CN112355885A - Grinding device for semiconductor preparation - Google Patents
Grinding device for semiconductor preparation Download PDFInfo
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- CN112355885A CN112355885A CN202011193550.1A CN202011193550A CN112355885A CN 112355885 A CN112355885 A CN 112355885A CN 202011193550 A CN202011193550 A CN 202011193550A CN 112355885 A CN112355885 A CN 112355885A
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- 238000000227 grinding Methods 0.000 title claims abstract description 154
- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 230000000670 limiting effect Effects 0.000 claims abstract description 38
- 230000006978 adaptation Effects 0.000 claims abstract description 14
- 239000000428 dust Substances 0.000 claims description 263
- 239000002245 particle Substances 0.000 claims description 29
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- 238000005498 polishing Methods 0.000 claims description 17
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- 238000004519 manufacturing process Methods 0.000 claims description 12
- 244000309464 bull Species 0.000 claims description 7
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- 230000035939 shock Effects 0.000 abstract description 9
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 abstract description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0046—Column grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N2015/0096—Investigating consistence of powders, dustability, dustiness
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Abstract
The invention relates to the technical field of grinding, and discloses a grinding device for semiconductor preparation, which comprises a grinding frame body, wherein two groups of first hydraulic cylinders are fixedly connected to the inner wall of the bottom of the grinding frame body, moving plates are fixedly connected to the top ends of the two groups of first hydraulic cylinders, a first motor frame is arranged on the upper surface of each moving plate, and a first motor is arranged inside each first motor frame. This grinder for semiconductor preparation, exert a decurrent power to the support column through grinding a body, the support column drives the limiting plate downstream, limiting plate downstream extrusion spring, utilize the elasticity of spring, carry out the shock attenuation to the device, the size of limiting plate and the size looks adaptation of placing the piece simultaneously, it has played limiting displacement to the removal of limiting plate to place the piece, the stability of device has been improved, be the rubber slab through the backing plate, utilize the elasticity of rubber slab, make second fixed plate and ground contact when, slow down the impact force.
Description
Technical Field
The invention relates to the technical field of grinding, in particular to a grinding device for semiconductor preparation.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and most electronic products, such as computers, mobile phones or core units in digital recorders, are closely related to the semiconductor. In the semiconductor manufacturing, a grinding device is required to be used for grinding a semiconductor material, the clamping effect of the existing grinding machine is poor, and when the grinding device grinds the semiconductor material, the situation that the semiconductor material slides easily occurs due to the poor clamping effect of the grinding device, so that the grinding and polishing machine is influenced for grinding the semiconductor material.
Disclosed a semiconductor material grinds processingequipment in chinese patent publication No. CN210909501U, this semiconductor material grinds processingequipment, adjusts pole one end through simple pushing down and can realize the removal of grinding miller to the operation of polishing that conveniently quick makes the device is simpler, through fixture, improves the stability of grinding, but this kind of mode has very big defect: manual operation is needed, labor cost is improved, and working efficiency is reduced.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a grinding device for semiconductor preparation, which is used for solving the problem that manual operation is needed in the background technology, improving the labor cost and reducing the working efficiency.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a grinding device for semiconductor preparation comprises a grinding frame body, wherein two groups of first hydraulic cylinders are fixedly connected to the inner wall of the bottom of the grinding frame body, a moving plate is fixedly connected to the top ends of the two groups of first hydraulic cylinders, a first motor frame is arranged on the upper surface of the moving plate, a first motor is arranged inside the first motor frame, the output end of the first motor is fixedly connected with the top end of a rotating shaft, the bottom end of the rotating shaft penetrates through the moving plate to be fixedly connected with grinding wheels, two groups of fixed blocks are fixedly connected to the inner wall of the bottom of the grinding frame body, two groups of second hydraulic cylinders are respectively and fixedly connected to the front side and the rear side of each fixed block, the output end of each second hydraulic cylinder is fixedly connected with one end of a clamping plate, a semiconductor plate is fixedly connected to the other end of the clamping plate, a supporting column is fixedly connected to the bottom of the, the left end and the right end of the first fixing plate are rotatably connected with two groups of first fixing shafts, the first fixing shafts are fixedly connected with one ends of the rotating rods, the other ends of the rotating rods are rotatably connected with the second fixing shafts, the second fixing shafts are fixedly connected with the second fixing plate, and a base plate is arranged on the lower surface of the second fixing plate.
Preferably, the bottom four corners of grinding frame body respectively with four group's support column top fixed connection, the bottom of support column is connected with the last fixed surface of limiting plate, the lower surface of limiting plate and the top fixed connection of spring, the bottom of spring and the bottom inner wall fixed connection who places the piece, the inside of placing the piece is provided with first groove, the width of first groove and the width looks adaptation of limiting plate, the length of first groove and the length looks adaptation of limiting plate.
Preferably, the left and right sides of movable plate all is provided with the second groove, the quantity in second groove is four groups, both ends and the back of back shaft both ends fixed connection in second groove, the back shaft rotates with the pulley to be connected, the quantity in pulley is unanimous with the quantity in second groove, the left and right sides inner wall of grinding frame body is provided with two sets of spacing grooves respectively, spacing groove and pulley sliding connection, the width of spacing groove and the width looks adaptation of movable plate.
Preferably, the upper surface of backing plate and the lower surface fixed connection of second fixed plate, the size of backing plate and the size looks adaptation of second fixed plate, the backing plate is the rubber slab.
Preferably, the upper surface of the moving plate is fixedly connected with the lower surface of a first motor frame, the first motor frame is a U-shaped structure with an upward opening, and the first motor frame is fixedly connected with a first motor.
