CN213636310U - Novel laminated dual-frequency dual-polarization millimeter wave antenna - Google Patents
Novel laminated dual-frequency dual-polarization millimeter wave antenna Download PDFInfo
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- CN213636310U CN213636310U CN202022627507.3U CN202022627507U CN213636310U CN 213636310 U CN213636310 U CN 213636310U CN 202022627507 U CN202022627507 U CN 202022627507U CN 213636310 U CN213636310 U CN 213636310U
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Abstract
The utility model provides a novel laminated dual-frequency dual-polarization millimeter wave antenna, which comprises a PCB (printed circuit board) layer and an HDI (high density interconnect) process board layer which are arranged in an up-and-down stacked manner, wherein the PCB layer and the HDI process board layer are electrically connected by adopting conductive paste; wherein, PCB board material layer is including the first dielectric plate, the second dielectric plate, third dielectric plate and the fourth dielectric plate of from top to bottom range upon range of setting, and the upper surface of first dielectric plate is provided with first high frequency radiation piece, and the upper surface of second dielectric plate is provided with second high frequency radiation piece, and the upper surface of third dielectric plate is provided with the low frequency radiation piece, through vertical polarization feed network and horizontal polarization feed network connection between first high frequency radiation piece and the second high frequency radiation piece, the utility model provides an antenna covers 5G millimeter wave communication n261(27.5GHz ~ 28.35GHz) and n260(37GHz ~ 40GHz) frequency channel, and the while polarization mode is horizontal polarization and vertical polarization two kinds, has realized dual-frenquency dual polarization on an antenna element, and the sheet layer structure makes simple process, low in manufacturing cost simultaneously.
Description
Technical Field
The utility model belongs to the technical field of communication, especially, relate to a novel stromatolite dual-frenquency double polarization millimeter wave antenna.
Background
In the 5G communication era, the main communication frequency band is divided into Sub-6G and millimeter wave frequency bands. The millimeter wave has the advantages of wide frequency band, large information quantity, small antenna volume, easy integration and the like, is gradually an important technology of 5G communication, and simultaneously has the characteristics of large loss, high precision requirement, high cost and the like, so that the research and the processing of the millimeter wave antenna become very challenging.
At present, the millimeter wave antenna is mainly in a single-frequency or single-polarization mode, the structure of a plate layer is complex, the cost is high, and the millimeter wave antenna is not suitable for a millimeter wave base station antenna array. Therefore, the significance of providing the novel dual-frequency dual-polarization millimeter wave antenna with the laminated plate is great.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a novel stromatolite dual-frenquency double polarization millimeter wave antenna realizes the dual-frenquency double polarization on an antenna element, simple process simultaneously, low in manufacturing cost.
In order to solve the above problem, the technical scheme of the utility model is that:
a novel laminated dual-frequency dual-polarization millimeter wave antenna comprises a PCB (printed Circuit Board) layer and an HDI (high Density interconnection) process board layer which are arranged in an up-down laminated mode, wherein the PCB layer and the HDI process board layer are electrically connected through conductive paste;
the PCB board layer comprises a first dielectric plate, a second dielectric plate, a third dielectric plate and a fourth dielectric plate which are stacked from top to bottom, a first high-frequency radiation piece is arranged on the upper surface of the first dielectric plate, a second high-frequency radiation piece is arranged on the upper surface of the second dielectric plate, a low-frequency radiation piece is arranged on the upper surface of the third dielectric plate, and a grounding point of the millimeter wave antenna is arranged on the upper surface of the fourth dielectric plate;
the PCB board layer further comprises a feed unit, the feed unit comprises a vertical polarization feed network and a horizontal polarization feed network, the vertical polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize vertical polarization, the horizontal polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize horizontal polarization, and the low-frequency radiation piece is fed by coupling of the first high-frequency radiation piece and the second high-frequency radiation piece;
the HDI process plate layer comprises a plurality of HDI process plates which are stacked from top to bottom;
the working frequency ranges of the millimeter wave antenna comprise 36.9 GHz-40.9 GHz and 26.91 GHz-28.61 GHz.
