CN117697059A - High-precision CCGA device board level assembly method - Google Patents
High-precision CCGA device board level assembly method Download PDFInfo
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- CN117697059A CN117697059A CN202311691033.0A CN202311691033A CN117697059A CN 117697059 A CN117697059 A CN 117697059A CN 202311691033 A CN202311691033 A CN 202311691033A CN 117697059 A CN117697059 A CN 117697059A
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 229910000679 solder Inorganic materials 0.000 claims abstract description 112
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 238000003466 welding Methods 0.000 claims abstract description 74
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000005476 soldering Methods 0.000 claims abstract description 16
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 238000009736 wetting Methods 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims description 39
- 239000007921 spray Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 5
- 229910007116 SnPb Inorganic materials 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 230000000875 corresponding effect Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- SEEZIOZEUUMJME-FOWTUZBSSA-N cannabigerolic acid Chemical group CCCCCC1=CC(O)=C(C\C=C(/C)CCC=C(C)C)C(O)=C1C(O)=O SEEZIOZEUUMJME-FOWTUZBSSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of integrated circuit manufacturing, and particularly discloses a high-precision CCGA device board-level assembly method, which comprises the following steps: coating solder paste on the bonding pad of the assembly substrate; pre-aligning a welding column on the CCGA device with a welding disc of the assembling substrate with high precision; heating the bottom of the assembly substrate to perform pre-welding of the welding column and the welding pad; and (3) fully melting the solder paste and fully wetting the solder paste with the welding column and the welding pad through a reflow soldering process to form intermetallic compounds so as to complete the high-precision CCGA device board level assembly. The high-precision CCGA device board-level assembly method provided by the invention solves the technical problems of poor alignment precision, bridging of welding columns and the like of CCGA device board-level assembly through high-precision pre-alignment and pre-welding of CCGA devices to an assembly substrate, and improves the yield and reliability of CCGA device board-level assembly.
Description
Technical Field
The invention relates to the technical field of integrated circuit manufacturing, in particular to a high-precision CCGA device board-level assembly method.
Background
With the increase of the scale of integrated circuits, the number of I/Os of packaged devices is continuously increased, the I/O pitch is continuously reduced, and the thermal cycle reliability problem caused by the CTE difference between a ceramic substrate and an assembled substrate after device board level assembly is quite remarkable. Compared with the traditional CBGA structure, the CCGA structure increases the distance between the ceramic substrate and the assembly substrate, and can relieve the thermal mismatch effect. However, with the increase of the number of I/Os and the reduction of the pitch, the position accuracy of the welding columns to the assembly substrate is difficult to ensure, the problems of open circuit and bridging of welding spots are remarkable, and the assembly yield is directly affected.
In the traditional CCGA device board level assembly process, an artificial pre-alignment auxiliary microscopic and X-ray optical alignment inspection mode is adopted, the position accuracy of device assembly is difficult to accurately control in artificial pre-alignment, meanwhile, secondary deviation is easy to occur in the device transmission process before a welding process, along with the increase of the I/O number and the reduction of the pitch of CCGA devices, the control and stability of alignment accuracy are more difficult to guarantee, and hidden danger is caused to the performance and reliability of the devices.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a high-precision CCGA device board-level assembly method, which solves the technical problems of poor alignment precision, bridging of welding columns and the like of CCGA device board-level assembly and improves the yield and reliability of CCGA device board-level assembly through high-precision pre-alignment and pre-welding of CCGA devices to an assembly substrate.
In order to solve the problems, the invention provides a high-precision CCGA device board-level assembly method, which comprises the following steps:
step 101: coating solder paste on the bonding pad of the assembly substrate;
step 102: pre-aligning a welding column on the CCGA device with a welding disc of the assembling substrate with high precision;
step 103: heating the bottom of the assembly substrate to perform pre-welding of the welding column and the welding pad;
step 104: and (3) fully melting the solder paste and fully wetting the solder paste with the welding column and the welding pad through a reflow soldering process to form intermetallic compounds so as to complete the high-precision CCGA device board level assembly.
