CN112378716A - Sample preparation method for solderability test of CBGA device - Google Patents
Sample preparation method for solderability test of CBGA device Download PDFInfo
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- CN112378716A CN112378716A CN202011059961.1A CN202011059961A CN112378716A CN 112378716 A CN112378716 A CN 112378716A CN 202011059961 A CN202011059961 A CN 202011059961A CN 112378716 A CN112378716 A CN 112378716A
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- SEEZIOZEUUMJME-FOWTUZBSSA-N cannabigerolic acid Chemical compound CCCCCC1=CC(O)=C(C\C=C(/C)CCC=C(C)C)C(O)=C1C(O)=O SEEZIOZEUUMJME-FOWTUZBSSA-N 0.000 title claims abstract description 154
- SEEZIOZEUUMJME-UHFFFAOYSA-N cannabinerolic acid Natural products CCCCCC1=CC(O)=C(CC=C(C)CCC=C(C)C)C(O)=C1C(O)=O SEEZIOZEUUMJME-UHFFFAOYSA-N 0.000 title claims abstract description 154
- 238000005464 sample preparation method Methods 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 290
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 42
- 238000007639 printing Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 9
- 238000007598 dipping method Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000007790 scraping Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 239000006071 cream Substances 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/44—Sample treatment involving radiation, e.g. heat
Abstract
The invention provides a sample preparation method for a solderability test of a CBGA device, which belongs to the technical field of surface mounting and comprises the following steps: uniformly applying solder paste on the top of each solder ball of the CBGA device; heating the solder ball of the CBGA device applied with the solder paste upwards until the solder paste is melted; and (4) carrying out gas-phase cleaning on the CBGA device after the molten solder paste is kept stand and cooled, and obtaining a test sample. The sample preparation method for the solderability test of the CBGA device, provided by the invention, has the advantages that the operation is simple, the solder paste application efficiency is high, the uniformity of the solder paste applied on each solder ball of the CBGA device is good, and the solderability of the CBGA device can be conveniently and accurately judged according to the obtained test sample.
Description
Technical Field
The invention belongs to the technical field of surface mounting, and particularly relates to a sample preparation method for a solderability test of a CBGA device.
Background
In the SMT (Surface Mount Technology) process, an assembly method of tin soldering is generally used, and the quality of soldering directly affects the reliability of the product. With the development of BGA (Ball Grid Array) products in the fields of aviation and aerospace, the requirements for product performance and reliability are higher and higher, and in the national and industrial execution standards, the requirements for the solderability inspection standard of microelectronic devices before soldering are provided, and the solderability is determined by visually observing the wetting and diffusion state of solder on the soldering surface.
For a Ball Grid Array (CBGA) device packaged by a Ball Grid Array (CBGA), each solder Ball on the back of the CBGA device needs to be used as a connection terminal for welding, so the solderability of the CBGA device depends on the wetting diffusion state of the solder on the surface of the solder Ball, and because the surface of the solder Ball is of a non-planar structure, and the number of the solder balls is large (the CBGA device usually has hundreds to thousands of solder balls with different intervals), the sample preparation difficulty for the solderability test of the CBGA device is very large, and because no reliable sample preparation method can ensure the uniformity of the solder on each solder Ball of the CBGA device at present, the problem of high error rate of the solderability judgment of the CBGA device is caused.
Disclosure of Invention
The invention aims to provide a sample preparation method for a solderability test of a CBGA device, and aims to solve the problems that in the prior art, the sample preparation difficulty of the solderability test of the CBGA device is high, and the solderability judgment accuracy is low.
In order to achieve the purpose, the invention adopts the technical scheme that: the sample preparation method for the solderability test of the CBGA device comprises the following steps:
uniformly applying solder paste on the top of each solder ball of the CBGA device;
heating the solder ball of the CBGA device applied with the solder paste upwards until the solder paste is melted;
and (4) carrying out gas-phase cleaning on the CBGA device after the molten solder paste is kept stand and cooled, and obtaining a test sample.