Preferably, two groups of empty grooves are respectively formed in the left end and the right end of the upper surface of the second fixing plate, and two ends of the through groove are respectively fixedly connected with two ends of the second fixing shaft.
Preferably, the clamping plates are of a curved structure, the side, close to the semiconductor board, of each clamping plate is provided with an anti-slip pad, the number of the clamping plates is four, and each two groups of the clamping plates are symmetrically arranged about a vertical centerline of the semiconductor board.
Preferably, the dust collecting device further comprises a dust collecting device comprising:
the grinding rack comprises a grinding rack body, a dust collecting plate and a grinding wheel, wherein clamping grooves are formed in two sides of the grinding rack body, the dust collecting plate is clamped in the grinding rack body through the clamping grooves, the tail end of the dust collecting plate is in sliding fit with the clamping grooves, the part of the dust collecting plate, which extends into the clamping grooves, is connected with the clamping grooves through elastic buffer parts, and the dust collecting plate can move in the grinding rack body along the clamping grooves;
a dust collection box is arranged on one side of the grinding frame body and is divided into an upper box body and a lower box body, the upper box body and the lower box body are detachably connected, a dust collection interface is arranged on the upper box body, a connector matched with the dust collection interface is arranged on the grinding frame body, the dust collection box is communicated with the inside of the grinding frame body through the matching of the dust collection interface and the connector, and a filter screen is movably connected in the lower box body;
the second motor is fixed outside the grinding frame body, the driving shaft penetrates through the grinding frame body and is rotatably connected with the grinding frame body through a bearing fixed in the side wall of the grinding frame body, the output end of the second motor is connected with one end of the driving shaft through a coupling in a transmission manner, the other end of the driving shaft is fixedly connected with one end of a transmission rod, the other end of the transmission rod is rotatably connected with one end of a push rod, and the other end of the push rod is detachably connected with one side of the dust collecting plate;
the driving shaft is also fixedly connected with a cam;
a sliding frame is arranged on one side, close to the dust collection box, in the grinding frame body, a sliding block capable of sliding along the sliding frame is arranged on the sliding frame, one side of the sliding block is fixedly connected with one end of a brush rod, the other side of the sliding block is in contact with the cam, the other end of the brush rod penetrates through the side wall of the grinding frame body and extends into the lower box body, one end, extending into the lower box body, of the brush rod is provided with a brush head, the brush head is in contact with the filter screen, a part, located in the grinding frame body, of the brush rod is sleeved with a return spring, one end of the return spring is in contact with the inner wall of the grinding frame body, and the other end of the return spring is in contact with;
a fan is arranged on one side, opposite to the dust collecting interface, in the grinding frame body;
the inner side of the top of the grinding frame body is provided with a discharge plate.
Preferably, the grinding rack further comprises a controller, the controller is electrically connected with a dust remover, the dust remover is arranged in the grinding rack body, and the dust remover comprises a box body and a fan;
the two opposite sides in the box body are respectively provided with a positive plate and a negative plate, the box body is provided with an air inlet, the fan is positioned in the grinding rack body, and an air outlet of the fan is communicated with the air inlet of the box body and is used for injecting dust-containing gas in the grinding rack body into the box body;
the dust concentration detector is arranged in the grinding frame body and used for detecting the dust concentration in the grinding frame body;
the flow sensor is arranged at an air inlet of the box body and used for detecting the flow of the gas entering the box body;
the controller controls the dust remover to work based on the detection values of the dust concentration detector and the flow sensor, and specifically comprises the following steps:
step 1: when the detection value of the dust concentration detector exceeds the maximum value of the set dust concentration standard range, the controller controls the dust remover to work, and the dust remover is arranged in the dust removerAfter a certain time w, the controller calculates the volume V of the dust-containing gas processed by the dust remover in the time w according to the detection value of the flow sensor in the time w1；
Q (t) is a detection value of the flow sensor at the time t;
step 2: the controller calculates the driving speed of the charged particles in the dust remover based on the calculation result of the formula (1);
v is the driving speed of the charged particles in the dust remover;
f is the electric field force borne by the charged particles in the dust remover;
u is the voltage between the positive plate and the negative plate;
i is the working current of the positive plate and the negative plate;
d is the distance between the positive plate and the negative plate;
m is the mass of the dusty gas treated by the dust remover;
τ1is the dielectric constant of the dusty gas in the grinding rack body;
τ0for vacuum dielectric constant, take 8.85X 10-12；
d1Is the diameter of the dust particles;
V2is the volume inside the grinding rack body;
and step 3: the controller obtains the dust removal efficiency of the current dust remover through a formula (3) based on the calculation result of the formula (2);
epsilon is the dust removal efficiency of the current dust remover;
exp is an exponential function with a natural constant e as a base, and e is 2.72;
x is the diffusion coefficient of dust particles;
l is the length of an exhaust pipeline of the fan;
omega is the speed of the airflow blown out by the fan;
and 4, step 4: the controller compares the obtained dust removal efficiency of the current dust remover with a target dust removal efficiency, and when the current dust removal efficiency is lower than the target dust removal efficiency, the controller changes the driving speed of charged particles in the dust remover by adjusting the voltage between the positive plate and the negative plate until the dust removal efficiency of the dust remover reaches the target dust removal efficiency;
and 5: the controller controls the dust remover to work until the dust concentration detector detects that the dust concentration in the grinding frame body is within a set dust concentration standard range, and the controller controls the dust remover to stop working.
(III) advantageous effects
Compared with the prior art, the invention provides a grinding device for semiconductor preparation, which has the following beneficial effects:
1. this grinder for semiconductor preparation, exert a decurrent power to the support column through grinding a body, the support column drives the limiting plate downstream, limiting plate downstream extrusion spring, utilize the elasticity of spring, carry out the shock attenuation to the device, the size of limiting plate and the size looks adaptation of placing the piece simultaneously, it has played limiting displacement to the removal of limiting plate to place the piece, the stability of device has been improved, be the rubber slab through the backing plate, utilize the elasticity of rubber slab, make second fixed plate and ground contact when, slow down the impact force.