Further, the step of coating solder paste on the bonding pad of the assembly substrate further comprises:
placing the solder paste printing screen on one surface of the assembly substrate provided with the bonding pads, wherein the mesh holes of the placed solder paste printing screen are opposite to the bonding pads on the assembly substrate one by one, and the diameters of the opposite mesh holes do not exceed the diameters of the bonding pads;
and brushing solder paste with the area corresponding to the mesh openings into each mesh opening by using a scraper, and removing the solder paste printing screen plate.
Further, the step of coating solder paste on the bonding pad of the assembly substrate further comprises:
fixing the assembled substrate on a solder paste spray printing equipment base station;
and (3) utilizing a pressure spray printing mode, and completing the spray printing of the solder paste on the bonding pads of the assembly substrate one by one through the nozzles, wherein the spray printing positions of the solder paste correspond to the bonding pad positions of the assembly substrate one by one, and the spray printing area of the solder paste does not exceed the area of the bonding pads.
Further, the pre-aligning the solder columns on the CCGA device with the bonding pads of the assembly substrate with high precision further includes:
fixing the assembly substrate on a high-precision mounting system carrier, and precisely positioning the center position of each bonding pad on the assembly substrate through a high-precision mounting system image tool;
preparing a CCGA device with a welding column on one side, clamping one side of the CCGA device, which is not provided with the welding column, by a clamping tool of a high-precision mounting system, placing one side of the CCGA device, which is provided with the welding column, above the assembly substrate, precisely positioning the center position of each welding column on the CCGA device by an image tool of the high-precision mounting system, aligning the center position of each welding column with the center position of each welding disc one by one, and completing high-precision pre-alignment of the welding column on the CCGA device and the welding disc of the assembly substrate.
Further, the heating the bottom of the assembly substrate to perform pre-soldering of the solder post and the solder pad further includes:
and heating the bottom of the assembly substrate through a high-precision mounting system carrier, and heating one side of the assembly substrate, on which the bonding pad is not arranged, to the solid-liquid phase temperature of the solder paste, so that the pre-welding of the welding column and the bonding pad is realized.
Further, the pre-soldered CCGA board-level assembly device is fully melted and fully infiltrated with solder columns and pads to form intermetallic compounds through a reflow soldering process, and the method further comprises:
and placing the pre-welded CCGA board-level assembly device into a reflow oven, and setting the heating rate, the highest temperature heat-preserving time and the cooling rate to enable the solder paste to be fully melted and fully infiltrated with the welding columns and the bonding pads, so that intermetallic compounds are formed at interfaces of the solder paste, the welding columns and the bonding pads.
Further, the shape of the welding post is straight or spring-shaped.
Further, the assembly substrate is made of BT, FR4 or ABF.
Further, the solder paste is made of SnPb, snAg or SnAgCu.
Further, the welding column is made of SnPb, beCu or Cu.
The high-precision CCGA device board-level assembly method provided by the invention has the following advantages: the high-precision pre-alignment and pre-welding from the CCGA device to the assembly substrate effectively improves and accurately controls the assembly alignment precision of the CCGA device board level, prevents secondary deviation before welding of the welding column, solves the technical problems of poor assembly alignment precision of the CCGA device board level, bridging of the welding column and the like, and improves the assembly yield and reliability level of the CCGA device board level.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention.
FIG. 1 is a flow chart of a method for board level assembly of a high precision CCGA device provided by the present invention.
Fig. 2 is a schematic diagram of aligning and fixing mesh holes of a printing screen and bonding pads of an assembly substrate according to the present invention.
Fig. 3 is a schematic diagram of a solder paste brush provided by the invention into mesh openings of a screen plate.
Fig. 4 is a schematic diagram of solder paste spray-printing on an assembly substrate pad according to the present invention.
FIG. 5a is a schematic diagram of a CCGA device with straight bond posts in accordance with the present invention after high precision pre-alignment of the bond posts with the package substrate pads.
