CN112291944A - Circuit board and laser windowing method thereof - Google Patents
Circuit board and laser windowing method thereof Download PDFInfo
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- CN112291944A CN112291944A CN202011166202.5A CN202011166202A CN112291944A CN 112291944 A CN112291944 A CN 112291944A CN 202011166202 A CN202011166202 A CN 202011166202A CN 112291944 A CN112291944 A CN 112291944A
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- target position
- coordinate
- circuit board
- windowing
- laser
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The application provides a circuit board and a laser windowing method thereof. The method comprises the steps of obtaining a solder resist printing image of the circuit board; acquiring a target position coordinate according to the solder resist printing image; comparing the target position coordinates with preset coordinates to obtain target position deviation compensation quantity; adjusting a laser windowing coordinate of the laser ablation device according to the target position deviation compensation amount so as to enable the windowing position of the circuit board to coincide with the windowing position corresponding to the preset coordinate; and carrying out laser ablation operation on the circuit board according to the laser windowing coordinate. The target position coordinate left after the printing process is obtained and used as a comparison variable for determining the windowing coordinate, and the target position deviation compensation amount reflects the deviation condition between the target position coordinate and the preset coordinate after the target position coordinate is compared with the preset coordinate.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board and a laser windowing method thereof.
Background
With the gradual maturity of the manufacturing technology of printed circuit boards, the manufacture of single-layer boards, multi-layer boards and flexible boards has become the mainstream form of circuit boards, wherein, for the structural design and the process flow of the circuit boards, a complete system is basically formed, for the solder resist printing process of the printed circuit boards, a layer of photosensitive solder resist ink is coated on the copper surface after the circuit is formed, and the photosensitive solder resist ink is used as the image transfer of the post-process, and simultaneously plays a role in protecting the board surface, preventing the circuit from being oxidized and having the function of solder resist in the post-process. The solder mask window refers to the size of the part where copper is exposed at the position to be soldered, i.e. the size of the part without covering ink, and the cover line refers to the size and the amount of the part of the circuit covered by the solder mask oil. Too small a cover thread distance can cause thread exposure during production.
However, the production of circuit boards of each type requires a corresponding exposure film, and the exposure parameters need to be adjusted according to different boards, so that the final solder mask effect is affected by the personnel of the exposure machine who cannot control the exposure machine in place, the film wrinkles, the film black spots and the like. The exposure deviation is one of the main defects of the solder mask, and the control of the exposure deviation problem in solder mask production is greatly hidden due to the complexity of human factors and other related process factors. Because exposure off normal and lead to pad and copper line on the solder mask printing ink to expose, influence follow-up subsides and paste dress stability for the welding fastness reduces, more seriously brings the fatal defect of short circuit for the electrical property function, and moreover, off normal bad board most can't be repaired, can directly retreat to wash reworking production and scrap even, seriously influence the precision and the efficiency of production.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a circuit board capable of improving windowing precision of the circuit board and a laser windowing method thereof.
The purpose of the invention is realized by the following technical scheme:
a method of laser windowing a circuit board, the method comprising: obtaining a solder resist printing image of the circuit board; acquiring a target position coordinate according to the solder resist printing image; comparing the target position coordinates with preset coordinates to obtain target position deviation compensation quantity; adjusting the laser windowing coordinate of the laser ablation device according to the target position deviation compensation quantity so as to enable the windowing position of the circuit board to coincide with the windowing position corresponding to the preset coordinate; and carrying out laser ablation operation on the circuit board according to the laser windowing coordinate so as to remove the solder resist ink corresponding to the preset coordinate on the circuit board.
In one embodiment, the obtaining the solder resist printing image of the circuit board includes: obtaining a printing blocking point image of the circuit board, wherein the printing blocking point image comprises a printing area image and a blocking point area image, solder resist ink is printed on the printing area image, and the laser windowing coordinate is located in the printing area; and solder resist ink is not covered on the image of the point blocking area, and the coordinates of the target position are positioned in the point blocking area.
In one embodiment, the acquiring the coordinates of the target position according to the solder resist printing image comprises: acquiring a ring positioning coordinate according to the image of the blocking point area; and acquiring the coordinates of the target position according to the positioning coordinates of the ring hole.
In one embodiment, the comparing the target position coordinate with a preset coordinate to obtain the target position deviation compensation amount includes: performing displacement difference processing on the target position coordinates and first preset coordinates to obtain target position displacement compensation quantity; the laser windowing coordinate of the laser ablation device is adjusted according to the target position deviation compensation quantity, and the method comprises the following steps: and adjusting the distance between the laser windowing coordinate of the laser ablation device and the target position coordinate according to the target position displacement compensation amount.
In one embodiment, the comparing the target position coordinate with a preset coordinate to obtain the target position deviation compensation amount includes: carrying out deflection angle difference solving processing on the target position coordinates and second preset coordinates to obtain target position deflection angle compensation quantity; the laser windowing coordinate of the laser ablation device is adjusted according to the target position deviation compensation quantity, and the method comprises the following steps: and adjusting the deflection angle between the laser windowing coordinate of the laser ablation device and the target position coordinate according to the target position deflection angle compensation amount.
In one embodiment, the acquiring the coordinates of the target position according to the solder resist printing image comprises: acquiring a first target position coordinate and a second target position coordinate according to the solder resist printing image; the target position coordinate is compared with a preset coordinate to obtain a target position deviation compensation quantity, and the method comprises the following steps: acquiring a coordinate space difference between the first target position coordinate and the second target position coordinate; detecting whether the coordinate space difference is equal to a preset space or not; and when the coordinate space difference is equal to the preset space, sending a qualified silk-screen signal to a monitoring system.