As another embodiment of the present application, the uniformly applying the solder paste on top of each solder ball of the CBGA device comprises:
fixing the CBGA device on a fixture, wherein the solder ball of the CBGA device faces upwards;
and uniformly applying the solder paste on the top of each solder ball of the CBGA device by adopting a solder paste applying device.
As another embodiment of the present application, a solder paste applying apparatus includes a stencil and a squeegee; the method for uniformly applying the solder paste on the top of each solder ball of the CBGA device by adopting the solder paste applying device comprises the following steps:
laying a leakage net above the solder balls of the CBGA device, and respectively enabling each mesh of the leakage net to vertically correspond to each solder ball of the CBGA device;
scraping and coating solder paste on the screen by using a scraper, so that the solder paste is applied to the top of each solder ball through each mesh;
and taking down the drain mesh to obtain the CBGA device with the tin paste printed on the top of each tin ball.
As another embodiment of the present application, the solder paste applying device is a paste dispenser or a solder paste printer; the method for uniformly applying the solder paste on the top of each solder ball of the CBGA device by adopting the solder paste applying device comprises the following steps:
and aligning a needle head of the paste dispenser or a spray head of the solder paste spray printing machine to the top of each solder ball in sequence, and dispensing solder paste on the top of each solder ball in an equal amount.
As another embodiment of the present application, the uniformly applying the solder paste on top of each solder ball of the CBGA device comprises:
printing solder paste on the solder paste carrier plate, wherein the printing area is larger than the solder ball area of the CBGA device;
dipping the solder balls of the CBGA device downwards to obtain solder paste on the solder paste carrier plate;
and turning over the CBGA device dipped with the solder paste to make the solder balls face upwards to obtain the CBGA device with the solder paste applied to the top of each solder ball.
As another embodiment of the present application, dipping the solder ball of the CBGA device downward into the solder paste on the solder paste carrier includes:
absorbing the front side of the CBGA device by using a vacuum suction head, and driving the CBGA device to move to the position right above the solder paste carrier plate in a state that the solder balls face downwards;
moving the vacuum suction head adsorbing the CBGA device downwards to enable each solder ball on the back of the CBGA device to be in contact with the solder paste on the solder paste carrier plate to dip the solder paste;
and moving the vacuum suction head upwards to drive the CBGA device dipped with the solder paste to be separated from the solder paste on the solder paste carrier plate, and taking down the CBGA device from the vacuum suction head.
As another embodiment of the present application, heating the solder ball of the CBGA device to which the solder paste is applied to be up until the solder paste is melted includes:
the solder balls of the CBGA device applied with the solder paste are upwards placed on a heating table or a vacuum heating furnace for heating.
As another embodiment of the present application, the heating temperature of heating the CBGA device with the solder paste applied thereon by placing the device with the solder ball facing upward in a heating table or a vacuum heating furnace is 205-215 ℃.
As another embodiment of the present application, the time for standing and cooling is 50 to 70 seconds.
As another embodiment of the present application, each solder ball on the CBGA device is a Pb90Sn10 solder ball, and the solder paste is Sn63Pb37 solder.
