CN112248579A - 一种耐腐蚀的覆铜板 - Google Patents
一种耐腐蚀的覆铜板 Download PDFInfo
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Abstract
本发明公开了一种耐腐蚀的覆铜板;包括基体,还包括散热层设置于基体上下表面,可以对覆铜板的局部加强散热;还包括绝缘层,覆于散热层远基体表面,还包括粘接层,覆于绝缘层远散热层表面,还包括铜箔层,设置于粘接层外表面;还包括耐磨层,覆于铜箔层远粘接层表面,可减缓覆铜板的磨损程度;还包括耐腐蚀层,覆于耐腐蚀层外表面,可避免覆铜板被腐蚀。本发明设计合理,散热层的设计使得覆铜板可以对覆铜板的局部加强散热,即为发热电子元件底部提供散热,从而增加发热电子元件的散热效率,进而增加电子元件的使用寿命,表面覆有的耐腐蚀层,可避免覆铜板被腐蚀,耐腐蚀层下方的耐磨层设计,可减缓覆铜板的磨损程度。
Description
技术领域
本发明涉及覆铜板制造领域,具体来讲涉及的是一种耐腐蚀的覆铜板。
背景技术
近年来,表面工程技术迅猛发展,各种功能涂层在生产中应用日益广泛,其应用领域涉及汽车、火车、家电、能源、交通工程、机械制造、计算机、土建工程、水利工程、石油化工、航空航天等许多领域。为使金属构件防腐,在金属机械设备表面涂装一层耐磨涂层,是提高其使用寿命的有效途径之一,也是一种十分普遍的方法。其防腐作用来自两方面,一是涂料的不渗透性即密着性,隔绝了金属与外界的接触;二是颜料、填料的缓蚀作用。高分子材料凭借独特的分子结构特征,在耐腐蚀性能方面具有一定的优势。但高分子复合材料耐磨性差以及易氧化,在应用方面受到了限制。
经过检索发现,申请号CN201410723337.5的发明公开了一种高剥离强度挠性覆铜板及其制作方法,所述覆铜板包括以下层结构:有机聚合物膜层、调节层、过渡层、铜层;其制备方法为:1)在有机聚合物膜层至少一面形成调节层;2)形成过渡层;3)形成铜层;或者为:1)对有机聚合物膜层的表面改性,再于膜层至少一面形成调节层;2)形成过渡层;3)形成铜层;或者为:1)在有机聚合物膜层至少一面形成调节层;2)表面改性;3)形成过渡层;4)形成金属铜层。或者为:1)将有机聚合物膜层的至少一面进行表面改性;2)形成调节层;3)表面改性;4)形成过渡层;5)形成铜层。
申请号CN201710317008.4的发明公开了一种氮化铝陶瓷覆铜板,该覆铜板依次由氮化铝陶瓷基底、NiCr结合过渡层、脉冲磁控溅射Cu层结构组成,本发明还公开了该种氮化铝陶瓷覆铜板的制备方法,步骤如下:A、对氮化铝陶瓷基底进行清洗;B、使用磁控溅射沉积NiCr结合过渡层;C、NiCr结合过渡层上利用脉冲磁控溅射铜层;得到氮化铝陶瓷覆铜板。
申请号CN201611236876.1的发明涉及一种耐热性酚醛纸紫外光屏蔽覆铜板,是由铜箔和补强层上下压制而成,作为补强层的半固化胶纸的浸渍胶液包括酚醛混合树脂、紫外光屏蔽料和作为耐热材料的硅微粉;所述酚醛混合树脂为桐油改性酚醛树脂和腰果酚改性酚醛树脂按质量比为3∶6-8的混合树脂;所述紫外光屏蔽料包括醇溶苯胺黑和氧化镁,酚醛混合树脂、醇溶苯胺黑和氧化镁的质量比为100∶1-2∶5-6;酚醛混合树脂和硅微粉的质量比为100∶6-7。
