CN112376088A - Ultra-thick electrolytic copper foil for PCB and preparation method thereof - Google Patents
Ultra-thick electrolytic copper foil for PCB and preparation method thereof Download PDFInfo
- Publication number
- CN112376088A CN112376088A CN202011215506.6A CN202011215506A CN112376088A CN 112376088 A CN112376088 A CN 112376088A CN 202011215506 A CN202011215506 A CN 202011215506A CN 112376088 A CN112376088 A CN 112376088A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- electrolytic copper
- thick electrolytic
- ultra
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Abstract
The invention discloses an ultra-thick electrolytic copper foil for a PCB, which comprises the following raw materials in parts by weight: 80-90% of pure copper block, 1-5% of organic divalent sulfur compound, 1-5% of sulfur-containing propane sulfonate, 1-3% of adhesive, 1-2% of tea polyphenol, 1-2% of collagen, 1-7% of superfine copper powder, 1-2% of gelatin and 0.5-1.5% of wire-drawing powder. According to the super-thick electrolytic copper foil for the PCB and the preparation method thereof, the super-thick electrolytic copper foil for the PCB can adopt a novel bonding method, so that the strength of the super-thick electrolytic copper foil for the PCB can be ensured while the thickness of the super-thick electrolytic copper foil is ensured, the super-thick electrolytic copper foil cannot be easily loosened due to uneven bonding caused by over-thickness of the body, the use of the electrolytic copper foil is ensured, the super-thick electrolytic copper foil cannot be easily rushed away and loosened at will, the service life of the super-thick electrolytic copper foil is prolonged, and the super-thick electrolytic copper foil is convenient for people.
Description
Technical Field
The invention relates to the technical field of ultra-thick electrolytic copper foil, in particular to ultra-thick electrolytic copper foil for a PCB and a preparation method thereof.
Background
PCB, the name of Chinese is printed circuit board, also known as printed wiring board, is the important electronic part, is the supporter of the electronic component, is the carrier of the electrical connection of the electronic component, because it is made by adopting the electronic printing technology, so called "printed" circuit board, short printed board, is one of the important parts of the electronic industry, almost every kind of electronic equipment, as small as electronic watch, calculator, as large as computer, communication electronic equipment, military weapon system, as long as there are electronic components such as integrated circuit, etc., in order to make the electrical interconnection between each component, the printed board is used, the printed wiring board is composed of insulating bottom plate, connecting wire and pad assembled with welded electronic component, it has the dual function of conducting wire and insulating bottom plate, it can replace the complicated wiring, realize the electrical connection between each component in the circuit, the assembly and welding work of the electronic product is simplified, the wiring workload in the traditional mode is reduced, and the labor intensity of workers is greatly reduced; the size of the whole machine is reduced, the product cost is reduced, the quality and the reliability of electronic equipment are improved, the printed circuit board has good product consistency, the standardized design can be adopted, the mechanization and automation in the production process can be realized, and meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and the maintenance of the whole machine product are facilitated.
The strength of the existing ultra-thick electrolytic copper foil for the PCB is reduced after the existing ultra-thick electrolytic copper foil for the PCB reaches a certain thickness, and then the existing ultra-thick electrolytic copper foil for the PCB is directly loosened after being used for a long time or even processed, so that the follow-up use of people becomes very troublesome, the quality of the electrolytic copper foil is reduced, and once the ultra-thick electrolytic copper foil for the PCB is suddenly crashed in the working process when the existing ultra-thick electrolytic copper foil for the PCB is put into use, the running equipment of the existing ultra-thick electrolytic copper foil for the PCB is directly stopped, irretrievable loss is.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an ultra-thick electrolytic copper foil for a PCB and a preparation method thereof, which solve the problems in the background art.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: an ultra-thick electrolytic copper foil for a PCB comprises the following raw materials in parts by weight: 80-90% of pure copper block, 1-5% of organic divalent sulfur compound, 1-5% of sulfuric propane sulfonate, 1-3% of adhesive, 1-2% of tea polyphenol, 1-2% of collagen, 1-7% of superfine copper powder, 1-2% of gelatin and 0.5-1.5% of wire-drawing powder.
An ultra-thick electrolytic copper foil for a PCB comprises the following raw materials in parts by weight: 80% of pure copper block, 5% of organic divalent sulfur compound, 5% of sulfur-containing propane sulfonate, 3% of adhesive, 1% of tea polyphenol, 1% of collagen, 3% of superfine copper powder, 1.5% of gelatin and 0.5% of wire-drawing powder.
