CN112271243A - 一种提升led灯珠可靠性的点胶结构及工艺 - Google Patents
一种提升led灯珠可靠性的点胶结构及工艺 Download PDFInfo
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Abstract
本发明公开了一种提升LED灯珠可靠性的点胶结构及工艺,包括支架碗杯、芯片、键合金线、固晶胶、荧光胶和白胶,支架碗杯内底部通过固晶胶固定有芯片;芯片的负极通过另一侧的键合金线连接在支架负极一侧;芯片的正极通过一侧的键合金线连接在支架正极一侧形成串联电路;支架碗杯内不完全填满有荧光粉,荧光粉上方填充一层白胶。本发明操作方便,设计有效、制程简单;碗杯填设一定量荧光胶后,再填设一定量白胶,隔绝荧光胶中的Mn4+离子与空气中的水分发生水解反应,达到提升LED灯珠可靠性,延长LED器件寿命的效果。
Description
技术领域
本发明涉及的是LED封装技术领域,具体涉及一种提升LED灯珠可靠性的点胶结构及工艺。
背景技术
由于LED灯节能、环保、显色性好的优点,帮助LED灯迅速占领市场,发展迅猛。LED器件如今已被广泛应用于信号指示运用、显示运用、照明运用等领域。随着LED灯的迅猛发展,上游原物料厂商也在不断发展,推陈出新。其中,数种荧光粉由于其优越的发光性能受到广泛关注。特别的,就液晶显示背光源而言,其要求发光材料(蓝、绿、红)具有尽可能窄的发射带宽和合适的发射波长,从而获得高的色纯度及广的色域范围(>92%NTSC),而目前商用的氮化物红色荧光粉难以满足这一要求。近些年,Mn4+离子掺杂的氟化物荧光粉由于其能被蓝光有效激发、高发光效率以及~630nm的尖锐谱线发射(带宽 <7nm)等优势而受到广泛关注,在高显照明领域具有很好的应用前景。但是,该类材料的抗湿性能普遍较差,这主要是因为材料表面的 Mn4+离子易与空气中的水分发生水解反应,导致材料劣化,影响最终LED器件的寿命,这也成为阻碍其商业化应用的最大挑战。
综上所述,本发明设计了一种提升LED灯珠可靠性的点胶结构及工艺。
发明内容
针对现有技术上存在的不足,本发明目的是在于提供一种提升 LED灯珠可靠性的点胶结构及工艺,操作方便,设计有效、制程简单;碗杯填设一定量荧光胶后,再填设一定量白胶,隔绝荧光胶中的Mn4+ 离子与空气中的水分发生水解反应,达到提升LED灯珠可靠性,延长 LED器件寿命的效果。
为了实现上述目的,本发明是通过如下的技术方案来实现:一种提升LED灯珠可靠性的点胶结构,包括支架碗杯、芯片、键合金线、固晶胶、荧光胶和白胶,支架碗杯内底部通过固晶胶固定有芯片;芯片的负极通过另一侧的键合金线连接在支架负极一侧;芯片的正极通过一侧的键合金线连接在支架正极一侧形成串联电路;支架碗杯内不完全填满有荧光粉,荧光粉上方填充一层白胶。
作为优选,所述的支架碗杯内嵌设固定有白道,白道设置在支架正极与负极之间;芯片表面设有荧光胶,荧光胶通过芯片激发复合产生白光。
作为优选,所述的芯片可设置有多个。
一种提升LED灯珠可靠性的点胶结构及工艺,包括以下步骤:首先在支架碗杯底部通过固晶胶固定芯片,芯片正负极上分别焊接连接有键合金线,键合金线分别连接至支架碗杯的正负极区域,然后将荧光胶填充在支架碗杯中,不完全填满,经过高温烘烤,使荧光胶不完全固化,并呈半固体状态,再在荧光胶填上一层白胶,离心流平后经过高温烘烤,使得白胶固化,支架碗杯内嵌有白道,白道设置在支架碗杯的正负极之间,芯片表面设有荧光胶,荧光胶通过芯片激发复合产生白光;白胶覆盖在荧光胶上方,隔绝了荧光胶与外界接触的途径,防止荧光粉直接接触外界而潮解,从而使特殊材质的荧光粉的可靠性提升。
本发明针对氟化物荧光粉中Mn4+离子易与空气中的水分发生水解反应的特性,在荧光胶6填设在支架碗杯1的碗杯后,再填设一层白胶7,使荧光胶6无法与空气中的水分接触,荧光胶6填设完后必须进行高温烘烤使胶体固化,防止荧光胶6中的Mn4+离子进行分子运动进入到白胶7中。
本发明的有益效果:本发明能够隔绝荧光粉与外界接触,并提升特殊材质荧光粉的可靠性,增加LED灯珠可靠性,实用性更强,本发明具有结构简单,设置合理,制作成本低等优点。
附图说明
下面结合附图和具体实施方式来详细说明本发明;
图1为现有LED发光装置支架碗杯与芯片、固晶胶、键合金线、连接结构示意图;
图2为现有LED点胶工艺剖面结构示意图;
图3为本发明的剖面结构示意图;
图4为本发明的另一种立体结构图。
具体实施方式
为使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体实施方式,进一步阐述本发明。