In one embodiment, the detecting whether the coordinate distance difference is equal to a preset distance further includes: and when the coordinate distance difference is smaller than or larger than the preset distance, taking out the circuit board, and sending a silk-screen early warning signal to a monitoring system.
In one embodiment, the performing a laser ablation operation on the circuit board according to the laser windowing coordinate further includes: and starting a dust suction fan of the laser ablation device to discharge ablation gas formed after the laser ablation operation.
In one embodiment, the obtaining the solder resist printing image of the circuit board further comprises: and carrying out pre-baking operation on the circuit board to obtain the printed circuit board with stably coated solder resist ink.
A circuit board is obtained by adopting the circuit board laser windowing method in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
by acquiring the target position coordinate left after the printing process and taking the target position coordinate as a comparison variable for determining the windowing coordinate, after the target position coordinate is compared with the preset coordinate, the target position deviation compensation amount reflects the deviation condition between the target position coordinate and the preset coordinate, so that after the target position coordinate deviates, the position to be windowed is correspondingly changed according to the target position deviation compensation amount, the laser windowing coordinate is always overlapped with the windowing position corresponding to the preset coordinate, the laser windowing precision is improved, solder resist ink at the appointed windowing position is conveniently removed, a circuit board with higher windowing precision is acquired, and the qualified rate of the circuit board is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of a laser windowing method for a circuit board in an embodiment;
FIG. 2 is a schematic diagram of a circuit board according to an embodiment;
FIG. 3 is a cross-sectional view of the wiring board shown in FIG. 2 taken along the direction A-A;
fig. 4 is an enlarged schematic view of the wiring board shown in fig. 3 at a 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention relates to a laser windowing method for a circuit board. In one embodiment, the circuit board laser windowing method comprises the steps of obtaining a solder mask printing image of a circuit board; acquiring a target position coordinate according to the solder resist printing image; comparing the target position coordinates with preset coordinates to obtain target position deviation compensation quantity; adjusting the laser windowing coordinate of the laser ablation device according to the target position deviation compensation quantity so as to enable the windowing position of the circuit board to coincide with the windowing position corresponding to the preset coordinate; and carrying out laser ablation operation on the circuit board according to the laser windowing coordinate so as to remove the solder resist ink corresponding to the preset coordinate on the circuit board. By acquiring the target position coordinate left after the printing process and taking the target position coordinate as a comparison variable for determining the windowing coordinate, after the target position coordinate is compared with the preset coordinate, the target position deviation compensation amount reflects the deviation condition between the target position coordinate and the preset coordinate, so that after the target position coordinate deviates, the position to be windowed is correspondingly changed according to the target position deviation compensation amount, the laser windowing coordinate is always overlapped with the windowing position corresponding to the preset coordinate, the laser windowing precision is improved, solder resist ink at the appointed windowing position is conveniently removed, a circuit board with higher windowing precision is acquired, and the qualified rate of the circuit board is improved.
Please refer to fig. 1, which is a flowchart illustrating a laser windowing method for a circuit board according to an embodiment of the present invention. The laser windowing method of the circuit board comprises part or all of the following steps.
S100: and obtaining a solder mask printing image of the circuit board.
In this embodiment, the solder resist printing image is a circuit board formed after the circuit board is subjected to screen printing, wherein the printing material used in the screen printing is solder resist ink, and is used for forming a solder resist layer with a pattern on the circuit board, so that the circuit and the copper foil on the circuit board are protected, the circuit of the circuit board is prevented from being exposed to the external environment too much, and the corrosion of the copper foil circuit of the circuit board is reduced.
S200: and acquiring the coordinates of the target position according to the solder resist printing image.
In this embodiment, the target position coordinate is hinder and weld the corresponding coordinate of fender point on the printing image, moreover, the target position coordinate is located and hinders outside the solder ink on the circuit board, promptly the position that the target position coordinate corresponds does not hinder the solder ink, is convenient for with the target position coordinate distinguishes with other position coordinates, thereby is convenient for with the target position coordinate is as location coordinate, and then the position of being convenient for follow-up adjustment laser windowing to improve the precision that the laser windowed.
S300: and comparing the target position coordinates with preset coordinates to obtain the offset compensation quantity of the target position.
In this embodiment, the preset coordinates are coordinates of a target position on the standard circuit board, that is, the coordinates corresponding to the preset coordinates are reference coordinates, which is convenient for adjusting the laser windowing coordinates. And comparing the target position coordinates with preset coordinates, namely comparing the current target position coordinates on the circuit board with the target position coordinates on the standard circuit board, so as to obtain the offset compensation amount of the target position, and conveniently determining the deviation condition of the current target position coordinates on the circuit board and the target position coordinates on the standard circuit board, thereby facilitating the subsequent corresponding adjustment of the laser windowing coordinates. For example, when the target position coordinate is shifted to the right relative to the preset coordinate, the laser windowing coordinate is conveniently shifted to the left by the same amount in the following process, so that the laser windowing coordinate is conveniently and continuously superposed with the windowing position corresponding to the preset coordinate, and the laser windowing precision is improved.
S400: and adjusting the laser windowing coordinate of the laser ablation device according to the target position deviation compensation amount so as to enable the windowing position of the circuit board to coincide with the windowing position corresponding to the preset coordinate.