An ultra-thick electrolytic copper foil for a PCB comprises the following raw materials in parts by weight: 85% of pure copper block, 3% of organic divalent sulfur compound, 2% of sulfur-containing propane sulfonate, 2% of adhesive, 1% of tea polyphenol, 2% of collagen, 2.5% of superfine copper powder, 1% of gelatin and 1.5% of wire-drawing powder
An ultra-thick electrolytic copper foil for a PCB and a preparation method thereof, the ultra-thick electrolytic copper foil comprises the following raw materials by weight: 90 percent of pure copper block, 1 percent of organic divalent sulfur compound, 1 percent of sulfur-containing propane sulfonate, 1 percent of adhesive, 1 percent of tea polyphenol, 1 percent of collagen, 3 percent of superfine copper powder, 1 percent of gelatin and 1 percent of wire drawing powder
Preferably, the preparation method of the ultra-thick electrolytic copper foil for the PCB specifically comprises the following steps:
s1, preparing a copper melting tank to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting a pure copper block into the copper melting tank to dissolve the pure copper block to prepare a main electrolyte, sequentially adding an organic divalent sulfur compound, sulfur-containing propane sulfonate, a binder, tea polyphenol, collagen, superfine copper powder and wire drawing powder into the copper melting tank in the preparation process, and fully stirring the solution in the copper melting tank by using a stirring rod while adding the organic divalent sulfur compound, the sulfur-containing propane sulfonate, the binder, the tea polyphenol, the collagen, the superfine copper powder and the wire drawing powder to fully mix the solution;
s2, carrying out electrolysis copper preparation on the main electrolyte through an anode of an electrolytic cell and a cathode of the electrolytic cell of an electrolysis device, taking out the prepared copper foil, stacking the copper foil in a container for lamination, then stopping stacking after stacking to the required size and thickness, cutting the electrolytic copper foil through a cutting tool, and cutting the electrolytic copper foil into a proper size;
s3, taking out the cut ultra-thick electrolytic copper foil, placing the ultra-thick electrolytic copper foil in an empty container, pouring gelatin into the container to enable the ultra-thick electrolytic copper foil to be soaked in the gelatin, and standing for 10m-15 m;
and S4, taking out the super-thick electrolytic copper foil soaked for a set time, and drying the gelatin on the surface of the super-thick electrolytic copper foil through an air duct to enable the gelatin to be melted into the inside of the super-thick electrolytic copper foil.
Preferably, the heating temperature in S1 is 80-90 ℃, and the rotating speed of the stirring rod during stirring is set to be 150/min.
Preferably, the wire drawing powder is made of protein fibers, and the particle size of the superfine copper powder is less than 0.01 mu m.
(III) advantageous effects
The invention provides an ultra-thick electrolytic copper foil for a PCB and a preparation method thereof. The ultra-thick electrolytic copper foil for the PCB and the preparation method thereof have the advantages that the ultra-thick electrolytic copper foil for the PCB can be bonded by a novel bonding method, so that the strength of the ultra-thick electrolytic copper foil for the PCB can be ensured while the thickness of the ultra-thick electrolytic copper foil is ensured, the ultra-thick electrolytic copper foil for the PCB cannot be easily bonded unevenly due to over-thick bodies and then loosened, the use of the electrolytic copper foil is guaranteed, the ultra-thick electrolytic copper foil cannot be easily burst and loosened randomly, the service life of the ultra-thick electrolytic copper foil is prolonged, and the ultra-thick electrolytic copper foil for the PCB is convenient for people to use.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
An ultra-thick electrolytic copper foil for a PCB comprises the following raw materials in parts by weight: 80% of pure copper block, 5% of organic divalent sulfur compound, 5% of sulfur-containing propane sulfonate, 3% of adhesive, 1% of tea polyphenol, 1% of collagen, 3% of superfine copper powder, 1.5% of gelatin and 0.5% of wire-drawing powder, and the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting 80% of pure copper blocks into the copper melting tank to dissolve the pure copper blocks to prepare a main electrolyte, sequentially adding 5% of organic divalent sulfur compound, 5% of sulfur-containing propane sulfonate, 3% of adhesive, 1% of tea polyphenol, 1% of collagen and 0.5% of superfine copper powder to the copper melting tank in the preparation process, and fully stirring the solution in the copper melting tank by using a stirring rod while adding the organic divalent sulfur compound, the sulfur-containing propane sulfonate, the adhesive, the tea polyphenol, the collagen and the superfine copper powder to fully mix.
