CN218867373U

CN218867373U - Antenna module

Info

Publication number: CN218867373U
Application number: CN202223103122.2U
Authority: CN
Inventors: 韦文竹; 何明展; 沈芾云
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2022-11-22
Filing date: 2022-11-22
Publication date: 2023-04-14
Anticipated expiration: 2032-11-22

Abstract

An antenna module comprises a circuit substrate, an antenna unit and a radio frequency chip; the circuit substrate comprises a first dielectric layer and a first circuit layer which are arranged in a stacked mode; the antenna unit comprises a second dielectric layer, a main radiating sheet, a parasitic radiating sheet and a second conductive hole, wherein the parasitic radiating sheet is positioned on one side of the main radiating sheet, which deviates from the circuit substrate, the main radiating sheet is embedded in the second dielectric layer, and the main radiating sheet is connected with the first circuit layer through the second conductive hole; the radio frequency chip is connected with the first circuit layer. The application provides an antenna module, antenna element and circuit substrate lug connection reduce antenna module's thickness.

Description

Antenna module

Technical Field

The application relates to the field of semiconductors, especially, relate to an antenna module.

Background

Users' demands for low-cost, high-performance, compact radar systems for millimeter wave applications are increasing, and therefore, the development of Antenna-in-Package (AiP) becomes more important. However, when the requirements of larger and larger bandwidth and high gain and directivity are met, it is difficult to adapt to smaller antenna package size.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for an antenna module with a small package size.

An antenna module comprises a circuit substrate, an antenna unit, a radio frequency chip and a second conductive hole; the circuit substrate comprises a first dielectric layer and a first circuit layer which are arranged in a stacked mode; the antenna unit comprises a second dielectric layer, a main radiating sheet and a parasitic radiating sheet, wherein the parasitic radiating sheet is positioned on one side of the main radiating sheet, which is far away from the circuit substrate, the main radiating sheet is embedded in the second dielectric layer, and the main radiating sheet is connected with the first circuit layer through the second conductive hole; the radio frequency chip is connected with the first circuit layer.

In some embodiments of the present application, a projection of the parasitic radiation piece on the circuit substrate is located within a projection of the main radiation piece on the circuit substrate.

In some embodiments of the present application, the number of layers of the parasitic radiation piece is greater than or equal to two, and the shape of the conductor in different layers is different.

In some embodiments of the present application, the number of the first circuit layers is multiple, and the multiple first circuit layers are electrically connected through the first conductive via.

In some embodiments of the present application, the antenna unit further includes a plurality of second circuit layers, and the plurality of second circuit layers are embedded in the second dielectric layer and located between the main radiating patch and the circuit substrate, and are electrically connected through the second conductive via between the adjacent second circuit layers and between the second circuit layers and the main radiating patch.

In some embodiments of the present application, the second conductive via between different layers rises spirally.

In some embodiments of the present application, each of the antenna elements includes at least two sets of second conductive vias, each set of second conductive vias is connected to one set of first conductive vias, one set of the first conductive vias and the second conductive vias are used for feeding with horizontal polarization, and the other set of the first conductive vias and the second conductive vias are used for feeding with vertical polarization.

In some embodiments of the present application, the first conductive via and the second conductive via further include a plurality of conductive vias for functioning as an isolation ground, and the plurality of conductive vias for functioning as an isolation ground are disposed between the conductive via for horizontally polarized feeding and the conductive via for vertically polarized feeding.

In some embodiments of the present disclosure, the modulus of the second dielectric layer is greater than the modulus of the first dielectric layer, and the tensile strength of the second dielectric layer is greater than the tensile strength of the first dielectric layer.

In some embodiments of the present application, the dielectric constants of the first dielectric layer and the second dielectric layer are both less than 3.3, and the dielectric dissipation factor is both less than 0.003.

The application provides an antenna module, antenna element and circuit substrate lug connection have saved the support plate among the correlation technique to reduce antenna module's thickness.

Drawings

Fig. 1 is a schematic cross-sectional view of an antenna module according to the related art.

Fig. 2 is a schematic cross-sectional view of an antenna module according to an embodiment of the present application.

Fig. 3 is a schematic top view of an antenna module according to an embodiment of the present application.

Fig. 4 is a schematic structural view illustrating that the second conductive holes between different layers of the antenna module spirally rise.

Fig. 5 is a schematic cross-sectional view of intermediate structures for manufacturing an antenna module according to an embodiment of the present application.

