CN112345214A - Clamp for high-acceleration centrifugal test of packaged integrated circuit - Google Patents
Clamp for high-acceleration centrifugal test of packaged integrated circuit Download PDFInfo
- Publication number
- CN112345214A CN112345214A CN202011024203.6A CN202011024203A CN112345214A CN 112345214 A CN112345214 A CN 112345214A CN 202011024203 A CN202011024203 A CN 202011024203A CN 112345214 A CN112345214 A CN 112345214A
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- group
- clamp
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- packaged integrated
- acceleration
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- 238000012360 testing method Methods 0.000 title claims abstract description 45
- 210000005056 cell body Anatomy 0.000 claims description 3
- 230000001133 acceleration Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000010998 test method Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a clamp for a high-acceleration centrifugal test of a packaged integrated circuit, which is characterized in that: the centrifugal machine comprises a barrel (1) connected and matched with a centrifugal machine, a group of clamping grooves (2) are formed in the barrel (1), a fixture (3) is inserted in each clamping groove (2), at least one group of groove bodies (4) are arranged on the fixture (3), and a group of cover plates are detachably communicated on a fixture main body (3). The invention has the advantages of simple structure, convenient use, high reliability, strong stability, repeated use and the like.
Description
The technical field is as follows:
the invention relates to the field of integrated circuit centrifugal tests, in particular to a clamp for a high-acceleration centrifugal test of an encapsulated integrated circuit.
Background art:
according to the constant acceleration test regulation in methods 2001A and 2001.1 of GJB548A-1996 microelectronic device test method and program and GJB548B-2005 microelectronic device test method and program, a centrifugal test with proper acceleration is one of effective means for examining the internal structure strength, internal lead strength, internal component bonding strength, packaging strength and the like of an integrated circuit. With the continuous expansion of the application range of integrated circuits, the centrifugal test of the integrated circuits has more and more high requirements: the centrifugal acceleration is required to be higher and higher, and meanwhile, the directions of all integrated circuits capable of bearing centrifugal tests are required to be more and more (the Y1 direction, namely the direction of separating from the device, is generally required before, and the test requirements are provided for X, Y, Z directions, even for X1, X2, Y1, Y2, Z1 and Z2 directions at present).
At present, three technical schemes are provided for carrying out a large acceleration centrifugal test: one is a sand burying method, the second is a magnetic pasting method, and the third is a special clamp. In the first test method, it is shown from the related art data that the stress of the actual test (especially the large acceleration centrifugal test) is 5.5 to 6 times that of the initial predetermined test, and thus the test result is not completely true and reliable. The second test method has no problem for small acceleration, but for large acceleration test, the outer lead is not fixed well, the pin deformation is easy to generate, multi-direction test is not easy to realize, and ceramic and glass are easy to crack, so that the product damage and the yield are reduced. The third method is the most practical method at present, namely, a special centrifugal test fixture is designed and manufactured according to the customization or the autonomy of a test object. Because the centrifugal test equipment for carrying out centrifugal test is different, it is difficult to find a test fixture with strong universality between a test device and an equipment turntable. It is also difficult for the equipment manufacturer to equip the test fixture of the comparison system. Therefore, only after the device is clamped, different female clamps are matched with different equipment turntables, and the clamps can reasonably have high universality.
The test comprises the following specific steps:
the existing test method adopts a magnetic pasting method, a rotating disc made of green magnet is embedded in a main rotating disc of the high-acceleration centrifugal machine, then a circuit is adsorbed on the rotating disc made of green magnet in a magnetic absorption mode, a safety device is opened, conditions are set, and the high-acceleration centrifugal machine is used for testing. The main body turntable of the high-acceleration centrifugal machine drives the turntable made of the magnetism to perform a test, and when the equipment is stopped, a sample is taken down from the turntable made of the magnetism and placed in an anti-static aluminum plate, so that the test is finished.
