CN112328052A - CPU circulation heat radiation structure - Google Patents
CPU circulation heat radiation structure Download PDFInfo
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- CN112328052A CN112328052A CN202011123021.4A CN202011123021A CN112328052A CN 112328052 A CN112328052 A CN 112328052A CN 202011123021 A CN202011123021 A CN 202011123021A CN 112328052 A CN112328052 A CN 112328052A
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- heat
- heat dissipation
- cpu
- cavity
- heat conduction
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a CPU circulating heat dissipation structure which comprises a mounting plate, wherein a heat dissipation cavity is separately arranged on the left half part in the mounting plate, a mounting cavity is separately arranged on the right half part of the mounting plate, a CPU body is fixedly arranged in the mounting cavity, a heat conduction copper sheet is fixedly connected to the CPU body, a communication port is formed between the mounting cavity and the heat dissipation cavity, a heat conduction sheet is fixedly arranged in the communication port, one end, away from the CPU body, of the heat conduction copper sheet is fixedly connected to the side wall of the heat conduction sheet, a rotary disc is arranged in the heat dissipation cavity, an impeller is fixedly arranged at the lower end of the rotary disc, the center of the impeller is rotatably connected to the inner wall of the heat dissipation cavity through a connecting shaft, and a plurality of sliding. The invention can change the self rotating speed according to the working condition of the CPU body to carry out heat dissipation on the CPU body, has self-regulation capability, good heat dissipation effect, no need of electric energy consumption, energy saving and environmental protection.
Description
Technical Field
The invention relates to the technical field of CPUs (central processing units), in particular to a CPU.
Background
A Central Processing Unit (CPU), which is one of the main devices of an electronic computer, is a core accessory in the computer. Its functions are mainly to interpret computer instructions and to process data in computer software.
When the computer is just started, the temperature of the CPU is low, the cooling fan starts to work after being started, certain electric energy is consumed, the cooling fan cannot automatically adjust the cooling speed of the fan according to the temperature of the CPU, and the cooling effect is not good enough.
In order to solve the above problems, the present invention provides a CPU circulation heat dissipation structure.
Disclosure of Invention
The invention aims to solve the defects that in the prior art, when a computer is just started, the temperature of a CPU is low, a cooling fan starts to work after being started, certain electric energy is consumed, the cooling fan cannot automatically adjust the cooling speed of the fan according to the temperature of the CPU, and the cooling effect is not good enough, and thereby the invention provides the CPU circulating cooling structure.
In order to achieve the purpose, the invention adopts the following technical scheme:
a CPU circulating heat dissipation structure comprises a mounting plate, wherein a heat dissipation cavity is separately arranged on the left half part in the mounting plate, a mounting cavity is separately arranged on the right half part of the mounting plate, a CPU body is fixedly arranged in the mounting cavity, a heat conduction copper sheet is fixedly connected to the CPU body, a communication port is formed between the mounting cavity and the heat dissipation cavity, a heat conduction sheet is fixedly arranged in the communication port, one end, away from the CPU body, of the heat conduction copper sheet is fixedly connected to the side wall of the heat conduction sheet, a rotary disc is arranged in the heat dissipation cavity, an impeller is fixedly arranged at the lower end of the rotary disc, the center of the impeller is rotatably connected to the inner wall of the heat dissipation cavity through a connecting shaft, a plurality of sliding cavities are formed in an equally-spaced ring array in the rotary disc, a sliding plug is slidably connected in each sliding cavity, a memory metal spring is fixedly arranged on one side, opposite to the, every the one end that memory metal spring was kept away from to heat conduction slippery fellow runs through the lateral wall of carousel and extends to the external world, and is a plurality of the relative one end in smooth chamber all is provided with the spray tube, every the lower extreme of spray tube all runs through the bottom face and the fixedly connected with air nozzle of carousel, every the air nozzle all corresponds with the impeller.
Preferably, a plurality of heat dissipation holes are symmetrically formed in the side wall of the heat dissipation cavity, and the other end of each heat dissipation hole penetrates through the side wall of the mounting plate and is communicated with the outside.
Preferably, the deformation temperature of the memory metal spring is sixty degrees.
Preferably, the heat-conducting slider and the heat-conducting fin are both made of magnetic materials.