In this embodiment, the target position deviation compensation amount is used for reflecting the deviation condition between the current target position and the standard target position of the circuit board, so that when the laser windowing coordinate of the laser ablation device is adjusted, the position where windowing is finally needed can be quickly determined, the windowing position of the circuit board is made to coincide with the windowing position corresponding to the preset coordinate, that is, the windowing position of the corrected circuit board is the same as the standard windowing position, and the windowing precision is improved.
S500: and carrying out laser ablation operation on the circuit board according to the laser windowing coordinate so as to remove the solder resist ink corresponding to the preset coordinate on the circuit board.
In this embodiment, the laser windowing coordinate is a coordinate corresponding to a final windowing position, that is, the windowing coordinate after correction according to the target offset compensation amount is convenient for the laser ablation device to align to a position on the circuit board to be windowed, so that solder resist ink at the position to be windowed is conveniently and accurately removed, and accurate windowing of the circuit board is realized.
In one embodiment, the obtaining the solder resist printing image of the circuit board includes: obtaining a printing blocking point image of the circuit board, wherein the printing blocking point image comprises a printing area image and a blocking point area image, solder resist ink is printed on the printing area image, and the laser windowing coordinate is located in the printing area; and solder resist ink is not covered on the image of the point blocking area, and the coordinates of the target position are positioned in the point blocking area. In this embodiment, the printed dot blocking image has a printing area and a dot blocking area, the printing area is a material penetration area corresponding to the screen printing plate, so that the solder resist ink can be conveniently printed on the circuit board, and the structure of the screen printing plate can be correspondingly adjusted according to the required shape, so as to be suitable for different circuit boards. The blocking point area is a material blocking area corresponding to the screen printing plate, and blocks solder resist ink on the screen printing plate and cannot reach the circuit board through the screen printing plate so as to form an area with the target position coordinate, so that the target position coordinate is conveniently distinguished from coordinates of other positions. Therefore, the target position coordinates can be accurately obtained by the image acquisition device through acquiring the gray value of the circuit board.
In one embodiment, the acquiring the coordinates of the target position according to the solder resist printing image comprises: acquiring a ring positioning coordinate according to the image of the blocking point area; and acquiring the coordinates of the target position according to the positioning coordinates of the ring hole. In this embodiment, the aperture ring positioning coordinates are used to determine the target position coordinates, for example, the structure of the stop point region image is a rectangular structure, the aperture ring positioning coordinates are coordinates corresponding to four corners of the rectangular structure, two intersecting diagonals are determined by the four aperture ring positioning coordinates, and the focus of the two diagonals is taken as the target position coordinates. Therefore, the coordinates of the target position can be determined according to the positioning coordinates of the ring hole, and the coordinates of the target position can be conveniently used as comparison coordinates for adjusting windowing coordinates. In another embodiment, the target position coordinates are two, and the two target position coordinates are two quarter demarcation points adjacent to the two diagonal lines.
In one embodiment, the comparing the target position coordinate with a preset coordinate to obtain the target position deviation compensation amount includes: performing displacement difference processing on the target position coordinates and first preset coordinates to obtain target position displacement compensation quantity; the laser windowing coordinate of the laser ablation device is adjusted according to the target position deviation compensation quantity, and the method comprises the following steps: and adjusting the distance between the laser windowing coordinate of the laser ablation device and the target position coordinate according to the target position displacement compensation amount. In this embodiment, the first preset coordinate is a corresponding coordinate in an absolute coordinate system, that is, the target position coordinate and the first preset coordinate are both an X-axis coordinate value and a Y-axis coordinate value, and the target position coordinate and the first preset coordinate are subjected to displacement difference processing, so that the coordinate corresponding to the current target position of the circuit board is compared with the first standard coordinate, and the condition that the current target position of the circuit board deviates from the standard target position is convenient to determine. The distance between the laser windowing coordinate of the laser ablation device and the target position coordinate is adjusted according to the target position displacement compensation amount, namely, the windowing position of the circuit board is moved on an absolute coordinate axis, so that the distance between the windowing position of the circuit board and the current target position of the circuit board is adjusted, the laser windowing coordinate is conveniently overlapped with the windowing position corresponding to the preset coordinate all the time, and the laser windowing precision is improved.
In one embodiment, the comparing the target position coordinate with a preset coordinate to obtain the target position deviation compensation amount includes: carrying out deflection angle difference solving processing on the target position coordinates and second preset coordinates to obtain target position deflection angle compensation quantity; the laser windowing coordinate of the laser ablation device is adjusted according to the target position deviation compensation quantity, and the method comprises the following steps: and adjusting the deflection angle between the laser windowing coordinate of the laser ablation device and the target position coordinate according to the target position deflection angle compensation amount. In this embodiment, the second preset coordinate is a coordinate corresponding to the polar coordinate system, that is, the target coordinate and the second preset coordinate are a polar length value and a polar angle value, and the target coordinate and the second preset coordinate are subjected to a difference calculation processing of a deflection angle, so that the polar coordinate corresponding to the current target position of the circuit board is compared with the second standard coordinate, and the deflection condition of the current target position and the standard target position of the circuit board is determined conveniently. The distance between the laser windowing coordinate of the laser ablation device and the target position coordinate is adjusted according to the target position displacement compensation amount, namely, the windowing position of the circuit board is moved on a relative polar coordinate axis, so that the deflection angle between the windowing position of the circuit board and the current target position of the circuit board is adjusted, the laser windowing coordinate is conveniently overlapped with the windowing position corresponding to the preset coordinate all the time, and the laser windowing precision is improved.
