CN112300572A - 有机陶瓷手机背板及其压延制备方法 - Google Patents
有机陶瓷手机背板及其压延制备方法 Download PDFInfo
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Abstract
本申请公开了一种有机陶瓷手机背板及其压延制备方法,其中有机陶瓷手机背板主要由以下重量份原料制备而成:高频树脂30‑70份、环氧树脂10‑50份、无机非金属粉体50‑200份、固化剂5‑30份、颜料1‑30份、添加剂5‑20份;高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。本申请有机陶瓷手机背板中高分子树脂经过高温固化后发生聚合反应,使得树脂材料的柔韧性可加工性良好;氧化铝等无机物经过高温聚合反应使得本申请手机背板具有陶瓷刚性质感。介电损耗更低,小于0.01,电性能满足5G使用要求;韧性、强度、散热等综合性能更好,可满足无线充电设计要求;加工能耗低。
Description
技术领域
本申请属于手机背板材料技术领域,具体涉及一种有机陶瓷手机背板及其压延制备方法。
背景技术
当今主流的几款手机背板材质为四类:塑胶、金属、玻璃、陶瓷。
塑胶材质具有高强度、耐冲击、使用温度范围广、可自由染色、本身着色、不会掉漆、信号表现好阻燃性好等优点,早期在塑料机身应用范围最为广泛。但其外观与手感较为廉价,品质感较差,目前基本应用于千元机。
手机上用的金属有不同的分类,但手机上金属材质主要是铝合金,即铝金属再掺入少量的镁或者其它的金属材料来增强其强度,包括镁铝合金、钛铝合金等。还有将不锈钢材质和钛合金应用于手机机身。金属机身工艺较高,手感较好,因此多用于中高端机型。
除了金属,玻璃材质在手机中的运用也不少,与一般金属和塑料相比,玻璃具有较高的硬度,导热系数介于两者之间,比塑料更透明,比金属更容易着色。而且玻璃对无线信号的影响也较小等优点。然而,玻璃材料本身性质决定其3D Unibody机身加工工艺难度大良品率低,且容易碎裂。所以玻璃背板一般是扁平设计,高端机型会应用曲面玻璃背板。
智能手机上使用的陶瓷材质一般由氧化铝或氧化锆等金属氧化物或硼化物烧结而成,既有金属的光泽,导热好,硬度高,表面光泽好。但陶瓷烧结需要1000℃以上高温工艺,以及高硬度,低韧性带来的后期复杂加工工艺,造成陶瓷背板良率低,产能低,成本高。
总的来说,现有的手机背板材料综合形象均存在较为严重的问题,其中塑胶、塑料导热性能低,整体品质不高;铝合金等金属材料背板屏蔽信号和无法设计无线充电,5G高频无法使用;玻璃易碎,韧性低;陶瓷背板韧性低,生产加工过程能耗高,产能低成本高。因此,需要开发一种综合性能更好手机背板材料。
发明内容
鉴于现有技术中的上述缺陷或不足,期望提供一种有机陶瓷手机背板及其压延制备方法。
本申请提供一种有机陶瓷手机背板,主要由以下重量份原料制备而成:
高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。
本申请有机陶瓷手机背板中高分子树脂经过高温固化后发生聚合反应,使得树脂材料的柔韧性可加工性良好;复合材料中的氧化铝等无机物经过高温聚合反应使得本申请手机背板具有陶瓷刚性质感。介电损耗更低,小于0.01,电性能满足5G使用要求;韧性、强度、散热等综合性能更好,可满足无线充电设计要求。
优选的,高频树脂选自氰酸酯类树脂、聚苯硫醚类树脂、聚四氟类树脂、改性环氧类树脂中的一种或多种组合。
优选的,添加剂包括:
优选的,固化剂为潜伏性固化剂,如双氰胺,DDS等。
优选的,无机非金属粉体包括氮化铝、氮化硼、氧化铝、氧化锆、氧化硅、砷化镓、硫化锌、硒化锌、氟化镁、氟化钙中的一种或几种组合。
优选的,无机非金属粉体为氧化铝。
第二方面,本申请还提供一种上述有机陶瓷手机背板的压延制备方法,包括以下步骤:
混料:按比例将无机非金属粉体、高频树脂、环氧树脂、固化剂、颜料、添加剂混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制;
压延:将精密炼制后的物料使用压延设备压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将步骤压延所得片材和步骤浸胶所得浸胶玻纤布叠层进入真空热压机,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内经模具热压成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
优选的,精密炼制温度为50-110℃,时间为30-60min。
优选的,压延机设置温度为50-110℃,压力为0.5-5.0MPa。
优选的,半固化温度为80-150℃,时间为20-50min;固化温度为100-230℃,时间为30-150min。
本申请具有的优点和积极效果是:本申请有机陶瓷手机背板中高分子树脂经过高温固化后发生聚合反应,使得树脂材料的柔韧性可加工性良好;复合材料中的氧化铝等无机物经过高温聚合反应使得本申请手机背板具有陶瓷刚性质感。介电损耗更低,小于0.01,电性能满足5G使用要求;韧性、强度、散热等综合性能更好,可满足无线充电设计要求。