Preferably, a plurality of parasitic radiation pieces are arranged around the first high-frequency radiation piece.
Preferably, a plurality of metal shielding holes penetrating through the PCB layer and the HDI process plate layer are arranged around the millimeter wave antenna.
Preferably, the vertical polarization feed network and the horizontal polarization feed network are metalized via holes penetrating through the PCB board layer and the HDI process board layer.
The utility model discloses owing to adopt above technical scheme, make it compare with prior art and have following advantage and positive effect:
1) the utility model provides a novel laminated dual-frequency dual-polarization millimeter wave antenna, which comprises a PCB (printed circuit board) layer and an HDI (high density interconnect) process board layer which are arranged in an up-and-down stacked manner, wherein the PCB layer and the HDI process board layer are electrically connected by adopting conductive paste; wherein, PCB board layer is including the first dielectric plate of from top to bottom range upon range of setting, the second dielectric plate, third dielectric plate and fourth dielectric plate, the upper surface of first dielectric plate is provided with first high frequency radiation piece, the upper surface of second dielectric plate is provided with second high frequency radiation piece, the upper surface of third dielectric plate is provided with the low frequency radiation piece, the upper surface of fourth dielectric plate is the ground point of millimeter wave antenna, PCB board layer still includes the feed unit, the feed unit includes vertical polarization feed network and horizontal polarization feed network, first high frequency radiation piece of vertical polarization feed network connection and second high frequency radiation piece, realize vertical polarization, horizontal polarization feed network connection first high frequency radiation piece and second high frequency radiation piece, realize horizontal polarization, the low frequency radiation piece passes through first high frequency radiation piece and second high frequency radiation piece coupling feed, the utility model provides a novel stromatolite dual-polarization dual-frenquence millimeter wave antenna covers 5G millimeter wave communication n (27.5GHz ~ 28.35GHz ~ 28.35.35 GHz) and n260(37 GHz-40 GHz), and the polarization mode is horizontal polarization and vertical polarization, thereby realizing dual-frequency dual polarization on one antenna unit, and simultaneously, the structure of the plate layer enables the process to be simple and the manufacturing cost to be low.
Drawings
Fig. 1 is an overall structure diagram of a novel stacked dual-frequency dual-polarized millimeter wave antenna according to an embodiment of the present invention;
fig. 2 is an exploded view of a novel stacked dual-frequency dual-polarized millimeter wave antenna according to an embodiment of the present invention;
fig. 3 is a return loss curve of a novel stacked dual-frequency dual-polarized millimeter wave antenna provided in an embodiment of the present invention;
fig. 4 is a polarization isolation curve of a dual-frequency dual-polarized millimeter wave antenna of a novel stacked layer provided by an embodiment of the present invention.
Description of reference numerals:
1: a PCB board layer; 11: a first dielectric layer; 111: a first high-frequency radiation sheet; 1111: a parasitic radiating patch; 12: a second dielectric layer; 121: a second high-frequency radiation sheet; 13: a third dielectric layer; 131: a low-frequency radiation sheet; 14: a fourth dielectric layer; 15: a power feeding unit; 151: a vertically polarized feed network; 152: a horizontally polarized feed network; 2: HDI process board layer; 3: a conductive paste; 4: and a metal shielding hole.
Detailed Description
The following describes the dual-band dual-polarized millimeter wave antenna with a novel stacked layer in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the following description and appended claims.