In one embodiment, the acquiring the coordinates of the target position according to the solder resist printing image comprises: acquiring a first target position coordinate and a second target position coordinate according to the solder resist printing image; the target position coordinate is compared with a preset coordinate to obtain a target position deviation compensation quantity, and the method comprises the following steps: acquiring a coordinate space difference between the first target position coordinate and the second target position coordinate; detecting whether the coordinate space difference is equal to a preset space or not; and when the coordinate space difference is equal to the preset space, sending a qualified silk-screen signal to a monitoring system. In this embodiment, the structure of the solder resist printing image is rectangular and annular, the first target position coordinate is a quarter boundary point on one diagonal line of the solder resist printing image, and the second target position coordinate is a quarter boundary point on the other diagonal line of the solder resist printing image, that is, the first target position coordinate and the second target position coordinate are respectively two adjacent quarter boundary points on two diagonal lines, so that the first target position coordinate and the second target position coordinate can be conveniently distinguished. The first target position coordinate and the second target position coordinate are used for jointly determining the target position coordinate, and therefore accurate positioning of the target position coordinate is improved. And after the coordinate distance difference between the first target position coordinate and the second target position coordinate is obtained, whether the solder resist printing image is deformed or not is determined conveniently, so that whether the operation of obtaining the target position coordinate is continuously performed or not is determined conveniently. In this way, after the coordinate distance difference is determined to be equal to the preset distance, a silk-screen qualified signal is sent to the monitoring system, and the step S200 is continuously executed, so that the positioning accuracy of the target position coordinate is improved after the accuracy of the solder resist printing image is ensured.
In one embodiment, the detecting whether the coordinate distance difference is equal to a preset distance further includes: and when the coordinate distance difference is smaller than or larger than the preset distance, taking out the circuit board, and sending a silk-screen early warning signal to a monitoring system. In this embodiment, the coordinate interval difference is smaller than or larger than the preset interval, which indicates that the solder resist printing image printed on the circuit board is a deformed image, that is, the circuit board manufactured through the silk-screen process is unqualified, and before acquiring the target position coordinates, a silk-screen early warning signal is sent to the monitoring system to avoid subsequent influence on the windowing position precision, so that the monitoring system can find the unqualified circuit board in time and avoid entering the windowing process.
In one embodiment, the performing a laser ablation operation on the circuit board according to the laser windowing coordinate further includes: and starting a dust suction fan of the laser ablation device to discharge ablation gas formed after the laser ablation operation. In this embodiment, when the laser ablation device performs laser ablation, the laser ablation device performs sputtering on solder resist ink on the circuit board, so that the solder resist ink is bombarded, particles with extremely small particle size are formed, and the security of the circuit board can be threatened in the environment.
In one embodiment, the obtaining the solder resist printing image of the circuit board further comprises: and carrying out pre-baking operation on the circuit board to obtain the printed circuit board with stably coated solder resist ink. In this embodiment, the pre-baking of the circuit board makes the solder resist ink on the circuit board tend to be stable, so that the stable setting of the solder resist ink is facilitated, and the internal structure of the circuit board is protected.
It can be understood that after the laser ablation operation, a welding point for welding is formed on the circuit board, that is, the copper foil is exposed, however, the laser energy generated by the laser ablation device is large, and under the condition that the output power of the laser ablation device is not adjusted, when the thickness of the circuit board is small, for example, a single-layer circuit board or a flexible circuit board, when the energy of the laser ablation is too large, the circuit board is directly punctured, so that the inner and outer layers of circuits of the circuit board are directly short-circuited, and the circuit board cannot be used at this time, so that the qualification rate of the circuit board is reduced, and even the circuit board is scrapped.
In order to reduce the short circuit probability of the inner and outer layer circuits of the produced circuit board, namely reduce the rejection probability of the circuit board, after step S500, the method further comprises the following steps:
acquiring brightness reflection time corresponding to the laser windowing coordinate of the circuit board;
comparing the brightness reflection time with a preset reflection time to obtain a delay compensation quantity;
detecting whether the delay compensation amount is greater than 0;
and when the delay compensation amount is larger than 0, sending a defective product alarm signal to a monitoring system.
In this embodiment, the brightness reflection time is obtained by the infrared transmitter-receiver, that is, the output end of the infrared transmitter-receiver aligns to the laser windowing position of the circuit board, and emits infrared light to the laser windowing position of the circuit board, and determines whether the laser windowing position penetrates through the circuit board according to the time of receiving the reflected infrared light. When the laser windowing position does not penetrate through the circuit board, the laser windowing position is provided with a bottom on the circuit board, the infrared ray emitted by the output end of the infrared emitting receiver returns along the original path after meeting the bottom of the laser windowing position, namely the infrared emitting receiver receives the reflected infrared ray; when the laser windowing position penetrates through the circuit board, the infrared transmitting and receiving device cannot receive reflected infrared light, namely, the brightness reflection time is infinite. When the preset reflection time is on one side of the circuit board and the other side of the circuit board is used as the bottom of the laser windowing position, the infrared transmitting and receiving device receives the reflection time of the reflected infrared light. Therefore, the delay compensation quantity is obtained by comparing the brightness reflection time with the preset reflection time, and the delay compensation quantity is the reflection time difference for determining the infrared ray, so that whether the laser windowing position is penetrated or not is convenient to determine. When the delay compensation amount is larger than 0, the fact that the reflection time of the infrared light is larger than the preset reflection time is shown, namely that the bottom of the laser windowing position is outside the circuit board, namely that the laser windowing position penetrates through the circuit board is shown. The circuit board at this moment is the unqualified multiply wood, can't use as normal circuit board, through sending substandard product alarm signal to monitored control system, the monitored control system of being convenient for in time discovers unqualified circuit board to be convenient for in time reject unqualified product, improved the qualification rate of circuit board.