除了上面所描述的本申请解决的技术问题、构成技术方案的技术特征以及由这些技术方案的技术特征所带来的优点之外,本申请所能解决的其他技术问题、技术方案中包含的其他技术特征以及这些技术特征所带来的优点,将在下文中作进一步详细的说明。
具体实施方式
下面结合实施例对本申请作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释相关发明,而非对该发明的限定。需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。
实施例1
本实施例提供一种有机陶瓷手机背板,主要由以下重量份原料制备而成:
高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。
本实施例还提供一种上述有机陶瓷手机背板的压延制备方法,具体包括以下步骤:
混料:将氧化铝粉体1500g、聚苯硫醚类高频树脂500g、环氧树脂300g、双氰胺固化剂150g、颜料20g、流平剂20g、消泡剂20g、增韧剂30g、分散剂30g混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制,精密炼制温度为50-110℃,时间为30-60min;
压延:将精密炼制后的物料使用压延设备在50-110℃、0.5-5.0MPa压力下压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将片材和浸胶玻纤布根据要求叠层进入真空热压机,在120℃下热压30min,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内200℃下经模具热压90min成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
实施例2
本实施例提供一种有机陶瓷手机背板,主要由以下重量份原料制备而成:
高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。
本实施例还提供一种上述有机陶瓷手机背板的压延制备方法,具体包括以下步骤:
混料:将氮化铝粉体800g、氮化硼粉体800g、氧化铝粉体400g、聚四氟类高频树脂400g、改性环氧类高频树脂300g、环氧树脂500g、双氰胺固化剂300g、颜料300g、流平剂50g份、消泡剂50g、增韧剂50g、分散剂50g混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制,精密炼制温度为50-110℃,时间为30-60min;
压延:将精密炼制后的物料使用压延设备在50-110℃、0.5-5.0MPa压力下压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将片材和浸胶玻纤布叠层进入真空热压机,在150℃下热压20min,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内100℃下经模具热压150min成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
实施例3
本实施例提供一种有机陶瓷手机背板,主要由以下重量份原料制备而成:
高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。
本实施例还提供一种上述有机陶瓷手机背板的压延制备方法,具体包括以下步骤:
混料:
硫化锌粉体400g、硒化锌粉体100g、氰酸酯类高频树脂300g、环氧树脂100g、DDS固化剂50g、颜料、流平剂10g、消泡剂10g、增韧剂10g、分散剂10g混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制,精密炼制温度为50-110℃,时间为30-60min;
压延:将精密炼制后的物料使用压延设备在50-110℃、0.5-5.0MPa压力下压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将片材和浸胶玻纤布叠层进入真空热压机,在80℃下热压60min,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内230℃下经模具热压30min成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
实施例4
本实施例提供一种有机陶瓷手机背板,主要由以下重量份原料制备而成:
高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。
本实施例还提供一种上述有机陶瓷手机背板的压延制备方法,具体包括以下步骤:
混料:将氟化镁粉体900g、氧化镁粉体700g、聚四氟类高频树脂550g、环氧树脂400g、双氰胺固化剂200g、颜料50g、流平剂30g、消泡剂20g、增韧剂20g、分散剂30g混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制,精密炼制温度为50-110℃,时间为30-60min;
