CN112654143A - Electrolytic copper foil for multilayer PCB inner-layer plate and preparation method thereof - Google Patents
Electrolytic copper foil for multilayer PCB inner-layer plate and preparation method thereof Download PDFInfo
- Publication number
- CN112654143A CN112654143A CN202011215511.7A CN202011215511A CN112654143A CN 112654143 A CN112654143 A CN 112654143A CN 202011215511 A CN202011215511 A CN 202011215511A CN 112654143 A CN112654143 A CN 112654143A
- Authority
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- Prior art keywords
- copper foil
- copper
- electrolytic copper
- electrolytic
- multilayer pcb
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 155
- 239000011889 copper foil Substances 0.000 title claims abstract description 86
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 50
- 239000010949 copper Substances 0.000 claims abstract description 50
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 34
- 108010010803 Gelatin Proteins 0.000 claims abstract description 17
- 241001122767 Theaceae Species 0.000 claims abstract description 17
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920000159 gelatin Polymers 0.000 claims abstract description 17
- 239000008273 gelatin Substances 0.000 claims abstract description 17
- 235000019322 gelatine Nutrition 0.000 claims abstract description 17
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 17
- 150000008442 polyphenolic compounds Chemical class 0.000 claims abstract description 17
- 235000013824 polyphenols Nutrition 0.000 claims abstract description 17
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims description 25
- 230000008018 melting Effects 0.000 claims description 25
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- 239000003792 electrolyte Substances 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 5
- FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 claims description 2
- 229940053009 ethyl cyanoacrylate Drugs 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000003963 antioxidant agent Substances 0.000 abstract description 3
- 230000003078 antioxidant effect Effects 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract 2
- 239000003973 paint Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Abstract
The invention discloses an electrolytic copper foil for a multilayer PCB inner layer plate, which comprises the following raw materials in parts by weight: the invention relates to the technical field of circuit board electrolytic copper foil, and discloses a copper-based electrolytic copper foil, which comprises 85% -95% of pure copper, 1% -5% of thiourea, 1% -4% of tea polyphenol, 1% -2% of gelatin, 1% -5% of a binder and 1% -3% of copper powder. This multilayer electrolytic copper foil for PCB inner plating and preparation method thereof can let apply to the electrolytic copper foil of PCB inner plating, possess natural antioxidant, make its result of use better, and more convenient when the electrolytic copper foil of final system uses, it is more firm to bind between its multilayer, do not only rely on the industrial glue who paints, let in-service use, the effect of electrolytic copper foil is better, can not appear loosely because of a bit pressure, lead to separating between the multilayer, so just effectual life who prolongs electrolytic copper foil, let people more convenient when using this electrolytic copper foil, this people of being convenient for use.
Description
Technical Field
The invention relates to the technical field of electrolytic copper foil of a circuit board, in particular to an electrolytic copper foil for a multilayer PCB inner-layer plate and a preparation method thereof.
Background
PCB, the name of Chinese is printed circuit board, also known as printed wiring board, is the important electronic part, it is the supporter of the electronic device, it is the carrier that the electronic device connects electrically, because it is made by adopting the electronic printing technology, so called "printed" circuit board, short printed board, it is one of the important parts of the electronic industry, almost every kind of electronic equipment, as small as electronic watch, calculator, as large as computer, communication electronic equipment, military weapon system, as long as there are electronic components such as integrated circuit, etc., in order to make the electrical interconnection between each component, all use the printed board, the printed wiring board is made up of insulating bottom plate, connecting wire and pad assembling and welding the electronic component, have double functions of conducting wire and insulating bottom plate, it can replace the complicated wiring, realize the electrical connection between each component in the circuit, not only simplify the assembly of the electronic product, The welding work reduces the wiring workload in the traditional mode, and greatly lightens the labor intensity of workers; the printed circuit board has good product consistency, can adopt standardized design, is beneficial to realizing mechanization and automation in the production process, and meanwhile, the whole printed circuit board after assembly and debugging can be used as an independent spare part, thereby being convenient for the exchange and maintenance of the products of the whole machine.