Furthermore, after the solder resist ink is coated, a solder paste layer is coated on the solder resist ink to improve the solderability of the circuit board. When the laser ablation operation is carried out, at least one mode of sputtering hole forming and mechanical depth control drilling gong is used for forming a laser windowing position. However, the above hole-forming methods all need to remove part of the material of the circuit board, and in the removing process, part of the waste material is inevitably left, and the remaining waste material will affect the volume of the solder paste layer subsequently covered on the solder resist ink, so that the volume of the solder paste layer in the laser windowing position is reduced, the thickness of the solder paste layer is reduced, and the thickness of the solder paste layer directly affects the solderability thereof, which easily results in the reduction of the solderability of the circuit board.
In order to facilitate timely finding and cleaning of the residual waste material to improve the solderability of the circuit board, after step S500, the method further comprises the following steps:
acquiring a windowing imaging image of the circuit board;
acquiring a windowing brightness value according to the windowing imaging image;
comparing the brightness value with a preset brightness to obtain a brightness compensation quantity;
and adjusting the cleaning time and times of the plasma cleaner for the circuit board according to the brightness compensation amount.
In this embodiment, the laser windowing position imaging image is an image of a side face of the circuit board on which the windowing is arranged, and the image acquisition device acquires brightness of the circuit board to form the laser windowing position imaging image, wherein the laser windowing position imaging image includes a brightness value corresponding to each windowing, namely brightness of reflected light at the side wall and the bottom of the laser windowing position. The brightness value is a numerical value corresponding to the brightness in the laser windowing position and is used for reflecting the light reflecting performance of the side wall and the bottom of the laser windowing position, and when waste materials are remained in the laser windowing position, light rays are not in mirror reflection in the laser windowing position, namely the light rays are in diffuse reflection in the laser windowing position, so that the number of light rays finally reflected back to the image acquisition device is reduced, and the reflection brightness obtained by the image acquisition device is reduced. Therefore, the brightness compensation amount is obtained by comparing the brightness value with the preset brightness, wherein the preset brightness is the brightness corresponding to the situation that no residue exists in the laser windowing position, the brightness compensation amount represents the difference between the current brightness of the laser windowing position and the brightness of the situation that no residue exists, and whether the residue exists in the laser windowing position or not is convenient to determine. The size of the brightness compensation quantity determines cleaning parameters of the plasma cleaning machine, namely the brightness compensation quantity is in direct proportion to the cleaning time and times of the plasma cleaning machine for the circuit board, namely the brightness compensation quantity is increased, the cleaning time and times of the plasma cleaning machine for the circuit board are increased, residues in a laser windowing position can be conveniently removed, the cleanliness in the laser windowing position is improved, the size of a tin paste layer in the laser windowing position is improved, and the conductivity of the circuit board is further improved.
In addition, the preset brightness can be determined according to the shape of the laser windowing position on the circuit board, different shape structures and different brightness values of the windowing without residues, namely before the brightness values are compared with the preset brightness, the shape of the windowing corresponding to the used preset brightness is the same as the shape of the windowing to be detected currently, and the comparison standard is correspondingly adjusted when the brightness comparison is carried out on the windowing with different shapes, so that the cleanliness of the residues in the windowing is improved.
In the above embodiments, the image capturing Device includes a CCD (Charge Coupled Device) camera or a CMOS (Complementary Metal Oxide Semiconductor) camera.
The present application also provides a circuit board obtained by the method for manufacturing a multilayer circuit board described in any of the above embodiments. In this embodiment, target position coordinates left after a printing process are obtained and used as comparison variables for determining windowing coordinates, and after the target position coordinates are compared with preset coordinates, the target position deviation compensation amount reflects the deviation condition between the target position coordinates and the preset coordinates, so that after the target position coordinates are deviated, the position to be windowed is correspondingly changed according to the target position deviation compensation amount, the laser windowing coordinates are always overlapped with the windowing positions corresponding to the preset coordinates, the precision of laser windowing is improved, solder resist ink at the specified windowing positions is conveniently removed, a circuit board with higher windowing precision is obtained, and the qualification rate of the circuit board is improved.
Please refer to fig. 2, which is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Referring to fig. 3, the circuit board 10 of an embodiment includes a solder resist layer 100 and a target bump 300, and the circuit board 10 further includes a substrate 200. The substrate 200 has a printing region 210 and a target site region 220. The target area 220 is disposed adjacent to the printing area 210. The printed area 210 is covered with the solder resist layer 100. The solder mask layer 100 is provided with a window 110. The opening window 110 is used for exposing part of the copper foil on the substrate 200. The target site bulge 300 is disposed within the target site region 220. The target position bump 300 is connected with the substrate 200, and the distance that the target position bump 300 protrudes out of the substrate 200 is less than or equal to the distance that the solder mask layer 100 protrudes out of the substrate 200. The target protrusion 300 corresponds to the fenestration 110, and the target protrusion 300 is used for performing coordinate positioning on the fenestration 110.
