CN215315028U - Punch press sticky tape chip mounter with buffer structure - Google Patents

Punch press sticky tape chip mounter with buffer structure Download PDF

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Publication number
CN215315028U
CN215315028U CN202120054372.8U CN202120054372U CN215315028U CN 215315028 U CN215315028 U CN 215315028U CN 202120054372 U CN202120054372 U CN 202120054372U CN 215315028 U CN215315028 U CN 215315028U
Authority
CN
China
Prior art keywords
adhesive tape
punch
threaded rod
die
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202120054372.8U
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Chinese (zh)
Inventor
李娜娜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xingyu Automation Shenzhen Co ltd
Original Assignee
Xingyu Automation Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xingyu Automation Shenzhen Co ltd filed Critical Xingyu Automation Shenzhen Co ltd
Priority to CN202120054372.8U priority Critical patent/CN215315028U/en
Application granted granted Critical
Publication of CN215315028U publication Critical patent/CN215315028U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a punch adhesive tape chip mounter with a buffer structure, and relates to the field of punch adhesive tape chip mounters. According to the utility model, through the arrangement of the threaded rod, the threaded sleeve and the connecting frame, when stamping parts with different thicknesses are replaced, a worker needs to rotate the threaded sleeve to adjust the height of the threaded sleeve along the threaded rod, the connecting frame is rotationally connected with the threaded sleeve, so that the threaded sleeve can rotate to drive the connecting frame and the connected stamping die to adjust the position, the worker adjusts the distance from the stamping die to a machine table to be equal to the sum of the thicknesses of the adhesive tape and the stamping parts through comparison of the size strips arranged on the threaded rod, the thickness adjustment of the material passing groove is completed, and the condition that the application range of the device is poor due to the fact that the material passing groove is inconvenient to adjust is avoided.