The prior electrolytic copper foil for the multilayer PCB inner-layer plate and the preparation method thereof do not contain natural antioxidant, and each layer is only adhered by using glue, so that the tightness degree is not high, and the phenomenon of disconnection caused by the loss of viscosity between the layers is very easy to occur after long-time use, so that the prepared electrolytic copper foil cannot be used, the maintenance cost is extremely high, the service life of the electrolytic copper foil is extremely short indirectly, and the use is not facilitated for people.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an electrolytic copper foil for a multilayer PCB inner layer plate and a preparation method thereof, which solve the problems in the background art.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: an electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 85-95% of pure copper, 1-5% of thiourea, 1-4% of tea polyphenol, 1-2% of gelatin, 1-5% of adhesive and 1-3% of copper powder.
An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 90% of pure copper, 5% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of adhesive and 2% of copper powder.
An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 85% of pure copper, 3% of thiourea, 2% of tea polyphenol, 2% of gelatin, 5% of adhesive and 3% of copper powder.
An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 95% of pure copper, 1% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of adhesive and 1% of copper powder.
Preferably, the preparation method of the electrolytic copper foil for the multilayer PCB inner-layer plate specifically comprises the following steps:
s1, preparing a copper melting tank needed to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting pure copper blocks into the copper melting tank to be dissolved to prepare a main electrolyte, and sequentially adding thiourea, tea polyphenol, gelatin, a binder and copper powder into the copper melting tank in the preparation process to prepare the electrolyte for processing;
s2, carrying out electrolysis on the main electrolyte through an anode of an electrolytic cell and a cathode of the electrolytic cell of an electrolysis device to prepare copper, collecting the copper foil through a mechanical arm gripping device, and cutting the copper foil into required sizes;
s3, coating glue solution on the surface of the manufactured copper foil, then adhering according to the number of layers of the multi-layer copper foil required to be manufactured, adhering the multi-layer copper foil together and standing;
and S4, compacting the integrally bonded multi-layer copper foil through pressing equipment, cleaning the extruded glue solution while pressing, trimming the surface of the copper foil, pressing for 5-10 minutes, and taking out the copper foil.
Preferably, the glue solution in S4 is an industrial glue solution made of ethyl cyanoacrylate.
Preferably, the concentration of the sulfuric acid in the S1 is 92.3% concentrated sulfuric acid, and the particle size of the copper powder is 0.01 μm.
(III) advantageous effects
The invention provides an electrolytic copper foil for a multilayer PCB inner layer board and a preparation method thereof. The electrolytic copper foil for the multilayer PCB inner-layer plate and the preparation method thereof have the advantages that the electrolytic copper foil applied to the PCB inner-layer plate is provided with the natural antioxidant, so that the using effect is better, the finally prepared electrolytic copper foil is more convenient to use, the adhesion among the multiple layers is firmer, and the electrolytic copper foil is not only dependent on the coated industrial glue, so that the electrolytic copper foil is better in effect in actual use, the looseness caused by a little pressure can be avoided, the multiple layers are separated, the service life of the electrolytic copper foil is effectively prolonged, more convenience is brought to people when the electrolytic copper foil is used, and the electrolytic copper foil is convenient to use.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 90% of pure copper, 5% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of adhesive and 2% of copper powder, wherein the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank needed to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting 90% of pure copper into the copper melting tank to be dissolved to prepare a main electrolyte, and adding 5% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of a binder and 2% of copper powder into the copper melting tank in sequence during the preparation process to prepare the electrolyte for processing.
And S2, carrying out electrolysis on the main electrolyte through the anode and the cathode of the electrolytic cell of the electrolysis equipment to prepare copper, collecting the copper foil through a mechanical arm gripping device, and cutting the copper foil into required sizes.
And S3, coating glue solution on the surface of the prepared copper foil, then adhering according to the number of layers of the multilayer copper foil prepared according to the requirement, adhering the multilayer copper foils together and standing.
And S4, compacting the integrally bonded multi-layer copper foil through pressing equipment, cleaning the extruded glue solution while pressing, trimming the surface of the copper foil, pressing for 6 minutes, and taking out the copper foil.