In this embodiment, by forming the target area 220 on the substrate 200, the target protrusion 300 for positioning the coordinate of the opening window 110 is arranged in the target area 220, and the opening window 110 is arranged in the printed area 210 covered with the solder resist layer 100, after the target protrusion 300 is determined, the position of the opening window 110 is determined, so that the laser ablation device can conveniently perform the opening operation on the solder resist layer 100 on the substrate 200, so as to expose the copper foil in the opening window 110, thereby omitting the use of a film and a developing solution when manufacturing the circuit board, and reducing the production cost of the circuit board.
In one embodiment, referring to fig. 2, the solder mask layer 100 is formed with an auxiliary opening 120, and the auxiliary opening 120 is disposed adjacent to the opening 110. In this embodiment, the auxiliary window opening 120 is configured to assist in positioning coordinates of the window 110, and the position of the auxiliary window opening 120 is close to the window 110, so that the coordinates of the auxiliary window opening 120 are close to the coordinates of the window 110, that is, a difference between an X-axis coordinate value of the auxiliary window opening 120 and an X-axis coordinate value of the window 110 is reduced, and a difference between a Y-axis coordinate value of the auxiliary window opening 120 and a Y-axis coordinate value of the window 110 is reduced. Thus, after the coordinates of the target protrusion 300 are located, the coordinates of the auxiliary opening hole 120 facilitate further location of the coordinates of the opening window 110, and further improve the location accuracy of the opening window 110.
In one embodiment, referring to fig. 2, the auxiliary window 120 includes a first window 122 and a second window 124, the first window 122 is disposed adjacent to the second window 124, and the first window 122 and the second window 124 are disposed around the window 110. In this embodiment, the first opening hole 122 is close to the opening hole 110, and the second opening hole 124 is also close to the opening hole 110, so that the opening hole 110 is surrounded by the first opening hole 122 and the second opening hole 124, and the opening hole 110 is located between the first opening hole 122 and the second opening hole 124, thereby facilitating the determination of the position of the opening hole 110 through the positioning of the first opening hole 122 and the second opening hole 124.
In one embodiment, referring to fig. 2, the first opening 122 is located at a corner of the opening 110. In this embodiment, the first opening hole 122 is located at a corner of the opening window 110, which indicates that the first opening hole 122 is located at a specific position on the substrate 200, so that coordinates of the first opening hole 122 have specificity, and the position of the opening window 110 is conveniently located by determining the position of the first opening hole 122, thereby improving the location accuracy of the opening window 110.
In one embodiment, referring to fig. 2, the target area 220 has a ring structure, and the target area 220 and a portion of the solder mask layer 100 are disposed around. In this embodiment, the target region 220 having a ring structure is located on the substrate 200, the solder mask layer 100 on the substrate 200 is disposed adjacent to the target region 220, and the target region 220 and a portion of the solder mask layer 100 are disposed in a surrounding manner, so that the solder mask layer 100 and the inner side and the outer side of the target region 220 are adjacent to each other, and thus the target region 220 surrounds a portion of the solder mask layer 100 in a ring manner, which facilitates to quickly determine the position coordinates of the target region 220, and thus facilitates to quickly determine the coordinates of the target protrusion 300.
In one embodiment, referring to fig. 2, the target bump 300 is disposed adjacent to the solder resist layer 100. In this embodiment, the target protrusion 300 serves as a bridge for determining the window 110, that is, the coordinates of the window 110 can be obtained by determining the coordinates of the target protrusion 300. The target position bulge 300 is arranged adjacent to the solder mask layer 100, so that the distance between the target position bulge 300 and the solder mask layer 100 is reduced, the solder mask layer 100 has green light reflection characteristics and is easily identified by an image acquisition device, the target position bulge 300 is close to the solder mask layer 100, the position of the target position bulge 300 is conveniently determined through the change of the gray value on the substrate 200, the coordinate of the target position bulge 300 is more easily identified, and the acquisition speed of the coordinate of the target position bulge 300 is improved.
In one embodiment, the side edge of the solder mask layer close to the target area is provided with a groove, and at least part of the target protrusion is positioned in the groove. In this embodiment, the setting of recess makes the side shape of solder mask takes place great deformation, compares through the image to the edge of solder mask, and is right promptly the comparison of recess is convenient for the snap-on determination target position is protruding, has further improved right the acquisition speed of the bellied coordinate of target position. In other embodiments, the projection of the target protrusion on the substrate is located in the groove, and the caliber of the groove is larger than the diameter of the target protrusion, so that the target protrusion is completely accommodated in the groove, and thus, the deformation of the solder mask layer close to the edge of the target protrusion is further increased, and the position of the target protrusion is further conveniently and rapidly determined.
In one embodiment, the target protrusion is provided with a positioning hole, and the positioning hole is used for performing coordinate positioning on the target protrusion. In this embodiment, the formation of the positioning hole enables the gray scale on the target protrusion to change, and the coordinates of the target protrusion can be determined quickly through the comparison of the gray scale, so that the position of the window can be determined quickly.
It is understood that the solder resist ink is in a liquid state in the physical state of the solder resist layer 100 before the fixing molding. Before laser windowing, the solder mask layer 100 is formed on a calendering layer on a circuit board, a copper foil circuit layer of the circuit board is provided with solder mask holes, and the solder mask layer 100 is injected into the solder mask holes. However, traditional solder mask hole is straight hole, when welder welds, the temperature of welder tip is higher, heats solder mask 100 in the hole easily to welding, thereby make to weld solder mask 100 in the hole and be heated and soften, convert to jelly, make after welder breaks away from, solder mask 100's part flows from welding the downthehole, thereby make solder mask 100 break away from copper foil circuit layer, and then make solder mask 100 be in connection stability on the base plate 200 reduces, leads to the solderability reduction of circuit board, causes electronic component's on the circuit board welding point to fall into to weld downthehole and can't be connected with copper foil circuit layer, causes the rosin joint promptly, thereby improves the probability of scrapping of circuit board.