FIG. 5b is a schematic diagram of a CCGA device with spring-shaped bond posts in high precision pre-alignment with bond pads of an assembled substrate, in accordance with the present invention.
Fig. 6a is a schematic diagram of a CCGA device with straight bond posts and an assembled substrate after pre-soldering according to the present invention.
Fig. 6b is a schematic diagram of a CCGA device with spring-shaped bond posts according to the present invention after pre-soldering with an assembly substrate.
Fig. 7a is a schematic diagram of a CCGA device with straight solder columns according to the present invention after reflow soldering with an assembly substrate.
Fig. 7b is a schematic diagram of a CCGA device with spring-shaped solder columns according to the present invention after reflow soldering with an assembly substrate.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention to achieve the preset purpose, the following detailed description will refer to the specific implementation, structure, characteristics and effects of the high-precision CCGA device board-level assembly method according to the present invention with reference to the accompanying drawings and preferred embodiments. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In this embodiment, a method for assembling a high-precision CCGA device board is provided, as shown in fig. 1, where the method for assembling a high-precision CCGA device board includes the following steps:
step 101: coating solder paste on the bonding pad of the assembly substrate;
generally, in order to bond the CCGA device to the package substrate 20, pads are provided on the package substrate 20. Wherein the number of bonding pads of the assembly substrate is at least one.
In general, the number of pads of the assembly substrate 20 is positively correlated with the area of the assembly substrate, for example, the larger the area of the assembly substrate 20, the larger the number of pads of the assembly substrate 20. The bonding pad of the assembly substrate is arranged on one surface of the assembly substrate, which needs to be welded with the CCGA device bonding post.
Specifically, the solder paste coating is realized by adopting processes including but not limited to screen printing, solder paste spray printing and the like; the solder paste coating area does not exceed the package substrate pad area.
Preferably, the solder paste is coated at the bonding pad position of the assembly substrate, and the method further comprises:
firstly, placing a solder paste printing screen 22 on one surface of an assembly substrate 20 provided with bonding pads 201, wherein meshes 221 of the solder paste printing screen 22 after being placed are opposite to the bonding pads 201 on the assembly substrate 20 one by one, and the diameters of the opposite meshes do not exceed the diameters of the bonding pads; as shown in fig. 2, after the solder paste printing screen 22 is placed on the assembly substrate 20, the respective mesh holes 221 on the solder paste printing screen 22 are respectively in one-to-one correspondence with the pads 201 on the assembly substrate 20.
Then, the solder paste printing screen 22 is removed by brushing solder paste 202 having an area corresponding to the mesh into each mesh 221 using a doctor blade 23. The area of the solder paste 202 corresponds to the area of the mesh holes 221, and the height of the solder paste 202 does not exceed the thickness of the solder paste printing screen 22. As shown in fig. 3, a volume of solder paste 202 is brushed into each of the cells 221.
Alternatively, the thickness of the solder paste printing screen 22 may be 0.1mm to 0.3mm, and the specific thickness may be determined according to the pitch of the bonding pads of the assembly substrate actually used. For example, a thickness of the printing screen corresponding to a pad with a pitch of 0.6mm is 0.1mm, and a thickness of the printing screen corresponding to a pad with a pitch of 1.5mm is 0.3mm.
Specifically, the preparation process of the solder paste printing screen with the specification includes, but is not limited to, machining, electroforming, laser etching, and the like, and the preparation process of the solder paste printing screen is not limited in this embodiment.
Preferably, the solder paste is coated at the bonding pad position of the assembly substrate, and the method further comprises:
fixing the assembly substrate 20 on a solder paste jet printing equipment base;
and setting a solder paste spray printing position, a solder paste spray printing area and a solder paste spray printing volume, and completing solder paste spray printing on the bonding pads of the assembly substrate 20 one by one through the nozzles 24 in a pressure spray printing mode, wherein the solder paste spray printing position corresponds to the bonding pad position of the assembly substrate one by one, and the solder paste spray printing area does not exceed the bonding pad area. The solder paste jet printing volume can be determined according to the area and the pitch of the bonding pads of the actually adopted assembly substrate. As shown in fig. 4, a volume of solder paste 202 is spray printed onto each pad 201.