2. This grinder for semiconductor preparation, through the cooperation of first fixed plate, first fixed axle, bull stick, second fixed axle and second fixed plate, carry out the shock attenuation to the horizontal direction of device, improved the shock attenuation effect of device, play the effect that reduces friction through the pulley, prevent the produced frictional force of the bottom of movable plate direct contact spacing inslot wall, set up the spacing groove and play limiting displacement to the movable plate, prevent that it breaks away from the grinding frame body when reciprocating, improved the stability that the device goes up and down.
3. This grinder for semiconductor preparation all is provided with the second groove through the left and right sides of movable plate, and the quantity of second groove is four groups, both ends and the both ends fixed connection around the back shaft in second groove, and the back shaft rotates with the pulley to be connected, and the quantity of pulley is unanimous with the quantity in second groove, grinds the left and right sides inner wall of frame body and is provided with two sets of spacing grooves respectively, spacing groove and pulley sliding connection, the width of spacing groove and the width looks adaptation of movable plate, make the movable plate stable go up and down.
4. This grinder for semiconductor system, under the mating reaction through first motor, pivot and grinding miller, realized the work of polishing to the semiconductor board, improved the efficiency of polishing, support the second pneumatic cylinder through the fixed block for the stable work of developing of second pneumatic cylinder, second pneumatic cylinder and grip block cooperation carry out the centre gripping to the semiconductor board, have avoided taking place to rock at the in-process of polishing, and cause the problem of polishing injustice to take place.
5. According to the grinding device for semiconductor preparation, through the matching of the second motor, the driving shaft, the transmission rod and the push rod, the second motor drives the driving shaft to rotate to drive the transmission rod to rotate along the driving shaft, and the push rod pushes or pulls the dust collecting plate along with the rotation of the transmission rod, so that the effect of performing rapping dust removal on the dust collecting plate is achieved; the edge of the dust collecting plate is connected in the clamping groove through the elastic buffer room, so that the effects of limiting and preventing falling and buffering and damping are achieved in the process that the dust collecting plate moves along the clamping groove, and the service life of the dust collecting plate is prolonged; the filter screen is arranged in the lower box body of the dust collection box, so that dust particles entering the dust collection box pass through the filter screen and enter the lower box body, large objects such as small parts accidentally dropped in the grinding device are intercepted, and the small parts can be quickly found when accidentally dropped; promote the sliding block through fixing the cam of drive epaxial and slide on the sliding rack, reset spring atress compression, the sliding block drives brush-holder stud synchronous motion, when the cam does not promote the sliding block, reset spring loses the external pressure reconversion, it slides along the sliding rack to drive the sliding block, the brush-holder stud is along with the sliding block synchronous motion, when the brush-holder stud moves along with the sliding block, brush head on the brush-holder stud cleans the filter screen, avoid because the filter screen blocks up to cause the dust granule to pile up on the filter screen, the unable condition that gets into in the lower box.
6. The grinding device for semiconductor preparation monitors the dust concentration in a grinding frame body in real time through an arranged dust concentration detector, when the detection value of the dust concentration detector exceeds the maximum value of a set dust concentration standard range, a controller controls a dust remover to start working, the flow of dust-containing gas entering the dust remover is monitored in real time through the arranged flow sensor, after the dust remover works for a certain time, the controller calculates the volume of the dust-containing gas treated by the dust remover in the time based on the detection value of the flow sensor in the time, and calculates the driving speed of charged particles in the dust remover based on the voltage between a positive plate and a negative plate in the dust remover so as to calculate the dust removal efficiency of the dust remover in the time; the controller compares the obtained dust removal efficiency of the dust remover in the period of time with a target dust removal efficiency, and if the obtained dust removal efficiency is lower than the target dust removal efficiency, the controller changes the advancing speed of charged particles in the dust remover by adjusting the voltage between the positive plate and the negative plate until the dust removal efficiency of the dust remover reaches the target dust removal efficiency; the controller controls the dust remover to work until the dust concentration detector detects that the dust concentration in the grinding frame body is within a set dust concentration standard range, and the controller controls the dust remover to stop working. In conclusion, the dust remover can be automatically started and stopped according to actual working conditions, the optimal dust removing efficiency is guaranteed to be kept by adjusting the working voltage, the problem that manual cleaning can be carried out only in a shutdown state is solved, dust particles generated by grinding are cleaned in the process of working, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a structure of a clamping plate according to the present invention;
FIG. 3 is a schematic view of the pulley of the present invention;
FIG. 4 is a schematic view of the structure of the rotating rod of the present invention;
FIG. 5 is a schematic view of the spring structure of the present invention;
FIG. 6 is a schematic view of the dust collector of the present invention;
fig. 7 is a schematic structural view of a second motor driving part according to the present invention.