The sample preparation method for the weldability test of the CBGA device provided by the invention has the beneficial effects that: compared with the prior art, the sample preparation method for the solderability test of the CBGA device comprises the steps of uniformly applying the solder paste on the top of each solder ball of the CBGA device, placing the solder ball of the CBGA device upwards for heating, wetting and diffusing the melted solder paste on the top spherical surface of the solder ball, cooling the melted solder paste, and cleaning the CBGA device through gas phase, so that the solder paste residue or dirt on the surface of each solder ball is removed, and finally a test sample is obtained.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a first flowchart of a sample preparation method for a solderability test of a CBGA device according to an embodiment of the present invention;
FIG. 2 is a block diagram of a sample preparation method for a solderability test of a CBGA device according to an embodiment of the present invention;
fig. 3 is a block diagram of a flow chart of a sample preparation method for a solderability test of a CBGA device according to an embodiment of the present invention;
fig. 4 is a block diagram of a flow chart of a sample preparation method for a solderability test of a CBGA device according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a CBGA device used in the embodiments of the present invention before solder paste is applied;
FIG. 6 is a first schematic diagram of a CBGA device used in the embodiments of the present invention during the solder paste application process;
FIG. 7 is a second schematic view of a CBGA device used in the embodiments of the present invention in the process of applying solder paste;
FIG. 8 is a third schematic view of a CBGA device used in the embodiments of the present invention in the process of applying solder paste;
FIG. 9 is a schematic diagram of a CBGA device used in the embodiments of the present invention after solder paste is applied;
fig. 10 is a schematic structural diagram of a solderability test sample of a CBGA device obtained in accordance with an embodiment of the present invention.
In the figure: 1. a CBGA device; 10. tin paste; 2. a fixture tool; 3. a leakage net; 30. mesh openings; 4. a scraper; 5. a paste dispenser; 6. a solder paste carrier plate; 7. a vacuum chuck.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, 5 to 10, a sample preparation method for the solderability test of the CBGA device according to the present invention will now be described. The sample preparation method for the solderability test of the CBGA device comprises the following steps:
step S1, uniformly applying solder paste 10 on the top of each solder ball of the CBGA device 1;
step S2, heating the solder ball of the CBGA device 1 with the solder paste 10 upwards until the solder paste 10 is melted;
step S3, gas-phase cleaning is performed on the CBGA device 1 after the molten solder paste 10 is left to stand and cool, to obtain a test sample.
The CBGA device 1 is composed of a ceramic tube case and solder balls welded on the back of the ceramic tube case and distributed in an array, wherein the top of the solder ball is the spherical part of the solder ball far away from the ceramic tube case; the uniform application of the solder paste 10 on the top of each solder ball means that the amount of the solder paste 10 applied on the top of each solder ball is consistent, when the solder paste 10 is heated and melted, the solder balls are in a liquid state and automatically diffuse on the top of the solder balls, and since the solder balls are close in size and shape and are in the same environment, the diffusion areas of the melted solder paste 10 tend to be consistent; the vapor phase cleaning is a process method which heats a solvent through equipment, vaporizes the solvent, and utilizes the continuous evaporation and condensation of the solvent vapor on the surface of the solder ball, so that the surface of the solder ball continuously breathes and pollutants are brought out.
Compared with the prior art, the sample preparation method for the solderability test of the CBGA device, provided by the invention, comprises the steps of firstly uniformly applying the solder paste 10 on the top of each solder ball of the CBGA device 1, then placing the solder ball of the CBGA device 1 upwards for heating, wetting and diffusing the solder paste 10 on the top spherical surface of the solder ball after melting, and cleaning the CBGA device 1 through gas phase after cooling the molten solder paste 10, so that the residual or dirt of the solder paste 10 on the surface of each solder ball is removed, and finally a test sample is obtained.
Referring to fig. 2, 6 and 7, as an embodiment of a sample preparation method for a solderability test of a CBGA device according to the present invention, uniformly applying a solder paste 10 on top of each solder ball of the CBGA device 1 includes: s101, fixing the CBGA device 1 on a fixture tool 2, wherein the solder ball of the CBGA device 1 faces upwards; step S102, uniformly applying the solder paste 10 on the top of each solder ball of the CBGA device 1 by adopting a solder paste applying device.
Through the tight fixed CBGA device 1 of anchor clamps frock 2 clamp, ensure that CBGA device 1 is whole to be in the horizontality, thereby guarantee that each tin ball is up, then can make the convenient tin cream applying device align from top to bottom with each tin ball and apply tin cream 10 to tin ball top ration, ensure to apply the volume of applying to the tin cream 10 at each tin ball top unanimously, and can conveniently make CBGA device 1 keep the state that the tin ball is up to heat, ensure that the diffusion uniformity after the tin cream 10 at each tin ball top melts is good, thereby improve the quality of test sample, improve CBGA device 1's solderability and detect the accuracy.
