CN112259534A - Photoelectric coupler and forming method thereof - Google Patents
Photoelectric coupler and forming method thereof Download PDFInfo
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- CN112259534A CN112259534A CN202011513615.6A CN202011513615A CN112259534A CN 112259534 A CN112259534 A CN 112259534A CN 202011513615 A CN202011513615 A CN 202011513615A CN 112259534 A CN112259534 A CN 112259534A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
A photocoupler and method of forming the same, the method comprising: providing a base plate comprising an integrated frame and at least two initial extension ends, each initial extension end being connected to the frame, respectively; fixing a light emitting chip on a surface of a first initial extending end of the substrate, and fixing a light receiving chip on a surface of a second initial extending end of the substrate, wherein the first initial extending end and the second initial extending end extend towards each other; and bending the second initial extending end to obtain a second extending end, wherein the bending direction is vertical to the surface of the second initial extending end. The invention can reduce the purchasing and production cost and simplify the production process flow.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a photoelectric coupler and a forming method thereof.
Background
In the existing photoelectric coupler technology, the packaging structure usually sticks the light emitting chip and the light receiving chip on different frames, and then the 2 frames are aligned and overlapped with each other and spaced by a preset distance, so that the light receiving chip can receive the light of the light emitting chip and then convert the light into an electric signal.
However, the existing photoelectric coupler has high cost and complex process flow, and is difficult to meet the requirements.
Disclosure of Invention
The invention aims to provide a photoelectric coupler and a forming method thereof, which can reduce purchase and production cost and simplify production process flow.
In order to solve the above technical problem, an embodiment of the present invention provides a method for forming a photoelectric coupler, including: providing a base plate comprising an integrated frame and at least two initial extension ends, each initial extension end being connected to the frame, respectively; fixing a light emitting chip on a surface of a first initial extending end of the substrate, and fixing a light receiving chip on a surface of a second initial extending end of the substrate, wherein the first initial extending end and the second initial extending end extend towards each other; bending the first initial extending end to obtain a first extending end, wherein the bending direction is vertical to the surface of the first initial extending end, and bending the second initial extending end to obtain a second extending end, and the bending direction is vertical to the surface of the second initial extending end; at least a part of light emitted from the light emitting surface of the light emitting chip is directly transmitted to the light receiving surface of the light receiving chip.
Optionally, the method for forming the photoelectric coupler further includes: providing a first mold, and performing first sealing treatment on the substrate, the light-emitting chip and the light-receiving chip based on the first mold to obtain first plastic sealing glue wrapping the substrate, the light-emitting chip and the light-receiving chip; and providing a second mold, and performing second adhesive sealing treatment on the substrate, the light emitting chip and the light receiving chip after the first adhesive sealing treatment based on the second mold to obtain second adhesive sealing for wrapping the substrate, the light emitting chip, the light receiving chip and the first adhesive sealing.
Optionally, before the second sealing treatment, the method for forming the photoelectric coupler further includes: and coating a reflective material on all or part of the outer surface of the first molding compound, wherein the reflective surface faces the inside of the first molding compound.
Optionally, bending the first initial extending end, and bending the second initial extending end includes: determining the bending angle of the first initial extending end and the bending angle of the second initial extending end according to a preset current transmission ratio of a photoelectric coupler; bending the first initial extending end by adopting the bending angle of the first initial extending end, and bending the second initial extending end by adopting the bending angle of the second initial extending end; the larger the current transmission ratio of the photoelectric coupler is, the larger the angle sum of the bending angle of the first initial extending end and the bending angle of the second initial extending end is; the first initial angle of bending that extends the end does first initial extend the end the surface with the first contained angle that extends between the surface of end, the second initial angle of bending that extends the end is the second initial extend the end the surface with the second extends the contained angle between the surface of end.
Optionally, an included angle between the surface of the first extending end and the surface of the second extending end is θ, and θ is greater than 0 and less than 180 °.
Optionally, after the light emitting chip is fixed on the surface of the first initial extending end of the substrate, the method further includes: and forming silica gel, wherein the luminescent chip is wrapped by the silica gel.