In the figure: 1. a grinding frame body; 2. a first hydraulic cylinder; 3. moving the plate; 4. a first motor mount; 5. a first motor; 6. a rotating shaft; 7. a grinding wheel; 8. a limiting groove; 9. a semiconductor board; 10. a fixed block; 11. a second hydraulic cylinder; 12. a clamping plate; 13. a support shaft; 14. a pulley; 15. a first fixing plate; 16. a first fixed shaft; 17. a rotating rod; 18. a base plate; 19. a second fixing plate; 20. a second fixed shaft; 21. a support pillar; 22. a limiting plate; 23. a spring; 24. placing the blocks; 25. a dust collecting plate; 26. a card slot; 27. an elastic buffer member; 28. a dust collection box; 281. an upper box body; 282. a lower box body; 283. a dust collection interface; 284. filtering with a screen; 29. a second motor; 30. a drive shaft; 31. a transmission rod; 32. a push rod; 33. a cam; 34. a sliding frame; 35. a sliding block; 36. a brush bar; 37. a return spring; 38. a fan; 39. and a discharge plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a grinding device for semiconductor preparation comprises a grinding frame body 1, wherein two groups of first hydraulic cylinders 2 are fixedly connected to the inner wall of the bottom of the grinding frame body 1, the two groups of first hydraulic cylinders 2 are symmetrically arranged about the vertical centerline of the grinding frame body 1, the types of the first hydraulic cylinders 2 are HOB40, moving plates 3 are fixedly connected to the top ends of the two groups of first hydraulic cylinders 2, a first motor frame 4 is arranged on the upper surface of the moving plate 3, a first motor 5 is arranged inside the first motor frame 4, the output end of the first motor 5 is fixedly connected with the top end of a rotating shaft 6, the bottom end of the rotating shaft 6 penetrates through the moving plates 3 to be fixedly connected with grinding wheels 7, two groups of fixed blocks 10 are fixedly connected to the inner wall of the bottom of the grinding frame body 1, two groups of second hydraulic cylinders 11 are fixedly connected to the front side and the rear side of each fixed block 10, the output end of each second hydraulic cylinder 11 is fixedly connected, the bottom fixedly connected with support column 21 of grinding frame body 1 grinds the lower surface fixedly connected with first fixed plate 15 of frame body 1, and both ends are rotated and are connected with two sets of first fixed axles 16 about first fixed plate 15, first fixed axle 16 and the one end fixed connection of bull stick 17, and the other end and the second fixed axle 20 of bull stick 17 rotate and are connected, second fixed axle 20 and second fixed plate 19 fixed connection, and the lower surface of second fixed plate 19 is provided with backing plate 18.
Specifically, in order to carry out the shock attenuation to the device, the bottom four corners that has set up grinding frame body 1 respectively with the 21 top fixed connection of four group's support columns, the bottom of support column 21 and limiting plate 22's last fixed surface are connected, limiting plate 22's lower surface and spring 23's top fixed connection, spring 23's bottom and the bottom inner wall fixed connection who places piece 24, the inside of placing piece 24 is provided with first groove, the width in first groove and limiting plate 22's width looks adaptation, the length in first groove and limiting plate 22's length looks adaptation, utilize spring 23's elasticity to carry out the shock attenuation, the shock attenuation effect has been improved.
Specifically, in order to make the movable plate 3 go up and down stably, the left and right sides that have set up the movable plate 3 all is provided with the second groove, the quantity of second groove is four groups, both ends and the front and back both ends fixed connection of back shaft 13 in the second groove, back shaft 13 rotates with pulley 14 and is connected, the quantity of pulley 14 is unanimous with the quantity in second groove, the left and right sides inner wall of grinding frame body 1 is provided with two sets of spacing grooves 8 respectively, spacing groove 8 and pulley 14 sliding connection, the width of spacing groove 8 and the width looks adaptation of movable plate 3, play the effect of reducing friction through pulley 14, prevent the produced frictional force of the bottom of movable plate 3 direct contact spacing groove 8 inner wall.
Specifically, in order to protect the device, the upper surface of the backing plate 18 is fixedly connected with the lower surface of the second fixing plate 19, the size of the backing plate 18 is matched with that of the second fixing plate 19, the backing plate 18 is a rubber plate, and impact force generated in the working process is relieved by the elasticity of the rubber plate.
Specifically, for fixed first motor 5, the lower surface fixed connection of the upper surface that has set up movable plate 3 and first motor frame 4, first motor frame 4 is the ascending U-shaped structure of opening, first motor frame 4 and first motor 5 fixed connection, and first motor frame 4 can be fixed first motor 5, has avoided because of lacking fixing device, leads to first motor 5 unstable situation to appear in the during operation.
Specifically, in order to support the rotation of the rotating rod 17, two sets of empty grooves are respectively formed at the left end and the right end of the upper surface of the second fixing plate 19, and two ends of each through groove are respectively fixedly connected with two ends of the second fixing shaft 20, so that the rotating rod 17 can stably deflect.
Specifically, in order to protect the semiconductor board 9, the clamping plates 12 are of a curved structure, anti-slip pads are arranged on one sides, close to the semiconductor board 9, of the clamping plates 12, the clamping plates 12 are four groups, and each two groups of clamping plates 12 are symmetrically arranged about a vertical centerline of the semiconductor board 9, so that the semiconductor board 9 is prevented from being damaged due to overlarge clamping force.
When the grinding rack is used, a semiconductor board 9 is placed on the upper surface of a grinding rack body 1, a second hydraulic cylinder 11 is started, the second hydraulic cylinder 11 pushes a clamping plate 12 to move, so that the clamping plate 12 is in contact with the semiconductor board 9 to clamp and fix the semiconductor board 9, then a first hydraulic cylinder 2 is started, the first hydraulic cylinder 2 drives a moving plate 3 to move downwards, when a grinding wheel 7 is in contact with the semiconductor board 9, the first hydraulic cylinder 2 stops working, the first motor 5 is electrified, the first motor 5 drives a rotating shaft 6 to rotate, the rotating shaft 6 drives the grinding wheel 7 to rotate at a high speed, so that the surface of the semiconductor board 9 is ground, certain vibration is generated in the working process, so that the grinding rack body 1 has a downward acting force on a supporting column 21, the supporting column 21 pushes a limiting plate 22 downwards to move, and the limiting plate 22 has an extrusion force on a spring 23, utilize the elasticity of spring 23 to cushion, slow down the vibrations of vertical direction, when grinding a body 1 lapse simultaneously, grind a body 1 and drive first fixed plate 15 downwards, reach backing plate 18 and ground contact, the bull stick 17 can use the link of first fixed axle 16 and bull stick 17 to deflect as the fulcrum to realized the shock attenuation of horizontal direction, improved the shock attenuation effect.