Example two
An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 85% of pure copper, 3% of thiourea, 2% of tea polyphenol, 2% of gelatin, 5% of adhesive and 3% of copper powder, and the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank needed to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting 85% of pure copper into the copper melting tank to dissolve the pure copper to prepare a main electrolyte, and adding 3% of thiourea, 2% of tea polyphenol, 2% of gelatin, 5% of a binder and 3% of copper powder into the copper melting tank in sequence during the preparation process to prepare the electrolyte for processing.
And S2, carrying out electrolysis on the main electrolyte through the anode and the cathode of the electrolytic cell of the electrolysis equipment to prepare copper, collecting the copper foil through a mechanical arm gripping device, and cutting the copper foil into required sizes.
And S3, coating glue solution on the surface of the prepared copper foil, then adhering according to the number of layers of the multilayer copper foil prepared according to the requirement, adhering the multilayer copper foils together and standing.
And S4, compacting the integrally bonded multi-layer copper foil through pressing equipment, cleaning the extruded glue solution while pressing, trimming the surface of the copper foil, pressing for 10 minutes, and taking out the copper foil.
EXAMPLE III
An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 95% of pure copper, 1% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of adhesive and 1% of copper powder, and the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank needed to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting 95% of pure copper into the copper melting tank to dissolve the pure copper to prepare a main electrolyte, sequentially adding 1% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of a binder and 1% of copper powder into the copper melting tank in the preparation process, and then preparing the electrolyte for processing.
And S2, carrying out electrolysis on the main electrolyte through the anode and the cathode of the electrolytic cell of the electrolysis equipment to prepare copper, collecting the copper foil through a mechanical arm gripping device, and cutting the copper foil into required sizes.
And S3, coating glue solution on the surface of the prepared copper foil, then adhering according to the number of layers of the multilayer copper foil prepared according to the requirement, adhering the multilayer copper foils together and standing.
And S4, compacting the integrally bonded multi-layer copper foil through pressing equipment, cleaning the extruded glue solution while pressing, trimming the surface of the copper foil, pressing for 7 minutes, and taking out the copper foil.
Procedure of experiment
1. And (3) detecting the oxidation speed, namely respectively placing the products prepared in the three embodiments on a laboratory table in an oxidation reactor, starting the reactor, recording the oxidation resistance speed of the multilayer electrolytic copper foil, keeping the oxidation resistance speed in the oxidation reactor for a long time without oxidation, and recording data.
2. Tensile strength test, the products obtained in the three examples were placed on a tensile tester and subjected to a tensile test, which required to be kept intact at this compressive strength for five minutes, and then the maximum tensile pressure was recorded.
3. And (3) testing the bonding degree, namely respectively placing the products prepared in the three embodiments between two mechanical arms of the detection equipment on the side, starting the detection equipment, screwing and bending the multiple layers of electrolytic copper foils by the mechanical arms, testing the bonding degree of the multiple layers, recording the separation or disconnection between the layers of the multiple layers of electrolytic copper foils within a long time under the state, and recording.
Results of the experiment
Randomly selecting the existing multilayer PCB electrolytic copper foil on the market as a control group, respectively detecting the oxidation speed, the tensile strength and the bonding degree of the multilayer PCB electrolytic copper foil, and recording the result after the detection conditions are consistent with the above conditions to obtain the following table chart, wherein the table chart shows that the product prepared in the example 1 has the best effects of oxidation speed, tensile strength and bonding degree.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An electrolytic copper foil for a multilayer PCB inner layer board comprises the following raw materials in parts by weight: 85-95% of pure copper, 1-5% of thiourea, 1-4% of tea polyphenol, 1-2% of gelatin, 1-5% of adhesive and 1-3% of copper powder.
2. The electrolytic copper foil for the inner layer plate of the multilayer PCB as claimed in claim 1, which comprises the following raw materials in parts by weight: 90% of pure copper, 5% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of adhesive and 2% of copper powder.
3. The electrolytic copper foil for the inner layer plate of the multilayer PCB as claimed in claim 1, which comprises the following raw materials in parts by weight: 85% of pure copper, 3% of thiourea, 2% of tea polyphenol, 2% of gelatin, 5% of adhesive and 3% of copper powder.