Step 102: pre-aligning a welding column on the CCGA device with a welding disc of the assembling substrate with high precision;
preferably, the pre-aligning the solder columns on the CCGA device with the bonding pads of the assembly substrate with high precision further includes:
firstly, after step 101 is completed, fixing the assembly substrate 20 on a high-precision mounting system carrier, and precisely positioning the center position of each bonding pad 201 on the assembly substrate 20 by using a high-precision mounting system image tool;
then, the CCGA device 21 with the bonding posts on one side is prepared, the side, on which the bonding posts are not arranged, of the CCGA device is clamped by the clamping tool 25 of the high-precision mounting system, the side, on which the bonding posts are arranged, of the CCGA device is placed above the assembly substrate 20, the center position of each bonding post on the CCGA device 21 is accurately positioned by the image tool of the high-precision mounting system, the center position of each bonding post is aligned with the center position of each bonding pad one by one, and the high-precision pre-alignment of the bonding posts on the CCGA device and the bonding pads of the assembly substrate is completed.
Alternatively, the types of the welding posts include, but are not limited to, straight or spring-shaped, etc.
As shown in fig. 5a, when the type of solder columns of the CCGA device 21 is flat, the CCGA device 21 having the flat solder columns 211a is pre-aligned with high accuracy with the package substrate pads 201.
As shown in fig. 5b, when the type of stud of the CCGA device 21 is spring-shaped, the CCGA device 21 having the spring-shaped stud 211b is pre-aligned with the package substrate pad 201 with high accuracy.
Generally, the diameter of the bond post on the CCGA device is set according to the diameter of the bond pad on the package substrate, and in order to achieve effective bonding of the CCGA device to the package substrate, the diameter of the bond post on the CCGA device does not exceed the diameter of the bond pad on the package substrate, for example, the diameter of the bond post corresponding to a 0.8mm bond pad is 0.5mm.
Step 103: heating the bottom of the assembly substrate to perform pre-welding of the welding column and the welding pad;
preferably, the heating the bottom of the assembly substrate to perform pre-soldering of the solder post and the solder pad further includes:
after step 102 is completed, the bottom of the assembly substrate is heated by the high-precision mounting system stage, the side of the assembly substrate, on which the bonding pad is not disposed, is heated to the solid-liquid phase temperature of the solder paste, and the solder columns and the bonding pad are pre-welded by preventing oxidation of the solder columns and the solder paste with protective gases including but not limited to nitrogen, helium, argon and the like.
It should be noted that, the heating is performed from the bottom of the assembly substrate 20 (i.e. the surface on which the bonding pad is not disposed), so that the solder paste 202 is changed from solid state to liquid state due to the temperature rise, and then is cooled to normal temperature after a predetermined period of time is maintained, where the predetermined period of time is that the solder paste, the bonding post 211 and the bonding pad 201 are ensured to form a preliminary metallurgical bond, the CCGA device is preliminarily fixed, and the secondary misalignment of the bonding post is prevented, which may be specifically set according to practical experience, for example, 3 minutes, 5 minutes, etc., and the specific value of the predetermined period of time is not limited in this embodiment.
As shown in fig. 6a, when the type of solder columns of the CCGA device 21 is flat, the CCGA device 21 having the flat solder columns 211a is pre-soldered to the assembly substrate.
As shown in fig. 6b, when the type of the stud of the CCGA device 21 is spring-shaped, the CCGA device 21 having the spring-shaped stud 211b is pre-soldered to the assembly substrate.