To solve the above technical problem, an embodiment of the present invention provides a photoelectric coupler, including: a base plate including an integrated frame and at least two extension ends, each extension end being connected to the frame, respectively; the light-emitting chip is fixed on the surface of the first extending end of the substrate; the light receiving chip is fixed on the surface of the second extending end of the substrate; at least one part of light emitted from the light emitting surface of the light emitting chip is directly transmitted to the light receiving surface of the light receiving chip; the first extending end and the second extending end are obtained after being bent, the direction of the first extending end which is bent is perpendicular to the surface of the first extending end, the direction of the second extending end which is bent is perpendicular to the surface of the second extending end, and the extending direction of the first extending end before being bent and the extending direction of the second extending end before being bent extend towards each other.
Optionally, the first extending end and the second extending end are located on the same side of the substrate, an included angle between a surface of the first extending end and a surface of the second extending end is θ, and θ is greater than 0 and less than 180 °.
Optionally, the photocoupler further includes: the first plastic package glue wraps the substrate, the light emitting chip and the light receiving chip; and the second plastic package glue wraps the substrate, the light emitting chip, the light receiving chip and the first plastic package glue.
Optionally, the photocoupler further includes: and the light reflecting material is coated on all or part of the outer surface of the first plastic sealant, and the light reflecting surface faces to the inside of the first plastic sealant.
Optionally, the substrate is made of a metal material.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:
in the embodiment of the invention, the integrated frame is adopted, so that the purchasing number of the frames can be reduced, the purchasing cost is effectively reduced when purchasing is carried out by taking the frame as a unit, the stability and the reliability of the integrated frame are stronger, compared with the prior art that extra alignment operation needs to be carried out on two frames to realize the light transmission from the light emitting chip to the light receiving chip, the alignment step can be reduced by adopting the integrated frame, and the production cost is reduced. Further, the light receiving chip can receive at least a part of the directly transmitted light by bending the first initial extending end and the second initial extending end.
Furthermore, the whole or part of the outer surface of the first plastic sealing adhesive is coated with the reflective material, and the reflective surface faces the inside of the first plastic sealing adhesive, so that light emitted from the light emitting chip can be transmitted to the light receiving chip through reflection of the outer surface of the first plastic sealing adhesive.
Further, photoelectric coupler's current transmission ratio is bigger, the angle sum of the angle of the first initial end of extending and the angle of the second initial end of extending is bigger to can set up appropriate angle of bending according to concrete demand, control the shared proportion of the light of direct transmission in the transmission light, improve the flexibility.
Drawings
Fig. 1 is a schematic cross-sectional view of a photocoupler in the prior art;
FIG. 2 is a flow chart of a method of forming a photocoupler in an embodiment of the present invention;
FIG. 3 is a schematic diagram of a top view and a cross-sectional structure of a photocoupler in an unfolded state according to an embodiment of the present invention;
fig. 4 is a schematic top view and a schematic cross-sectional view of a photocoupler in a bent state according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of another photocoupler according to the embodiment of the present invention.
Detailed Description
As described above, in the conventional photocoupler technology, the light emitting chip and the light receiving chip are generally attached to different frames, and then the 2 frames are aligned and stacked with each other and spaced apart by a predetermined distance, so that the light receiving chip can receive the light from the light emitting chip and then convert the light into an electrical signal.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of a photoelectric coupler in the prior art. The photo coupler includes a light receiving chip 110, a light emitting chip 120, a first frame 101, and a second frame 102.
The light receiving chip 110 is attached to the first frame 101, the light emitting chip 120 is attached to the second frame 102, and the first frame 101 and the second frame 102 are aligned with each other and stacked together with a predetermined distance therebetween, so that the light receiving chip 110 can receive light emitted by the light emitting chip 120, convert the light into an electrical signal, and lead out through the first frame 101.
However, the existing photoelectric coupler has high cost and complex process flow, and is difficult to meet the requirements.
The inventor of the invention finds that in the prior art, two different frames need to be purchased, and the purchasing cost is increased when purchasing is carried out by taking a piece as a unit; in addition, in the production process, additional alignment operation needs to be performed on the two frames to realize light transmission from the light emitting chip to the light receiving chip, so that the production steps are complex, and the production cost is high.