In conclusion, according to the grinding device for semiconductor preparation, a downward force is applied to the supporting column 21 through the grinding frame body 1, the supporting column 21 drives the limiting plate 22 to move downwards, the limiting plate 22 extrudes the spring 23 downwards, the device is damped by the elasticity of the spring 23, meanwhile, the size of the limiting plate 22 is matched with the size of the placing block 24, the placing block 24 has a limiting effect on the movement of the limiting plate 22, the stability of the device is improved, the backing plate 18 is a rubber plate, the impact force is reduced when the second fixing plate 19 is contacted with the ground by the elasticity of the rubber plate, the horizontal direction of the device is damped through the matching of the first fixing plate 15, the first fixing shaft 16, the rotating rod 17, the second fixing shaft 20 and the second fixing plate 19, the damping effect of the device is improved, the friction reducing effect is achieved through the pulley 14, and the friction force generated when the moving plate 3 is directly contacted with the bottom of the inner wall of the limiting groove 8 is, the limiting grooves 8 are arranged to limit the moving plate 3 and prevent the moving plate from being separated from the grinding rack body 1 when moving up and down, the lifting stability of the device is improved, the left side and the right side of the moving plate 3 are provided with the second grooves, the number of the second grooves is four, two ends of the second grooves are fixedly connected with the front end and the rear end of the supporting shaft 13, the supporting shaft 13 is rotatably connected with the pulleys 14, the number of the pulleys 14 is consistent with that of the second grooves, two groups of limiting grooves 8 are respectively arranged on the inner walls of the left side and the right side of the grinding rack body 1, the limiting grooves 8 are slidably connected with the pulleys 14, the width of the limiting grooves 8 is matched with the width of the moving plate 3, the moving plate 3 is stably lifted, the grinding work of the semiconductor plate 9 is realized under the matching action of the first motor 5, the rotating shaft 6 and the grinding wheel 7, the grinding efficiency is improved, the second, the work of developing that makes second hydraulic cylinder 11 stable, second hydraulic cylinder 11 and clamping plate 12 cooperation carry out the centre gripping to semiconductor plate 9, have avoided taking place to rock at the in-process of polishing, and cause the uneven problem of polishing to take place.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
Referring to fig. 6-7, the present invention provides a technical solution: a grinding apparatus for semiconductor production, further comprising a dust collecting device, the dust collecting device comprising:
the grinding rack comprises a dust collecting plate 25, wherein clamping grooves 26 are formed in two sides of the grinding rack body 1, the dust collecting plate 25 is clamped in the grinding rack body 1 through the clamping grooves 26, the tail end of the dust collecting plate 25 is in sliding fit with the clamping grooves 26, the part, extending into the clamping grooves 26, of the dust collecting plate 25 is connected with the clamping grooves 26 through an elastic buffer part 6, and the dust collecting plate 25 can move in the grinding rack body 1 along the clamping grooves 26;
a dust collection box 28 is arranged on one side of the grinding frame body 1, the dust collection box 28 is divided into an upper box body 281 and a lower box body 282, the upper box body 281 and the lower box body 282 are detachably connected, a dust collection interface 283 is arranged on the upper box body 281, a connecting port matched with the dust collection interface 283 is arranged on the grinding frame body 1, the dust collection box 28 is communicated with the inside of the grinding frame body 1 through the matching of the dust collection interface 283 and the connecting port, and a filter screen 284 is movably connected in the lower box body 282;
the second motor 29 is fixed outside the grinding frame body 1, the driving shaft 30 penetrates through the grinding frame body 1 and is rotatably connected with the grinding frame body 1 through a bearing fixed in the side wall of the grinding frame body 1, the output end of the second motor 29 is in transmission connection with one end of the driving shaft 30 through a coupler, the other end of the driving shaft 30 is fixedly connected with one end of a transmission rod 31, the other end of the transmission rod 31 is rotatably connected with one end of a push rod 32, and the other end of the push rod 32 is detachably connected with one side of the dust collecting plate 25;
the driving shaft 30 is also fixedly connected with a cam 33;
a sliding frame 34 is arranged on one side of the grinding frame body 1 close to the dust collection box 28, a sliding block 35 capable of sliding along the sliding frame 34 is arranged on the sliding frame 34, one side of the sliding block 35 is fixedly connected with one end of a brush rod 36, the other side of the sliding block 35 is in contact with the cam 33, the other end of the brush rod 36 penetrates through the side wall of the grinding frame body 1 and extends into the lower box 282, a brush head is arranged at one end of the brush rod 36 extending into the lower box 282 and is in contact with the filter screen 284, a return spring 37 is sleeved on the part of the brush rod 36 located in the grinding frame body 1, one end of the return spring 37 is in contact with the inner wall of the grinding frame body 1, and the other end of the return spring 37 is in contact with the sliding block 35;
a fan 38 is arranged on one side of the grinding rack body 1 opposite to the dust collection interface 283;
the inner side of the top of the grinding frame body 1 is provided with a discharge plate 39.
