CN112296669A - Radiator assembling production line - Google Patents
Radiator assembling production line Download PDFInfo
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- CN112296669A CN112296669A CN202011244810.3A CN202011244810A CN112296669A CN 112296669 A CN112296669 A CN 112296669A CN 202011244810 A CN202011244810 A CN 202011244810A CN 112296669 A CN112296669 A CN 112296669A
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- jig
- assembling
- assembly
- feeding
- plate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 296
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 83
- 229910052802 copper Inorganic materials 0.000 claims description 83
- 239000010949 copper Substances 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 67
- 230000017525 heat dissipation Effects 0.000 claims description 58
- 238000003825 pressing Methods 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 238000012546 transfer Methods 0.000 claims description 34
- 238000007650 screen-printing Methods 0.000 claims description 24
- 238000004026 adhesive bonding Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 239000000306 component Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
- B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
- B05C9/022—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means to obtain ornamental coatings
- B05C9/025—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means to obtain ornamental coatings using silk screens or stencils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/001—Article feeders for assembling machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/001—Article feeders for assembling machines
- B23P19/002—Article feeders for assembling machines orientating the articles
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a radiator assembling production line, which comprises a rack, an assembling conveying line, a carrier conveying line, jigs, carriers, a jig disassembling mechanism, a first assembling mechanism, a second assembling mechanism, a third assembling mechanism, a fourth assembling mechanism and a jig assembling mechanism, wherein the jigs and the carriers are synchronously conveyed to positions corresponding to other mechanisms through the two conveying lines, so that each jig corresponds to one carrier, a jig limiting middle frame and a jig upper cover of each jig can be disassembled to the corresponding carrier when the jig disassembling mechanism disassembles the jigs, and the jig limiting middle frame and the jig upper cover on each carrier can be assembled on a corresponding jig base plate when the jig assembling mechanism assembles the jigs; the radiator assembly production line further completes automatic assembly of the radiator through the first assembly mechanism, the second assembly mechanism, the third assembly mechanism and the fourth assembly mechanism, and is high in production efficiency.
Description
Technical Field
The invention relates to the technical field of radiator production, in particular to a radiator assembly production line.
Background
Commercial use of 5G technology has driven hardware upgrades throughout the 3C industry. The power of the core components such as chips, processors, servers, etc. of mobile phones and computers must be increased. The increase in power necessarily increases the heat dissipation requirements. The radiator is used for absorbing the heat and then radiating the heat into the chassis or out of the chassis to ensure that the temperature of the assembly is normal. A computer heat sink is generally formed by assembling a copper plate, a large substrate, a large heat-dissipating block, a small substrate, a small heat-dissipating block, and a copper tube, wherein the large substrate is disposed on the copper plate, the small heat-dissipating block is assembled with the copper tube, the small heat-dissipating block is disposed on the small substrate, the copper tube is connected to the large substrate, and the large heat-dissipating block covers the copper tube and is disposed on the large substrate. At present, the assembly of all parts of a computer radiator is basically carried out in a manual assembly mode, and the problems of high labor cost and low production efficiency exist.
Therefore, it is necessary to provide a heat sink assembly line capable of automatically assembling heat sinks and having high production efficiency.
Disclosure of Invention
The invention aims to provide a radiator assembling production line which can automatically assemble a radiator and has high production efficiency.
In order to achieve the purpose, the invention provides a radiator assembling production line which comprises a rack, an assembling conveying line, a carrier conveying line, a jig, a carrier, a jig disassembling mechanism, a first assembling mechanism, a second assembling mechanism, a third assembling mechanism, a fourth assembling mechanism and a jig assembling mechanism, wherein the assembling conveying line and the carrier conveying line are arranged on the rack in parallel; the jig is placed on the assembly conveying line and comprises a jig bottom plate, a jig limiting middle frame and a jig upper cover, the jig bottom plate is provided with a placing station for placing the radiator, the jig limiting middle frame is detachably stacked in the jig bottom plate, the jig limiting middle frame is provided with a through hole communicated with the placing station, the through hole is used for the radiator to pass through, and the jig upper cover covers the jig limiting middle frame and is detachably stacked on the jig bottom plate; the carrier is placed on the carrier conveying line; the jig dismounting mechanism, the first assembling mechanism, the second assembling mechanism, the third assembling mechanism, the fourth assembling mechanism and the jig assembling mechanism are sequentially arranged on the rack along the conveying direction of the assembling conveying line; the jig is conveyed to move by the assembly conveying line and the carrier is conveyed by the carrier conveying line to move, so that the jig and the carrier sequentially move to positions corresponding to the jig dismounting mechanism, the first assembling mechanism, the second assembling mechanism, the third assembling mechanism, the fourth assembling mechanism and the jig assembling mechanism; the jig dismounting mechanism is used for sequentially dismounting the jig upper cover and the jig limiting middle frame from the jig bottom plate and stacking the jig bottom plate on the carrier; the first assembling mechanism is used for respectively placing the silk-screen first substrate and the copper plate on the placing station; the second assembling mechanism is used for assembling a second substrate on the copper plate and dotting solder paste on the second substrate; the third assembling mechanism is used for assembling a heat dissipation assembly formed by connecting a first heat dissipation block and a copper pipe on the first substrate and the copper plate, so that the first heat dissipation block is connected to the first substrate and the copper pipe is connected to the copper plate, and solder paste can be dispensed at the position between the two copper pipes by the third assembling mechanism; the fourth assembling mechanism is used for assembling the silk-screen second heat dissipation block on the copper pipe and covering the second substrate, so that the heat radiator is assembled; the jig assembling mechanism is used for sequentially assembling the jig limiting middle frame and the jig upper cover on the carrier on the jig bottom plate so as to position the radiator.