Description

Punch press sticky tape chip mounter with buffer structure
Technical Field
The utility model relates to the field of punch adhesive tape chip mounters, in particular to a punch adhesive tape chip mounter with a buffer structure.
Background
At present, in wide electronic field products such as mobile phones and the like, a large number of steel tiny thin-wall stamping parts are used, the length and the width of the stamping parts are only a few millimeters, the thickness of the stamping parts is also only a few tens of threads, and the number of the stamping parts is extremely large. After the punching is finished, how to arrange the sheets in order is beneficial to subsequent processing or installation, and further mass production is realized, so that a punch adhesive tape chip mounter is required to be used for sorting.
According to the chinese patent with publication number CN205183569U, a punch chip mounter is disclosed, which is characterized in that a material groove is arranged below a material punching hole, an adhesive tape passes through the material groove as a conveyor belt, a molded part after punching is adhered on the adhesive tape, and the adhesive tape drives the molded part to leave a punching die, thereby realizing the ordered arrangement of the molded parts, and no human hand is needed to grab, thereby reducing the influence of human factors, improving the production efficiency, and reducing the cost, but the material passing groove in the above manner has constant thickness, is inconvenient to adjust, and can not be used when needing to process stamped parts with different thicknesses, so that the application range of the device is poor, and meanwhile, when the device punches the stamped parts, because the punching force is too strong, the stamped parts are easy to deform, and the quality of the stamped parts is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to: in order to solve the problem that the deformation of a stamping part is easily caused by poor application range and too strong stamping force of a device due to the inconvenient adjustment of a material passing groove, the punching machine adhesive tape chip mounter with the buffer structure is provided.
In order to achieve the purpose, the utility model provides the following technical scheme: a punch adhesive tape chip mounter with a buffer structure comprises a machine table, wherein a first fixing plate and a second fixing plate are fixed on two sides of the machine table respectively, a motor frame is mounted at the top of the first fixing plate, a power grinding wheel and a driven grinding wheel are mounted above the outer surface and below the outer surface of the motor frame respectively, an adhesive tape wheel and a guide wheel are mounted inside the second fixing plate respectively, an adhesive tape is wound on the outer surface of the adhesive tape wheel, a rubber pad is fixed in the middle of the top of the machine table, a supporting frame is arranged on the back of the machine table, an operating table is mounted on the outer surface of the supporting frame, an air cylinder is mounted in the middle of the bottom of the supporting frame, an output end of the air cylinder is connected with a mounting plate through a piston rod, punches are mounted on two sides of the bottom of the mounting plate, the bottom of the mounting plate is connected with a touch plate through a buffer spring, and a plurality of convex blocks are fixed on the bottom of the touch plate, threaded rods are fixed to two sides of the bottom of the supporting frame, threaded sleeves are sleeved in the middle of the outer surfaces of the threaded rods, connecting frames are sleeved on the outer surfaces of the threaded sleeves, stamping dies are fixed to the bottoms of the connecting frames, stamping holes penetrate through the tops of the stamping dies, stamping parts are placed at the bottoms of the stamping holes, and material passing grooves are formed between the stamping dies and the rubber pads.
Preferably, one end of the adhesive tape, which is far away from the adhesive tape wheel, sequentially passes through the guide wheel, the material passing groove and the power grinding wheel.
Preferably, the link is connected with the surface of thread bush in a rotating way, thread bush and threaded rod threaded connection, just the surface of threaded rod is provided with the size strip.
Preferably, the length of the buffer spring is greater than that of the punch, and the bumps are all arc-shaped and uniformly distributed.
Preferably, the punching hole is positioned above the rubber pad, and the punching hole is positioned below the punch.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, by arranging the threaded rod, the threaded sleeve and the connecting frame, when stamping parts with different thicknesses are replaced, a worker needs to rotate the threaded sleeve to adjust the height of the threaded sleeve along the threaded rod, and the connecting frame is rotationally connected with the threaded sleeve, so that the threaded sleeve can rotate to drive the connecting frame and the connected stamping die to adjust the position;
2. according to the utility model, the buffer spring, the contact plate, the lugs and the rubber pad are arranged, when the air cylinder operates, the piston rod can push the mounting plate to move downwards, so that the punch and the buffer spring move downwards, the buffer spring is longer than the punch and can be firstly contacted with the stamping part, the lugs which are uniformly distributed initially buffer, then the buffer spring buffers again, then the punch pushes the stamping part into the punching hole, the stamping part can fall on the adhesive tape, and when the force of the punch is too large, the punch can be abutted against the stamping part and the adhesive tape to be pressed on the rubber pad, and the rubber pad further buffers, so that the safety of the stamping part is improved, and the condition that the stamping part is deformed easily due to too strong stamping force is avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of a machine according to the present invention;
FIG. 3 is a schematic view of the structure of the connecting frame of the present invention;