压延:将精密炼制后的物料使用压延设备在50-110℃、0.5-5.0MPa压力下压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将片材和浸胶玻纤布叠层进入真空热压机,在100℃下热压40min,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内150℃下经模具热压40min成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
实施例5
本实施例提供一种有机陶瓷手机背板,主要由以下重量份原料制备而成:
高频树脂为介电常数小于4.0,且介电损耗小于0.01的树脂。
本实施例还提供一种上述有机陶瓷手机背板的压延制备方法,具体包括以下步骤:
混料:将氧化锆粉体1300g、改性环氧类高频树脂450g、环氧树脂200g、DDS固化剂120g、颜料80g、流平剂40g、消泡剂30g、增韧剂50g、分散剂10g混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制,精密炼制温度为50-110℃,时间为30-60min;
压延:将精密炼制后的物料使用压延设备在50-110℃、0.5-5.0MPa压力下压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将片材和浸胶玻纤布叠层进入真空热压机,在110℃下热压40min,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内180℃下经模具热压30min成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
本申请中无机非金属粉体可以是氧化物、氮化物、氟化物、砷化物、硒化物、硫化物等;除了上述实施例采用的无机非金属粉体外,在本申请其他实施例中,无机非金属粉体也可以选用氧化硅、砷化镓、氟化钙、氧化铍、氧化钇等中的一种或几种组合,或者氧化锆、砷化镓、氟化镁、氧化镁、氧化铍、氧化钇与实施例1-实施例5中非金属粉体组合。
对比例1
塑料手机背板。
对比例2
玻璃手机背板。
对比例3
铝合金手机背板。
对比例4
陶瓷手机背板。
对实施例1-实施例5及对比例1-对比例4进行性能测试,测试标准及测试结果如表1所示。
表1性能测试结果
本申请提供的有机陶瓷手机背板材料是一款兼具树脂材料的柔韧性可加工性及陶瓷刚性质感的复合材料,电热性能满足5G频率应用,外观陶瓷质感,韧性、强度、散热等综合性能更好,可以应用到无线充电设计方案,散热要求满足5G应用。此外,还具有加工能耗低,便于批量生产应用。
本方法已经经过实验室验证、终端客户小批量试用,其他电热性能良好均可满足品质要求。
以上描述仅为本申请的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解,本申请中所涉及的发明范围,并不限于上述技术特征的特定组合而成的技术方案,同时也应涵盖在不脱离所述发明构思的情况下,由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。
Claims (10)
2.根据权利要求1所述的有机陶瓷手机背板,其特征在于,所述高频树脂选自氰酸酯类树脂、聚苯硫醚类树脂、聚四氟类树脂、改性环氧类树脂中的一种或多种组合。
4.根据权利要求1所述的有机陶瓷手机背板,其特征在于,所述固化剂为潜伏性固化剂。
5.根据权利要求1所述的有机陶瓷手机背板,其特征在于,所述无机非金属粉体包括氮化铝、氮化硼、氧化铝、氧化锆、氧化硅、砷化镓、硫化锌、硒化锌、氟化镁、氟化钙中的一种或几种组合。
6.根据权利要求5所述的有机陶瓷手机背板,其特征在于,所述无机非金属粉体为氧化铝。
7.一种如权利要求1-6任一项所述的有机陶瓷手机背板的压延制备方法,其特征在于,包括以下步骤:
混料:按比例将所述无机非金属粉体、高频树脂、环氧树脂、固化剂、颜料、添加剂混合,得到混合料;
精密炼制:将混合料通过捏合机或密炼机精密炼制;
压延:将精密炼制后的物料使用压延设备压延成片材;
浸胶:将玻璃纤维布通过涂布设备做成浸胶玻纤布;
半固化:将步骤压延所得片材和步骤浸胶所得浸胶玻纤布叠层进入真空热压机,压制成半固化产品;
固化:将半固化产品裁切成模压所需小片,在真空热压机内经模具热压成手机背板坯料;
修整:将手机背板坯料表面抛光,修边,表面处理,得到手机背板成品。
8.根据权利要求7所述的压延制备方法,其特征在于,精密炼制温度为50-110℃,时间为30-60min。
9.根据权利要求7所述的压延制备方法,其特征在于,压延机设置温度为50-110℃,压力为0.5-5.0MPa。
10.根据权利要求7所述的压延制备方法,其特征在于,半固化温度为80-150℃,时间为20-50min;固化温度为100-230℃,时间为30-150min。
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