Compared with the prior art, the invention has the beneficial effects that:
when the CPU body continuously works, the temperature of the CPU body gradually rises, the heat on the CPU body can be quickly transferred to the heat-conducting copper sheet, the heat-conducting copper sheet can transfer the heat to the heat-conducting sheet, the heat-conducting sheet can transfer the heat of the CPU body to the heat-conducting sliding heads which are in contact with each other along with the increase of the temperature of the heat-conducting sliding heads, the temperature of the memory metal spring on the heat-conducting sliding head can also gradually rise along with the increase of the temperature of the heat-conducting sliding heads, when the temperature of the memory metal spring reaches sixty degrees of deformation temperature, the memory metal spring continuously extends from the softer martensite phase of the memory metal spring and is converted into the hard phase, so that the length of the memory metal spring is prolonged, under the action of the tension, the memory metal spring can push the sliding plug to move towards the direction close to the air nozzle, the sliding plug can gradually push the air in the sliding cavity to the impeller through the air nozzle, so that the impeller rotates, and the heat, the next adjacent heat-conducting sliding head is contacted with the heat-conducting fin to continuously absorb the heat on the heat-conducting fin, and the heat-conducting sliding head and the heat-conducting fin are both made of magnetic materials, so that the attraction force between the heat-conducting sliding head and the heat-conducting fin enables the heat-conducting sliding head and the heat-conducting fin to be just opposite, the dislocation between the heat-conducting sliding head and the heat-conducting fin is avoided, and the heat-conducting fin is circularly radiated; when the heat-conducting sliding head contacted with the heat-conducting fin leaves, the memory metal spring on the heat-conducting sliding head can be gradually cooled and contracted again for resetting, and when the CPU body runs fast, the temperature rises fast and the temperature is high, the rotating speed of the turntable is faster; conversely, the slower the rotation speed of the turntable; the rotary disc can change the self rotating speed according to the working condition of the CPU body to dissipate heat of the CPU body, and the rotary disc has self-adjusting capacity, good heat dissipation effect, no need of electric energy consumption, energy conservation and environmental protection.
Drawings
Fig. 1 is a front sectional view of a memory metal spring in a CPU circulating heat dissipation structure according to the present invention in a natural state;
FIG. 2 is a front sectional view of a memory metal spring in an extended state in a CPU circulating heat dissipation structure according to the present invention;
fig. 3 is a top sectional view of a turntable in a CPU heat dissipation structure according to the present invention.
In the figure: 1 air nozzle, 2 heat-conducting fins, 3 sliding plugs, 4 sliding cavities, 5 turntables, 6 memory metal springs, 7 heat-conducting sliding heads, 8 heat-radiating cavities, 9 mounting plates, 10 heat-radiating holes, 11 impellers, 12CPU bodies, 13 mounting cavities and 14 heat-conducting copper sheets.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-3, a CPU circulating heat dissipating structure comprises a mounting plate 9, a heat dissipating cavity 8 is separately arranged on the left half part in the mounting plate 9, a plurality of heat dissipating holes 10 are symmetrically arranged on the side wall of the heat dissipating cavity 8, the other end of each heat dissipating hole 10 penetrates through the side wall of the mounting plate 9 and is communicated with the outside, a mounting cavity 13 is separately arranged on the right half part of the mounting plate 9, a CPU body 12 is fixedly arranged in the mounting cavity 13, a heat conducting copper sheet 14 is fixedly connected to the CPU body 12, a communicating port is arranged between the mounting cavity 13 and the heat dissipating cavity 8, a heat conducting sheet 2 is fixedly arranged in the communicating port, one end of the heat conducting copper sheet 14, which is far away from the CPU body 12, is fixedly connected to the side wall of the heat conducting sheet 2, a rotating disc 5 is arranged in the heat dissipating cavity 8, an impeller 11 is fixedly arranged at the lower end of the rotating disc, equal sliding connection has sliding plug 3 in every smooth chamber 4, the equal fixed mounting in one side that a plurality of sliding plugs 3 carried on the back mutually has memory metal spring 6, memory metal spring 6's deformation temperature is the equal fixed mounting of the other end of every memory metal spring 6 of sixty degrees and has heat conduction slippery head 7, heat conduction slippery head 7 and conducting strip 2 are made by magnetic material, the one end that every heat conduction slippery head 7 kept away from memory metal spring 6 runs through the lateral wall of carousel 5 and extends to the external world, the one end that a plurality of smooth chambers 4 are relative all is provided with the spray tube, the bottom face and the fixedly connected with air nozzle 1 of carousel 5 are all run through to the lower extreme of every spray tube, every air nozzle 1 all corresponds with impeller 11.