FIG. 4 is a schematic view of the structure of the mounting plate of the present invention.
In the figure: 1. a machine platform; 2. a support frame; 3. an operation table; 4. a threaded rod; 5. a threaded sleeve; 6. a connecting frame; 7. punching a die; 8. stamping parts; 9. a first fixing plate; 10. a second fixing plate; 11. a tape wheel; 12. a guide wheel; 13. a motor frame; 14. a power grinding wheel; 15. a driven grinding wheel; 16. an adhesive tape; 17. a cylinder; 18. a piston rod; 19. mounting a plate; 20. a punch; 21. a buffer spring; 22. a touch plate; 23. a material passing groove; 24. punching a material hole; 25. a bump; 26. and (7) a rubber pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention based on its overall structure.
Referring to fig. 1-4, a die-punching adhesive tape chip mounter with a buffer structure includes a machine table 1, a support frame 2, an operation table 3, a threaded rod 4, a threaded sleeve 5, a connection frame 6, a die 7, a stamping part 8, a first fixing plate 9, a second fixing plate 10, an adhesive tape wheel 11, a guide wheel 12, a motor frame 13, a power grinding wheel 14, a driven grinding wheel 15, an adhesive tape 16, an air cylinder 17, a piston rod 18, a mounting plate 19, a punch 20, a buffer spring 21, a collision plate 22, a material passing groove 23, a material punching hole 24, a bump 25 and a rubber pad 26, wherein the first fixing plate 9 and the second fixing plate 10 are respectively fixed on two sides of the machine table 1, the motor frame 13 is installed on the top of the first fixing plate 9, the power grinding wheel 14 and the driven grinding wheel 15 are respectively installed on the upper portion of the outer surface and the lower portion of the outer surface of the motor frame 13, so that the motor on the motor frame 13 drives the power grinding wheel 14 and the driven grinding wheel 15 to rotate simultaneously, the adhesive tape wheel 11 and the guide wheel 12 are respectively installed inside the second fixing plate 10, the adhesive tape 16 is wound on the outer surface of the adhesive tape wheel 11, the rubber pad 26 is fixed in the middle of the top of the machine table 1, the supporting frame 2 is arranged on the back of the machine table 1, the operating table 3 is installed on the outer surface of the supporting frame 2, the air cylinder 17 is installed in the middle of the bottom of the supporting frame 2, the output end of the air cylinder 17 is connected with the mounting plate 19 through the piston rod 18, the punches 20 are installed on two sides of the bottom of the mounting plate 19, the bottom of the mounting plate 19 is connected with the touch plate 22 through the buffer spring 21, the plurality of convex blocks 25 are fixed at the bottom of the touch plate 22, the threaded rod 4 is fixed on two sides of the bottom of the supporting frame 2, the threaded sleeve 5 is sleeved in the middle of the outer surface of the threaded rod 4, the connecting frame 6 is sleeved on the outer surface of the threaded sleeve 5, the die 7 is fixed with the die 7, the die hole 24 penetrates through the top of the die 7, the stamping part 8 is placed at the bottom of the punching hole 24, and a material passing groove 23 is arranged between the punching die 7 and the rubber pad 26.
Please refer to fig. 1-3, one end of the adhesive tape 16 far from the adhesive tape wheel 11 sequentially passes through the guide wheel 12, the material passing groove 23 and the power grinding wheel 14, so that the adhesive tape 16 can be smoothly moved and transmitted, the connecting frame 6 is rotatably connected with the outer surface of the threaded sleeve 5, the threaded sleeve 5 is in threaded connection with the threaded rod 4, and the outer surface of the threaded rod 4 is provided with a dimension strip, so that the connecting frame 6 can be driven when the threaded sleeve 5 moves along the threaded rod 4 in a threaded manner.
Referring to fig. 2 and 4, the length of the buffer spring 21 is greater than the length of the punch 20, the plurality of protrusions 25 are arc-shaped and uniformly distributed, so that the protrusions 25 can play a role of shock absorption and buffering, the punching hole 24 is located above the rubber pad 26, and the punching hole 24 is located below the punch 20, so that the punch 20 can penetrate through the punching hole 24.
The working principle is as follows: firstly, the worker pulls out the adhesive tape 16 from the adhesive tape wheel 11 and sequentially passes through the guide wheel 12 and the material passing groove 23, and finally one end of the adhesive tape 16 passes between the power grinding wheel 14 and the driven grinding wheel 15, then the worker places the stamping part 8 at the top middle of the die 7 corresponding to the material passing hole 24, then the piston rod 18 pushes the mounting plate 19 downwards when the air cylinder 17 operates, so that the punch 20 and the buffer spring 21 are downward, the buffer spring 21 is longer than the punch 20 and can be firstly contacted with the stamping part 8, the uniformly distributed bumps 25 perform primary buffering, then the buffer spring 21 performs buffering again, then after the punch 20 pushes the stamping part 8 into the material passing hole 24, the stamping part 8 falls on the adhesive tape 16, the processing is completed, when the force of the punch 20 is too large, the punch 20 can be pressed against the stamping part 8 and the adhesive tape 16 on the rubber pad 26, further cushion through rubber pad 26, thereby improve stamping workpiece 8's security, simultaneously when the stamping workpiece 8 of different thickness of needs changing, the staff need rotate thread bush 5, let thread bush 5 along threaded rod 4 and height-adjusting, and because link 6 rotates with thread bush 5 to be connected, make thread bush 5 rotate and to drive link 6 and the 7 adjusting position of die that connect, the staff is and through the contrast adjustment of the size strip that is equipped with on threaded rod 4, finally make the die 7 to the distance of board 1 equal the thickness sum of sticky tape 16 and stamping workpiece 8, thereby accomplish the thickness adjustment of silo 23, so that follow-up use.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (5)

