CN112397628B - 一种高效的led自动封装装置 - Google Patents
一种高效的led自动封装装置 Download PDFInfo
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- CN112397628B CN112397628B CN202110029985.0A CN202110029985A CN112397628B CN 112397628 B CN112397628 B CN 112397628B CN 202110029985 A CN202110029985 A CN 202110029985A CN 112397628 B CN112397628 B CN 112397628B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 53
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 8
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- 238000009434 installation Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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CN202110029985.0A CN112397628B (zh) | 2021-01-11 | 2021-01-11 | 一种高效的led自动封装装置 |
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CN202110029985.0A CN112397628B (zh) | 2021-01-11 | 2021-01-11 | 一种高效的led自动封装装置 |
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CN112397628A CN112397628A (zh) | 2021-02-23 |
CN112397628B true CN112397628B (zh) | 2021-11-09 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5976619A (en) * | 1995-01-19 | 1999-11-02 | Sewer Coating Systems Verbundmaterialienentwicklungs-Und Vertriebsgesellschaft M.B.H. | Process and device for production coatings |
JP2012099292A (ja) * | 2010-10-31 | 2012-05-24 | Mitsubishi Electric Corp | 照明器具 |
CN104009134A (zh) * | 2014-05-29 | 2014-08-27 | 华南理工大学 | 一种led基板和透镜键合、热压和注胶一体化设备 |
CN108183161A (zh) * | 2017-12-27 | 2018-06-19 | 杭州大晨显示技术有限公司 | 一种led的封装工艺及其系统 |
CN108461422A (zh) * | 2018-02-07 | 2018-08-28 | 宜昌市汇宜兴新能源科技有限公司 | 一种集成芯片封装设备 |
CN108580186A (zh) * | 2018-05-18 | 2018-09-28 | 浦江县杰浩进出口有限公司 | 一种智能led点胶封装装置 |
CN112082135A (zh) * | 2020-09-29 | 2020-12-15 | 天津昂熙灯具有限公司 | 一种led灯封装干燥装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9240538B2 (en) * | 2012-11-12 | 2016-01-19 | Andrey Zykin | LED spirit system and manufacturing method |
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- 2021-01-11 CN CN202110029985.0A patent/CN112397628B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5976619A (en) * | 1995-01-19 | 1999-11-02 | Sewer Coating Systems Verbundmaterialienentwicklungs-Und Vertriebsgesellschaft M.B.H. | Process and device for production coatings |
JP2012099292A (ja) * | 2010-10-31 | 2012-05-24 | Mitsubishi Electric Corp | 照明器具 |
CN104009134A (zh) * | 2014-05-29 | 2014-08-27 | 华南理工大学 | 一种led基板和透镜键合、热压和注胶一体化设备 |
CN108183161A (zh) * | 2017-12-27 | 2018-06-19 | 杭州大晨显示技术有限公司 | 一种led的封装工艺及其系统 |
CN108461422A (zh) * | 2018-02-07 | 2018-08-28 | 宜昌市汇宜兴新能源科技有限公司 | 一种集成芯片封装设备 |
CN108580186A (zh) * | 2018-05-18 | 2018-09-28 | 浦江县杰浩进出口有限公司 | 一种智能led点胶封装装置 |
CN112082135A (zh) * | 2020-09-29 | 2020-12-15 | 天津昂熙灯具有限公司 | 一种led灯封装干燥装置 |
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Effective date of registration: 20211015 Address after: 224700 floors 3-4, building 3, zone a, Jingliu road smart Industrial Park, high tech Zone, Jianhu County, Yancheng City, Jiangsu Province Applicant after: Jiangsu Mingna Semiconductor Technology Co.,Ltd. Address before: 211199 room 21, building 168, 168 Xianlin Avenue, Qixia District, Nanjing City, Jiangsu Province Applicant before: Nanjing linyuansen Digital Technology Co.,Ltd. |
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Effective date of registration: 20231007 Address after: 224300 East of Fujian Circuit and South of North 3rd Ring Road, Sheyang Economic Development Zone, Yancheng, Jiangsu Province Patentee after: Jiangsu Wenyang Semiconductor Technology Co.,Ltd. Address before: 224700 floors 3-4, building 3, zone a, Jingliu road smart Industrial Park, high tech Zone, Jianhu County, Yancheng City, Jiangsu Province Patentee before: Jiangsu Mingna Semiconductor Technology Co.,Ltd. |
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