Preferably, the jig is provided with an elastic pressing component which can form pre-pressure on the product in the jig, so that the product in the jig cannot deform due to the melting and welding of solder paste in the product and the stress release of the product when the product in the jig is in a high-temperature furnace. The elastic press-fit assembly comprises a first support, a rotary pressing plate and a first elastic piece, the first support is fixed on the jig bottom plate, the rotary pressing plate is pivoted on the first support, the first elastic piece is connected between the jig bottom plate and the rotary pressing plate, and the first elastic piece is used for driving the rotary pressing plate to press the jig upper cover on the jig bottom plate.
Preferably, the jig dismounting mechanism comprises a pressing plate opening mechanism, a first dismounting manipulator and a second dismounting manipulator, the pressing plate opening mechanism, the first dismounting manipulator and the second dismounting manipulator are sequentially arranged on the frame along the conveying direction of the assembling conveying line, the pressing plate opening mechanism can drive the rotary pressing plate to rotate and separate from the upper jig cover, the first dismounting manipulator is used for dismounting the upper jig cover and stacking the upper jig cover on the carrier, and the second dismounting manipulator is used for dismounting the limiting middle jig frame, stacking the limiting middle jig frame on the upper jig cover on the carrier and taking out the radiator on the bottom plate of the jig.
Preferably, the jig dismounting mechanism further comprises a product outflow conveying line, the product outflow conveying line is arranged on the rack and located on one side of the second dismounting manipulator, and the second dismounting manipulator can place the radiator taken out on the product outflow conveying line, so that the radiator is conveyed away by the product outflow conveying line.
Preferably, the jig processing device further comprises a first jig rotary conveying line, a reflow furnace and a second jig rotary conveying line, wherein the first jig rotary conveying line is arranged between one end of the assembling conveying line and one end of the reflow furnace, the second jig rotary conveying line is arranged between the other end of the reflow furnace and the other end of the assembling conveying line, and the jig loaded with the radiator is conveyed to the reflow furnace through the first jig rotary conveying line by the assembling conveying line so that the reflow furnace processes the radiator; the second jig rotary conveying line is used for conveying the jig loaded with the processed radiator to an assembly conveying line.
Preferably, the carrier reflow mechanism is disposed on the rack, one end of the carrier conveying line can convey the empty carrier to the carrier reflow mechanism, and the carrier reflow mechanism can transfer the empty carrier back to the other end of the carrier conveying line.
Preferably, the first assembly mechanism includes a transfer mechanism, a first feeding mechanism, a copper plate feeding manipulator, a first substrate feeding manipulator, a first silk-screen printing mechanism and a first discharging manipulator, the transfer mechanism includes a transfer plate and a transfer driving mechanism, the transfer driving mechanism is disposed on the rack, the transfer plate is disposed on the transfer driving mechanism, the first feeding mechanism, the first silk-screen printing mechanism and the first discharging manipulator are sequentially disposed on the rack along a moving direction of the transfer plate, the transfer driving mechanism can sequentially drive the transfer plate to move to positions corresponding to the first feeding mechanism, the first silk-screen printing mechanism and the first discharging manipulator, the first feeding mechanism includes a copper plate feeding assembly and a first substrate feeding assembly, the copper plate feeding assembly is used for providing the copper plate, first base plate feed subassembly is used for providing first base plate, copper material loading manipulator with first base plate material loading manipulator set up respectively in the frame, copper material loading manipulator be used for with copper on the copper feed subassembly snatchs extremely move on the support plate, first base plate material loading manipulator be used for with first base plate on the first base plate feed subassembly snatchs extremely move the support plate, first silk screen printing mechanism is used for being located move copper and first base plate on the support plate and carry out the silk screen printing, first material unloading manipulator be used for with move the copper that moves the silk screen printing on the board and first base plate snatch and place in place on placing the station.
Preferably, the second assembling mechanism includes a second feeding mechanism, a second substrate feeding manipulator and a second solder paste dispensing module, the second feeding mechanism, the second substrate feeding manipulator and the second solder paste dispensing module are respectively disposed on the rack, the second feeding mechanism is used for providing a second substrate, the second substrate feeding manipulator is used for grabbing and assembling a second substrate on the second feeding mechanism on the copper plate on the placing station, and the second solder paste dispensing module is used for dispensing solder paste onto the second substrate after assembly.