Referring to fig. 1 to 2, the present embodiment provides a novel stacked dual-frequency dual-polarized millimeter wave antenna, including a PCB board layer 1 and an HDI process board layer 2 stacked up and down, where the PCB board layer 1 and the HDI process board layer 2 are electrically connected by using a conductive paste 3;
the PCB board layer 1 comprises a first dielectric plate 11, a second dielectric plate 12, a third dielectric plate 13 and a fourth dielectric plate 14 which are stacked from top to bottom, wherein a first high-frequency radiation piece 111 is arranged on the upper surface of the first dielectric plate 11, a second high-frequency radiation piece 121 is arranged on the upper surface of the second dielectric plate 12, a low-frequency radiation piece 131 is arranged on the upper surface of the third dielectric plate 13, and the upper surface of the fourth dielectric plate 14 is a grounding point of a millimeter wave antenna;
in this embodiment, the first dielectric slab 11, the second dielectric slab 12, the third dielectric slab 13 and the fourth dielectric slab 14 are dielectric slabs with copper coated on both sides, the first dielectric slab 11, the second dielectric slab 12, the third dielectric slab 13 and the fourth dielectric slab 14 are laminated together to form the PCB board layer 1, the first high-frequency radiation sheet 111 is a copper-coated layer on the upper surface of the first dielectric slab 11, the second high-frequency radiation sheet 121 is a copper-coated layer on the upper surface of the second dielectric slab 12, and the low-frequency radiation sheet 131 is a copper-coated layer on the upper surface of the third dielectric slab 13;
the PCB panel layer 1 further includes a feeding unit 15, the feeding unit 15 includes a vertical polarization feeding network 151 and a horizontal polarization feeding network 152, the vertical polarization feeding network 151 connects the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121 to realize vertical polarization, the horizontal polarization feeding network 152 connects the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121 to realize horizontal polarization, in this embodiment, the vertical polarization feeding network 151 and the horizontal polarization feeding network 152 are both metalized vias connecting the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121, the metalized vias penetrate through from the bottom layer to the top layer to feed power, the directions of feeding are different, one is horizontal feeding, one is vertical feeding, the metalized via is not connected with the low-frequency radiating patch 131 on the third dielectric plate 13, the low-frequency radiating patch 131 is coupled to feed through the first high-frequency radiating patch 111 and the second high-frequency radiating patch 121, broadening the low frequency bandwidth;
in this embodiment, a plurality of parasitic radiation fins 1111 are arranged around the first high-frequency radiation fin 111 to extend the high-frequency bandwidth;
the HDI process board layer 2 comprises a plurality of HDI process boards which are stacked from top to bottom, in the embodiment, the HDI process board layer 2 comprises eight HDI process boards which are stacked from top to bottom, and the eight HDI process boards are sequentially a GND (ground potential), a horizontal polarization feed wiring layer, a GND (ground potential), a vertical polarization feed wiring layer, a GND (ground potential), a control signal layer of a radio frequency chip, a GND (ground potential) and a power supply layer of the radio frequency chip from top to bottom;
as a preferred example of this embodiment, a plurality of metal shielding holes 4 penetrating through the PCB layer 1 and the HDI process board layer 2 are arranged around the millimeter wave antenna, the metal shielding holes 4 play a role of electromagnetic shielding, prevent electromagnetic leakage, and avoid noise and other resonances, and the metal shielding holes 4 are drawn as a pillar structure in fig. 2 to show that the metal shielding holes penetrate through multiple layers, and the metal shielding holes 4 are connected to ground.
The working frequency band of the millimeter wave antenna provided by this embodiment includes 36.9 GHz-40.9 GHz and 26.91 GHz-28.61 GHz, where the high frequency of 36.9 GHz-40.9 GHz passes through the first high frequency radiation patch 111 and the second high frequency radiation patch 121, the low frequency of 26.91 GHz-28.61 GHz is realized by the larger low frequency radiation patch 131 on the third dielectric layer 13, and horizontal polarization and vertical polarization are realized by feeding in two horizontal and vertical directions, fig. 3 is the return loss of the novel stacked dual-frequency dual-polarized antenna provided by this embodiment, and the frequency band below-10 dB of the dual-frequency dual-polarized millimeter wave antenna of this embodiment is 26.91-28.61 GHz and 36.9 GHz-40.9 GHz. Fig. 4 shows polarization isolation of the novel stacked dual-frequency dual-polarization provided by this embodiment, where the polarization isolation is below-15 dB.