In the embodiment of the invention, the integrated frame is adopted, so that the purchasing number of the frames can be reduced, the purchasing cost is effectively reduced when purchasing is carried out by taking the frame as a unit, the stability and the reliability of the integrated frame are stronger, compared with the prior art that extra alignment operation needs to be carried out on two frames to realize the light transmission from the light emitting chip to the light receiving chip, the alignment step can be reduced by adopting the integrated frame, and the production cost is reduced. Further, the light receiving chip can receive at least a part of the directly transmitted light by bending the first initial extending end and the second initial extending end.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Referring to fig. 2, fig. 2 is a flow chart of a method for forming a photocoupler in an embodiment of the present invention. The method of forming the photo-coupler may include steps S21 to S23:
step S21: providing a base plate comprising an integrated frame and at least two initial extension ends, each initial extension end being connected to the frame, respectively;
step S22: fixing a light emitting chip on a surface of a first initial extending end of the substrate, and fixing a light receiving chip on a surface of a second initial extending end of the substrate, wherein the first initial extending end and the second initial extending end extend towards each other;
step S23: and bending the first initial extending end to obtain a first extending end, wherein the bending direction is vertical to the surface of the first initial extending end, and bending the second initial extending end to obtain a second extending end, wherein the bending direction is vertical to the surface of the second initial extending end, and at least a part of light emitted from the light emitting surface of the light emitting chip is directly transmitted to the light receiving surface of the light receiving chip.
The above steps will be described with reference to fig. 3 to 5.
Fig. 3 is a schematic top view and a schematic cross-sectional structure of a photocoupler in an unfolded state according to an embodiment of the present invention.
The photo coupler may include a substrate 201, a light receiving chip 210, and a light emitting chip 220.
Further, the base plate 201 may include an integrated frame and at least two initial extension ends, each of which is connected to the frame, respectively.
The light emitting chip 220 is fixed on a surface of a first initial extending end of the substrate 201, and the light receiving chip 210 is fixed on a surface of a second initial extending end of the substrate 201, wherein the first initial extending end and the second initial extending end extend towards each other.
It should be noted that, the first initial extending end and the second initial extending end extend towards each other, which means that the first initial extending end and the end of the second initial extending end are opposite to each other and extend towards each other. In a specific implementation manner of the embodiment of the present invention, the ends of the first initial extending end and the second initial extending end may not be aligned, for example, there may be a certain alignment deviation within an error range.
It should be noted that, in the stage of fixing the light receiving chip 210 and the light emitting chip 220, the substrate 201 may be kept in a flat state to improve the operability of chip fixing.
The light receiving chip 210 and the light emitting chip 220 may be chips on which light receiving device fabrication or light emitting device fabrication is completed on the basis of a semiconductor substrate, for example, chips on which processes such as thin film formation, electronic circuit patterning, doping, metal interconnection, passivation, and the like have been completed.
The light receiving chip 210 may be fixed to a surface of the first initial extending end of the substrate 201 by soldering or gluing, and the light emitting chip 220 may be fixed to a surface of the second initial extending end of the substrate 201 by soldering or gluing.
Further, the material of the substrate 201 may be a metal material with good bending property and firmness, and the metal material may be, for example, copper, a copper alloy, iron or an iron alloy.
Referring to fig. 4, fig. 4 is a schematic diagram of a top view and a cross-sectional structure of a photocoupler in a bent state according to an embodiment of the present invention.
Specifically, the first initial extending end is bent to obtain a first extending end, and the bending direction is perpendicular to the surface of the first initial extending end, and the second initial extending end is bent to obtain a second extending end, and the bending direction is perpendicular to the surface of the second initial extending end.
At least a portion of light emitted from the light emitting surface of the light emitting chip 220 is directly transmitted to the light receiving surface of the light receiving chip 210.
Further, the step of bending the first initial extension end and the step of bending the second initial extension end may include: determining the bending angle of the first initial extending end and the bending angle of the second initial extending end according to a preset current transmission ratio of a photoelectric coupler; bending the first initial extending end by adopting the bending angle of the first initial extending end, and bending the second initial extending end by adopting the bending angle of the second initial extending end; the larger the current transmission ratio of the photoelectric coupler is, the larger the angle sum of the bending angle of the first initial extending end and the bending angle of the second initial extending end is; the first initial angle of bending that extends the end does first initial extend the end the surface with the first contained angle that extends between the surface of end, the second initial angle of bending that extends the end is the second initial extend the end the surface with the second extends the contained angle between the surface of end.
The Current Transfer Ratio (CTR) of the photoelectric coupler is a parameter describing the control characteristic of the optical coupler, and can be understood as the percentage of the output Current of the secondary side to the input Current of the primary side. It is understood that, for the light emitting chip and the light receiving chip of the same parameters, the higher the efficiency of transmitting the light emitted from the light emitting chip to the light receiving chip is, the larger the amount of absorbed light is, the larger the current transmission ratio of the photocoupler is. Therefore, according to the preset requirement, the current transmission ratio of the photoelectric coupler required to be met can be determined, and then the angle sum of the bending angle of the first initial extending end and the bending angle of the second initial extending end can be determined.