Preferably, the third assembly devices include a third feeding mechanism, a heat dissipation assembly feeding manipulator, a flattening mechanism and a third point solder paste module, the third feeding mechanism is arranged in the frame and used for providing the heat dissipation assembly, the heat dissipation assembly feeding manipulator, the flattening mechanism and the third point solder paste module are arranged in the frame in sequence along the conveying direction of the assembly conveying line, the heat dissipation assembly feeding manipulator is used for grabbing and assembling the heat dissipation assembly on the third feeding mechanism on the first substrate and the copper plate, the flattening mechanism is used for pressing the heat dissipation assembly on the jig bottom plate on the first substrate and the copper plate, and the third point solder paste module is used for pointing solder paste at the position between the copper tubes.
Preferably, the fourth assembling mechanism includes a fourth feeding mechanism, a transferring and assembling mechanism, a second heat dissipation block feeding manipulator and a screen printing and gluing mechanism, the fourth feeding mechanism is disposed on the rack and is used for providing the second heat dissipation block, the transferring and assembling mechanism is disposed on the rack, the second heat dissipation block feeding manipulator is disposed on the rack and is located between the fourth feeding mechanism and the transferring and assembling mechanism, and the second heat dissipation block feeding manipulator is used for grabbing the second heat dissipation block on the fourth feeding mechanism onto the transferring and assembling mechanism; the silk-screen gluing mechanism is arranged on the rack; the second heat dissipation block is driven by the transfer assembly mechanism to move to a position corresponding to the silk-screen gluing mechanism, so that the silk-screen gluing mechanism can glue the gluing surface of the second heat dissipation block; the second heat dissipation block which is coated with the glue is driven to move by the transferring and assembling mechanism, and the glue coating surface of the second heat dissipation block is bonded on the copper pipe of the jig bottom plate.
Compared with the prior art, the radiator assembling production line has the advantages that the two conveying lines of the assembling conveying line and the carrier conveying line are arranged, the jig and the carrier are synchronously conveyed to the positions corresponding to other mechanisms by the two conveying lines, so that each jig corresponds to one carrier, when the jig is disassembled by the jig disassembling mechanism, the jig limiting middle frame and the jig upper cover of the jig can be disassembled to the corresponding carrier, and when the jig is assembled by the jig assembling mechanism, the jig limiting middle frame and the jig upper cover on the carrier can be assembled on the corresponding jig bottom plate; the radiator assembly production line further completes automatic assembly of the radiating assembly formed by the first base plate, the copper plate, the second base plate, the first radiating block and the copper pipe and the second radiating block through the first assembly mechanism, the second assembly mechanism, the third assembly mechanism and the fourth assembly mechanism, so that automatic production and assembly of the radiator are achieved, and production efficiency is high.
Drawings
Fig. 1 is a plan view of a heat sink assembly line of the present invention.
Fig. 2 is a schematic perspective view of a jig according to the present invention.
Fig. 3 is an exploded view of the jig of the present invention.
Fig. 4 is a schematic perspective view of the jig dismounting mechanism of the present invention.
Fig. 5 is a plan view of the jig dismounting mechanism of the present invention.
Fig. 6 is a perspective view of the first fitting mechanism of the present invention.
Fig. 7 is a schematic structural view of a transplanting mechanism of the first assembling mechanism of the present invention.
Fig. 8 is a perspective view of a second assembly mechanism of the present invention.
Fig. 9 is a plan view of a second assembly mechanism of the present invention.
Fig. 10 is a perspective view of a third assembly mechanism of the present invention.
Fig. 11 is a plan view of a third assembly mechanism of the present invention.
Fig. 12 is a perspective view of a fourth mounting mechanism of the present invention.
Fig. 13 is a plan view of a fourth assembly mechanism of the present invention.
Fig. 14 is a top view of the jig assembling mechanism of the present invention.
Fig. 15 is a schematic structural view of a heat sink assembled and produced by the heat sink assembly line of the present invention.