参照图3-4,本具体实施方式采用以下技术方案:一种提升LED 灯珠可靠性的点胶结构,包括支架碗杯1、芯片2、键合金线3、固晶胶4、白道5、荧光胶6和白胶7,支架碗杯1内底部通过固晶胶4 固定有芯片2;芯片2的正极和负极上均焊接连接键合金线3的一端;键合金线3的另一端分别焊接固定在支架的正负极区域内;荧光胶6 填充在支架碗杯中,未完全填满,经过高温烘烤,使荧光胶6不完全固化,呈半固体状;荧光胶6上方填有白胶7,白胶7填设在支架碗杯1的碗杯内,荧光胶6上方,离心流平后经过高温烘烤,使白胶7 固化;所述的支架碗杯1内嵌设固定有白道5,白道5设置在支架1 正极与负极之间;芯片2表面设有荧光胶6,荧光胶6通过芯片2激发复合产生白光;白胶7覆盖在荧光胶6上方,隔绝了荧光胶6与外界接触的途径,防止荧光粉直接接触外界而潮解,从而使特殊材质的荧光粉的可靠性提升。
本具体实施方式的工作原理:将白胶7覆盖在荧光胶6上方,在荧光胶上呈现一层薄膜“保护膜”,从而隔绝荧光胶6中荧光粉与外界的接触,减少氟化物的潮解,使荧光粉的可靠性得到提升,继而进一步提升LED灯珠的可靠性。封装完成后,LED灯珠颜色一致性好,色温集中,与市场上LED灯光源通用性一致。
本具体实施方式在填充完荧光胶后再进行白胶填充,白胶覆盖住支架内部的荧光胶,隔绝荧光胶中的Mn4+离子与空气中的水分发生水解反应,具有操作简单,设置合理等优点。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (4)
1.一种提升LED灯珠可靠性的点胶结构,其特征在于,包括支架碗杯(1)、芯片(2)、键合金线(3)、固晶胶(4)、荧光胶(6)和白胶(7),支架碗杯(1)内底部通过固晶胶(4)固定有芯片(2);芯片(2)的负极通过另一侧的键合金线(3)连接在支架负极一侧;芯片(2)的正极通过一侧的键合金线(3)连接在支架正极一侧形成串联电路;支架碗杯(1)内不完全填满有荧光粉(6),荧光粉(6)上方填充一层白胶(7)。
2.根据权利要求1所述的一种提升LED灯珠可靠性的点胶结构,其特征在于,所述的支架碗杯(1)内嵌固定有白道(5),白道(5)设置在支架(1)正极与负极之间;芯片(2)表面设有荧光胶(6),荧光胶(6)通过芯片(2)激发复合产生白光。
3.根据权利要求1所述的一种提升LED灯珠可靠性的点胶结构,其特征在于,所述的芯片(2)可设置有多个。
4.一种提升LED灯珠可靠性的点胶工艺,其特征在于,包括以下步骤:首先在支架碗杯底部通过固晶胶固定芯片,芯片正负极上分别焊接连接有键合金线,键合金线分别连接至支架碗杯的正负极区域,然后将荧光胶填充在支架碗杯中,不完全填满,经过高温烘烤,使荧光胶不完全固化,并呈半固体状态,再在荧光胶填上一层白胶,离心流平后经过高温烘烤,使得白胶固化,支架碗杯内嵌有白道,白道设置在支架碗杯的正负极之间,芯片表面设有荧光胶,荧光胶通过芯片激发复合产生白光;白胶覆盖在荧光胶上方,隔绝了荧光胶与外界接触的途径,防止荧光粉直接接触外界而潮解,从而使特殊材质的荧光粉的可靠性提升。
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CN113964258A (zh) * | 2021-10-29 | 2022-01-21 | 广东晶科电子股份有限公司 | Led封装结构及其制作方法 |
CN115347103A (zh) * | 2022-09-19 | 2022-11-15 | 深圳市宇亮光电技术有限公司 | 无色漂灯珠及其制备方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN113964258A (zh) * | 2021-10-29 | 2022-01-21 | 广东晶科电子股份有限公司 | Led封装结构及其制作方法 |
CN113964258B (zh) * | 2021-10-29 | 2023-11-14 | 广东晶科电子股份有限公司 | Led封装结构及其制作方法 |
CN115347103A (zh) * | 2022-09-19 | 2022-11-15 | 深圳市宇亮光电技术有限公司 | 无色漂灯珠及其制备方法 |
CN115347103B (zh) * | 2022-09-19 | 2023-05-26 | 深圳市宇亮光电技术有限公司 | 无色漂灯珠及其制备方法 |
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