Description of the main elements

Antenna module	100、100’
		Circuit substrate	10、10’
A first dielectric layer	11
		First circuit layer	13
Signal line	132
		Grounding wire	134
First conductive via	15
		Hard plate area	17
Bendable region	19
		Antenna unit	20、20’
A second dielectric layer	21
		Main radiating fin	23
Parasitic radiation sheet	25
		Second circuit layer	27
Second conductive via	29
		Radio frequency chip	30、30’
Support plate	40’

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1, the related art of the present application provides an antenna module 100', which includes a carrier 40', an antenna unit 20', a circuit substrate 10', and a radio frequency chip 30'; the antenna unit 20' and the circuit substrate 10' are located on opposite sides of the carrier 40', and the rf chip 30' is located on a surface of the circuit substrate 10 '. The inventor of the present application finds that the antenna module 100 'has a relatively thick thickness, which is difficult to satisfy the size requirement of the user for the antenna module 100'.

Referring to fig. 2, an antenna module 100 according to an embodiment of the present disclosure includes a circuit substrate 10, an antenna unit 20, and a radio frequency chip 30, where the antenna unit 20 is disposed on a surface of the circuit substrate 10, and the radio frequency chip 30 is connected to the circuit substrate 10.

The circuit substrate 10 includes a first dielectric layer 11 and a first circuit layer 13, the first dielectric layer 11 and the first circuit layer 13 are stacked, and the number of the first circuit layer 13 is multiple. The first circuit layers 13 are arranged at intervals through the first dielectric layer 11 and are electrically connected through first conductive holes 15.

The first circuit layer 13 includes a signal line 132 and a ground line 134, and the signal line 132 is located on a side of the ground line 134 facing away from the antenna unit 20.

In this embodiment, the circuit substrate 10 includes a rigid board region 17 and a bendable region 19, the antenna units 20 are plural, the antenna units 20 are disposed in the rigid board region 17 at intervals, and the antenna module 100 can be bent in the bendable region 19.

The rf chip 30 may be disposed inside the circuit substrate 10 or on the surface of the circuit substrate 10, and the rf chip 30 is connected to the first circuit layer 13.

Each antenna unit 20 includes a second dielectric layer 21, a main radiating patch 23, and a parasitic radiating patch 25, where the parasitic radiating patch 25 is located on a side of the main radiating patch 23 away from the circuit substrate 10, and the main radiating patch 23 is embedded in the second dielectric layer 21.

The material of the second dielectric layer 21 is different from the material of the first dielectric layer 11. The material of the first dielectric layer 11 is a polymer, the second dielectric layer 21 is a polymer and a filler added in the polymer, the filler is fibrous or granular, and the filler is used for increasing the modulus and the tensile strength of the second dielectric layer 21, that is, the modulus of the second dielectric layer 21 is greater than the modulus of the first dielectric layer 11, and the tensile strength of the second dielectric layer 21 is greater than the tensile strength of the first dielectric layer 11. The modulus and the tensile strength of the second dielectric layer 21 are improved, which is beneficial to improving the flatness of the main radiating patch 23 and the parasitic radiating patch 25, so that the characteristics of each antenna unit 20 are kept consistent, and the uniformity of the thickness from the main radiating patch 23 and the parasitic radiating patch 25 to the ground wire 134 is also beneficial to ensuring.

Dielectric constants D of the first dielectric layer 11 and the second dielectric layer 21 _k Are all less than 3.3, and the dielectric loss factor D _f Are all less than 0.003 to reduce signal loss.

Referring to fig. 3, the parasitic radiating patch 25 is a two-dimensional periodic array of a plurality of conductors having the same shape and size. The length of main radiation piece 23 is greater than parasitic radiation piece 25's length, and the width of main radiation piece 23 is greater than parasitic radiation piece 25's width, parasitic radiation piece 25 is in the projection of circuit substrate 10 is located main radiation piece 23 is in the projection of circuit substrate 10 to avoid the relative area change that results in the layer-to-layer deviation, and then lead to the antenna performance to change.

The number of layers of the parasitic radiation piece 25 is greater than or equal to two, and the shape of the conductors of different layers can be different, so that the bandwidth of the antenna unit 20 can be increased.

The antenna unit 20 may further include a plurality of second circuit layers 27 and second conductive vias 29, the second circuit layers 27 are embedded in the second dielectric layer 21 and located between the main radiating patch 23 and the circuit substrate 10, the adjacent second circuit layers 27 and the main radiating patch 23 may be electrically connected through the second conductive vias 29, the second conductive vias 29 between different layers are spirally raised (see fig. 4), and the spiral structure may counteract inductance generated by a part of the second conductive vias 29, so as to facilitate controlling the overall impedance of the feeding structure.