Fig. 16 is an exploded view of the heat sink shown in fig. 15.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
Referring to fig. 1 to 3 and fig. 15 to 16, a heat sink assembly line 100 of the present invention includes a frame 11, an assembly line 12, a carrier line 13, a jig 21, a carrier 22, a jig dismounting mechanism 3, a first assembling mechanism 4, a second assembling mechanism 5, a third assembling mechanism 6, a fourth assembling mechanism 7, and a jig assembling mechanism 8, wherein the assembly line 12 and the carrier line 13 are disposed on the frame 11 in parallel; the jig 21 is placed on the assembly conveying line 12, the jig 21 comprises a jig base plate 211, a jig limiting middle frame 212 and a jig upper cover 213, the jig base plate 211 is provided with a placing station 211a for placing the heat radiator 200, the jig limiting middle frame 212 is detachably stacked in the jig base plate 211, the jig limiting middle frame 212 is provided with a through hole 212b communicated with the placing station 211a, the through hole 212b is used for the heat radiator 200 to pass through, and the jig upper cover 213 covers the jig limiting middle frame 212 and is detachably stacked on the jig base plate 211; the carrier 22 is placed on the carrier conveying line 13; the jig dismounting mechanism 3, the first assembling mechanism 4, the second assembling mechanism 5, the third assembling mechanism 6, the fourth assembling mechanism 7 and the jig assembling mechanism 8 are sequentially arranged on the rack 11 along the conveying direction of the assembling conveying line 12; the jig 21 is conveyed by the assembling conveying line 12 to move and the carrier 22 is conveyed by the carrier conveying line 13 to move, so that the jig 21 and the carrier 22 are sequentially moved to positions corresponding to the jig disassembling mechanism 3, the first assembling mechanism 4, the second assembling mechanism 5, the third assembling mechanism 6, the fourth assembling mechanism 7 and the jig assembling mechanism 8 together; the jig dismounting mechanism 3 is used for sequentially dismounting the jig upper cover 213 and the jig limiting middle frame 212 from the jig base plate 211 and stacking the jig base plate on the carrier 22; the first assembling mechanism 4 is used for placing the silk-screen printed first substrate 201 and the copper plate 202 on the placing station 211a respectively; the second mounting mechanism 5 is used for mounting the second substrate 203 on the copper plate 202 and dispensing solder paste on the second substrate 203; the third assembling mechanism 6 is used for assembling the heat dissipation assembly formed by connecting the first heat dissipation block 204 and the copper pipe 205 on the first substrate 201 and the copper plate 202, so that the first heat dissipation block 204 is connected on the first substrate 201 and the copper pipe 205 is connected on the copper plate 202, and the third assembling mechanism 6 can perform solder paste dispensing at a position between the two copper pipes 205; the fourth assembling mechanism 7 is used for assembling the silk-screen second heat dissipation block 206 on the copper tube 205 and covering the second substrate 203, so as to assemble and form the heat sink 200; the jig assembling mechanism 8 is used for sequentially assembling the jig limiting middle frame 212 and the jig upper cover 213 on the carrier 22 on the jig base plate 211, thereby positioning the heat sink 200.
Referring to fig. 2 and 3, the jig 21 is provided with an elastic pressing component 214, which can form a pre-pressure on the product (heat sink 200) in the jig, so that the product (heat sink 200) in the jig does not deform due to the melting and welding of the solder paste in the product and the stress release of the product itself when the product (heat sink 200) passes through the high temperature furnace (reflow furnace 92), thereby ensuring the production quality of the product. The elastic pressing assembly 214 includes a first support 214a, a rotating pressing plate 214b and a first elastic member 214c, the first support 214a is fixed on the fixture base plate 211, the rotating pressing plate 214b is pivotally connected to the first support 214a, the first elastic member 214c is connected between the fixture base plate 211 and the rotating pressing plate 214b, and the first elastic member 214c is used for driving the rotating pressing plate 214b to press the fixture upper cover 213 on the fixture base plate 211. The rotary pressing plate 214b can press the upper fixture cover 213 under the elastic force of the first elastic member 214c, so as to press the upper fixture cover 213 on the bottom fixture plate 211; the fixture upper cover 213 can be detached by driving the rotary pressing plate 214b to rotate and resisting the elastic force of the first elastic member 214c, so that the rotary pressing plate 214b no longer abuts against the fixture upper cover 213.
Referring to fig. 4 and 5, the jig dismounting mechanism 3 includes a pressing plate opening mechanism 31, a first dismounting robot 32 and a second dismounting robot 33, the pressing plate opening mechanism 31, the first dismounting robot 32 and the second dismounting robot 33 are sequentially disposed on the rack 11 along the conveying direction of the assembly conveying line 12, the pressing plate opening mechanism 31 can drive the rotating pressing plate 214b to rotate to separate from the upper jig cover 213, the first dismounting robot 32 is used for dismounting the upper jig cover 213 and stacking the upper jig cover 213 on the carrier 22, the second dismounting robot 33 is used for dismounting the spacing middle jig frame 212, stacking the spacing middle jig frame 212 on the upper jig cover 213 on the carrier 22, and taking out the heat sink 200 on the bottom jig plate 211. Specifically, the rotary platen 214b may be provided with an insertion hole into which the rotary platen 214b is driven to rotate by the platen opening mechanism 31. The specific structure of the first disassembling robot 32 and the second disassembling robot 33 is well known to those skilled in the art, and therefore, the detailed description thereof is omitted here. Further, the jig dismounting mechanism 3 further includes a product outflow conveyor line 34, the product outflow conveyor line 34 is disposed on the rack 11 and located on one side of the second dismounting robot 33, and the second dismounting robot 33 can place the taken-out heat sink 200 on the product outflow conveyor line 34, so that the product outflow conveyor line 34 conveys the heat sink 200 away.