Referring to fig. 2 and 6, as a specific embodiment of the present invention, a solder paste applying apparatus includes a screen 3 and a doctor blade 4; the uniformly applying of the solder paste 10 on the top of each solder ball of the CBGA device 1 by the solder paste applying apparatus includes: laying a leakage net 3 above the solder balls of the CBGA device 1, and respectively enabling each mesh 30 of the leakage net 3 to be in up-down correspondence with each solder ball of the CBGA device 1; scraping the solder paste 10 on the screen 3 by using a scraper 4, so that the solder paste 10 is applied to the top of each solder ball through each mesh 30; the drain net 3 is removed to obtain the CBGA device 1 with the top of each solder ball printed with the solder paste 10.
Utilize the uniformity of each mesh 30 on leaking the net 3, will leak net 3 as the printing template, can ensure to see through that to leak the net 3 and apply the volume of the tin cream 10 at each tin ball top unanimously, thereby improve the printing uniformity of tin cream 10, and adopt and to leak behind the net 3 can be directly will leaking the net 3 top and apply behind the tin cream 10, adopt scraper 4 to scrape the tin cream 10 to the other end from the one end of leaking net 3, thereby make the even top of printing to each tin ball of each mesh 30 that sees through of tin cream 10, the printing process is simple, easy to operate, printing efficiency is high.
Referring to fig. 2 and 7, another embodiment of the present invention is a solder paste applying apparatus, such as a paste dispenser or a solder paste dispenser; the uniformly applying of the solder paste 10 on the top of each solder ball of the CBGA device 1 by the solder paste applying apparatus includes: and (3) aligning a needle head of the paste dispenser 5 or a spray head of a solder paste 10 spray printing machine to the top of each solder ball in sequence, and dispensing the solder paste 10 on the top of each solder ball in an equal amount.
The quantitative point coating is carried out by adopting the paste dropping machine 5 or the solder paste 10 spray printing machine, only the needle head of the paste dropping machine 5 or the spray head of the solder paste 10 spray printing machine are required to be stopped right above each solder ball in sequence, the consistent quantity of the solder paste 10 applied to each solder ball can be ensured by controlling the paste dropping (paste spraying) time or controlling the paste output quantity of a single time, the control of the coating quantity of the solder paste 10 is accurate, the consistency of the application quantity of the solder paste is high compared with the manual operation mode, and the point coating efficiency is high.
Referring to fig. 3 and 8, as another embodiment of the sample preparation method for the solderability test of the CBGA device provided by the present invention, the step of uniformly applying the solder paste 10 on the top of each solder ball of the CBGA device 1 includes: step S1001, printing solder paste 10 on a solder paste carrier plate 6, wherein the printing area is larger than the solder ball area of the CBGA device 1; step S1002, dipping the solder ball of the CBGA device 1 downwards to obtain the solder paste 10 on the solder paste carrier plate 6; step S1003, the CBGA device 1 dipped with the solder paste 10 is turned over with the solder balls facing upward, and the CBGA device 1 with the solder paste 10 applied to the top of each solder ball is obtained.
The mode of dipping the solder balls downwards to obtain the solder paste 10 printed on the solder paste carrier plate 6 only needs to ensure that the surfaces of the CBGA device 1 and the solder paste carrier plate 6 are parallel, and certainly, the thickness of the solder paste 10 printed on the solder paste carrier plate 6 also needs to be uniform, so that the contact degree of each solder ball and the solder paste 10 can be ensured to be consistent, the quantity of the solder paste 10 dipped on each solder ball is ensured to be consistent, the operation is simple, and the efficiency of applying the solder paste 10 is high.