In an actual test, however, a circuit sample is placed on a rotating disc made of a magnet, the sample is displaced due to overlarge conditions, the surface of a product is rubbed, obvious scratches are caused, and the damage of a coating has great influence on subsequent storage and use of the sample; the outer lead cannot be fixed, so that the pins are easy to deform, the glass insulator is damaged, the sealing performance of a circuit sample is damaged, and a multi-directional centrifugal test cannot be realized; because centrifugal test stress is applied on a line in the test direction, stress concentration can generate very adverse effect on devices, and ceramics and glass are easy to crack, so that the product is damaged and the qualification rate is reduced.
The invention content is as follows:
the invention aims to overcome the defects in the prior art and provides a clamp for a high-acceleration centrifugal test of a packaged integrated circuit.
The application provides the following technical scheme:
the novel centrifugal machine comprises a barrel body which is connected and matched with a centrifugal machine rotating disc, a group of clamping grooves are evenly distributed on the inner wall of the barrel body, a clamp is inserted in each clamping groove, at least one group of groove bodies are arranged on each clamp, and a group of cover plates which cover the groove bodies are detachably communicated on the clamps.
On the basis of the technical scheme, the following further technical scheme can be provided:
the bottom of the barrel is provided with a group of clamping joints which are in clamping fit with the centrifuge turntable.
The fixture comprises a main body, extension parts extending outwards are arranged on two sides of the bottom of the main body, two groups of groove bodies are arranged on the top of the main body along the length direction of the main body, and a group of groove bodies are arranged on the side walls of two sides of the main body along the length direction of the main body respectively.
A group of top threaded holes are formed in the top of the clamp, and a group of side wall threaded holes are formed in the side walls on the two sides of the clamp respectively; the group of cover plates comprise a top cover plate and two side wall cover plates, a group of top screws corresponding to the top threaded holes are arranged on the top cover plate in a penetrating mode, and a group of side wall screws corresponding to the side wall threaded holes are arranged on the side wall cover plate in a penetrating mode.
The group of groove bodies comprises five square grooves which are arranged along a straight line, and a round groove communicated with the square grooves is respectively arranged at the four corners of each square groove.
The invention has the advantages that:
the invention has the advantages of simple structure, convenient use, high reliability, strong stability, repeated use and the like. Especially, three faces of the main body of the clamp are respectively provided with a plurality of groove bodies, high-acceleration centrifugal tests in X, Y, Z three directions can be carried out on a plurality of ceramic SOP sealed integrated circuits at the same time, stress concentration is eliminated, the test stress of the integrated circuits is uniform, adverse effects on devices caused by the stress concentration are eliminated, the test result can truly and effectively reflect the test stress of the devices, and the influence of porcelain tightening in the acceleration centrifugal tests can be greatly reduced.
Description of the drawings:
FIG. 1 is a schematic view of the structure of the clamp of the present invention when inserted into a slot;
FIG. 2 is a top view of the clamp;
FIG. 3 is a side view of FIG. 2;
fig. 4 is a schematic view of the cover plate connected and fixed with the clamp.
The specific implementation mode is as follows:
as shown in fig. 1-4, a fixture for a high-acceleration centrifugal test of an encapsulated integrated circuit comprises a cylinder 1, wherein two symmetrically-distributed clamping connectors 1a are integrally formed at the bottom of the cylinder 1 with a circular cross section, and the clamping connectors 1a are in clamping fit with a centrifuge turntable.
A group of clamping grooves 2 are formed in the inner wall of the barrel body 1, and clamping hooks 2a extend from two sides of each clamping groove 2. A clamp 3 is inserted in each slot 2. Anchor clamps 3 include main part 3a, be equipped with extension 3b to outer edge play in main part 3a bottom both sides, be equipped with on extension 3b and correspond the complex fillet with trip 2 a.