The working principle and the beneficial effects of the technical scheme are as follows:
the dust collecting plate 25 is slidably connected in the grinding rack body 1 through a clamping groove 26 on the grinding rack body 1, the part of the dust collecting plate 25 extending into the clamping groove 26 is connected with the clamping groove 26 through an elastic buffer part 27, the elastic buffer part 27 can be a return spring 37, when the dust collecting plate 25 and the clamping groove 26 slide relatively, the dust collecting plate 25 is limited firstly, the dust collecting plate 25 is prevented from being separated from the clamping groove 26, and the dust collecting plate 25 has a buffering and damping effect secondly, so that hard collision is avoided, and the service life of the dust collecting plate 25 is prolonged; after the second motor 29 is started, the driving shaft 30 rotates synchronously, one end of the transmission rod 31 is fixedly connected to the driving shaft 30, the other end of the transmission rod 31 rotates by taking the driving shaft 30 as a circle center, the other end of the transmission rod 31 is connected with one end of the push rod 32, the other end of the push rod 32 is connected with the dust collecting plate 25, the push rod 32 moves in a reciprocating manner along with the rotation of the transmission rod 31 to push or pull the dust collecting plate 25, so that the dust collecting plate 25 moves in a reciprocating manner along the clamping groove 26, and the effect of vibrating; meanwhile, the fan 38 arranged opposite to the dust collecting port introduces dust into the dust collecting box 28 through air flow when falling on the dust collecting plate 25, and part of water can be injected into the lower box body 282 of the dust collecting box 28 to adsorb the dust when the dust enters, so that secondary dust raising is avoided; the filter screen 284 movably connected in the lower box 282 can filter particles entering the dust box 28, when some small parts in the grinding rack body 1 fall off accidentally, enter the dust box 28 and are mixed with collected dust particles into a whole, so that the small parts are not convenient to find out, the small parts can be intercepted by the filter screen 284 after the filter screen 284 is arranged, and the small parts can be found out quickly after the dust box 28 is taken out; the driving shaft 30 is also connected with a cam 33, the cam 33 rotates along with the driving shaft 30, when the cam 33 pushes the sliding block 35, the sliding block 35 slides on the sliding frame 34, the return spring 37 is pressed to drive the brush rod 36 to move, the brush head connected to the brush rod 36 cleans the filter screen 284, when the cam 33 does not push the sliding block 35, the return spring 37 loses pressure and returns to the original state, and the sliding block 35 slides along the sliding frame 34 under the pushing force of the return spring 37 to return to the original state; to sum up, when grinding wheel 7 carries out the work of polishing to the surface of semiconductor plate 9, polish and can produce tiny dust particle, untimely processing can influence grinder's result of use, through setting up dust collector, can collect the processing to the tiny particle that grinds the production in grinder work, and is high-efficient convenient.
In one embodiment, the grinding rack further comprises a controller, wherein the controller is electrically connected with a dust remover, the dust remover is arranged in the grinding rack body 1, and the dust remover comprises a box body and a fan;
the positive plate and the negative plate are respectively arranged on two opposite sides in the box body, an air inlet is formed in the box body, the fan is positioned in the grinding rack body 1, and an air outlet of the fan is communicated with the air inlet of the box body and is used for injecting dust-containing gas in the grinding rack body 1 into the box body;
the dust concentration detector is arranged in the grinding rack body 1 and is used for detecting the dust concentration in the grinding rack body 1;
the flow sensor is arranged at an air inlet of the box body and used for detecting the flow of the gas entering the box body;
the controller controls the dust remover to work based on the detection values of the dust concentration detector and the flow sensor, and specifically comprises the following steps:
step 1: when the detection value of the dust concentration detector exceeds the set powderWhen the standard range of the dust concentration is maximum, the controller controls the dust remover to work, after a certain time w passes through the dust remover, the controller calculates the volume V of the dust-containing gas processed by the dust remover in the time w according to the detection value of the flow sensor in the time w1；
Q (t) is a detection value of the flow sensor at the time t;
step 2: the controller calculates the driving speed of the charged particles in the dust remover based on the calculation result of the formula (1);
v is the driving speed of the charged particles in the dust remover;
f is the electric field force borne by the charged particles in the dust remover;
u is the voltage between the positive plate and the negative plate;
i is the working current of the positive plate and the negative plate;
d is the distance between the positive plate and the negative plate;
m is the mass of the dusty gas treated by the dust remover;
τ1is the dielectric constant of the dust-containing gas in the grinding rack body (1);
τ0for vacuum dielectric constant, take 8.85X 10-12；
d1Is the diameter of the dust particles;
V2is the volume inside the grinding rack body (1);
and step 3: the controller obtains the dust removal efficiency of the current dust remover through a formula (3) based on the calculation result of the formula (2);
epsilon is the dust removal efficiency of the current dust remover; exp is an exponential function with a natural constant e as a base, and e is 2.72;
x is the diffusion coefficient of dust particles;
l is the length of an exhaust pipeline of the fan;
omega is the speed of the airflow blown out by the fan;
and 4, step 4: the controller compares the obtained dust removal efficiency of the current dust remover with a target dust removal efficiency, and when the current dust removal efficiency is lower than the target dust removal efficiency, the controller changes the driving speed of charged particles in the dust remover by adjusting the voltage between the positive plate and the negative plate until the dust removal efficiency of the dust remover reaches the target dust removal efficiency;
and 5: the controller controls the dust remover to work until the dust concentration detector detects that the dust concentration in the grinding frame body 1 is within a set dust concentration standard range, and the controller controls the dust remover to stop working.