Further, the thickness of printing tin cream 10 on tin cream support plate 6 matches with the tin cream 10 volume that needs the coating on the tin ball, when dipping in and getting tin cream 10, only needs to contradict each tin ball and tin cream support plate 6 simultaneously and dip in and get tin cream 10 and can guarantee to dip in on each tin ball that the tin cream 10 volume of getting is unanimous, and it is more convenient to operate, and efficiency is higher to apply to tin cream 10.
Specifically, referring to fig. 4 and 8, dipping the solder balls of the CBGA device 1 downward into the solder paste 10 on the solder paste carrier 6 includes: step S121, absorbing the front side of the CBGA device 1 by using a vacuum suction head 7, and driving the CBGA device 1 to move to the position right above the solder paste carrier plate 6 in a state that the solder balls are downward; step S122, moving the vacuum suction head 7 adsorbed with the CBGA device 1 downwards to enable each solder ball on the back of the CBGA device 1 to collide with the solder paste 10 on the solder paste carrier plate 6 to dip the solder paste 10; and S123, moving the vacuum suction head 7 upwards to drive the CBGA device 1 dipped with the solder paste 10 to be separated from the solder paste 10 on the solder paste carrier plate 6, and taking down the CBGA device 1 from the vacuum suction head 7.
Referring to fig. 9 and 10, as an embodiment of the present invention, the heating the CBGA device 1 applied with the solder paste 10 with the solder ball facing upward until the solder paste 10 is melted includes: the CBGA device 1 to which the solder paste 10 is applied is placed on a heating stage or in a vacuum heating furnace with the solder balls facing upward and heated. The CBGA device 1 is heated by utilizing a heating table or a vacuum heating furnace, the solder balls face upwards, and the solder paste 10 is positioned at the tops of the solder balls, so that the solder paste 10 can be uniformly diffused on the spherical surfaces of the solder balls under the action of gravity after being melted, the diffusion consistency of the solder paste 10 at the tops of the solder balls is good, the weldability of the CBGA device 1 can be judged according to the diffusion state of the solder paste 10 on the solder balls, and the judgment result accuracy is high.
As a specific implementation manner of the embodiment of the invention, the heating temperature of placing the solder ball of the CBGA device 1 applied with the solder paste 10 upwards in a heating table or a vacuum heating furnace for heating is 205-215 ℃. The heating temperature is controlled to be 205-215 ℃, so that the solder paste 10 can be rapidly melted, and the damage of high temperature to other welding structures or internal circuits of the CBGA device 1 can be avoided.
As a specific implementation manner of the embodiment of the invention, the standing and cooling time is 50-70 s. The diffusion process can be completed 50-70 s after the solder paste 10 is melted, the solder paste is cooled and converted into a solid state, and then the next step of gas phase cleaning can be performed, so that the problem that the welding reliability of the CBGA device 1 is influenced due to the incomplete diffusion of the solder caused by too short cooling time or the poor gas phase cleaning effect caused by too long cooling time is solved.
As a specific implementation manner of the embodiment of the invention, each solder ball on the CBGA device 1 is a Pb90Sn10 solder ball, and the solder paste 10 is Sn63Pb37 solder. The melting point of the Pb90Sn10 solder ball is 275-302 ℃, the Sn63Pb37 solder is the low-temperature solder paste 10, and the melting point is lower than that of the Pb90Sn10 solder ball, so that the solder paste 10 can be ensured to be melted at the temperature lower than the melting point of the solder ball, the problem that the solder ball collapses or deforms at high temperature due to overhigh melting temperature of the solder paste 10 is avoided, and the reliability of the CBGA device 1 is ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A sample preparation method for a solderability test of a CBGA device is characterized by comprising the following steps:
uniformly applying solder paste on the top of each solder ball of the CBGA device;
heating the solder balls of the CBGA device applied with the solder paste upwards until the solder paste is molten;
and carrying out gas-phase cleaning on the CBGA device after the molten solder paste is kept stand and cooled to obtain a test sample.