In order to improve solder mask 100 with the stability of being connected between the base plate 200 reduces the probability that solder mask 100 breaks away from in hindering the solder mask hole promptly, please refer to fig. 3 and fig. 4 together, circuit board 10 still includes and prolongs layer 400 and copper foil circuit layer 500, copper foil circuit layer 500 passes through prolong layer 400 with base plate 200 connects, copper foil circuit layer 500 has been seted up and has been hindered solder mask 510, solder mask 100 is located hinder in solder mask 510, copper foil circuit layer 500 still seted up with hinder reverse connection groove 520 that solder mask 510 communicates, copper foil circuit layer 500 has chamfer connection face 530, chamfer connection face 530 is located in reverse connection groove 520, just chamfer connection face 530 is located hinder outside the opening extending direction of solder mask 510, chamfer connection face 530 with solder mask 100 butt. In this embodiment, the part of solder mask 100 is located in reverse connection groove 520, promptly the part of solder mask 100 stretches into in the reverse connection groove 520, solder mask 100 support hold in chamfer connection surface 530, chamfer connection surface 530 does solder mask 100 provides a orientation the effort of calendering layer 400, solder mask 100 is in reverse connection groove 520's bottom and under the common centre gripping of chamfer connection surface 530, make solder mask 100 stable calorie locate in reverse connection groove 520, thereby make solder mask 100 stable calorie locate in hinder welding hole 510, improved solder mask 100 with the stability of connection between the base plate 200. In one embodiment, the number of the reverse connection slots 520 is two, two of the reverse connection slots 520 are disposed oppositely, and the openings of the two reverse connection slots 520 are disposed oppositely. Like this, solder mask 100 stretches into reverse connection groove 520's part increases, makes solder mask 100 with the joint area increase between the copper foil circuit layer 500 improves solder mask 100 with copper foil circuit layer 500, thereby improves solder mask 100 with the stability of being connected between the base plate 200. Moreover, the supporting force provided by the chamfered connecting surfaces 530 in the two oppositely-arranged reverse connecting grooves 520 is symmetrical, so that the stress of the solder mask layer 100 is stable, and the connection stability between the solder mask layer 100 and the substrate 200 is further improved.
Further, solder mask 100 coats and is stamped the solder paste layer of being convenient for the welding, because solder mask 100 and the partial contact of solder paste layer, the size of the adhesive force between solder mask 100 and the solder paste layer is adjusted through area of contact between the two, promptly the adhesive force between solder mask 100 and the solder paste layer and the area of contact between the two are directly proportional, promptly area of contact between solder mask 100 and the solder paste layer is big more, the adhesive force between solder mask 100 and the solder paste layer is big more for connection between the two is more stable. In order to improve the connection stability between the solder resist layer 100 and the solder paste layer, please refer to fig. the aperture of the solder resist hole 510 away from the substrate 200 is larger than the aperture of the solder resist hole 510 close to the substrate 200. In this embodiment, solder mask 100 is embedded in solder mask hole 510, solder mask 100 is stably clamped in solder mask hole 510, wherein solder mask layer covers solder mask hole 510, so that solder mask layer abuts against the plane of solder mask layer 100 away from the bottom of solder mask hole 510. Under the condition of the aperture adjustment of solder mask 510, promptly the solder mask 510 is kept away from the bore of base plate 200 is greater than solder mask 510 is close to the bore of base plate 200 for the solder mask with the area of contact between solder mask 100 increases, thereby makes adhesive force between solder mask 100 and the solder mask, improved the solder mask with the stability of being connected between solder mask 100 has reduced solder mask 100 and the probability of breaking away from of solder mask. In other embodiments, the aperture of the solder resist hole 510 gradually increases along the opening direction thereof, so that the contact area between the solder paste layer and the solder resist layer 100 increases.
Furthermore, in order to further improve the stability of the solder mask layer 100 in the solder mask holes 510, please refer to fig. 4, the circuit board 10 further includes a positioning connecting protrusion 600, the positioning connecting protrusion 600 is disposed in the solder mask holes 510, the positioning connecting protrusion 600 is connected to the calendering layer 400, and the positioning connecting protrusion 600 is used for being clamped with a positioning groove on the solder mask layer 100. In this embodiment, the positioning and connecting protrusion 600 is located in the solder mask hole 510, for example, the positioning and connecting protrusion 600 is connected to the sidewall of the solder mask hole 510; for another example, the positioning connection protrusion 600 is protruded at the bottom of the solder mask hole 510; for another example, the positioning connection protrusion 600 is protruded from the sidewall of the solder mask hole 510 and the bottom of the solder mask hole 510. Protruding 600 of location connection with the constant head tank on the solder mask 100 corresponds, is convenient for with solder mask 100 joint in the protruding 600 of location connection in hinder welding hole 510 makes solder mask 100 with the protruding 600 stable connection of location connection, thereby makes solder mask 100 set up in hinder the stability in welding hole 510, and then make solder mask 100 with connection stability between the base plate 200 improves.