In a specific application of the embodiment of the present invention, the bending angle of the first initial extending end and the bending angle of the second initial extending end may be equal to each other or a preset ratio may be set, so that each bending angle may be determined according to the angle sum.
In the embodiment of the invention, the larger the current transmission ratio of the photoelectric coupler is, the larger the angle sum of the bending angle of the first initial extending end and the bending angle of the second initial extending end is, so that a proper bending angle can be set according to specific requirements, the proportion of light directly transmitted to the light receiving chip in total emitted light is controlled, and the current transmission ratio is adjusted.
The folding angle of the first initial extending end is a1, the folding angle of the second initial extending end is a2, and the sum of the folding angles of the first initial extending end and the second initial extending end (a 1+ a 2) =180 ° - θ as shown in fig. 4.
In a specific implementation, the included angle between the surface of the first extending end and the surface of the second extending end is theta, and 0 & lt theta & lt 180 degrees.
Note that the surface of the first extension end is a surface to which the light emitting chip is fixed, and the surface of the second extension end is a surface to which the light receiving chip is fixed.
Specifically, an included angle may be formed between the first extending end and the second extending end, and the included angle is not 0 or 180 °, so that at least a part of light emitted from the light emitting surface of the light emitting chip can be directly transmitted to the light receiving surface of the light receiving chip, which is beneficial to adjusting the efficiency of light transmission, and further adjusting the current transmission ratio.
In the embodiment of the present invention, by using the integrated frame, the number of frames to be purchased can be reduced, the purchasing cost can be effectively reduced when purchasing is performed on a piece basis, and the stability and reliability of the integrated frame are stronger. Further, by bending the first initial extending end and the second initial extending end, the light receiving chip 210 can receive at least a part of the directly transmitted light.
Referring to fig. 5, fig. 5 is a schematic cross-sectional structure diagram of another photocoupler according to the embodiment of the present invention.
After the light emitting chip 220 is fixed on the surface of the first initial extending end of the substrate 201, a silicone gel 221 may be further formed, and the silicone gel 221 wraps the light emitting chip 220.
In the embodiment of the invention, the light-emitting chip 220 can be effectively protected by arranging the silica gel 221, so that the photoelectric conversion effect is improved.
Further, a first mold (not shown) may be provided, and a first molding process may be performed on the substrate 201, the light emitting chip 220, and the light receiving chip 210 based on the first mold; providing a second mold (not shown), and performing a second molding process on the substrate 201, the light emitting chip 220, and the light receiving chip 210 after the first molding process based on the second mold.
Furthermore, during the sealing process, the second mold is overlapped with the first mold in the placement center position.
Further, a first molding compound 231 may be used to perform a first molding compound treatment on the substrate 201, the light emitting chip 220, and the light receiving chip 210; and/or performing second glue sealing treatment on the substrate 201, the light emitting chip 220 and the light receiving chip 210 after the first glue sealing treatment by using second glue sealing 232.
Further, before the second molding compound treatment, all or a portion of the outer surface of the first molding compound 231 may be coated with a reflective material, and the reflective surface faces the inside of the first molding compound 231.
The dotted line shown in fig. 5 is a light path, and may include light directly transmitted and may also include light transmitted by reflection of the light reflecting material.
In the embodiment of the present invention, the whole or part of the outer surface of the first molding compound 231 is coated with the reflective material, and the reflective surface faces the inside of the first molding compound 231, so that part of light emitted from the light emitting chip 220 is reflected and transmitted to the light receiving chip 210 through the outer surface of the first molding compound 231.
Note that a decoupling isolation film with a low dielectric constant may be introduced between the light emitting chip 220 and the light receiving chip 210 to reduce the coupling capacitance.
Furthermore, the light transmittance of the first molding compound 231 may be greater than or equal to a first preset light transmittance threshold; and/or the light transmittance of the second molding compound 232 is less than or equal to a second preset light transmittance threshold; wherein the first preset light transmittance threshold is greater than the second preset light transmittance threshold.
