CN112331589B - Rolling unit, scribing wafer separation device and scribing wafer separation method - Google Patents
Rolling unit, scribing wafer separation device and scribing wafer separation method Download PDFInfo
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- CN112331589B CN112331589B CN202011159426.3A CN202011159426A CN112331589B CN 112331589 B CN112331589 B CN 112331589B CN 202011159426 A CN202011159426 A CN 202011159426A CN 112331589 B CN112331589 B CN 112331589B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a rolling unit, and relates to the technical field of scribe line wafer separation. The rolling unit comprises a reference seat, a press roller, a pushing mechanism and a tightening mechanism; the reference seat is connected with the press roller through a pushing mechanism, the pushing mechanism has elasticity, and the press roller can be far away from the reference seat under the action of the elasticity of the pushing mechanism; the moving direction of the press roller is vertical to the axis direction of the press roller; the tightening mechanism is arranged on the pushing mechanism and used for adjusting the elasticity of the pushing mechanism. According to the rolling unit, the elasticity of the pushing mechanism can be changed through the tightening mechanism, so that the rolling acting force of the pressing roller on the grooved wafer can be adjusted, the situation that adhesion occurs due to too small acting force or edge breakage occurs due to too large acting force is prevented, the production efficiency of a wafer product is improved, and the breakage rate of the product is reduced. On the basis, the invention also provides a paddle-wheel wafer separating device and a paddle-wheel wafer separating method.
Description
Technical Field
The invention relates to the technical field of paddle-wheel wafer separation, in particular to a rolling unit, a paddle-wheel wafer separation device and a paddle-wheel wafer separation method.
Background
Currently, the photoelectric industry is rapidly developed, and the demand for high-performance and high-integration semiconductor wafers is increasing. In order to reduce the manufacturing cost and improve the production efficiency, in the mass production process, an integrated circuit chip or a circuit element structure is often deposited on a wafer, then cut into a plurality of units, and finally packaged and soldered. Among them, the wafer dicing technique has an important influence on improving yield and packaging efficiency.
Wafer dicing techniques include a dicing process and a separation process. The existing wafer separation process mainly uses manual single-sheet rolling and semi-automatic rolling, and the rolling force is difficult to control and adjust according to the condition of the wafer, so that the phenomenon of edge breakage (too large rolling force) or adhesion (too small rolling force) of a finished product often occurs, and the wafer product has low production efficiency and high breakage rate.
Disclosure of Invention
The invention aims to provide a rolling unit, a scribing wafer separation device and a scribing wafer separation method, which are beneficial to solving the technical problems.
The invention is realized in the following way:
the rolling unit comprises a reference seat, a press roller, a pushing mechanism and a tightening mechanism; the reference seat is connected with the press roller through the pushing mechanism, the pushing mechanism has elasticity, and the press roller can be away from the reference seat under the action of the elasticity of the pushing mechanism; the moving direction of the press roller is perpendicular to the axis direction of the press roller; the tightening mechanism is arranged on the pushing mechanism and used for adjusting the elasticity of the pushing mechanism.
When the rolling unit is used, the tension of the pushing mechanism can be changed by the tightening mechanism, so that the acting force of the compression roller for outwards moving relative to the reference seat is adjusted. Therefore, the rolling unit can be adjusted according to the scribing condition of the wafer so as to meet different production requirements.
Further, the pushing mechanism comprises a guide post, a pressure spring and a lifting beam; the tightening mechanism comprises a tightening screw; the reference seat is provided with a guide hole, and the guide column penetrates through the guide hole; one end of the guide post is connected with the compression roller, and the other end of the guide post is connected with the lifting beam; the pressure spring is sleeved outside the guide post and is positioned between the reference seat and the compression roller; the lifting beam and the reference seat are provided with the tightening screw, and the tightening screw is used for adjusting the distance between the lifting beam and the reference seat. The technical effects are as follows: the guide post is used for limiting the moving direction of the compression roller, the compression spring is used for generating elastic pressure of the compression roller to the grooved wafer, the lifting beam is used for limiting on one hand and preventing the guide post from separating from the guide hole, and on the other hand, the lifting beam and the reference seat are used for changing the distance between the lifting beam and the reference seat together with the tightening screw, so that the adjustment of the elastic force of the compression spring is realized.
