CN112332097A - Novel laminated dual-frequency dual-polarization millimeter wave antenna - Google Patents
Novel laminated dual-frequency dual-polarization millimeter wave antenna Download PDFInfo
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- CN112332097A CN112332097A CN202011271694.4A CN202011271694A CN112332097A CN 112332097 A CN112332097 A CN 112332097A CN 202011271694 A CN202011271694 A CN 202011271694A CN 112332097 A CN112332097 A CN 112332097A
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- 230000010287 polarization Effects 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000005855 radiation Effects 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000003071 parasitic effect Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 11
- 230000009977 dual effect Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention provides a novel laminated dual-frequency dual-polarization millimeter wave antenna which comprises a PCB (printed circuit board) layer and an HDI (high density interconnect) process board layer which are arranged in an up-and-down laminated manner, wherein the PCB layer and the HDI process board layer are electrically connected by adopting a conductive paste; the antenna provided by the invention comprises a 5G millimeter wave communication n261(27.5 GHz-28.35 GHz) and n260(37 GHz-40 GHz) frequency bands, and simultaneously has two polarization modes of horizontal polarization and vertical polarization, thereby realizing dual-frequency dual polarization on one antenna unit, and simultaneously having simple process and low manufacturing cost due to the structure of the board layer.
Description
Technical Field
The invention belongs to the technical field of communication, and particularly relates to a novel laminated dual-frequency dual-polarization millimeter wave antenna.
Background
In the 5G communication era, the main communication frequency band is divided into Sub-6G and millimeter wave frequency bands. The millimeter wave has the advantages of wide frequency band, large information quantity, small antenna volume, easy integration and the like, is gradually an important technology of 5G communication, and simultaneously has the characteristics of large loss, high precision requirement, high cost and the like, so that the research and the processing of the millimeter wave antenna become very challenging.
At present, the millimeter wave antenna is mainly in a single-frequency or single-polarization mode, the structure of a plate layer is complex, the cost is high, and the millimeter wave antenna is not suitable for a millimeter wave base station antenna array. Therefore, the significance of providing the novel dual-frequency dual-polarization millimeter wave antenna with the laminated plate is great.
Disclosure of Invention
The invention aims to provide a novel laminated dual-frequency dual-polarized millimeter wave antenna, which realizes dual-frequency dual polarization on one antenna unit and has simple process and low manufacturing cost.
In order to solve the problems, the technical scheme of the invention is as follows:
a novel laminated dual-frequency dual-polarization millimeter wave antenna comprises a PCB (printed Circuit Board) layer and an HDI (high Density interconnection) process board layer which are arranged in an up-down laminated mode, wherein the PCB layer and the HDI process board layer are electrically connected through conductive paste;
the PCB board layer comprises a first dielectric plate, a second dielectric plate, a third dielectric plate and a fourth dielectric plate which are stacked from top to bottom, a first high-frequency radiation piece is arranged on the upper surface of the first dielectric plate, a second high-frequency radiation piece is arranged on the upper surface of the second dielectric plate, a low-frequency radiation piece is arranged on the upper surface of the third dielectric plate, and a grounding point of the millimeter wave antenna is arranged on the upper surface of the fourth dielectric plate;
the PCB board layer further comprises a feed unit, the feed unit comprises a vertical polarization feed network and a horizontal polarization feed network, the vertical polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize vertical polarization, the horizontal polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize horizontal polarization, and the low-frequency radiation piece is fed by coupling of the first high-frequency radiation piece and the second high-frequency radiation piece;
the HDI process plate layer comprises a plurality of HDI process plates which are stacked from top to bottom;
the working frequency ranges of the millimeter wave antenna comprise 36.9 GHz-40.9 GHz and 26.91 GHz-28.61 GHz.
Preferably, a plurality of parasitic radiation pieces are arranged around the first high-frequency radiation piece.
Preferably, a plurality of metal shielding holes penetrating through the PCB layer and the HDI process plate layer are arranged around the millimeter wave antenna.
Preferably, the vertical polarization feed network and the horizontal polarization feed network are metalized via holes penetrating through the PCB board layer and the HDI process board layer.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) the invention provides a novel laminated dual-frequency dual-polarization millimeter wave antenna which comprises a PCB (printed circuit board) layer and an HDI (high density interconnect) process board layer which are arranged in an up-and-down laminated manner, wherein the PCB layer and the HDI process board layer are electrically connected by adopting a conductive paste; the PCB board layer comprises a first dielectric plate, a second dielectric plate, a third dielectric plate and a fourth dielectric plate which are stacked from top to bottom, the upper surface of the first dielectric plate is provided with a first high-frequency radiation piece, the upper surface of the second dielectric plate is provided with a second high-frequency radiation piece, the upper surface of the third dielectric plate is provided with a low-frequency radiation piece, the upper surface of the fourth dielectric plate is a grounding point of the millimeter wave antenna, the PCB board layer further comprises a feed unit, the feed unit comprises a vertical polarization feed network and a horizontal polarization feed network, the vertical polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize vertical polarization, the horizontal polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize horizontal polarization, and the low-frequency radiation piece is coupled and fed through the first high-frequency radiation piece and the second high-frequency radiation piece, so that the novel dual-polarization stacked millimeter wave antenna covers 5G communication n261(27.5 GHz-28.35 GHz) And an n260(37 GHz-40 GHz) frequency band, the polarization mode is horizontal polarization and vertical polarization, double-frequency dual polarization is realized on one antenna unit, and meanwhile, the structure of the plate layer enables the process to be simple and the manufacturing cost to be low.