And S2, carrying out electrolysis copper preparation on the main electrolyte through an electrolytic tank anode and an electrolytic tank cathode of an electrolysis device, taking out the prepared copper foil, stacking the copper foil in a container for lamination, stopping stacking after stacking to a required size and thickness, cutting the electrolytic copper foil through a cutting tool, and cutting the electrolytic copper foil into a proper size.
S3, taking out the cut ultra-thick electrolytic copper foil, placing the ultra-thick electrolytic copper foil in an empty container, pouring gelatin into the ultra-thick electrolytic copper foil to enable the ultra-thick electrolytic copper foil to be soaked in the gelatin, and standing for 10 m.
And S4, taking out the super-thick electrolytic copper foil soaked for a set time, and drying the gelatin on the surface of the super-thick electrolytic copper foil through an air duct to enable the gelatin to be melted into the inside of the super-thick electrolytic copper foil.
Example two
An ultra-thick electrolytic copper foil for a PCB comprises the following raw materials in parts by weight: 85% of pure copper block, 3% of organic divalent sulfur compound, 2% of sulfur-containing propane sulfonate, 2% of adhesive, 1% of tea polyphenol, 2% of collagen, 2.5% of superfine copper powder, 1% of gelatin and 1.5% of wire-drawing powder, and the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting a pure copper block into the copper melting tank to dissolve 85% of the pure copper block to prepare a main electrolyte, sequentially adding 3% of organic divalent sulfur compound, 2% of sulfur-containing propane sulfonate, 2% of adhesive, 1% of tea polyphenol, 2% of collagen, 2.5% of superfine copper powder and 1.5% of wire drawing powder into the copper melting tank in the preparation process, and fully stirring the solution in the copper melting tank by using a stirring rod while adding the organic divalent sulfur compound, the sulfur-containing propane sulfonate, the adhesive, the tea polyphenol, the collagen, the superfine copper powder and.
And S2, carrying out electrolysis copper preparation on the main electrolyte through an electrolytic tank anode and an electrolytic tank cathode of an electrolysis device, taking out the prepared copper foil, stacking the copper foil in a container for lamination, stopping stacking after stacking to a required size and thickness, cutting the electrolytic copper foil through a cutting tool, and cutting the electrolytic copper foil into a proper size.
S3, taking out the cut ultra-thick electrolytic copper foil, placing the ultra-thick electrolytic copper foil in an empty container, pouring gelatin into the ultra-thick electrolytic copper foil to enable the ultra-thick electrolytic copper foil to be soaked in the gelatin, and standing for 13 m.
And S4, taking out the super-thick electrolytic copper foil soaked for a set time, and drying the gelatin on the surface of the super-thick electrolytic copper foil through an air duct to enable the gelatin to be melted into the inside of the super-thick electrolytic copper foil.
EXAMPLE III
An ultra-thick electrolytic copper foil for a PCB and a preparation method thereof, the ultra-thick electrolytic copper foil comprises the following raw materials by weight: 90% of pure copper block, 1% of organic divalent sulfur compound, 1% of sulfur-containing propane sulfonate, 1% of adhesive, 1% of tea polyphenol, 1% of collagen, 3% of superfine copper powder, 1% of gelatin and 1% of wire-drawing powder, and the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal induction fan, putting 90% of pure copper blocks into the copper melting tank to dissolve the pure copper blocks to prepare a main electrolyte, sequentially adding 1% of organic divalent sulfur compound, 1% of sulfur-containing propane sulfonate, 1% of adhesive, 1% of tea polyphenol, 1% of collagen, 3% of superfine copper powder and 1% of wire drawing powder into the copper melting tank in the preparation process, and fully stirring the solution in the copper melting tank by using a stirring rod while adding the organic divalent sulfur compound, the sulfur-containing propane sulfonate, the adhesive, the tea polyphenol, the collagen, the superfine copper powder and the.
And S2, carrying out electrolysis copper preparation on the main electrolyte through an electrolytic tank anode and an electrolytic tank cathode of an electrolysis device, taking out the prepared copper foil, stacking the copper foil in a container for lamination, stopping stacking after stacking to a required size and thickness, cutting the electrolytic copper foil through a cutting tool, and cutting the electrolytic copper foil into a proper size.
And S3, taking out the cut ultra-thick electrolytic copper foil, placing the ultra-thick electrolytic copper foil in an empty container, pouring gelatin into the ultra-thick electrolytic copper foil to enable the ultra-thick electrolytic copper foil to be soaked in the gelatin, and standing for 15 m.
And S4, taking out the super-thick electrolytic copper foil soaked for a set time, and drying the gelatin on the surface of the super-thick electrolytic copper foil through an air duct to enable the gelatin to be melted into the inside of the super-thick electrolytic copper foil.