The utility model provides a dual-frenquency double polarization millimeter wave antenna is a millimeter wave antenna of work at 26.91GHz ~ 28.62GHz and 36.9GHz ~ 40.90GHz frequency channel, it communicates n261(27.5GHz ~ 28.35GHz) and n260(37GHz ~ 40GHz) frequency channel to cover 5G millimeter wave, the polarization mode is horizontal polarization and vertical polarization two kinds simultaneously, adopt 4+ 8's sheet layer structure, the dual-frenquency double polarization has been realized on an antenna element, 4+ 8's sheet layer structure makes simple process simultaneously, low in manufacturing cost.
The utility model provides a dual-frenquency double polarization millimeter wave antenna's use scene has two kinds: firstly, the dual-frequency dual-polarization communication method is used for a millimeter wave communication base station and can simultaneously carry out dual-frequency dual-polarization communication; and secondly, the antenna is used for a mobile phone millimeter wave communication antenna, is high in integration level and small in size, and can be used as a mobile phone millimeter wave antenna.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, the changes are still within the scope of the present invention if they fall within the scope of the claims and their equivalents.
Claims (4)
1. A novel laminated dual-frequency dual-polarization millimeter wave antenna is characterized by comprising a PCB (printed Circuit Board) layer and an HDI (high Density interconnection) process board layer which are arranged in an up-down laminated mode, wherein the PCB layer and the HDI process board layer are electrically connected through a conductive paste;
the PCB board layer comprises a first dielectric plate, a second dielectric plate, a third dielectric plate and a fourth dielectric plate which are stacked from top to bottom, a first high-frequency radiation piece is arranged on the upper surface of the first dielectric plate, a second high-frequency radiation piece is arranged on the upper surface of the second dielectric plate, a low-frequency radiation piece is arranged on the upper surface of the third dielectric plate, and a grounding point of the millimeter wave antenna is arranged on the upper surface of the fourth dielectric plate;
the PCB board layer further comprises a feed unit, the feed unit comprises a vertical polarization feed network and a horizontal polarization feed network, the vertical polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize vertical polarization, the horizontal polarization feed network is connected with the first high-frequency radiation piece and the second high-frequency radiation piece to realize horizontal polarization, and the low-frequency radiation piece is fed by coupling of the first high-frequency radiation piece and the second high-frequency radiation piece;
the HDI process plate layer comprises a plurality of HDI process plates which are stacked from top to bottom;
the working frequency ranges of the millimeter wave antenna comprise 36.9 GHz-40.9 GHz and 26.91 GHz-28.61 GHz.
2. A novel stacked dual-frequency dual-polarized millimeter wave antenna according to claim 1, wherein a plurality of parasitic radiating fins are arranged around the first high-frequency radiating fin.
3. A novel stacked dual-frequency dual-polarized millimeter wave antenna according to claim 1, wherein a plurality of metal shielding holes penetrating through the PCB board layer and the HDI process board layer are arranged around the millimeter wave antenna.
4. A novel stacked dual-frequency dual-polarized millimeter wave antenna according to claim 1, wherein the vertical polarization feed network and the horizontal polarization feed network are metalized vias running through the PCB board layer and the HDI process board layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022627507.3U CN213636310U (en) | 2020-11-13 | 2020-11-13 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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| CN202022627507.3U CN213636310U (en) | 2020-11-13 | 2020-11-13 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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| CN213636310U true CN213636310U (en) | 2021-07-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112332097A (en) * | 2020-11-13 | 2021-02-05 | 上海安费诺永亿通讯电子有限公司 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112332097A (en) * | 2020-11-13 | 2021-02-05 | 上海安费诺永亿通讯电子有限公司 | Novel laminated dual-frequency dual-polarization millimeter wave antenna |
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