The working principle and the beneficial effects of the technical scheme are as follows:
the dust concentration in the grinding frame body 1 is monitored in real time through an arranged dust concentration detector, when the detection value of the dust concentration detector exceeds the maximum value of a set dust concentration standard range, a controller starts to work, the flow of dust-containing gas entering the dust remover is monitored in real time through a flow sensor, after the dust remover works for a certain time, the controller calculates the volume of the dust-containing gas treated by the dust remover in the time based on the detection value of the flow sensor in the time, and calculates the driving speed of charged particles in the dust remover based on the voltage between a positive plate and a negative plate in the dust remover, so that the dust removal efficiency of the dust remover in the time is calculated; the controller compares the obtained dust removal efficiency of the dust remover in the period of time with a target dust removal efficiency, and if the obtained dust removal efficiency is lower than the target dust removal efficiency, the controller changes the advancing speed of charged particles in the dust remover by adjusting the voltage between the positive plate and the negative plate until the dust removal efficiency of the dust remover reaches the target dust removal efficiency; the controller controls the dust remover to work until the dust concentration detector detects that the dust concentration in the grinding frame body 1 is within a set dust concentration standard range, and the controller controls the dust remover to stop working. In conclusion, the dust remover can be automatically started and stopped according to actual working conditions, the optimal dust removing efficiency is guaranteed to be kept by adjusting the working voltage, the problem that manual cleaning can be carried out only in a shutdown state is solved, dust particles generated by grinding are cleaned in the process of working, and the working efficiency is improved. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A grinding device for semiconductor manufacturing, comprising a grinding frame body (1), characterized in that: the grinding rack is characterized in that two groups of first hydraulic cylinders (2) are fixedly connected to the inner wall of the bottom of the grinding rack body (1), a moving plate (3) is fixedly connected to the top ends of the two groups of first hydraulic cylinders (2), a first motor frame (4) is arranged on the upper surface of the moving plate (3), a first motor (5) is arranged inside the first motor frame (4), the output end of the first motor (5) is fixedly connected with the top end of a rotating shaft (6), the bottom end of the rotating shaft (6) penetrates through the moving plate (3) to be fixedly connected with a grinding wheel (7), two groups of fixing blocks (10) are fixedly connected to the inner wall of the bottom of the grinding rack body (1), two groups of second hydraulic cylinders (11) are fixedly connected to the front side and the rear side of each fixing block (10), the output end of each second hydraulic cylinder (11) is fixedly connected with one end of a clamping plate (12), and a semiconductor plate (9, grind bottom fixedly connected with support column (21) of a body (1), grind first fixed plate (15) of lower fixed surface fixedly connected with of a body (1), both ends are rotated and are connected with two sets of first fixed axles (16) about first fixed plate (15), the one end fixed connection of first fixed axle (16) and bull stick (17), the other end and second fixed axle (20) of bull stick (17) rotate and are connected, second fixed axle (20) and second fixed plate (19) fixed connection, the lower surface of second fixed plate (19) is provided with backing plate (18).
2. A polishing apparatus for semiconductor production according to claim 1, wherein: grind the bottom four corners of frame body (1) respectively with four group's support column (21) top fixed connection, the bottom of support column (21) and the last fixed surface of limiting plate (22) are connected, the lower surface of limiting plate (22) and the top fixed connection of spring (23), the bottom of spring (23) and the bottom inner wall fixed connection who places piece (24), the inside of placing piece (24) is provided with first groove, the width in first groove with the width looks adaptation of limiting plate (22), the length in first groove with the length looks adaptation of limiting plate (22).
3. A polishing apparatus for semiconductor production according to claim 1, wherein: the left and right sides of movable plate (3) all is provided with the second groove, the quantity in second groove is four groups, both ends fixed connection around both ends and back shaft (13) in second groove, back shaft (13) rotate with pulley (14) and are connected, the quantity of pulley (14) with the quantity in second groove is unanimous, the left and right sides inner wall of grinding frame body (1) is provided with two sets of spacing grooves (8) respectively, spacing groove (8) with pulley (14) sliding connection, the width of spacing groove (8) with the width looks adaptation of movable plate (3).
4. A polishing apparatus for semiconductor production according to claim 1, wherein: the upper surface of backing plate (18) with the lower surface fixed connection of second fixed plate (19), the size of backing plate (18) with the size looks adaptation of second fixed plate (19), backing plate (18) are the rubber slab.
5. A polishing apparatus for semiconductor production according to claim 1, wherein: the upper surface of the moving plate (3) is fixedly connected with the lower surface of the first motor frame (4), the first motor frame (4) is of a U-shaped structure with an upward opening, and the first motor frame (4) is fixedly connected with the first motor (5).
6. A polishing apparatus for semiconductor production according to claim 1, wherein: two groups of empty grooves are formed in the left end and the right end of the upper surface of the second fixing plate (19), and two ends of each through groove are fixedly connected with two ends of the second fixing shaft (20).
7. A polishing apparatus for semiconductor production according to claim 1, wherein: the clamping plates (12) are of a curved structure, anti-slip pads are arranged on one sides, close to the semiconductor board (9), of the clamping plates (12), the number of the clamping plates (12) is four, and every two groups of the clamping plates (12) are symmetrically arranged about a vertical centerline of the semiconductor board (9).