Referring to fig. 1, the assembly line 100 of heat sinks of the present invention further includes a first jig rotary conveyor line 91, a reflow furnace 92, and a second jig rotary conveyor line 93, wherein the first jig rotary conveyor line 91 is disposed between one end of the assembly conveyor line 12 and one end of the reflow furnace 92, and the second jig rotary conveyor line 93 is disposed between the other end of the reflow furnace 92 and the other end of the assembly conveyor line 12; the jig 21 loaded with the heat sink 200 is conveyed to the reflow furnace 92 through the first jig rotary conveying line 91 by the assembly conveying line 12, so that the reflow furnace 92 performs high-temperature processing on the heat sink 200; the second jig revolving conveyor line 93 is used for conveying the jig 21 loaded with the processed heat sink 200 to the assembly conveyor line 12, and after the jig 21 loaded with the processed heat sink 200 is conveyed to the assembly conveyor line 12, the assembly conveyor line 12 conveys the jig 21 to a position corresponding to the jig detaching mechanism 3, so that the jig detaching mechanism 3 detaches the jig 21, the processed heat sink 200 is clamped to the product outflow conveyor line 34, and the processed heat sink 200 is conveyed away by the product outflow conveyor line 34. The structures of the first jig rotary conveying line 91, the reflow furnace 92 and the second jig rotary conveying line 93 are conventional technologies, and therefore are not described herein again.
Referring to fig. 4, 6, 8, 10 and 12, the heat sink assembly line 100 of the present invention further includes a carrier reflow mechanism 94, the carrier reflow mechanism 94 is disposed on the frame 11, one end of the carrier transport line 13 can transport the empty carrier 22 to the carrier reflow mechanism 94, and the carrier reflow mechanism 94 can transport the empty carrier 22 back to the other end of the carrier transport line 13. The carrier backflow mechanism 94 can adopt a lifting conveyor belt and a backflow conveyor belt, the backflow conveyor belt is disposed below the carrier conveyor line 13, the two lifting conveyor belts are disposed at two ends of the carrier conveyor line 13, one end of the carrier conveyor line 13 can convey the empty carrier 22 to one of the lifting conveyor belts, the lifting conveyor belt descends and conveys the empty carrier 22 to the backflow conveyor belt, the backflow conveyor belt conveys the empty carrier 22 to the other lifting conveyor belt, and the lifting conveyor belt ascends and returns the empty carrier 22 to the carrier conveyor line 13. However, the structure of the carrier reflow mechanism 94 is not limited thereto.
Referring to fig. 6 and 7, the first assembling mechanism 4 includes a transferring mechanism 41, a first feeding mechanism 42, a copper plate feeding manipulator 43, a first substrate feeding manipulator 44, a first screen printing mechanism 45 and a first discharging manipulator 46, the transferring mechanism 41 includes a transferring plate 411 and a transferring driving mechanism 412, the transferring driving mechanism 412 is disposed on the rack 11, the transferring plate 411 is disposed on the transferring driving mechanism 412, the first feeding mechanism 42, the first screen printing mechanism 45 and the first discharging manipulator 46 are sequentially disposed on the rack 11 along the moving direction of the transferring plate 411, the transferring driving mechanism 412 can sequentially drive the transferring plate 411 to move to positions corresponding to the first feeding mechanism 42, the first screen printing mechanism 45 and the first discharging manipulator 46, the first feeding mechanism 42 includes a copper plate feeding assembly 421 and a first substrate feeding assembly 422, the copper plate feeding assembly 421 is used for providing the copper plate 202, the first substrate feeding assembly 422 is used for providing a first substrate 201, the copper plate feeding manipulator 43 and the first substrate feeding manipulator 44 are respectively arranged on the rack 11, the copper plate feeding manipulator 43 is used for grabbing the copper plate 202 on the copper plate feeding assembly 421 to the transfer board 411, the first substrate feeding manipulator 44 is used for grabbing the first substrate 201 on the first substrate feeding assembly 422 to the transfer board 411, the first silk-screen printing mechanism 45 is used for silk-screen printing the copper plate 202 and the first substrate 201 on the transfer board 411, and the first blanking manipulator 46 is used for grabbing and placing the silk-screen printed copper plate 202 and the first substrate 201 on the transfer board 411 on the placing station 211 a. The first feeding mechanism 42, the copper plate loading robot 43, the first substrate loading robot 44, the first screen printing mechanism 45, and the first unloading robot 46 are conventional in the art, and therefore, they are not described herein again.
Referring to fig. 8 and 9, the second assembling mechanism 5 includes a second feeding mechanism 51, a second substrate feeding manipulator 52 and a second solder paste dispensing module 53, the second feeding mechanism 51, the second substrate feeding manipulator 52 and the second solder paste dispensing module 53 are respectively disposed on the rack 11, the second feeding mechanism 51 is configured to provide a second substrate 203, the second substrate feeding manipulator 52 is configured to grab and assemble the second substrate 203 on the second feeding mechanism 51 onto the copper plate 202 located on the placing station 211a, and the second solder paste dispensing module 53 is configured to dispense solder paste onto the assembled second substrate 203. The structures of the second feeding mechanism 51, the second substrate feeding manipulator 52 and the second solder paste dispensing module 53 are conventional, and therefore are not described herein again.