Further, the device also comprises a balancing mechanism; the balance mechanism is arranged between the lifting beam and the reference seat and is used for adjusting the moving direction of the press roller. The technical effects are as follows: because deflection may occur in the extending direction of the press roller, the press roller is not parallel and not tight to the bonding of the scribing wafer, and the balance mechanism is used for adjusting the moving direction of the press roller, so that the axial direction of the press roller and the surface of the scribing wafer are kept parallel to each other.
Further, the balancing mechanism comprises a balancing seat, a first lifting lug, a second lifting lug, a first jacking screw and a second jacking screw; the first lifting lug and the second lifting lug are arranged on the reference seat, and the first jacking screw is sequentially in threaded connection with the first lifting lug and the balance seat; the second jacking screw is sequentially in threaded connection with the second lifting lug and the balance seat. The technical effects are as follows: the reference seat is movably arranged on the balance seat through the first lifting lug and the second lifting lug, and the first lifting screw and the second lifting screw are used for respectively adjusting the horizontal positions of the two sides of the reference seat on the balance seat, so that the space posture adjustment of the press roller is realized.
Further, the device also comprises a lifting mechanism; the lifting mechanism comprises a mounting seat, a third lifting lug and a lifting screw; the third lifting lug is arranged on the balance seat, and the lifting screw is sequentially in threaded connection with the third lifting lug and the installation seat. The technical effects are as follows: the balance seat is arranged on the mounting seat through the third lifting lug, and the lifting screw is used for changing the height position of the balance seat relative to the mounting seat.
A paddle-wheel wafer separating device comprises a first guide shaft, a second guide shaft, a cross beam and at least one rolling unit; the first guide shaft and the second guide shaft are parallel to each other; the two ends of the cross beam are respectively connected with the first guide shaft and the second guide shaft, and the cross beam can move along the axial direction of the first guide shaft; the rolling unit is arranged on the cross beam, and the moving direction of the pressing roller relative to the reference seat is perpendicular to the length direction of the first guide shaft; the length direction of the compression roller and the length direction of the first guide shaft form an included angle.
Further, a slide unit is also included; the slide unit is arranged between the first guide shaft and the second guide shaft; a rolling plane is arranged on the slide glass unit, and the moving direction of the pressing roller relative to the reference seat is vertical to the rolling plane; the press roller is used for rolling the grooved wafer positioned on the rolling plane. The technical effects are as follows: the slide glass unit is used for bearing the wafer with the groove and separating the wafer with the press roller. At this time, one or more scribe line wafers may be provided on the carrier unit.
Further, the slide unit is rotatable about an axis perpendicular to the roll plane. The technical effects are as follows: through the rotation of the slide glass unit, the pressing roller can relatively uniformly roll the grooved wafer in the moving process of the slide glass unit in one direction.
Further, a plurality of slide discs are arranged on the slide unit; the slide disc is rotatable about an axis perpendicular to the roll plane. The technical effects are as follows: by independent rotation of the plurality of slide discs on the slide unit, more rolling angles of the paddle-wheel wafer can be met.
The separation method based on the paddle-wheel wafer separation device comprises the following steps:
step one, driving the press roller to move from an initial position to a final position along the axial direction of the first guide shaft, wherein the press roller rolls a grooved wafer on the rolling plane for one time;
step two, rotating the grooved wafer around an axis perpendicular to the rolling plane;
and thirdly, driving the press roller to move from a final position to an initial position along the axial direction of the first guide shaft, wherein the press roller realizes secondary rolling on the grooved wafer on the rolling plane.