Procedure of experiment
1. The product manufactured by the three embodiments is placed in a pressure detector, then the pressure detector is started, the time when the product is in specific pressure and can keep the product unaffected and the time when the product is damaged are detected, and the time is recorded.
2. The two ends of the product manufactured by the three embodiments are respectively placed on the surfaces of the two clamping components, then the two clamping components are pulled in a split manner, the pulling force is recorded, and then the maximum force which can be borne by the product is detected and recorded.
And (5) experimental results.
The existing ultra-thick electrolytic copper foil on the market is randomly selected as a control group, then the compression resistance and the cohesiveness of the electrolytic copper foil are respectively tested under the same test conditions, and then the results are recorded to obtain the following table, wherein the table shows that the product prepared in the embodiment 3 has the best compression resistance and cohesiveness.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An ultra-thick electrolytic copper foil for a PCB comprises the following raw materials in parts by weight: 80-90% of pure copper block, 1-5% of organic divalent sulfur compound, 1-5% of sulfur-containing propane sulfonate, 1-3% of adhesive, 1-2% of tea polyphenol, 1-2% of collagen, 1-7% of superfine copper powder, 1-2% of gelatin and 0.5-1.5% of wire-drawing powder.
2. The ultra-thick electrolytic copper foil for the PCB as claimed in claim 1, which comprises the following raw materials in parts by weight: 80% of pure copper block, 5% of organic divalent sulfur compound, 5% of sulfur-containing propane sulfonate, 3% of adhesive, 1% of tea polyphenol, 1% of collagen, 3% of superfine copper powder, 1.5% of gelatin and 0.5% of wire-drawing powder.
3. The ultra-thick electrolytic copper foil for the PCB as claimed in claim 1, which comprises the following raw materials in parts by weight: 85% of pure copper block, 3% of organic divalent sulfur compound, 2% of sulfur-containing propane sulfonate, 2% of adhesive, 1% of tea polyphenol, 2% of collagen, 2.5% of superfine copper powder, 1% of gelatin and 1.5% of wire-drawing powder.
4. The ultra-thick electrolytic copper foil for the PCB and the preparation method thereof as claimed in claim 1, wherein the raw materials comprise, by weight: 90% of pure copper block, 1% of organic divalent sulfur compound, 1% of sulfur-containing propane sulfonate, 1% of adhesive, 1% of tea polyphenol, 1% of collagen, 3% of superfine copper powder, 1% of gelatin and 1% of wire-drawing powder.
5. The ultra-thick electrolytic copper foil for a PCB according to claims 1 to 4, wherein: the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal induction fan, putting a pure copper block into the copper melting tank to dissolve the pure copper block to prepare a main electrolyte, sequentially adding an organic divalent sulfur compound, sulfur-containing propane sulfonate, a binding agent, tea polyphenol, collagen, superfine copper powder and wire drawing powder into the copper melting tank in the preparation process, and fully stirring the solution in the copper melting tank by using a stirring rod while adding the organic divalent sulfur compound, the sulfur-containing propane sulfonate, the binding agent, the tea polyphenol, the collagen, the superfine copper powder and the wire drawing powder to fully;
s2, carrying out electrolysis copper preparation on the main electrolyte through an anode of an electrolytic cell and a cathode of the electrolytic cell of an electrolysis device, taking out the prepared copper foil, stacking the copper foil in a container for lamination, then stopping stacking after stacking to the required size and thickness, cutting the electrolytic copper foil through a cutting tool, and cutting the electrolytic copper foil into a proper size;
s3, taking out the cut ultra-thick electrolytic copper foil, placing the ultra-thick electrolytic copper foil in an empty container, pouring gelatin into the container to enable the ultra-thick electrolytic copper foil to be soaked in the gelatin, and standing for 10m-15 m;
and S4, taking out the super-thick electrolytic copper foil soaked for a set time, and drying the gelatin on the surface of the super-thick electrolytic copper foil through an air duct to enable the gelatin to be melted into the inside of the super-thick electrolytic copper foil.
6. The ultra-thick electrolytic copper foil for PCB and the preparation method thereof as claimed in claim 5, wherein: the heating temperature in the S1 is 80-90 ℃, and the rotating speed of the stirring rod during stirring is set to be 150/min.