8. A polishing apparatus for semiconductor production according to claim 1, wherein:
still include dust collecting device, dust collecting device includes:
the grinding rack comprises a dust collecting plate (25), clamping grooves (26) are formed in two sides of a grinding rack body (1), the dust collecting plate (25) is clamped in the grinding rack body (1) through the clamping grooves (26), the tail end of the dust collecting plate (25) is in sliding fit with the clamping grooves (26), the part, extending into the clamping grooves (26), of the dust collecting plate (25) is connected with the clamping grooves (26) through an elastic buffer piece (6), and the dust collecting plate (25) can move in the grinding rack body (1) along the clamping grooves (26);
a dust collection box (28) is arranged on one side of the grinding rack body (1), the dust collection box (28) is divided into an upper box body (281) and a lower box body (282), the upper box body (281) is detachably connected with the lower box body (282), a dust collection interface (283) is arranged on the upper box body (281), a connecting port matched with the dust collection interface (283) is arranged on the grinding rack body (1), the dust collection box (28) is communicated with the inside of the grinding rack body (1) through the matching of the dust collection interface (283) and the connecting port, and a filter screen (284) is movably connected in the lower box body (282);
the second motor (29) is fixed outside the grinding rack body (1), a driving shaft (30) penetrates through the grinding rack body (1) and is rotatably connected with the grinding rack body (1) through a bearing fixed in the side wall of the grinding rack body (1), the output end of the second motor (29) is in transmission connection with one end of the driving shaft (30) through a coupler, the other end of the driving shaft (30) is fixedly connected with one end of a transmission rod (31), the other end of the transmission rod (31) is rotatably connected with one end of a push rod (32), and the other end of the push rod (32) is detachably connected with one side of the dust collecting plate (25);
the driving shaft (30) is also fixedly connected with a cam (33);
a sliding frame (34) is arranged on one side of the grinding frame body (1) close to the dust collection box (28), a sliding block (35) which can slide along the sliding frame (34) is arranged on the sliding frame (34), one side of the sliding block (35) is fixedly connected with one end of the brush rod (36), the other side of the sliding block (35) is contacted with the cam (33), the other end of the brush rod (36) penetrates through the side wall of the grinding rack body (1) and extends into the lower box body (282), one end of the brush rod (36) extending into the lower box body (282) is provided with a brush head, the brush head is contacted with the filter screen (284), a return spring (37) is sleeved on the part of the brush rod (36) positioned in the grinding rack body (1), one end of the return spring (37) is contacted with the inner wall of the grinding rack body (1), the other end of the return spring (37) is contacted with the sliding block (35);
a fan (38) is arranged on one side of the grinding rack body (1) opposite to the dust collection interface (283);
the inner side of the top of the grinding frame body (1) is provided with a discharge plate (39).
9. A polishing apparatus for semiconductor production according to claim 1, wherein: further comprising:
the controller is electrically connected with a dust remover, the dust remover is arranged in the grinding rack body (1), and the dust remover comprises a box body and a fan;
the positive plate and the negative plate are respectively arranged on two opposite sides in the box body, an air inlet is formed in the box body, the fan is positioned in the grinding rack body (1), and an air outlet of the fan is communicated with the air inlet of the box body and is used for injecting dust-containing gas in the grinding rack body (1) into the box body;
the dust concentration detector is arranged in the grinding rack body (1) and is used for detecting the dust concentration in the grinding rack body (1);
the flow sensor is arranged at an air inlet of the box body and used for detecting the flow of the gas entering the box body;
the controller controls the dust remover to work based on the detection values of the dust concentration detector and the flow sensor, and specifically comprises the following steps:
step 1: when the detection value of the dust concentration detector exceeds the maximum value of the set dust concentration standard range, the controller controls the dust remover to work, after a certain time w passes through the dust remover, the controller calculates the volume V of the dust-containing gas processed by the dust remover in the time w according to the detection value of the flow sensor in the time w1；
Q (t) is a detection value of the flow sensor at the time t;
step 2: the controller calculates the driving speed of the charged particles in the dust remover based on the calculation result of the formula (1);
v is the driving speed of the charged particles in the dust remover;
f is the electric field force borne by the charged particles in the dust remover;
u is the voltage between the positive plate and the negative plate;
i is the working current of the positive plate and the negative plate;
d is the distance between the positive plate and the negative plate;
m is the mass of the dusty gas treated by the dust remover;
τ1is the dielectric constant of the dust-containing gas in the grinding rack body (1);
τ0for vacuum dielectric constant, take 8.85X 10-12；
d1Is the diameter of the dust particles;
V2is the volume inside the grinding rack body (1);
and step 3: the controller obtains the dust removal efficiency of the current dust remover through a formula (3) based on the calculation result of the formula (2);
epsilon is the dust removal efficiency of the current dust remover; exp is an exponential function with a natural constant e as a base, and e is 2.72;
x is the diffusion coefficient of dust particles;
l is the length of an exhaust pipeline of the fan;
omega is the speed of the airflow blown out by the fan;
and 4, step 4: the controller compares the obtained dust removal efficiency of the current dust remover with a target dust removal efficiency, and when the current dust removal efficiency is lower than the target dust removal efficiency, the controller changes the driving speed of charged particles in the dust remover by adjusting the voltage between the positive plate and the negative plate until the dust removal efficiency of the dust remover reaches the target dust removal efficiency;
and 5: the controller controls the dust remover to work until the dust concentration detector detects that the dust concentration in the grinding frame body (1) is within a set dust concentration standard range, and the controller controls the dust remover to stop working.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011193550.1A CN112355885A (en) | 2020-10-30 | 2020-10-30 | Grinding device for semiconductor preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011193550.1A CN112355885A (en) | 2020-10-30 | 2020-10-30 | Grinding device for semiconductor preparation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112355885A true CN112355885A (en) | 2021-02-12 |
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ID=74513141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011193550.1A Withdrawn CN112355885A (en) | 2020-10-30 | 2020-10-30 | Grinding device for semiconductor preparation |
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| CN (1) | CN112355885A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115284102A (en) * | 2022-08-06 | 2022-11-04 | 安徽阿斯乐电器科技有限公司 | Surface finishing device for impeller production |
-
2020
- 2020-10-30 CN CN202011193550.1A patent/CN112355885A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115284102A (en) * | 2022-08-06 | 2022-11-04 | 安徽阿斯乐电器科技有限公司 | Surface finishing device for impeller production |
| CN115284102B (en) * | 2022-08-06 | 2023-11-21 | 安徽阿斯乐电器科技有限公司 | Surface finish machining device for impeller production |
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