Drawings
Fig. 1 is an overall structural diagram of a novel stacked dual-frequency dual-polarized millimeter wave antenna according to an embodiment of the present invention;
fig. 2 is an exploded view of a novel stacked dual-frequency dual-polarized millimeter wave antenna according to an embodiment of the present invention;
fig. 3 is a return loss curve of a novel stacked dual-frequency dual-polarized millimeter wave antenna according to an embodiment of the present invention;
fig. 4 is a polarization isolation curve of a novel stacked dual-frequency dual-polarized millimeter wave antenna according to an embodiment of the present invention.
Description of reference numerals:
1: a PCB board layer; 11: a first dielectric layer; 111: a first high-frequency radiation sheet; 1111: a parasitic radiating patch; 12: a second dielectric layer; 121: a second high-frequency radiation sheet; 13: a third dielectric layer; 131: a low-frequency radiation sheet; 14: a fourth dielectric layer; 15: a power feeding unit; 151: a vertically polarized feed network; 152: a horizontally polarized feed network; 2: HDI process board layer; 3: a conductive paste; 4: and a metal shielding hole.
Detailed Description
The novel stacked dual-frequency dual-polarized millimeter wave antenna provided by the invention is further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims.
Referring to fig. 1 to 2, the present embodiment provides a novel stacked dual-frequency dual-polarized millimeter wave antenna, including a PCB board layer 1 and an HDI process board layer 2 stacked up and down, where the PCB board layer 1 and the HDI process board layer 2 are electrically connected by using a conductive paste 3;
the PCB board layer 1 comprises a first dielectric plate 11, a second dielectric plate 12, a third dielectric plate 13 and a fourth dielectric plate 14 which are stacked from top to bottom, wherein a first high-frequency radiation piece 111 is arranged on the upper surface of the first dielectric plate 11, a second high-frequency radiation piece 121 is arranged on the upper surface of the second dielectric plate 12, a low-frequency radiation piece 131 is arranged on the upper surface of the third dielectric plate 13, and the upper surface of the fourth dielectric plate 14 is a grounding point of a millimeter wave antenna;
in this embodiment, the first dielectric slab 11, the second dielectric slab 12, the third dielectric slab 13 and the fourth dielectric slab 14 are dielectric slabs with copper coated on both sides, the first dielectric slab 11, the second dielectric slab 12, the third dielectric slab 13 and the fourth dielectric slab 14 are laminated together to form the PCB board layer 1, the first high-frequency radiation sheet 111 is a copper-coated layer on the upper surface of the first dielectric slab 11, the second high-frequency radiation sheet 121 is a copper-coated layer on the upper surface of the second dielectric slab 12, and the low-frequency radiation sheet 131 is a copper-coated layer on the upper surface of the third dielectric slab 13;
the PCB panel layer 1 further includes a feeding unit 15, the feeding unit 15 includes a vertical polarization feeding network 151 and a horizontal polarization feeding network 152, the vertical polarization feeding network 151 connects the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121 to realize vertical polarization, the horizontal polarization feeding network 152 connects the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121 to realize horizontal polarization, in this embodiment, the vertical polarization feeding network 151 and the horizontal polarization feeding network 152 are both metalized vias connecting the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121, the metalized vias penetrate through from the bottom layer to the top layer to feed power, the directions of feeding are different, one is horizontal feeding, one is vertical feeding, the metalized via is not connected with the low-frequency radiating patch 131 on the third dielectric plate 13, the low-frequency radiating patch 131 is coupled to feed through the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121, broadening the low frequency bandwidth;
in this embodiment, a plurality of parasitic radiation fins 1111 are arranged around the first high-frequency radiation fin 111 to extend the high-frequency bandwidth;
the HDI process board layer 2 comprises a plurality of HDI process boards which are stacked from top to bottom, in the embodiment, the HDI process board layer 2 comprises eight HDI process boards which are stacked from top to bottom, and the eight HDI process boards are sequentially a GND (ground potential), a horizontal polarization feed wiring layer, a GND (ground potential), a vertical polarization feed wiring layer, a GND (ground potential), a control signal layer of a radio frequency chip, a GND (ground potential) and a power supply layer of the radio frequency chip from top to bottom;
as a preferred example of this embodiment, a plurality of metal shielding holes 4 penetrating through the PCB layer 1 and the HDI process board layer 2 are arranged around the millimeter wave antenna, the metal shielding holes 4 play a role of electromagnetic shielding, prevent electromagnetic leakage, and avoid noise and other resonances, and the metal shielding holes 4 are drawn as a pillar structure in fig. 2 to show that the metal shielding holes penetrate through multiple layers, and the metal shielding holes 4 are connected to ground.