1. The utility model provides a punch press sticky tape chip mounter with buffer structure, includes board (1), its characterized in that: the machine is characterized in that a first fixing plate (9) and a second fixing plate (10) are fixed on two sides of the machine table (1) respectively, a motor frame (13) is installed at the top of the first fixing plate (9), a power grinding wheel (14) and a driven grinding wheel (15) are installed above the outer surface and below the outer surface of the motor frame (13) respectively, an adhesive tape wheel (11) and a guide wheel (12) are installed inside the second fixing plate (10) respectively, an adhesive tape (16) is wound on the outer surface of the adhesive tape wheel (11), a rubber pad (26) is fixed in the middle of the top of the machine table (1), a support frame (2) is arranged on the back of the machine table (1), an operation table (3) is installed on the outer surface of the support frame (2), an air cylinder (17) is installed in the middle of the bottom of the support frame (2), and the output end of the air cylinder (17) is connected with a mounting plate (19) through a piston rod (18), drift (20) are installed to the bottom both sides of mounting panel (19), the bottom of mounting panel (19) is connected with through buffer spring (21) and supports touch panel (22), the bottom of supporting panel (22) is fixed with a plurality of lugs (25), the bottom both sides of support frame (2) all are fixed with threaded rod (4), thread bush (5) have been cup jointed in the middle of the surface of threaded rod (4), link (6) have been cup jointed to the surface of thread bush (5), the bottom of link (6) is fixed with die (7), it has towards material hole (24) to run through in the middle of the top of die (7), stamping workpiece (8) have been placed to the bottom towards material hole (24), be provided with between die (7) and rubber pad (26) silo (23).
2. The die bonder tape dispenser with a cushion structure of claim 1, wherein: one end of the adhesive tape (16) far away from the adhesive tape wheel (11) sequentially passes through the guide wheel (12), the material passing groove (23) and the power grinding wheel (14).
3. The die bonder tape dispenser with a cushion structure of claim 1, wherein: the connecting frame (6) is rotationally connected with the outer surface of the threaded sleeve (5), the threaded sleeve (5) is in threaded connection with the threaded rod (4), and the outer surface of the threaded rod (4) is provided with a size strip.
4. The die bonder tape dispenser with a cushion structure of claim 1, wherein: the length of the buffer spring (21) is larger than that of the punch (20), and the plurality of convex blocks (25) are arc-shaped and are uniformly distributed.
5. The die bonder tape dispenser with a cushion structure of claim 1, wherein: the punching hole (24) is positioned above the rubber pad (26), and the punching hole (24) is positioned below the punch (20).
CN202120054372.8U 2021-01-11 2021-01-11 Punch press sticky tape chip mounter with buffer structure Expired - Fee Related CN215315028U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120054372.8U CN215315028U (en) 2021-01-11 2021-01-11 Punch press sticky tape chip mounter with buffer structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120054372.8U CN215315028U (en) 2021-01-11 2021-01-11 Punch press sticky tape chip mounter with buffer structure

Publications (1)

Publication Number Publication Date
CN215315028U true CN215315028U (en) 2021-12-28

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CN202120054372.8U Expired - Fee Related CN215315028U (en) 2021-01-11 2021-01-11 Punch press sticky tape chip mounter with buffer structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114714631A (en) * 2022-06-10 2022-07-08 合肥航太电物理技术有限公司 Automatic processing equipment for airplane lightning protection system accessories

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114714631A (en) * 2022-06-10 2022-07-08 合肥航太电物理技术有限公司 Automatic processing equipment for airplane lightning protection system accessories

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211228