然而,对于覆铜板来讲,一般的耐腐蚀涂料如过氯乙烯树脂防腐涂料、氯醚树脂涂料等由于所形成的涂层没有足够的机械强度与耐磨性,在受到长时间冲击与机械作用后,会很快磨损脱离,乃至剥落而失去对覆铜板的保护作用。
发明内容
因此,为了解决上述不足,本发明在此提供一种耐磨,抗腐蚀,能对散热元件进行散热的耐腐蚀的覆铜板;本发明设计合理,散热层的设计使得覆铜板可以对覆铜板的局部加强散热,即为发热电子元件底部提供散热,从而增加发热电子元件的散热效率,进而增加电子元件的使用寿命,表面覆有的耐腐蚀层,可避免覆铜板被腐蚀,耐腐蚀层下方的耐磨层设计,可减缓覆铜板的磨损程度。
本发明是这样实现的,构造一种耐腐蚀的覆铜板,包括基体,
还包括散热层设置于基体上下表面,可以对覆铜板的局部加强散热,即为发热电子元件底部提供散热,从而增加发热电子元件的散热效率,进而增加电子元件的使用寿命;
还包括绝缘层,覆于散热层远基体表面,
还包括粘接层,覆于绝缘层远散热层表面,
还包括铜箔层,设置于粘接层外表面;
还包括耐磨层,覆于铜箔层远粘接层表面,可减缓覆铜板的磨损程度;
还包括耐腐蚀层,覆于耐腐蚀层外表面,可避免覆铜板被腐蚀。
作为上述技术方案的改进,所述散热层材料为石墨烯,可有效降低发热源的热密度,达到大面积快速传热、大面积散热、并消除单点高温。
作为上述技术方案的改进,所述绝缘层材料为环氧树脂,环氧树脂耐化学品性优良,尤其是耐碱性,漆膜附着力强,特别是对金属,具有较好的耐热性和电绝缘性,漆膜保色性较好。
作为上述技术方案的改进,所述耐腐蚀层材料为二氧化硅,二氧化硅在机械性能方面具有高附着力和高硬度,在化学性能方面要求耐腐蚀和低吸水性,在热性能方面有高稳定性和低收缩性,因而具有较强的耐磨耐腐蚀性能。
作为上述技术方案的改进,所述耐磨层材料为超高分子量聚乙烯,超高分子量聚乙烯耐磨性极高,且抗冲击能力强,能对覆铜板进行有效的保护。
作为上述技术方案的改进,所述的一种耐腐蚀的覆铜板制备过程如下:(1)粘接层制备:将重量份数环氧树脂50-80份,增韧剂10-20份,阻燃剂10-20份,稀释剂5-8份混合,然后用有机溶剂溶解,然后加入固化剂10-15份,吸水剂3-5份,然后搅拌30min至体系完全均匀,即制得液晶环氧树脂胶粘剂;
(2)铜基复合基板(1)的制备:先按重量比1000∶2-5称取铜粉和石墨粉,然后将称取好的铜粉和石墨粉混合粉末置于密封基板模具中,然后在压力为50MPa,温度为800℃的环境下烧结,烧结时间为10min,烧结后得到铜基复合基板;
(3)将获得的铜基复合基板和铜箔按规格进行裁剪,然后将铜基复合基板和铜箔排好,然后在铜基复合基板的两侧布置石墨烯和环氧树脂,并在铜箔的内、外侧面涂布粘接剂,然后在铜箔层的外侧涂抹超高分子量聚乙烯和二氧化硅,然后将所形成的整体在150℃连续压合,最后置于150-180℃的烘箱中固化1-3h,即可得到高介电性能挠性覆铜板。
作为上述技术方案的改进,步骤2所使用的基板模具内侧面具有波纹,使得烧结后得到铜基复合基板表面具有深度0.5-1mm的波纹,便于与石墨烯结合。
本发明具有如下优点:本发明在此提供一种耐磨、抗腐蚀、能对散热元件进行散热的耐腐蚀的覆铜板;具有如下改进及优点;