7. The ultra-thick electrolytic copper foil for a PCB and the method for preparing the same according to claim 1, wherein: the wire drawing powder is made of protein fibers, and the particle size of the superfine copper powder is less than 0.01 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011215506.6A CN112376088A (en) | 2020-11-04 | 2020-11-04 | Ultra-thick electrolytic copper foil for PCB and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011215506.6A CN112376088A (en) | 2020-11-04 | 2020-11-04 | Ultra-thick electrolytic copper foil for PCB and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112376088A true CN112376088A (en) | 2021-02-19 |
Family
ID=74579801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011215506.6A Pending CN112376088A (en) | 2020-11-04 | 2020-11-04 | Ultra-thick electrolytic copper foil for PCB and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112376088A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
| CN203722920U (en) * | 2014-02-27 | 2014-07-16 | 长沙牧泰莱电路技术有限公司 | Ultra-thick-copper PCB multilayer board |
| CN105208796A (en) * | 2015-09-14 | 2015-12-30 | 上海美维电子有限公司 | Super-thick copper circuit board fabrication method and super-thick copper circuit board |
| CN110629257A (en) * | 2019-07-05 | 2019-12-31 | 九江德福科技股份有限公司 | Manufacturing method of high-tensile-strength lithium-ion battery copper foil |
| CN111286745A (en) * | 2018-12-06 | 2020-06-16 | 湖北工程学院 | Additive for high-tensile electrolytic copper foil, preparation method of electrolytic copper foil and lithium ion battery |
| CN111315145A (en) * | 2020-04-20 | 2020-06-19 | 深圳市汇和精密电路有限公司 | Lamination process for multilayer PCB |
-
2020
- 2020-11-04 CN CN202011215506.6A patent/CN112376088A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
| CN203722920U (en) * | 2014-02-27 | 2014-07-16 | 长沙牧泰莱电路技术有限公司 | Ultra-thick-copper PCB multilayer board |
| CN105208796A (en) * | 2015-09-14 | 2015-12-30 | 上海美维电子有限公司 | Super-thick copper circuit board fabrication method and super-thick copper circuit board |
| CN111286745A (en) * | 2018-12-06 | 2020-06-16 | 湖北工程学院 | Additive for high-tensile electrolytic copper foil, preparation method of electrolytic copper foil and lithium ion battery |
| CN110629257A (en) * | 2019-07-05 | 2019-12-31 | 九江德福科技股份有限公司 | Manufacturing method of high-tensile-strength lithium-ion battery copper foil |
| CN111315145A (en) * | 2020-04-20 | 2020-06-19 | 深圳市汇和精密电路有限公司 | Lamination process for multilayer PCB |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102127289B (en) | Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same | |
| CN101578010B (en) | Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate | |
| CN102093670A (en) | Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same | |
| CN104284520B (en) | A kind of PCB surface processing method | |
| CN106686905A (en) | Surface mount technology for sheet components | |
| CN107570911A (en) | A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof | |
| CN110254025B (en) | Copper-clad plate production treatment process | |
| CN111681972A (en) | Tool for assisting gold removal of chip with pins and gold removing and tin coating method | |
| CN110452653A (en) | A kind of weather-proof hot melt adhesive of high viscous force and preparation method thereof and hot melt adhesive film | |
| CN112376088A (en) | Ultra-thick electrolytic copper foil for PCB and preparation method thereof | |
| CN102013325A (en) | Electrolyte of wide-temperature long-life patch aluminium electrolytic capacitor and preparation method thereof | |
| CN105215579A (en) | Halogen-free scaling powder and preparation method in a kind of automatic welding machine people solder stick | |
| CN102905463B (en) | PCB (printed circuit board) structure available for grafting and transplanting and PCB structure grafting method | |
| US9707738B1 (en) | Copper foil and methods of use | |
| CN204203153U (en) | A kind of mechanism for detecting electroplated component | |
| CN211595483U (en) | Tab protection adhesive tape | |
| CN111593388A (en) | Preparation method of copper-plated graphite film | |
| CN112654143A (en) | Electrolytic copper foil for multilayer PCB inner-layer plate and preparation method thereof | |
| CN107316747B (en) | The production method of low ESR lamination solid-state aluminum electrolytic capacitor | |
| CN109263230A (en) | A kind of high heat resistance, the preparation method of CEM-1 copper-clad plate | |
| CN201917629U (en) | Short circuit test device for aluminum electrolytic capacitor jacketing machine | |
| CN103978768A (en) | Preparation method for bisphenol A modified phenolic paper-based single-side copper-clad plate | |
| CN105704919B (en) | A kind of production method of edge PTH hole and PCB on PCB | |
| CN201550356U (en) | Circuit board capable of loading large current | |
| CN109518233B (en) | Conductive solution for preventing miniature electronic component from being stuck on chip and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210219 |