Two groups of groove bodies 4 which are distributed side by side are arranged at the top of the main body 3a along the length direction of the main body, and a group of groove bodies 4 are respectively arranged on the side walls at the two sides of the main body 3a along the length direction. The group of groove bodies 4 comprises five square grooves 4a which are arranged along a straight line, and a round groove 4b communicated with the square grooves is respectively arranged at the four corners of each square groove 4 a.
Three top threaded holes 3c are linearly distributed between the two groups of groove bodies 4 at the top of the main body 3a along the length direction of the main body 3a in a left, middle and right mode. Two side wall threaded holes 3d are respectively formed in two ends of the side walls on the two sides of the main body 3 a.
A group of cover plates is arranged, and the group of cover plates comprises a top cover plate 5 corresponding to the top of the main body 3a and two side wall cover plates 5a corresponding to the side walls of the two sides of the main body 3 a. A group of top screws 5b distributed corresponding to the top threaded holes 3c penetrate through the top cover plate 5, and two side wall screws 5c corresponding to the side wall threaded holes 3d penetrate through the side wall cover plate 5 a. The top cover plate 5 and the side wall cover plate 5a are fixedly connected to the main body 3a by means of screw connection.
The working process is as follows:
the integrated circuit that will experiment at first is put into square inslot, then seals it in the cell body through the apron, accomplishes the equipment of anchor clamps, then with the joint of barrel and centrifuge carousel joint together, inserts the back in the draw-in groove with anchor clamps at last, just can begin to open centrifuge and carry out centrifugal test.
Claims (5)
1. A clamp for a high-acceleration centrifugal test of a packaged integrated circuit is characterized in that: the novel centrifugal machine comprises a barrel (1) connected and matched with a centrifugal machine rotating disc, a group of clamping grooves (2) are uniformly distributed on the inner wall of the barrel (1), a clamp (3) is inserted in each clamping groove (2), at least one group of groove bodies (4) are arranged on the clamp (3), and a group of cover plates covering the groove bodies (4) are detachably communicated on the clamp (3).
2. A jig for high-acceleration centrifugal test of packaged integrated circuits according to claim 1, wherein: the bottom of the barrel body (1) is provided with a group of clamping joints (1 a) which are in clamping fit with the centrifuge turntable.
3. A jig for high-acceleration centrifugal test of packaged integrated circuits according to claim 1, wherein: anchor clamps (3) including main part (3 a), be equipped with extension (3 b) that go out to outer edge in main part (3 a) bottom both sides, be equipped with two sets of cell bodies (4) at the top of main part (3 a) along its length direction, be equipped with a set of cell body (4) on main part (3 a) length direction's both sides lateral wall respectively.
4. A jig for high-acceleration centrifugal test of packaged integrated circuits according to claim 1, wherein: a group of top threaded holes (3 c) are formed in the top of the clamp (3), and a group of side wall threaded holes (3 d) are formed in the side walls of the two sides of the clamp (3) respectively; a set of apron include a top apron (5) and two lateral wall apron (5 a), wear to be equipped with a set ofly on top apron (5) and correspond complex top screw (5 b) with top screw hole (3 c), wear to be equipped with a set ofly on lateral wall apron (5 a) and correspond complex lateral wall screw (5 c) with lateral wall screw hole (3 d).