In one embodiment, referring to fig. 4, the circuit board 10 further includes a heat conduction layer 700, the heat conduction layer 700 is disposed in the solder resist hole 510, the heat conduction layer 700 is respectively connected to the rolling layer 400 and the solder resist layer 100, and a portion of the heat conduction layer 700 is configured to protrude to an external environment. In this embodiment, during soldering, the solder mask 100 absorbs heat of a soldering gun, the heat will gradually gather in the solder mask hole 510, and a portion of the heat conduction layer 700 extends out to the external environment, and the heat conduction layer 700 guides the heat on the solder mask 100 to the external environment, so that the heat on the solder mask 100 is dissipated to the external environment through the heat conduction layer 700, the temperature in the solder mask hole 510 is reduced, and the heat dissipation effect of the circuit board is improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A laser windowing method for a circuit board is characterized by comprising the following steps:
obtaining a solder resist printing image of the circuit board;
acquiring a target position coordinate according to the solder resist printing image;
comparing the target position coordinates with preset coordinates to obtain target position deviation compensation quantity;
adjusting the laser windowing coordinate of the laser ablation device according to the target position deviation compensation quantity so as to enable the windowing position of the circuit board to coincide with the windowing position corresponding to the preset coordinate;
and carrying out laser ablation operation on the circuit board according to the laser windowing coordinate so as to remove the solder resist ink corresponding to the preset coordinate on the circuit board.
2. The laser windowing method for a circuit board according to claim 1, wherein the obtaining of the solder resist printed image of the circuit board comprises:
obtaining a printing blocking point image of the circuit board, wherein the printing blocking point image comprises a printing area image and a blocking point area image, solder resist ink is printed on the printing area image, and the laser windowing coordinate is located in the printing area; and solder resist ink is not covered on the image of the point blocking area, and the coordinates of the target position are positioned in the point blocking area.
3. The laser windowing method for the circuit board according to the claim 2, wherein the obtaining the coordinates of the target position according to the solder resist printing image comprises:
acquiring a ring positioning coordinate according to the image of the blocking point area;
and acquiring the coordinates of the target position according to the positioning coordinates of the ring hole.
4. The laser windowing method of the circuit board according to claim 1, wherein the comparing the target position coordinates with preset coordinates to obtain the offset compensation amount of the target position comprises:
performing displacement difference processing on the target position coordinates and first preset coordinates to obtain target position displacement compensation quantity;
the laser windowing coordinate of the laser ablation device is adjusted according to the target position deviation compensation quantity, and the method comprises the following steps:
and adjusting the distance between the laser windowing coordinate of the laser ablation device and the target position coordinate according to the target position displacement compensation amount.
5. The laser windowing method of the circuit board according to claim 1, wherein the comparing the target position coordinates with preset coordinates to obtain the offset compensation amount of the target position comprises:
carrying out deflection angle difference solving processing on the target position coordinates and second preset coordinates to obtain target position deflection angle compensation quantity;
the laser windowing coordinate of the laser ablation device is adjusted according to the target position deviation compensation quantity, and the method comprises the following steps:
and adjusting the deflection angle between the laser windowing coordinate of the laser ablation device and the target position coordinate according to the target position deflection angle compensation amount.
6. The laser windowing method for the circuit board according to claim 1, wherein the obtaining target position coordinates from the solder resist printing image comprises:
acquiring a first target position coordinate and a second target position coordinate according to the solder resist printing image;
the target position coordinate is compared with a preset coordinate to obtain a target position deviation compensation quantity, and the method comprises the following steps:
acquiring a coordinate space difference between the first target position coordinate and the second target position coordinate;
detecting whether the coordinate space difference is equal to a preset space or not;
and when the coordinate space difference is equal to the preset space, sending a qualified silk-screen signal to a monitoring system.
7. The laser windowing method for circuit boards as recited in claim 6, wherein said detecting whether the coordinate spacing difference is equal to a preset spacing further comprises:
and when the coordinate distance difference is smaller than or larger than the preset distance, taking out the circuit board, and sending a silk-screen early warning signal to a monitoring system.
8. The laser windowing method for a circuit board according to claim 1, wherein the laser ablation operation is performed on the circuit board according to the laser windowing coordinates, and then further comprising:
and starting a dust suction fan of the laser ablation device to discharge ablation gas formed after the laser ablation operation.
9. The laser windowing method for a circuit board according to claim 1, wherein said obtaining a solder resist printed image of the circuit board further comprises:
and carrying out pre-baking operation on the circuit board to obtain the printed circuit board with stably coated solder resist ink.
10. A wiring board obtained by the laser windowing method for a wiring board according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011166202.5A CN112291944B (en) | 2020-10-27 | 2020-10-27 | Circuit board and laser windowing method thereof |
| PCT/CN2021/084938 WO2022088607A1 (en) | 2020-10-27 | 2021-04-01 | Circuit board and method for forming opening thereon using laser |
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| CN202011166202.5A CN112291944B (en) | 2020-10-27 | 2020-10-27 | Circuit board and laser windowing method thereof |
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| CN114799492A (en) * | 2022-03-21 | 2022-07-29 | 武汉华工激光工程有限责任公司 | Efficient high-precision Mini LED panel windowing method and system |
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| CN117893529A (en) * | 2024-03-14 | 2024-04-16 | 江苏富翰医疗产业发展有限公司 | Intelligent fundus shooting method |
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Also Published As
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| WO2022088607A1 (en) | 2022-05-05 |
| CN112291944B (en) | 2022-02-18 |
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