Further, before the first step, a distance between the pressing roller and the rolling plane is adjusted. The technical effects are as follows: the distance between the press roller and the rolling plane can be changed through the third lifting lug and the lifting screw, so that the press roller rolls the grooved wafer downwards when moving at a specific height.
Further, before the first step, the elastic force of the pushing mechanism is changed by the tightening mechanism. The technical effects are as follows: the distance between the press roller and the reference seat (namely the length of the compressed pressure spring) can be changed through the lifting beam and the tightening screw, so that the press roller generates proper extrusion acting force on the scribing groove wafer.
Further, before the first step, an included angle between the axis of the press roll and the rolling plane is adjusted to be zero. The technical effects are as follows: the gesture of compression roller in the space can be changed through aforementioned first lug, second lug, first jack screw and second jack screw for when the compression roller rolls the groove wafer, its circumference contacts the surface of groove wafer completely and evenly.
The beneficial effects of the invention are as follows:
according to the rolling unit, the scribing wafer separation device and the scribing wafer separation method, the elasticity of the pushing mechanism can be changed through the tightening mechanism, so that the rolling acting force of the pressing roller on the scribing wafer is adjusted, the situation that adhesion occurs due to too small acting force or edge breakage occurs due to too large acting force is prevented, the production efficiency of a wafer product is improved, and the breakage rate of the product is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a first view angle of a rolling unit according to a first embodiment of the present invention;
fig. 2 is a schematic view of a second view of the rolling unit according to the first embodiment of the present invention;
fig. 3 is a schematic view of a third view of the rolling unit according to the first embodiment of the present invention;
FIG. 4 is a schematic view of a scribe-lane wafer separation apparatus according to a second embodiment of the present invention;
FIG. 5 is a schematic view of a scribe-lane wafer separation apparatus according to a second embodiment of the present invention;
FIG. 6 is a schematic view of a part of the internal structure of a scribe-lane wafer separation apparatus according to a second embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating the operation of a scribe-lane wafer separation method according to a third embodiment of the present invention (the pressing roller is located at the initial position);
fig. 8 is an operation schematic diagram of a scribe-lane wafer separation method according to a third embodiment of the present invention (the pressing roller is located at the end position).
Icon: 1-a reference seat; 2-a press roll; 3-guide posts; 4-a compression spring; 5-lifting beams; 6-tightening the screw; 7-balancing the seat; 8-a first lifting lug; 9-a second lifting lug; 10-a first jacking screw; 11-a second jacking screw; 12-mounting seats; 13-a third lifting lug; 14-lifting screws; 15-a first guide shaft; 16-a second guide shaft; 17-a cross beam; 18-a slide unit; 20-slide discs; 21-a control unit; 22-touch control screen.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. The components of the embodiments of the present invention, as generally described and illustrated in the figures, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," "overhang," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
First embodiment:
fig. 1 is a schematic view of a first view angle of a rolling unit according to a first embodiment of the present invention; fig. 2 is a schematic view of a second view of the rolling unit according to the first embodiment of the present invention; fig. 3 is a schematic view illustrating a third view of a rolling unit according to the first embodiment of the present invention. Referring to fig. 1 to 3, the present embodiment provides a rolling unit, which includes a reference base 1, a pressing roller 2, a pushing mechanism and a tightening mechanism. The standard seat 1 and the compression roller 2 are connected through a pushing mechanism, the pushing mechanism has elasticity, and the compression roller 2 can be far away from the standard seat 1 under the action of the elasticity of the pushing mechanism; the moving direction of the press roller 2 is perpendicular to the axis direction of the press roller; the tightening mechanism is arranged on the pushing mechanism and used for adjusting the elasticity of the pushing mechanism.
When the rolling unit is used, the tension of the pushing mechanism can be changed by the tightening mechanism, so that the acting force of the compression roller 2 for outwards moving relative to the reference seat 1 is adjusted. Therefore, the rolling unit can be adjusted according to the scribing condition of the wafer so as to meet different production requirements.