5. A jig for high-acceleration centrifugal test of packaged integrated circuits according to claim 1, wherein: the group of groove bodies (4) comprises five square grooves (4 a) which are arranged along a straight line, and a round groove (4 b) communicated with the square grooves is respectively arranged at the four corners of each square groove (4 a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011024203.6A CN112345214A (en) | 2020-09-25 | 2020-09-25 | Clamp for high-acceleration centrifugal test of packaged integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011024203.6A CN112345214A (en) | 2020-09-25 | 2020-09-25 | Clamp for high-acceleration centrifugal test of packaged integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112345214A true CN112345214A (en) | 2021-02-09 |
Family
ID=74360353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011024203.6A Pending CN112345214A (en) | 2020-09-25 | 2020-09-25 | Clamp for high-acceleration centrifugal test of packaged integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112345214A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113777017A (en) * | 2021-09-23 | 2021-12-10 | 华东光电集成器件研究所 | Tidal heat test wafer bearing device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2083233A (en) * | 1980-08-21 | 1982-03-17 | Standard Telephones Cables Ltd | Tensile test grips for packaged optical fibre |
| CN201397250Y (en) * | 2009-05-06 | 2010-02-03 | 北京物资学院 | Clamp system for high-acceleration rotating laboratory equipment |
| CN201434772Y (en) * | 2009-03-31 | 2010-03-31 | 华东光电集成器件研究所 | Centrifugal acceleration test cramping apparatus of electronic element |
| US20100288052A1 (en) * | 2009-05-12 | 2010-11-18 | Takeshi Tanaka | Method and device for implementing simulated test of centrifugal stress in turbine blade |
| CN201974186U (en) * | 2010-12-13 | 2011-09-14 | 华东光电集成器件研究所 | Flat package acceleration centrifugal test fixture of integrated circuit |
| CN103894296A (en) * | 2014-04-08 | 2014-07-02 | 江苏欧耐尔新型材料有限公司 | Fixture of centrifugal machine |
| CN105823585A (en) * | 2015-01-05 | 2016-08-03 | 电计科技研发（上海）有限公司 | Centrifugal disc for testing cylindrical sample |
| CN105928678A (en) * | 2016-04-18 | 2016-09-07 | 中国空间技术研究院 | CCD image sensor vibration and impact test fixture |
| CN106706248A (en) * | 2015-11-16 | 2017-05-24 | 联合汽车电子有限公司 | Vibration clamp and vibration test method |
| CN207087704U (en) * | 2017-08-25 | 2018-03-13 | 南京苏试广博环境可靠性实验室有限公司 | Acceleration test machine clamp |
-
2020
- 2020-09-25 CN CN202011024203.6A patent/CN112345214A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2083233A (en) * | 1980-08-21 | 1982-03-17 | Standard Telephones Cables Ltd | Tensile test grips for packaged optical fibre |
| CN201434772Y (en) * | 2009-03-31 | 2010-03-31 | 华东光电集成器件研究所 | Centrifugal acceleration test cramping apparatus of electronic element |
| CN201397250Y (en) * | 2009-05-06 | 2010-02-03 | 北京物资学院 | Clamp system for high-acceleration rotating laboratory equipment |
| US20100288052A1 (en) * | 2009-05-12 | 2010-11-18 | Takeshi Tanaka | Method and device for implementing simulated test of centrifugal stress in turbine blade |
| CN201974186U (en) * | 2010-12-13 | 2011-09-14 | 华东光电集成器件研究所 | Flat package acceleration centrifugal test fixture of integrated circuit |
| CN103894296A (en) * | 2014-04-08 | 2014-07-02 | 江苏欧耐尔新型材料有限公司 | Fixture of centrifugal machine |
| CN105823585A (en) * | 2015-01-05 | 2016-08-03 | 电计科技研发（上海）有限公司 | Centrifugal disc for testing cylindrical sample |
| CN106706248A (en) * | 2015-11-16 | 2017-05-24 | 联合汽车电子有限公司 | Vibration clamp and vibration test method |
| CN105928678A (en) * | 2016-04-18 | 2016-09-07 | 中国空间技术研究院 | CCD image sensor vibration and impact test fixture |
| CN207087704U (en) * | 2017-08-25 | 2018-03-13 | 南京苏试广博环境可靠性实验室有限公司 | Acceleration test machine clamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113777017A (en) * | 2021-09-23 | 2021-12-10 | 华东光电集成器件研究所 | Tidal heat test wafer bearing device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210209 |
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| RJ01 | Rejection of invention patent application after publication |