In the embodiment of the invention, the high-precision mounting system carrier can ensure the high-precision one-to-one alignment of the welding columns on the CCGA device and the bonding pads of the assembly substrate, effectively improve the board-level assembly alignment precision of the CCGA device, has the functions of heating and protecting the assembly substrate, ensures the high-reliability pre-welding of the welding columns and the bonding pads of the assembly substrate, and prevents the secondary deviation of the welding columns.
Step 104: and (3) fully melting the solder paste and fully wetting the solder paste with the welding column and the welding pad through a reflow soldering process to form intermetallic compounds so as to complete the high-precision CCGA device board level assembly.
Preferably, the pre-soldered CCGA board-level assembly device is fully melted and fully infiltrated with solder columns and pads to form intermetallic compounds through a reflow soldering process, and further comprises:
after step 103, the high-precision mounting system clamping tool 25 is removed, the pre-soldered CCGA board-level assembly device is placed into a reflow oven, and the heating rate, the highest temperature holding time and the cooling rate are set to enable the solder paste to be fully melted and fully infiltrated with the solder columns and the bonding pads, so that intermetallic compounds are formed at the interfaces of the solder paste, the solder columns and the bonding pads. The reflow oven is provided with protective gas to prevent the solder columns and solder paste from oxidizing. The shielding gas includes but is not limited to nitrogen, helium, argon, or the like.
The heating rate, the highest temperature heat-preserving time and the cooling rate ensure that the solder paste is fully melted in the solder paste reflow soldering process, and intermetallic compounds are fully formed, so that low soldering defects (voids, bridging, cold joint and the like) and high soldering strength are realized, and the set value is specifically set according to the CCGA plate-level assembled structure and the components of the solder paste. Generally, the heating rate is not more than 3 ℃/s, the highest temperature is 20-50 ℃ higher than the melting point of the solder paste, the highest temperature heat preservation time is 60-120 s, and the cooling rate is not more than 3 ℃/s.
As shown in fig. 7a, when the type of solder columns of the CCGA device 21 is flat, the CCGA device 21 having the flat solder columns 211a is reflow-soldered to the package substrate.
As shown in fig. 7b, when the type of the solder columns of the CCGA device 21 is spring-shaped, the CCGA device 21 having the spring-shaped solder columns 211b is reflow-soldered to the package substrate.
Preferably, the shape of the solder post includes, but is not limited to, a straight shape or a spring shape.
Preferably, the material of the assembly substrate includes, but is not limited to BT, FR4 or ABF.
Preferably, the solder paste material includes, but is not limited to, snPb, snAg, or SnAgCu.
Preferably, the material of the solder post includes, but is not limited to, snPb, beCu or Cu.
According to the high-precision CCGA device board level assembly method provided by the invention, the alignment precision of the CCGA device board level assembly is effectively improved and precisely controlled through the high-precision pre-alignment of the CCGA device; the CCGA device board level assembly pre-welding is adopted, secondary deviation before welding of welding columns is prevented, the technical problems of poor assembly alignment precision of the CCGA device board level, bridging of the welding columns and the like are solved, the assembly alignment precision is improved to +/-10 mu m from the conventional +/-50 mu m, and the assembly yield and reliability level of the CCGA device board level are improved.
The present invention is not limited to the above-mentioned embodiments, but is intended to be limited to the following embodiments, and any modifications, equivalents and modifications can be made to the above-mentioned embodiments without departing from the scope of the invention.
Claims (10)
1. The high-precision CCGA device board-level assembly method is characterized by comprising the following steps of:
step 101: coating solder paste on the bonding pad of the assembly substrate;
step 102: pre-aligning a welding column on the CCGA device with a welding disc of the assembling substrate with high precision;
step 103: heating the bottom of the assembly substrate to perform pre-welding of the welding column and the welding pad;
step 104: and (3) fully melting the solder paste and fully wetting the solder paste with the welding column and the welding pad through a reflow soldering process to form intermetallic compounds so as to complete the high-precision CCGA device board level assembly.