Further, as shown in fig. 1 to 3, the pushing mechanism includes a guide post 3, a compression spring 4, and a lifting beam 5; the tightening mechanism comprises a tightening screw 6; the reference seat 1 is provided with a guide hole, and the guide column 3 penetrates through the guide hole; one end of the guide post 3 is connected with the compression roller 2, and the other end of the guide post 3 is connected with the lifting beam 5; the pressure spring 4 is sleeved outside the guide post 3, and the pressure spring 4 is positioned between the reference seat 1 and the compression roller 2; the lifting beam 5 and the reference seat 1 are provided with tightening screws 6, and the tightening screws 6 are used for adjusting the distance between the lifting beam 5 and the reference seat 1.
The number of the guide posts 3 is two, and the guide posts are respectively arranged at the left side and the right side and are oppositely arranged along the length direction of the press roller 2. Correspondingly, the number of the compression springs 4 and the tightening screws 6 is two. Alternatively, the tightening mechanism may be further provided with two nuts, and the upper section of the guide post 3 is provided with corresponding internal threads, and the compressed length of the compression spring 4 is adjusted by adjusting the positions of the two nuts on the guide post 3.
On the basis of the rolling unit provided in the above embodiment, further, as shown in fig. 1 to 3, a balancing mechanism is further included; a balancing mechanism is provided between the lifting beam 5 and the reference base 1 for adjusting the moving direction of the pressing roller 2. The balancing mechanism comprises a balancing seat 7, a first lifting lug 8, a second lifting lug 9, a first jacking screw 10 and a second jacking screw 11; the reference seat 1 is provided with a first lifting lug 8 and a second lifting lug 9, and a first jacking screw 10 is sequentially in threaded connection with the first lifting lug 8 and the balance seat 7; the second jacking screw 11 is sequentially in threaded connection with the second lifting lug 9 and the balance seat 7.
On the basis of the rolling unit provided in the above embodiment, further, as shown in fig. 1 to 3, the rolling unit further includes a lifting mechanism; the lifting mechanism comprises a mounting seat 12, a third lifting lug 13 and a lifting screw 14; the third lifting lug 13 is arranged on the balance seat 7, and the lifting screw 14 is sequentially in threaded connection with the third lifting lug 13 and the mounting seat 12.
Second embodiment:
FIG. 4 is a schematic view of a scribe-lane wafer separation apparatus according to a second embodiment of the present invention; FIG. 5 is a schematic view of a scribe-lane wafer separation apparatus according to a second embodiment of the present invention; fig. 6 is a schematic view of a part of an internal structure of a scribe-lane wafer separation apparatus according to a second embodiment of the present invention. Referring to fig. 4 to 6, the present embodiment provides a scribe-and-break wafer separating apparatus, which includes a first guiding shaft 15, a second guiding shaft 16, a cross beam 17, and at least one rolling unit according to the above embodiment; the first guide shaft 15 and the second guide shaft 16 are parallel to each other; the two ends of the cross beam 17 are respectively connected with the first guide shaft 15 and the second guide shaft 16, and the cross beam 17 can move along the axial direction of the first guide shaft 15; the rolling unit is arranged on the cross beam 17, and the moving direction of the pressing roller 2 relative to the reference seat 1 is vertical to the length direction of the first guide shaft 15; the length direction of the press roller 2 is arranged at an included angle with the length direction of the first guide shaft 15.
Further, as shown in fig. 4 to 6, the scribe-lane wafer separating device provided in the above embodiment further includes a slide unit 18; the slide unit 18 is disposed between the first guide shaft 15 and the second guide shaft 16; the slide glass unit 18 is provided with a rolling plane, and the moving direction of the pressing roller 2 relative to the reference seat 1 is vertical to the rolling plane; the press roller 2 is used for rolling the grooved wafer on the rolling plane.