Specifically, by setting the light transmittance of the first molding compound 231 to be greater than or equal to the first preset light transmittance threshold, the first molding compound 231 can be set to be closer to a transparent molding compound, such as a white first molding compound; by setting the light transmittance of the second molding compound 232 to be less than or equal to the second predetermined light transmittance threshold, the second molding compound 232 can be set to be closer to a non-transparent molding compound, such as a black second molding compound.
Further, the color brightness value of the second molding compound 232 may be smaller than a predetermined brightness threshold, or the gray-level value of the second molding compound 232 is smaller than a predetermined gray-level threshold.
Specifically, by setting the color brightness value of the second molding compound 232 to be smaller than the preset brightness threshold, the second molding compound 232 may be set to be a color molding compound with a darker color, such as a dark blue, a dark red, a dark purple molding compound, and the like close to black; by setting the gray value of the second molding compound 232 to be smaller than the preset gray threshold, the second molding compound 232 can be set to be a darker black and white molding compound, such as black and dark gray molding compound.
In the embodiment of the invention, the substrate 201, the light emitting chip 220 and the light receiving chip 210 are wrapped by the plastic package adhesive with the light transmittance being greater than or equal to the first preset light transmittance threshold, so that compared with other plastic package adhesives, the light transmittance can be improved, and the light receiving can be better realized; through adopting the plastic packaging glue parcel that luminousness is less than or equal to the second preset luminousness threshold base plate 201, luminous chip 220, photic chip 210 and first plastic packaging glue 231, can completely cut off the influence each other between external and the opto-coupler device inside better.
In an embodiment of the present invention, a photocoupler is further disclosed, and referring to fig. 5, the photocoupler may include: a base plate 201, the base plate 201 comprising an integrated frame and at least two extension ends, each extension end being connected to the frame, respectively; a light emitting chip 220 fixed on a surface of the first extending end of the substrate 201; a light receiving chip 210 fixed to a surface of the second extending end of the substrate 201; at least a part of light emitted from the light emitting surface of the light emitting chip 220 is directly transmitted to the light receiving surface of the light receiving chip 210, and the light is directly transmitted, that is, the whole transmission path of the light is a straight line; the first extending end and the second extending end are obtained after being bent, the direction of the first extending end which is bent is perpendicular to the surface of the first extending end, the direction of the second extending end which is bent is perpendicular to the surface of the second extending end, and the extending direction of the first extending end before being bent and the extending direction of the second extending end before being bent extend towards each other.
Further, the photocoupler can also include: the first molding compound 231, wherein the substrate 201, the light emitting chip 220 and the light receiving chip 210 are wrapped by the first molding compound 231; and the second molding compound 232 wraps the substrate 201, the light emitting chip 220, the light receiving chip 210 and the first molding compound 231.
Further, the photocoupler can also include: and a reflective material coated on all or a portion of the outer surface of the first molding compound 231, wherein the reflective surface faces the inside of the first molding compound 231.
Further, the photocoupler may further include a silicone rubber 221, and the silicone rubber 221 may wrap the light emitting chip 220.
Further, the material of the substrate 201 may be a metal material, and for example, may be copper, a copper alloy, iron, or an iron alloy.
Further, the included angle between the surface of the first extending end and the surface of the second extending end is theta, and 0 & lttheta & lt 180 degrees.
In the embodiment of the present invention, by using the integrated frame, the number of frames to be purchased can be reduced, the purchasing cost can be effectively reduced when purchasing is performed on a piece basis, and the stability and reliability of the integrated frame are stronger. Further, by bending the first initial extending end and the second initial extending end, the light receiving chip 210 can receive at least a part of the directly transmitted light.
For the principle, specific implementation and beneficial effects of the optoelectronic coupler, reference is made to the above description related to the method for forming the optoelectronic coupler, for example, the conventional wire bonding process for manufacturing the optoelectronic coupler can be used for the wire bonding process of gold wire and copper wire, and the details are not repeated herein.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A method of forming a photocoupler, comprising:
providing a base plate comprising an integrated frame and at least two initial extension ends, each initial extension end being connected to the frame, respectively;
fixing a light emitting chip on a surface of a first initial extending end of the substrate, and fixing a light receiving chip on a surface of a second initial extending end of the substrate, wherein the first initial extending end and the second initial extending end extend towards each other;
bending the first initial extending end to obtain a first extending end, wherein the bending direction is vertical to the surface of the first initial extending end, and bending the second initial extending end to obtain a second extending end, and the bending direction is vertical to the surface of the second initial extending end;
at least a part of light emitted from the light emitting surface of the light emitting chip is directly transmitted to the light receiving surface of the light receiving chip.