其1,本发明通过改进在此提供一种耐腐蚀的覆铜板,包括基体,散热层设置于基体上下表面,绝缘层覆于散热层远基体表面,粘接层覆于绝缘层远散热层表面,铜箔层设置于粘接层外表面,耐磨层覆于铜箔层远粘接层表面,耐腐蚀层覆于耐腐蚀层外表面。本发明实施时,将电子元件安装在覆铜板的安装孔内,元件尾部的输入输出触角与设置于安装孔内的安装环接触,覆铜板基体表面的散热层与安装环接触,对覆铜板的局部加强散热,即为发热电子元件底部提供散热,二氧化硅材料制成的耐腐蚀层可以避免外界空气对覆铜板的侵蚀,同时减少因为摩擦带来的损伤,超高分子量聚乙烯制成的耐磨层抗冲击能力强,可有效对覆铜板进行保护。
其2,本发明设计合理,散热层的设计使得覆铜板可以对覆铜板的局部加强散热,即为发热电子元件底部提供散热,从而增加发热电子元件的散热效率,进而增加电子元件的使用寿命,表面覆有的耐腐蚀层,可避免覆铜板被腐蚀,耐腐蚀层下方的耐磨层设计,可减缓覆铜板的磨损程度。
其3,合理的设计耐腐蚀层,耐腐蚀层采用二氧化硅材料,耐腐蚀的同时耐磨,降低覆铜板与其他物件产生摩擦时造成的损伤,提高覆铜板使用寿命。
其4,改变了覆铜板的成型方式,采用新的胶粘剂,并整体压合成型,避免耐腐蚀层和耐磨层的脱离;而且采用了新制备的铜基复合基板,增强了基板的性能。
附图说明
图1是本发明覆铜板的实施结构示意图。
图中:1、基体;2、散热层;3、绝缘层;4、粘接层;5、铜箔层;6、耐磨层;7、耐腐蚀层。
具体实施方式
下面将结合附图1对本发明进行详细说明,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明实施例;本发明通过改进在此提供一种耐腐蚀的覆铜板,包括基体1,散热层2设置于基体1上下表面,绝缘层3覆于散热层2远基体1表面,粘接层4覆于绝缘层3远散热层2表面,铜箔层5设置于粘接层4外表面,耐磨层6覆于铜箔层5远粘接层4表面,耐腐蚀层7覆于耐腐蚀层6外表面。
在本发明实施例中,所述散热层2材料为石墨烯。
在本发明实施例中,所述绝缘层3材料为聚丁二烯树脂。
在本发明实施例中,所述耐腐蚀层7材料为二氧化硅。
在本发明实施例中,所述耐磨层6材料为超高分子量聚乙烯。
本发明所述的一种耐腐蚀的覆铜板,制备过程如下:
(1)粘接层制备:将重量份数环氧树脂50-80份,增韧剂10-20份,阻燃剂10-20份,稀释剂5-8份混合,然后用有机溶剂溶解,然后加入固化剂10-15份,吸水剂3-5份,然后搅拌30min至体系完全均匀,即制得液晶环氧树脂胶粘剂;
(2)铜基复合基板的制备:先按重量比1000∶2-5称取铜粉和石墨粉,然后将称取好的铜粉和石墨粉混合粉末置于密封基板模具中,然后在压力为50MPa,温度为800℃的环境下烧结,烧结时间为10min,烧结后得到铜基复合基板;
(3)将获得的铜基复合基板和铜箔按规格进行裁剪,然后将铜基复合基板和铜箔排好,然后在铜基复合基板的两侧布置石墨烯和环氧树脂,并在铜箔的内、外侧面涂布粘接剂,然后在铜箔层的外侧涂抹超高分子量聚乙烯和二氧化硅,然后将所形成的整体在150℃连续压合,最后置于150-180℃的烘箱中固化1-3h,即可得到高介电性能挠性覆铜板。
本发明实施时,步骤2所使用的基板模具内侧面具有波纹,使得烧结后得到铜基复合基板表面具有深度0.5-1mm的波纹,便于与石墨烯结合。
本发明具有如下改进及优点;