Referring to fig. 10 and 11, the third assembly mechanism 6 includes a third feeding mechanism 61, a heat dissipation assembly feeding manipulator 62, a flattening mechanism 63, and a third solder paste module 64, the third feeding mechanism 61 is disposed on the frame 11 and is configured to provide a heat dissipation assembly, the heat dissipation assembly feeding manipulator 62, the flattening mechanism 63, and the third solder paste module 64 are sequentially disposed on the frame 11 along a conveying direction of the assembly conveying line 12, the heat dissipation assembly feeding manipulator 62 is configured to grasp and assemble the heat dissipation assembly on the third feeding mechanism 61 onto the first substrate 201 and the copper plate 202 on the fixture bottom plate 211, the flattening mechanism 63 is configured to press the heat dissipation assembly on the fixture bottom plate 211 onto the first substrate 201 and the copper plate 202, and the third solder paste module 64 is configured to dot solder paste at a position between the two copper tubes 205. The flattening mechanism 63 can adopt a mode of connecting the multi-axis manipulator and the pressing block, and the pressing block is driven by the multi-axis manipulator to press the heat dissipation assembly on the jig bottom plate 211, so that the heat dissipation assembly is pressed on the first substrate 201 and the copper plate 202, the heat dissipation assembly, the first substrate 201 and the copper plate 202 can be stably connected together, and the structure of the flattening mechanism 63 is not limited by the structure. The structures of the third feeding mechanism 61, the heat dissipation assembly feeding manipulator 62 and the third solder paste module 64 are conventional and will not be described herein.
Referring to fig. 12 and 13, the fourth assembly mechanism 7 includes a fourth feeding mechanism 71, a transferring and assembling mechanism 72, a second heat sink loading manipulator 73 and a screen printing and gluing mechanism 74, the fourth feeding mechanism 71 is disposed on the rack 11 and is used for providing a second heat sink 206, the transferring and assembling mechanism 72 is disposed on the rack 11, the second heat sink loading manipulator 73 is disposed on the rack 11 and is located between the fourth feeding mechanism 71 and the transferring and assembling mechanism 72, and the second heat sink loading manipulator 73 is used for grabbing the second heat sink 206 on the fourth feeding mechanism 71 onto the transferring and assembling mechanism 72; the silk-screen gluing mechanism 74 is arranged on the frame 11; the second heat dissipation block 206 is driven by the transfer assembly mechanism 72 to move to a position corresponding to the screen printing and gluing mechanism 74, so that the screen printing and gluing mechanism 74 can glue the gluing surface of the second heat dissipation block 206; the transfer assembly mechanism 72 drives the second heat sink 206 with the adhesive applied thereon to move and bond the adhesive coated surface of the second heat sink 206 to the copper tube 205 of the jig base plate 211. Specifically, the transferring and assembling mechanism 72 includes a linear driving mechanism, a rotating mechanism, a pushing mechanism and a positioning assembly, the linear driving mechanism is disposed on the frame 11, the rotating mechanism is disposed on the linear driving mechanism, and the pushing mechanism is disposed on the rotating mechanism; the positioning assembly is arranged on the pushing mechanism, the second radiating block feeding manipulator 73 can grab the second radiating block 206 on the fourth feeding mechanism 71 onto the positioning assembly, and the positioning assembly is used for positioning the second radiating block 206; the transfer driving mechanism can drive the positioning component to move; after the silk-screen glue-coating mechanism 74 coats the upward glue-coated surface of the second heat dissipation block 206 above the second heat dissipation block 206, the rotating mechanism drives the second heat dissipation block 206 to turn over up and down so that the glue-coated surface of the second heat dissipation block 206 faces downward, and the pushing mechanism pushes the second heat dissipation block 206 out of the positioning assembly so that the glue-coated surface of the second heat dissipation block 206 is bonded on the copper tube 205 of the jig base plate 211. The structures of the fourth feeding mechanism 71, the second heat sink feeding manipulator 73 and the screen printing and gluing mechanism 74 are conventional, and therefore are not described herein again.
Referring to fig. 14, the jig assembling mechanism 8 includes a first jig assembling robot 81, a second jig assembling robot 82, and a pressing plate pressing mechanism 83, the first jig assembling robot 81, the second jig assembling robot 82, and the pressing plate pressing mechanism 83 are sequentially disposed on the rack 11 along the conveying direction of the assembling conveyor 12, the first jig assembling robot 81 is configured to assemble the jig limiting middle frame 212 on the carrier 22 on the jig bottom plate 211, the second jig assembling robot 82 is configured to assemble the jig upper cover 213 on the jig bottom plate 211 and cover the jig limiting middle frame 212, and the pressing plate pressing mechanism 83 is configured to drive the rotary pressing plate 214b to rotate and press down the jig upper cover 213.