2. The method of high precision CCGA device board level assembly of claim 1, wherein the applying solder paste at the pad locations of the assembled substrate further comprises:
placing the solder paste printing screen on one surface of the assembly substrate provided with the bonding pads, wherein the mesh holes of the placed solder paste printing screen are opposite to the bonding pads on the assembly substrate one by one, and the diameters of the opposite mesh holes do not exceed the diameters of the bonding pads;
and brushing solder paste with the area corresponding to the mesh openings into each mesh opening by using a scraper, and removing the solder paste printing screen plate.
3. The method of high precision CCGA device board level assembly of claim 1, wherein the applying solder paste at the pad locations of the assembled substrate further comprises:
fixing the assembled substrate on a solder paste spray printing equipment base station;
and (3) utilizing a pressure spray printing mode, and completing the spray printing of the solder paste on the bonding pads of the assembly substrate one by one through the nozzles, wherein the spray printing positions of the solder paste correspond to the bonding pad positions of the assembly substrate one by one, and the spray printing area of the solder paste does not exceed the area of the bonding pads.
4. The method of high precision CCGA device board level assembly of claim 1, wherein said pre-aligning solder columns on the CCGA device with solder pads of the assembly substrate with high precision, further comprises:
fixing the assembly substrate on a high-precision mounting system carrier, and precisely positioning the center position of each bonding pad on the assembly substrate through a high-precision mounting system image tool;
preparing a CCGA device with a welding column on one side, clamping one side of the CCGA device, which is not provided with the welding column, by a clamping tool of a high-precision mounting system, placing one side of the CCGA device, which is provided with the welding column, above the assembly substrate, precisely positioning the center position of each welding column on the CCGA device by an image tool of the high-precision mounting system, aligning the center position of each welding column with the center position of each welding disc one by one, and completing high-precision pre-alignment of the welding column on the CCGA device and the welding disc of the assembly substrate.
5. The method of high precision CCGA device board level assembly of claim 1, wherein said heating the bottom of the assembly substrate to pre-bond the bond post to the bond pad further comprises:
and heating the bottom of the assembly substrate through a high-precision mounting system carrier, and heating one side of the assembly substrate, on which the bonding pad is not arranged, to the solid-liquid phase temperature of the solder paste, so that the pre-welding of the welding column and the bonding pad is realized.
6. The method of high precision CCGA device board level assembly of claim 1, wherein said solder paste is sufficiently melted and sufficiently infiltrated with solder columns and pads to form intermetallic compounds by a reflow soldering process for the pre-soldered CCGA device board level assembly, further comprising:
and placing the pre-welded CCGA board-level assembly device into a reflow oven, and setting the heating rate, the highest temperature heat-preserving time and the cooling rate to enable the solder paste to be fully melted and fully infiltrated with the welding columns and the bonding pads, so that intermetallic compounds are formed at interfaces of the solder paste, the welding columns and the bonding pads.
7. The method of assembling a high precision CCGA device board level of claim 1, wherein the solder columns are shaped as straight or spring shapes.
8. The method of claim 1, wherein the substrate is BT, FR4 or ABF.
9. The method of assembling a high-precision CCGA device board of claim 1, wherein the solder paste is SnPb, snAg, or SnAgCu.
10. The method of assembling a high-precision CCGA device board of claim 1, wherein the solder columns are SnPb, beCu, or Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311691033.0A CN117697059A (en) | 2023-12-11 | 2023-12-11 | High-precision CCGA device board level assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311691033.0A CN117697059A (en) | 2023-12-11 | 2023-12-11 | High-precision CCGA device board level assembly method |
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| Publication Number | Publication Date |
|---|---|
| CN117697059A true CN117697059A (en) | 2024-03-15 |
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|---|---|---|---|
| CN202311691033.0A Pending CN117697059A (en) | 2023-12-11 | 2023-12-11 | High-precision CCGA device board level assembly method |
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| Country | Link |
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| CN (1) | CN117697059A (en) |
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- 2023-12-11 CN CN202311691033.0A patent/CN117697059A/en active Pending
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