其1,本发明通过改进在此提供一种耐腐蚀的覆铜板,包括基体1,散热层2设置于基体1上下表面,绝缘层3覆于散热层2远基体1表面,粘接层4覆于绝缘层3远散热层2表面,铜箔层5设置于粘接层4外表面,耐磨层6覆于铜箔层5远粘接层4表面,耐腐蚀层7覆于耐腐蚀层6外表面。本发明实施时,将电子元件安装在覆铜板的安装孔内,元件尾部的输入输出触角与设置于安装孔内的安装环接触,覆铜板基体1表面的散热层2与安装环接触,对覆铜板的局部加强散热,即为发热电子元件底部提供散热,二氧化硅材料制成的耐腐蚀层7可以避免外界空气对覆铜板的侵蚀,同时减少因为摩擦带来的损伤,超高分子量聚乙烯制成的耐磨层6抗冲击能力强,可有效对覆铜板进行保护。
其2,本发明设计合理,散热层的设计使得覆铜板可以对覆铜板的局部加强散热,即为发热电子元件底部提供散热,从而增加发热电子元件的散热效率,进而增加电子元件的使用寿命,表面覆有的耐腐蚀层,可避免覆铜板被腐蚀,耐腐蚀层下方的耐磨层设计,可减缓覆铜板的磨损程度。
其3,合理的设计耐腐蚀层,耐腐蚀层采用二氧化硅材料,耐腐蚀的同时耐磨,降低覆铜板与其他物件产生摩擦时造成的损伤,提高覆铜板使用寿命。
其4,改变了覆铜板的成型方式,采用新的胶粘剂,避免耐腐蚀层和耐磨层的脱离;而且采用了新制备的铜基复合基板,增强了基板的性能。
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。
Claims (7)
1.一种耐腐蚀的覆铜板,包括基体(1);其特征在于:
还包括散热层(2),设置于基体(1)上下表面;
还包括绝缘层(3),覆于散热层(2)远基体(1)表面;
还包括粘接层(4),覆于绝缘层(3)远散热层(2)表面;
还包括铜箔层(5),设置于粘接层(4)外表面;
还包括耐磨层(6),覆于铜箔层(5)远粘接层(4)表面;
还包括耐腐蚀层(7),覆于耐腐蚀层(6)外表面。
2.根据权利要求1所述的一种耐腐蚀的覆铜板,其特征在于:所述散热层(2)为石墨烯材料。
3.根据权利要求1所述的一种耐腐蚀的覆铜板,其特征在于:所述绝缘层(3)为环氧树脂材料。
4.根据权利要求1所述的一种耐腐蚀的覆铜板,其特征在于:所述耐腐蚀层(7)材料为二氧化硅。
5.根据权利要求1所述的一种耐腐蚀的覆铜板,其特征在于:所述耐磨层(6)材料为超高分子量聚乙烯。
6.根据权利要求1所述的一种耐腐蚀的覆铜板,其特征在于:制备过程如下:(1)粘接层制备:将重量份数环氧树脂50-80份,增韧剂10-20份,阻燃剂10-20份,稀释剂5-8份混合,然后用有机溶剂溶解,然后加入固化剂10-15份,吸水剂3-5份,然后搅拌30min至体系完全均匀,即制得液晶环氧树脂胶粘剂;
(2)铜基复合基板(1)的制备:先按重量比1000∶2-5称取铜粉和石墨粉,然后将称取好的铜粉和石墨粉混合粉末置于密封基板模具中,然后在压力为50MPa,温度为800℃的环境下烧结,烧结时间为10min,烧结后得到铜基复合基板;
(3)将获得的铜基复合基板和铜箔按规格进行裁剪,然后将铜基复合基板和铜箔排好,然后在铜基复合基板的两侧布置石墨烯和环氧树脂,并在铜箔的内、外侧面涂布粘接剂,然后在铜箔层的外侧涂抹超高分子量聚乙烯和二氧化硅,然后将所形成的整体在150℃连续压合,最后置于150-180℃的烘箱中固化1-3h,即可得到高介电性能挠性覆铜板。
7.根据权利要求6所述的一种耐腐蚀的覆铜板,其特征在于:步骤2所使用的基板模具内侧面具有波纹,使得烧结后得到铜基复合基板表面具有深度0.5-1mm的波纹,便于与石墨烯结合。
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