The working frequency band of the millimeter wave antenna provided by this embodiment includes 36.9 GHz-40.9 GHz and 26.91 GHz-28.61 GHz, where the high frequency of 36.9 GHz-40.9 GHz passes through the first high frequency radiation patch 111 and the second high frequency radiation patch 121, the low frequency of 26.91 GHz-28.61 GHz is realized by the larger low frequency radiation patch 131 on the third dielectric layer 13, and horizontal polarization and vertical polarization are realized by feeding in two horizontal and vertical directions, fig. 3 is the return loss of the novel stacked dual-frequency dual-polarized antenna provided by this embodiment, and the frequency band below-10 dB of the dual-frequency dual-polarized millimeter wave antenna of this embodiment is 26.91-28.61 GHz and 36.9 GHz-40.9 GHz. Fig. 4 shows polarization isolation of the novel stacked dual-frequency dual-polarization provided by this embodiment, where the polarization isolation is below-15 dB.
The dual-frequency dual-polarization millimeter wave antenna provided by the invention is a millimeter wave antenna working at the frequency bands of 26.91 GHz-28.62 GHz and 36.9 GHz-40.90 GHz, and covers the n261(27.5 GHz-28.35 GHz) and n260(37 GHz-40 GHz) frequency bands of 5G millimeter wave communication, the polarization modes are horizontal polarization and vertical polarization, a 4+8 plate layer structure is adopted, dual-frequency dual polarization is realized on one antenna unit, and the 4+8 plate layer structure enables the process to be simple and the manufacturing cost to be low.
The dual-frequency dual-polarization millimeter wave antenna provided by the invention has two use scenes: firstly, the dual-frequency dual-polarization communication method is used for a millimeter wave communication base station and can simultaneously carry out dual-frequency dual-polarization communication; and secondly, the antenna is used for a mobile phone millimeter wave communication antenna, is high in integration level and small in size, and can be used as a mobile phone millimeter wave antenna.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (4)
1. A novel laminated dual-frequency dual-polarization millimeter wave antenna is characterized by comprising a PCB (printed Circuit Board) layer and an HDI (high Density interconnection) process board layer which are arranged in an up-down laminated mode, wherein the PCB layer and the HDI process board layer are electrically connected through a conductive paste;
the PCB board layer comprises a first dielectric plate, a second dielectric plate, a third dielectric plate and a fourth dielectric plate which are stacked from top to bottom, a first high-frequency radiation piece is arranged on the upper surface of the first dielectric plate, a second high-frequency radiation piece is arranged on the upper surface of the second dielectric plate, a low-frequency radiation piece is arranged on the upper surface of the third dielectric plate, and a grounding point of the millimeter wave antenna is arranged on the upper surface of the fourth dielectric plate;
the PCB board layer further comprises a feed unit, the feed unit comprises a vertical polarization feed network and a horizontal polarization feed network, the vertical polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize vertical polarization, the horizontal polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize horizontal polarization, and the low-frequency radiation piece is fed by coupling of the first high-frequency radiation piece and the second high-frequency radiation piece;
the HDI process plate layer comprises a plurality of HDI process plates which are stacked from top to bottom;
the working frequency ranges of the millimeter wave antenna comprise 36.9 GHz-40.9 GHz and 26.91 GHz-28.61 GHz.
2. A novel stacked dual-frequency dual-polarized millimeter wave antenna according to claim 1, wherein a plurality of parasitic radiating fins are arranged around the first high-frequency radiating fin.
3. A novel stacked dual-frequency dual-polarized millimeter wave antenna according to claim 1, wherein a plurality of metal shielding holes penetrating through the PCB board layer and the HDI process board layer are arranged around the millimeter wave antenna.
4. A novel stacked dual-frequency dual-polarized millimeter wave antenna according to claim 1, wherein the vertical polarization feed network and the horizontal polarization feed network are metalized vias running through the PCB board layer and the HDI process board layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011271694.4A CN112332097A (en) | 2020-11-13 | 2020-11-13 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011271694.4A CN112332097A (en) | 2020-11-13 | 2020-11-13 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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| CN112332097A true CN112332097A (en) | 2021-02-05 |
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| CN202011271694.4A Pending CN112332097A (en) | 2020-11-13 | 2020-11-13 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113506982A (en) * | 2021-09-09 | 2021-10-15 | 南京天朗防务科技有限公司 | Dual-band dual-polarization common-aperture antenna |
| CN113517559A (en) * | 2021-03-25 | 2021-10-19 | 西安电子科技大学 | High-isolation dual-frequency dual-polarization millimeter wave array antenna |
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