2. The sample preparation method for the solderability test of the CBGA device of claim 1, wherein the uniformly applying the solder paste on top of each solder ball of the CBGA device comprises:
fixing the CBGA device on a fixture, wherein the solder ball of the CBGA device faces upwards;
and uniformly applying the solder paste on the top of each solder ball of the CBGA device by adopting a solder paste applying device.
3. The sample preparation method for the solderability test of a CBGA device of claim 2, wherein said solder paste applying means comprises a screen and a scraper; the uniformly applying the solder paste on the top of each solder ball of the CBGA device by adopting a solder paste applying device comprises the following steps:
laying a leakage net above the solder balls of the CBGA device, and respectively enabling each mesh of the leakage net to vertically correspond to each solder ball of the CBGA device;
scraping solder paste on the leakage net by using a scraper, so that the solder paste is applied to the top of each solder ball through each mesh;
and taking down the drain net to obtain the CBGA device with the tin paste printed on the top of each tin ball.
4. The sample preparation method for the solderability test of the CBGA device of claim 2, wherein the solder paste applying device is a paste dispensing machine or a solder paste jet printing machine; the uniformly applying the solder paste on the top of each solder ball of the CBGA device by adopting a solder paste applying device comprises the following steps:
and aligning a needle head of the paste dispenser or a spray head of the solder paste spray printing machine to the top of each solder ball in sequence, and dispensing solder paste on the top of each solder ball in an equal amount.
5. The sample preparation method for the solderability test of the CBGA device of claim 1, wherein the uniformly applying the solder paste on top of each solder ball of the CBGA device comprises:
printing solder paste on the solder paste carrier plate, wherein the printing area is larger than the solder ball area of the CBGA device;
dipping the solder balls of the CBGA device downwards to obtain the solder paste on the solder paste carrier plate;
and turning over the CBGA device dipped with the solder paste to enable the solder balls to face upwards to obtain the CBGA device with the solder paste applied to the top of each solder ball.
6. The sample preparation method for the solderability test of the CBGA device as claimed in claim 5, wherein said dipping the solder balls of the CBGA device downward into the solder paste on the solder paste carrier plate comprises:
absorbing the front side of the CBGA device by using a vacuum suction head, and driving the CBGA device to move to the position right above the solder paste carrier plate in a state that the solder balls face downwards;
moving the vacuum suction head adsorbing the CBGA device downwards to enable each solder ball on the back of the CBGA device to be abutted against the solder paste on the solder paste carrier plate to dip solder paste;
and moving the vacuum suction head upwards to drive the CBGA device dipped with the solder paste to be separated from the solder paste on the solder paste carrier plate, and taking down the CBGA device from the vacuum suction head.
7. The method of claim 1, wherein the heating the solder balls of the CBGA device with the solder paste applied thereon upwards until the solder paste melts comprises:
and placing the solder balls of the CBGA device applied with the solder paste upwards in a heating table or a vacuum heating furnace for heating.
8. The sample preparation method for the solderability test of the CBGA device as claimed in claim 7, wherein the heating temperature for placing the solder ball of the CBGA device with the solder paste facing upwards in a heating table or a vacuum heating furnace is 205-215 ℃.
9. The sample preparation method for the solderability test of the CBGA device as claimed in claim 1, wherein the standing and cooling time is 50-70 s.
10. The sample preparation method for the solderability test of a CBGA device as claimed in any one of claims 1-9, wherein each solder ball on the CBGA device is a Pb90Sn10 solder ball, and the solder paste is Sn63Pb37 solder.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011059961.1A CN112378716A (en) | 2020-09-30 | 2020-09-30 | Sample preparation method for solderability test of CBGA device |
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| CN202011059961.1A CN112378716A (en) | 2020-09-30 | 2020-09-30 | Sample preparation method for solderability test of CBGA device |
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