In the invention, when the CPU body 12 continuously works, the temperature of the CPU body 12 gradually rises, the heat on the CPU body 12 can be rapidly transferred to the heat-conducting copper sheet 14, the heat-conducting copper sheet 14 can transfer the heat to the heat-conducting sheet 2, the heat-conducting sheet 2 can transfer the heat energy of the heat-conducting sheet to the heat-conducting sliding heads 7 which are contacted with each other along with the increase of the temperature of the heat-conducting sliding heads 7, the temperature of the memory metal spring 6 on the heat-conducting sliding heads 7 can also gradually rise, when the temperature of the memory metal spring 6 reaches the deformation temperature of sixty degrees, the memory metal spring 6 continuously extends from the softer martensite phase of the memory metal spring 6 and is converted into the hard phase, so that the length of the memory metal spring is lengthened, under the action of the tension, the memory metal spring 6 can push the sliding plug 3 to move towards the direction close to the air nozzle 1, the sliding plug 3 can gradually push the air in the sliding cavity 4 to the air nozzle 1 to be sprayed, the impeller 11 is rotated, the heat-conducting sliding head 7 which is in contact with the heat-conducting fin 2 is moved away when the impeller 11 rotates, the next adjacent heat-conducting sliding head 7 is in contact with the heat-conducting fin 2, and heat on the heat-conducting fin 2 is continuously absorbed, because the heat-conducting sliding head 7 and the heat-conducting fin 2 are both made of magnetic materials, the heat-conducting sliding head 7 and the heat-conducting fin 2 are opposite in positive direction by attraction between the heat-conducting sliding head 7 and the heat-conducting fin 2, the dislocation between the heat-conducting sliding head 7 and the heat-conducting fin 2 is avoided, and the heat-conducting fin 2 is circularly radiated; after the heat-conducting sliding head 7 contacted with the heat-conducting strip 2 leaves, the memory metal spring 6 on the heat-conducting sliding head 7 is gradually cooled and contracted again for resetting, and when the CPU body 12 runs fast, the temperature rises fast and the temperature is high, the rotating speed of the turntable 5 is faster; conversely, the slower the rotation speed of the turntable 5; the turntable 5 can change the self rotating speed to dissipate heat of the CPU body 12 according to the temperature of the CPU body 12, has self-adjusting capability, good heat dissipation effect, no need of electric energy consumption, energy conservation and environmental protection.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (4)
1. The CPU circulating heat dissipation structure comprises a mounting plate (9) and is characterized in that a heat dissipation cavity (8) is separately arranged in the left half part of the mounting plate (9), a mounting cavity (13) is separately arranged in the right half part of the mounting plate (9), a CPU body (12) is fixedly arranged in the mounting cavity (13), a heat conduction copper sheet (14) is fixedly connected onto the CPU body (12), a communication port is formed between the mounting cavity (13) and the heat dissipation cavity (8), a heat conduction sheet (2) is fixedly arranged in the communication port, one end, deviating from the CPU body (12), of the heat conduction copper sheet (14) is fixedly connected onto the side wall of the heat conduction sheet (2), a turntable (5) is arranged in the heat dissipation cavity (8), an impeller (11) is fixedly arranged at the lower end of the turntable (5), and the center of the impeller (11) is rotatably connected onto the inner wall of the heat dissipation cavity (8), equidistant ring row has seted up a plurality of smooth chambeies (4), every in carousel (5) equal sliding connection has sliding plug (3), and is a plurality of the equal fixed mounting in one side that sliding plug (3) carried on the back mutually has memory metal spring (6), every the equal fixed mounting of the other end of memory metal spring (6) has heat conduction slippery head (7), every the lateral wall that carousel (5) were run through to the one end that memory metal spring (6) were kept away from in heat conduction slippery head (7) is a plurality of the relative one end in smooth chamber (4) all is provided with the spray tube, every the bottom face and the fixedly connected with air nozzle (1) of carousel (5), every are all run through to the lower extreme of spray tube air nozzle (1) all corresponding with impeller (11).
2. The CPU circulation heat dissipation structure of claim 1, wherein the side wall of the heat dissipation cavity (8) is symmetrically provided with a plurality of heat dissipation holes (10), and the other end of each heat dissipation hole (10) penetrates through the side wall of the mounting plate (9) and is communicated with the outside.
3. The CPU circulation heat dissipation structure of claim 1, wherein the deformation temperature of the memory metal spring (6) is sixty degrees.
4. The CPU circulation heat dissipation structure of claim 1, wherein the heat conductive slider (7) and the heat conductive fin (2) are made of magnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011123021.4A CN112328052B (en) | 2020-10-20 | 2020-10-20 | CPU circulation heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011123021.4A CN112328052B (en) | 2020-10-20 | 2020-10-20 | CPU circulation heat radiation structure |
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| CN112328052A true CN112328052A (en) | 2021-02-05 |
| CN112328052B CN112328052B (en) | 2023-05-23 |
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| CN205895973U (en) * | 2016-08-18 | 2017-01-18 | 重庆理工大学 | Shape memory alloy spring driven circular cone friction formula fan clutch |
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| CN112328052B (en) | 2023-05-23 |
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Effective date of registration: 20230425 Address after: 518000, 1st, 2nd, and 3rd floors of Building 2, No.1 Furong 2nd Road, Xiangshan Community, Xinqiao Street, Bao'an District, Shenzhen, Guangdong Province Applicant after: SHENZHEN MINGRUIDA HARDWARE PRODUCTS Co.,Ltd. Address before: 515023 No.31, waiyuan, beilian village, Chenghai District, Shantou City, Guangdong Province Applicant before: Meng Xiuhua |
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