2. The method of forming a photocoupler according to claim 1, further comprising:
providing a first mold, and performing first sealing treatment on the substrate, the light-emitting chip and the light-receiving chip based on the first mold to obtain first plastic sealing glue wrapping the substrate, the light-emitting chip and the light-receiving chip;
and providing a second mold, and performing second adhesive sealing treatment on the substrate, the light emitting chip and the light receiving chip after the first adhesive sealing treatment based on the second mold to obtain second adhesive sealing for wrapping the substrate, the light emitting chip, the light receiving chip and the first adhesive sealing.
3. The method of forming a photocoupler according to claim 2, wherein before the second potting process, the method further comprises:
and coating a reflective material on all or part of the outer surface of the first molding compound, wherein the reflective surface faces the inside of the first molding compound.
4. The method of forming a photocoupler of claim 1, wherein bending the first initial extension end and bending the second initial extension end include:
determining the bending angle of the first initial extending end and the bending angle of the second initial extending end according to a preset current transmission ratio of a photoelectric coupler;
bending the first initial extending end by adopting the bending angle of the first initial extending end, and bending the second initial extending end by adopting the bending angle of the second initial extending end;
the larger the current transmission ratio of the photoelectric coupler is, the larger the angle sum of the bending angle of the first initial extending end and the bending angle of the second initial extending end is;
the first initial angle of bending that extends the end does first initial extend the end the surface with the first contained angle that extends between the surface of end, the second initial angle of bending that extends the end is the second initial extend the end the surface with the second extends the contained angle between the surface of end.
5. The method of claim 1, wherein the angle between the surface of the first extension end and the surface of the second extension end is θ, and 0 < θ < 180 °.
6. A photoelectric coupler, comprising:
a base plate including an integrated frame and at least two extension ends, each extension end being connected to the frame, respectively;
the light-emitting chip is fixed on the surface of the first extending end of the substrate;
the light receiving chip is fixed on the surface of the second extending end of the substrate;
at least one part of light emitted from the light emitting surface of the light emitting chip is directly transmitted to the light receiving surface of the light receiving chip;
the first extending end and the second extending end are obtained after being bent, the direction of the first extending end which is bent is perpendicular to the surface of the first extending end, the direction of the second extending end which is bent is perpendicular to the surface of the second extending end, and the extending direction of the first extending end before being bent and the extending direction of the second extending end before being bent extend towards each other.
7. The photocoupler of claim 6, wherein the surface of the first extension end and the surface of the second extension end form an angle θ, and 0 < θ < 180 °.
8. The photocoupler of claim 6, further comprising:
the first plastic package glue wraps the substrate, the light emitting chip and the light receiving chip;
and the second plastic package glue wraps the substrate, the light emitting chip, the light receiving chip and the first plastic package glue.
9. The photocoupler of claim 8, further comprising:
and the light reflecting material is coated on all or part of the outer surface of the first plastic sealant, and the light reflecting surface faces to the inside of the first plastic sealant.
10. The photocoupler of claim 6, wherein the substrate is made of a metallic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011513615.6A CN112259534A (en) | 2020-12-21 | 2020-12-21 | Photoelectric coupler and forming method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012084749A (en) * | 2010-10-13 | 2012-04-26 | Sharp Corp | Optical coupling semiconductor device and electric appliance |
| CN102723321A (en) * | 2012-07-03 | 2012-10-10 | 黄伟鹏 | Photoelectric coupler lead frame and photoelectric coupler |
| CN108091613A (en) * | 2017-12-25 | 2018-05-29 | 无锡少小科技有限公司 | The method for adjusting photoelectrical coupler amplifying power |
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2020
- 2020-12-21 CN CN202011513615.6A patent/CN112259534A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012084749A (en) * | 2010-10-13 | 2012-04-26 | Sharp Corp | Optical coupling semiconductor device and electric appliance |
| CN102723321A (en) * | 2012-07-03 | 2012-10-10 | 黄伟鹏 | Photoelectric coupler lead frame and photoelectric coupler |
| CN108091613A (en) * | 2017-12-25 | 2018-05-29 | 无锡少小科技有限公司 | The method for adjusting photoelectrical coupler amplifying power |
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Application publication date: 20210122 |