Further, as shown in fig. 4 to 6, the slide unit 18 can be rotated about an axis perpendicular to the rolling plane, on the basis of the scribe-lane wafer separating apparatus provided in the above-described embodiment.
Optionally, as shown in fig. 4 to 6, a plurality of slide discs 20 are provided on the slide unit 18 on the basis of the scribe-lane wafer separating device provided in the above embodiment; slide disc 20 is rotatable about an axis perpendicular to the roll plane.
Alternatively, one, two, three, four or more paddle wafers may be placed on the slide unit 18 as desired for production. Wherein, a plurality of paddle vat wafers are the circle evenly distributed on the roll-in plane.
Further, the scribe-lane wafer separation apparatus may further be provided with a control unit 21 and a touch control screen 22. The control unit 21 is used for controlling the movement and elevation of the platen roller 2, and the touch control screen 22 is used for display and manual touch control.
Third embodiment:
fig. 7 is a schematic operation diagram of a scribe-lane wafer separation method according to a third embodiment of the present invention (the pressing roller 2 is located at the initial position); fig. 8 is a schematic operation diagram of a scribe-lane wafer separation method according to a third embodiment of the present invention (the pressing roller 2 is located at the end position). Referring to fig. 7 and 8, the present embodiment provides a separation method of a scribe-lane wafer separation apparatus according to the above embodiment, which includes the following steps:
step one, the press roller 2 is driven to move from an initial position to a final position along the axial direction of the first guide shaft 15, and the press roller 2 rolls the grooved wafer on the rolling plane once.
And secondly, rotating the grooved wafer around an axis perpendicular to the rolling plane.
And thirdly, driving the press roller 2 to move from the final position to the initial position along the axial direction of the first guide shaft 15, and realizing secondary rolling on the grooved wafer on the rolling plane by the press roller 2.
Optionally, the distance between the press roll 2 and the roll plane is adjusted before the above step one.
Optionally, before the first step, the elastic force of the pushing mechanism is changed by the tightening mechanism.
Optionally, before the first step, the angle between the axis of the press roll 2 and the rolling plane is adjusted to zero.
The three adjustment processes before the first step can be sequentially adjusted according to different orders according to actual conditions.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A scribe-lane wafer separation apparatus characterized by comprising a first guide shaft (15), a second guide shaft (16), a cross beam (17), and a rolling unit connected to the cross beam (17) so as to be movable along the first guide shaft (15) and the second guide shaft (16) in synchronization with the cross beam (17);
the scribe-lane wafer separating apparatus further includes a slide unit (18) formed in a disk shape; the slide unit (18) is provided with a rolling plane, and the slide unit (18) can rotate around an axis perpendicular to the rolling plane; a plurality of disc-shaped slide discs (20) are arranged on the slide unit (18); -the slide disc (20) is rotatable about an axis perpendicular to the rolling plane;
the rolling unit comprises a reference seat (1), a press roller (2), a pushing mechanism and a tightening mechanism;
the reference seat (1) is connected with the press roller (2) through the pushing mechanism, the pushing mechanism has elasticity, and the press roller (2) can be away from the reference seat (1) under the action of the elasticity of the pushing mechanism; the moving direction of the press roller (2) is perpendicular to the axis direction of the press roller; the tightening mechanism is arranged on the pushing mechanism and is used for adjusting the elasticity of the pushing mechanism;
the pushing mechanism comprises a guide column (3), a pressure spring (4) and a lifting beam (5); the tightening mechanism comprises tightening screws (6), and the guide posts (3), the pressure springs (4) and the tightening screws (6) are provided with two groups and are respectively positioned at two ends of the compression roller (2) in the axial direction;
the rolling unit comprises a balancing mechanism, so that the included angle between the axis of the pressing roller (2) and the rolling plane can be adjusted to be zero; the roll-in unit further comprises a lifting mechanism to enable adjustment of the distance between the press roll (2) and the roll-in plane.