4. The electrolytic copper foil for the inner layer plate of the multilayer PCB as claimed in claim 1, which comprises the following raw materials in parts by weight: 95% of pure copper, 1% of thiourea, 1% of tea polyphenol, 1% of gelatin, 1% of adhesive and 1% of copper powder.
5. The electrolytic copper foil for an inner layer of a multilayer PCB according to claims 1 to 4, wherein: the preparation method specifically comprises the following steps:
s1, preparing a copper melting tank needed to be used, pouring a sulfuric acid solution into the copper melting tank, heating the copper melting tank by using a thermal fan, putting pure copper blocks into the copper melting tank to be dissolved to prepare a main electrolyte, and sequentially adding thiourea, tea polyphenol, gelatin, a binder and copper powder into the copper melting tank in the preparation process to prepare the electrolyte for processing;
s2, carrying out electrolysis on the main electrolyte through an anode of an electrolytic cell and a cathode of the electrolytic cell of an electrolysis device to prepare copper, collecting the copper foil through a mechanical arm gripping device, and cutting the copper foil into required sizes;
s3, coating glue solution on the surface of the manufactured copper foil, then adhering according to the number of layers of the multi-layer copper foil required to be manufactured, adhering the multi-layer copper foil together and standing;
and S4, compacting the integrally bonded multi-layer copper foil through pressing equipment, cleaning the extruded glue solution while pressing, trimming the surface of the copper foil, pressing for 5-10 minutes, and taking out the copper foil.
6. The electrolytic copper foil for an inner layer board of a multilayer PCB as claimed in claim 5, wherein: the glue solution in the S4 is industrial glue solution made of ethyl cyanoacrylate.
7. The electrolytic copper foil for an inner layer board of a multilayer PCB as claimed in claim 5, wherein: the concentration of sulfuric acid in the S1 is 92.3% concentrated sulfuric acid, and the particle size of the copper powder is 0.01 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011215511.7A CN112654143A (en) | 2020-11-04 | 2020-11-04 | Electrolytic copper foil for multilayer PCB inner-layer plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011215511.7A CN112654143A (en) | 2020-11-04 | 2020-11-04 | Electrolytic copper foil for multilayer PCB inner-layer plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112654143A true CN112654143A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011215511.7A Pending CN112654143A (en) | 2020-11-04 | 2020-11-04 | Electrolytic copper foil for multilayer PCB inner-layer plate and preparation method thereof |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337566A (en) * | 2011-10-28 | 2012-02-01 | 广东嘉元科技股份有限公司 | Method for manufacturing ultrathin electrolytic copper foil for new energy resource power battery |
| JP2014101581A (en) * | 2013-12-25 | 2014-06-05 | Furukawa Electric Co Ltd:The | Electrolytic copper alloy foil, its manufacturing method, electrolyte used for its manufacturing, negative electrode collector for secondary battery, secondary battery and its electrode |
| CN104862739A (en) * | 2015-04-21 | 2015-08-26 | 郎溪县鑫科金属科技有限公司 | Additive for improving stability of copper electrolyte and preparation method thereof |
| CN108677223A (en) * | 2018-06-21 | 2018-10-19 | 广东嘉元科技股份有限公司 | A kind of manufacturing method of the super book electrolytic copper foil of new energy resource power battery |
-
2020
- 2020-11-04 CN CN202011215511.7A patent/CN112654143A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337566A (en) * | 2011-10-28 | 2012-02-01 | 广东嘉元科技股份有限公司 | Method for manufacturing ultrathin electrolytic copper foil for new energy resource power battery |
| JP2014101581A (en) * | 2013-12-25 | 2014-06-05 | Furukawa Electric Co Ltd:The | Electrolytic copper alloy foil, its manufacturing method, electrolyte used for its manufacturing, negative electrode collector for secondary battery, secondary battery and its electrode |
| CN104862739A (en) * | 2015-04-21 | 2015-08-26 | 郎溪县鑫科金属科技有限公司 | Additive for improving stability of copper electrolyte and preparation method thereof |
| CN108677223A (en) * | 2018-06-21 | 2018-10-19 | 广东嘉元科技股份有限公司 | A kind of manufacturing method of the super book electrolytic copper foil of new energy resource power battery |
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Application publication date: 20210413 |