Each of the antenna units 20 includes at least two sets of second conductive vias 29, each set of second conductive vias 29 is connected to one set of first conductive vias 15, one set of first conductive vias 15 and second conductive vias 29 is used for feeding horizontally polarized power, and the other set of first conductive vias 15 and second conductive vias 29 is used for feeding vertically polarized power. In this embodiment, the conductive material in the second conductive hole 29 is a conductive paste, and when the conductive material is a conductive paste, the antenna module 100 can be laminated at one time, so as to reduce the overall thickness of the antenna module.

The first conductive via 15 and the second conductive via 29 further include a plurality of conductive vias for isolation, the plurality of conductive vias for isolation are disposed between the conductive vias for horizontally polarized feeding and the conductive vias for vertically polarized feeding, and the projection on the wiring substrate 10 is enclosed in a diamond shape, so that the isolation between the conductive vias for horizontally polarized feeding and the conductive vias for vertically polarized feeding is less than-30 dB.

Referring to fig. 5, an embodiment of the present invention further provides a method for manufacturing an antenna module 100, where the method includes: according to the required circuit pattern of the antenna module 100 and the number of layers of the circuit layers, circuit manufacturing is carried out on the copper-clad plate, the circuit layers are formed on the surfaces of the dielectric layers, and conductive holes for connecting the circuit layers are formed; carrying out circuit manufacturing on the copper-clad plate, and forming a main radiation piece 23 or a parasitic radiation piece 25 on the surface of the dielectric layer; the method of manufacturing the wiring substrate 10 may also employ the above steps to obtain the respective intermediate structures. Then, the intermediate structures are bonded together and connected to the rf chip 30 to form the antenna module 100 (see fig. 2 again). In the antenna module 100 manufactured by the above manufacturing method, the antenna unit 20 is directly connected to the circuit substrate 10, and the carrier plate 40' in the related art is omitted, so that the thickness of the antenna module 100 is reduced.

Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims

1. An antenna module, comprising

The circuit substrate comprises a first dielectric layer and a first circuit layer which are arranged in a stacked mode;

the antenna unit comprises a second dielectric layer, a main radiating sheet, a parasitic radiating sheet and a second conductive hole, wherein the parasitic radiating sheet is positioned on one side of the main radiating sheet, which is far away from the circuit substrate, the main radiating sheet is embedded in the second dielectric layer, and the main radiating sheet is connected with the first circuit layer through the second conductive hole; and

and the radio frequency chip is connected with the first circuit layer.

2. The antenna module of claim 1, wherein a projection of the parasitic radiating patch on the circuit substrate is located within a projection of the main radiating patch on the circuit substrate.

3. The antenna module of claim 1, wherein the number of layers of the parasitic radiating patch is greater than or equal to two, and the shape of the conductor in different layers is different.

4. The antenna module of claim 1, wherein the number of the first circuit layers is multiple, and the multiple first circuit layers are electrically connected through the first conductive via.

5. The antenna module of claim 4, wherein the antenna unit further comprises a plurality of second circuit layers embedded in the second dielectric layer and located between the main radiating patch and the circuit substrate, and the adjacent second circuit layers and the main radiating patch are electrically connected through the second conductive via.

6. The antenna module of claim 5, wherein the second conductive vias between different layers are spirally raised.

7. The antenna module of claim 5, wherein each of the antenna elements includes at least two sets of the second conductive vias, each set of the second conductive vias is connected to one set of the first conductive vias, one set of the first conductive vias and the second conductive vias is used for feeding with horizontal polarization, and the other set of the first conductive vias and the second conductive vias is used for feeding with vertical polarization.

8. The antenna module of claim 5, wherein the first conductive via and the second conductive via further comprise a plurality of conductive vias for functioning as isolation grounds, the plurality of conductive vias for functioning as isolation grounds being disposed between the conductive via for horizontally polarized feeding and the conductive via for vertically polarized feeding.

9. The antenna module of claim 1, wherein the modulus of the second dielectric layer is greater than the modulus of the first dielectric layer, and the tensile strength of the second dielectric layer is greater than the tensile strength of the first dielectric layer.

10. The antenna module of claim 8, wherein the dielectric constants of the first dielectric layer and the second dielectric layer are both less than 3.3 and the dielectric dissipation factor is both less than 0.003.