In summary, the heat sink assembly line 100 of the present invention has two conveying lines, i.e. the assembly conveying line 12 and the carrier conveying line 13, and the two conveying lines are used to synchronously convey the jigs 21 and the carriers 22 to positions corresponding to other mechanisms, so that each jig 21 corresponds to one carrier 22, and thus when the jig dismounting mechanism 3 demounts the jig 21, the jig limiting middle frame 212 and the jig upper cover 213 of the jig 21 can be dismounted to the corresponding carrier 22, and when the jig mounting mechanism 8 mounts the jig 21, the jig limiting middle frame 212 and the jig upper cover 213 of the carrier 22 can be mounted to the corresponding jig bottom plate 211; the heat sink assembly line 100 of the present invention further completes the automatic assembly of the heat dissipation assembly formed by the first substrate 201, the copper plate 202, the second substrate 203, the first heat dissipation block 204 and the copper tube 205, and the second heat dissipation block 206 through the first assembly mechanism 4, the second assembly mechanism 5, the third assembly mechanism 6 and the fourth assembly mechanism 7, thereby realizing the automatic production and assembly of the heat sink 200 and having high production efficiency.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. A radiator assembling production line is characterized by comprising a rack, an assembling conveying line, a carrier conveying line, a jig, a carrier, a jig disassembling mechanism, a first assembling mechanism, a second assembling mechanism, a third assembling mechanism, a fourth assembling mechanism and a jig assembling mechanism, wherein the assembling conveying line and the carrier conveying line are arranged on the rack in parallel; the jig is placed on the assembly conveying line and comprises a jig bottom plate, a jig limiting middle frame and a jig upper cover, the jig bottom plate is provided with a placing station for placing the radiator, the jig limiting middle frame is detachably stacked in the jig bottom plate, the jig limiting middle frame is provided with a through hole communicated with the placing station, the through hole is used for the radiator to pass through, and the jig upper cover covers the jig limiting middle frame and is detachably stacked on the jig bottom plate; the carrier is placed on the carrier conveying line; the jig dismounting mechanism, the first assembling mechanism, the second assembling mechanism, the third assembling mechanism, the fourth assembling mechanism and the jig assembling mechanism are sequentially arranged on the rack along the conveying direction of the assembling conveying line; the jig is conveyed to move by the assembly conveying line and the carrier is conveyed by the carrier conveying line to move, so that the jig and the carrier sequentially move to positions corresponding to the jig dismounting mechanism, the first assembling mechanism, the second assembling mechanism, the third assembling mechanism, the fourth assembling mechanism and the jig assembling mechanism; the jig dismounting mechanism is used for sequentially dismounting the jig upper cover and the jig limiting middle frame from the jig bottom plate and stacking the jig bottom plate on the carrier; the first assembling mechanism is used for respectively placing the silk-screen first substrate and the copper plate on the placing station; the second assembling mechanism is used for assembling a second substrate on the copper plate and dotting solder paste on the second substrate; the third assembling mechanism is used for assembling a heat dissipation assembly formed by connecting a first heat dissipation block and a copper pipe on the first substrate and the copper plate, so that the first heat dissipation block is connected to the first substrate and the copper pipe is connected to the copper plate, and solder paste can be dispensed at the position between the two copper pipes by the third assembling mechanism; the fourth assembling mechanism is used for assembling the silk-screen second heat dissipation block on the copper pipe and covering the second substrate, so that the heat radiator is assembled; the jig assembling mechanism is used for sequentially assembling the jig limiting middle frame and the jig upper cover on the carrier on the jig bottom plate so as to position the radiator.
2. The heat sink assembly line of claim 1, wherein the jig has an elastic pressing assembly, the elastic pressing assembly includes a first support, a rotating pressing plate and a first elastic member, the first support is fixed on the jig base plate, the rotating pressing plate is pivoted to the first support, the first elastic member is connected between the jig base plate and the rotating pressing plate, and the first elastic member is used for driving the rotating pressing plate to press the jig upper cover onto the jig base plate.
3. The heat sink assembly line of claim 2, wherein the jig disassembling mechanism includes a pressing plate opening mechanism, a first disassembling manipulator and a second disassembling manipulator, the pressing plate opening mechanism, the first disassembling manipulator and the second disassembling manipulator are sequentially disposed on the frame along a conveying direction of the assembly conveying line, the pressing plate opening mechanism can drive the rotating pressing plate to rotate to separate from the upper jig cover, the first disassembling manipulator is used for disassembling the upper jig cover and stacking the upper jig cover on the carrier, and the second disassembling manipulator is used for disassembling the spacing middle jig frame, stacking the spacing middle jig frame on the upper jig cover on the carrier and taking out the heat sink on the bottom jig plate.
4. The heat sink assembly line of claim 3, wherein the jig disassembling mechanism further comprises a product outflow conveyor line disposed on the frame and located at one side of the second disassembling robot, and the second disassembling robot can place the taken heat sink on the product outflow conveyor line so that the product outflow conveyor line conveys the heat sink.