2. The scribe-lane wafer separation apparatus as claimed in claim 1, wherein the reference base (1) is provided with a guide hole through which the guide post (3) penetrates; one end of the guide column (3) is connected with the compression roller (2), and the other end of the guide column (3) is connected with the lifting beam (5); the pressure spring (4) is sleeved outside the guide post (3), and the pressure spring (4) is positioned between the reference seat (1) and the compression roller (2); the lifting beam (5) and the reference seat (1) are provided with the tightening screw (6), and the tightening screw (6) is used for adjusting the distance between the lifting beam (5) and the reference seat (1).
3. The scribe-lane wafer separation apparatus according to claim 2, wherein the balancing mechanism is provided between the lifting beam (5) and the reference base (1) for adjusting the moving direction of the pressing roller (2).
4. The scribe-lane wafer separation apparatus as claimed in claim 3, wherein the balancing mechanism comprises a balancing stand (7), a first lifting lug (8), a second lifting lug (9), a first lifting screw (10) and a second lifting screw (11); the reference seat (1) is provided with the first lifting lug (8) and the second lifting lug (9), and the first jacking screw (10) is sequentially in threaded connection with the first lifting lug (8) and the balance seat (7); the second jacking screw (11) is sequentially in threaded connection with the second lifting lug (9) and the balance seat (7).
5. The scribe-lane wafer separation apparatus as claimed in claim 4, wherein the lifting mechanism comprises a mount (12), a third lifting lug (13) and a lifting screw (14); the third lifting lug (13) is arranged on the balance seat (7), and the lifting screw (14) is sequentially in threaded connection with the third lifting lug (13) and the mounting seat (12).
6. The scribe-lane wafer separation apparatus as claimed in claim 1, wherein the first guide shaft (15) and the second guide shaft (16) are parallel to each other; the two ends of the cross beam (17) are respectively connected with the first guide shaft (15) and the second guide shaft (16), and the cross beam (17) can move along the axial direction of the first guide shaft (15); the rolling unit is arranged on the cross beam (17), and the moving direction of the pressing roller (2) relative to the reference seat (1) is perpendicular to the length direction of the first guide shaft (15); the length direction of the compression roller (2) and the length direction of the first guide shaft (15) form an included angle.
7. The scribe-lane wafer separation apparatus as claimed in claim 6, wherein the slide unit (18) is disposed between the first guide shaft (15) and the second guide shaft (16); the moving direction of the pressing roller (2) relative to the reference seat (1) is vertical to the rolling plane; the press roller (2) is used for rolling the grooved wafer positioned on the rolling plane.
8. A scribe-lane wafer separation method based on the scribe-lane wafer separation apparatus as claimed in any one of claims 1 to 7, comprising the steps of:
step one, driving the press roller (2) to move from an initial position to a final position along the axial direction of the first guide shaft (15), wherein the press roller (2) realizes one-time rolling of a grooved wafer on the rolling plane;
step two, rotating the grooved wafer around an axis perpendicular to the rolling plane;
and thirdly, driving the press roller (2) to move from the final position to the initial position along the axial direction of the first guide shaft (15), wherein the press roller (2) realizes secondary rolling on the grooved wafer on the rolling plane.
9. The method of separating a scribe-lane wafer according to claim 8, wherein the distance between the pressing roller (2) and the rolling plane is adjusted before the first step.
10. The method of claim 8, wherein the spring force of the pushing mechanism is changed by the tightening mechanism prior to the first step.
11. The method according to claim 8, characterized in that the angle between the axis of the pressing roll (2) and the rolling plane is adjusted to zero before the first step.
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| CN202011159426.3A CN112331589B (en) | 2020-10-26 | 2020-10-26 | Rolling unit, scribing wafer separation device and scribing wafer separation method |
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| CN202011159426.3A CN112331589B (en) | 2020-10-26 | 2020-10-26 | Rolling unit, scribing wafer separation device and scribing wafer separation method |
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| CN112331589B true CN112331589B (en) | 2023-08-22 |
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