to claim 1, wherein in the tenth step, R > R +150 μm, where R is an inner diameter of the through-hole (2), is controlled.
CN202011173904.6A 2020-10-28 2020-10-28 High-precision stepped press connection hole machining method Active CN112423477B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113133226A (en) * 2021-04-20 2021-07-16 梅州市志浩电子科技有限公司 Circuit board high-precision back drilling method and circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103002674A (en) * 2012-09-03 2013-03-27 杭州华三通信技术有限公司 PCB (printed circuit board) back drilling method and PCB through hole structure
JP2013128114A (en) * 2011-12-16 2013-06-27 Samsung Electro-Mechanics Co Ltd Method of manufacturing printed circuit board
US20150208514A1 (en) * 2014-01-22 2015-07-23 Sanmina Corporation Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
US20160150653A1 (en) * 2013-08-02 2016-05-26 Peking University Founder Group Co., Ltd. Manufacturing method for back drilling hole in pcb and pcb
CN105636357A (en) * 2016-03-18 2016-06-01 奥士康科技股份有限公司 Method for controlling hole position accuracy of back drill hole

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013128114A (en) * 2011-12-16 2013-06-27 Samsung Electro-Mechanics Co Ltd Method of manufacturing printed circuit board
CN103002674A (en) * 2012-09-03 2013-03-27 杭州华三通信技术有限公司 PCB (printed circuit board) back drilling method and PCB through hole structure
US20160150653A1 (en) * 2013-08-02 2016-05-26 Peking University Founder Group Co., Ltd. Manufacturing method for back drilling hole in pcb and pcb
US20150208514A1 (en) * 2014-01-22 2015-07-23 Sanmina Corporation Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
CN105636357A (en) * 2016-03-18 2016-06-01 奥士康科技股份有限公司 Method for controlling hole position accuracy of back drill hole

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113133226A (en) * 2021-04-20 2021-07-16 梅州市志浩电子科技有限公司 Circuit board high-precision back drilling method and circuit board
CN113133226B (en) * 2021-04-20 2022-03-04 梅州市志浩电子科技有限公司 Circuit board high-precision back drilling method and circuit board

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