5. The heat sink assembly line of claim 1, further comprising a first jig rotary conveyor line, a reflow furnace and a second jig rotary conveyor line, wherein the first jig rotary conveyor line is disposed between one end of the assembly conveyor line and one end of the reflow furnace, the second jig rotary conveyor line is disposed between the other end of the reflow furnace and the other end of the assembly conveyor line, and the jig loaded with the heat sink is conveyed to the reflow furnace through the first jig rotary conveyor line by the assembly conveyor line, so that the reflow furnace processes the heat sink; the second jig rotary conveying line is used for conveying the jig loaded with the processed radiator to an assembly conveying line.
6. The heat sink assembly line of claim 1, further comprising a carrier return mechanism disposed on the frame, wherein one end of the carrier conveying line can convey the empty carrier to the carrier return mechanism, and the carrier return mechanism can return the empty carrier to the other end of the carrier conveying line.
7. The heat sink assembly line according to claim 1, wherein the first assembling mechanism includes a transfer mechanism, a first feeding mechanism, a copper plate feeding manipulator, a first substrate feeding manipulator, a first screen printing mechanism, and a first discharging manipulator, the transfer mechanism includes a transfer plate and a transfer driving mechanism, the transfer driving mechanism is disposed on the frame, the transfer plate is disposed on the transfer driving mechanism, the first feeding mechanism, the first screen printing mechanism, and the first discharging manipulator are sequentially disposed on the frame along a moving direction of the transfer plate, the transfer driving mechanism can sequentially drive the transfer plate to move to positions corresponding to the first feeding mechanism, the first screen printing mechanism, and the first discharging manipulator, the first feeding mechanism includes a copper plate feeding assembly and a first substrate feeding assembly, copper feed subassembly is used for providing the copper, first base plate feed subassembly is used for providing first base plate, copper feeding manipulator with first base plate feeding manipulator set up respectively in the frame, copper feeding manipulator be used for with copper on the copper feed subassembly snatchs extremely move on the support plate, first base plate feeding manipulator be used for with first base plate on the first base plate feed subassembly snatchs extremely move the support plate, first silk screen printing mechanism is used for being located move copper and first base plate on the support plate and carry out the silk screen printing, first unloading manipulator be used for with move the copper that has silk screen printing on the support plate and first base plate snatch and place in place on placing the station.
8. The heat sink assembly line according to claim 1, wherein the second assembling mechanism includes a second feeding mechanism, a second substrate feeding manipulator, and a second solder paste dispensing module, the second feeding mechanism, the second substrate feeding manipulator, and the second solder paste dispensing module are respectively disposed on the rack, the second feeding mechanism is configured to provide a second substrate, the second substrate feeding manipulator is configured to grab and assemble a second substrate on the second feeding mechanism onto the copper plate on the placement station, and the second solder paste dispensing module is configured to dispense solder paste onto the assembled second substrate.
9. The heat sink assembly line as recited in claim 1, wherein the third assembling mechanism comprises a third feeding mechanism, a heat sink feeding robot, a flattening mechanism and a third solder paste dispensing module, the third feeding mechanism is arranged on the frame and used for providing the heat dissipation assembly, the heat dissipation assembly feeding manipulator, the flattening mechanism and the third solder paste module are sequentially arranged on the frame along the conveying direction of the assembly conveying line, the heat dissipation assembly feeding manipulator is used for grabbing and assembling the heat dissipation assemblies on the third feeding mechanism on the first substrate and the copper plate of the jig bottom plate, the flattening mechanism is used for pressing the heat dissipation assembly on the jig base plate on the first base plate and the copper plate, and the third point solder paste module is used for carrying out point solder paste on the position between the two copper pipes.
10. The heat sink assembly line according to claim 1, wherein the fourth assembling mechanism includes a fourth feeding mechanism, a transfer and assembly mechanism, a second heat sink feeding manipulator and a screen printing and gluing mechanism, the fourth feeding mechanism is disposed on the rack and is configured to provide the second heat sink, the transfer and assembly mechanism is disposed on the rack, the second heat sink feeding manipulator is disposed on the rack and is located between the fourth feeding mechanism and the transfer and assembly mechanism, and the second heat sink feeding manipulator is configured to capture the second heat sink on the fourth feeding mechanism onto the transfer and assembly mechanism; the silk-screen gluing mechanism is arranged on the rack; the second heat dissipation block is driven by the transfer assembly mechanism to move to a position corresponding to the silk-screen gluing mechanism, so that the silk-screen gluing mechanism can glue the gluing surface of the second heat dissipation block; the second heat dissipation block which is coated with the glue is driven to move by the transferring and assembling mechanism, and the glue coating surface of the second heat dissipation block is bonded on the copper pipe of the jig bottom plate.
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| CN114770070A (en) * | 2022-04-27 | 2022-07-22 | 江苏创源电子有限公司 | Automatic assembling equipment |
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| CN112296669B (en) | 2024-07-23 |
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