CN112246690A - Classification device for integrated circuit packaged chips - Google Patents
Classification device for integrated circuit packaged chips Download PDFInfo
- Publication number
- CN112246690A CN112246690A CN202010909928.7A CN202010909928A CN112246690A CN 112246690 A CN112246690 A CN 112246690A CN 202010909928 A CN202010909928 A CN 202010909928A CN 112246690 A CN112246690 A CN 112246690A
- Authority
- CN
- China
- Prior art keywords
- chip
- wax
- chips
- conveyor belt
- conveyer belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a classification device of integrated circuit packaging chips, which comprises a collection port and is characterized in that: the chip detection device is characterized in that a performance detection device is installed at the tail end of the collection port, a detection conveyor belt is installed inside the performance detection device, an elastic electromagnet is installed on the surface of the detection conveyor belt, a performance detection computer is electrically connected to one side of the elastic electromagnet, a leakage recovery pipe is installed on one side of the detection conveyor belt, a pneumatic emission valve is installed at the front end of the leakage recovery pipe, a recovery hose is connected to the other side of the pneumatic emission valve, the other side of the recovery hose is connected with the collection port, the collection conveyor belt is sequentially installed above the classification conveyor belt, the elastic electromagnet is installed on the surface of the collection conveyor belt, a pin induction group is installed on one side of the collection conveyor belt, and a classification storage box is arranged below the collection conveyor belt.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging chip sorting devices, in particular to an integrated circuit packaging chip sorting device.
Background
The integrated circuit packaging is advanced along with the development of the integrated circuit, and along with the continuous development of various industries such as aerospace, aviation, machinery, light industry, chemical industry and the like, the whole machine is changed towards multifunction and miniaturization, thus, the integrated circuits are required to have higher and higher integration and more complex functions, and accordingly, the integrated circuits are required to have higher and higher packaging density and more lead wires, the volume is smaller and lighter, the updating is faster and faster, the rationality and scientificity of the packaging structure directly influence the quality of the integrated circuit, therefore, for the manufacturers and users of integrated circuits, besides mastering the performance parameters and identifying the lead arrangement of various integrated circuits, the knowledge of the overall dimension, tolerance fit, structural characteristics, packaging materials and the like of various packages of the integrated circuits needs to be systematically known and understood, so that the integrated circuit manufacturers can avoid reducing the performance of the integrated circuits due to improper packaging; the integrated circuit packaging chip classifying device has the advantages that when an integrated circuit is used for collection design and assembly by an integrated circuit user, the integrated circuit user can reasonably carry out plane layout and space occupation, the mode selection is proper, the application is reasonable, the existing integrated circuit packaging chip cannot be used for sealing and storing the chip in the classifying process, the chip is possibly damaged due to environmental factors in the storing process, and therefore the integrated circuit packaging chip classifying device is high in design practicability and capable of sealing and storing the chip.
Disclosure of Invention
The present invention is directed to a sorting apparatus for integrated circuit packaged chips, so as to solve the problems of the background art mentioned above.
In order to solve the technical problems, the invention provides the following technical scheme: an integrated circuit package chip sorting apparatus, comprising a collection port, characterized in that: collect the end of mouth and install performance detection device, performance detection device's internally mounted has the detection conveyer belt, the surface mounting who detects the conveyer belt has the elastic electromagnet, one side electricity of elastic electromagnet is connected with the performance and detects the computer, retrieves categorised in-process at the chip, needs detect the chip performance earlier, installs the elastic electromagnet on the inside detection conveyer belt of performance detection device, and the elastic electromagnet can adsorb the metal pin of each encapsulation chip, and the elastic electromagnet electricity is connected with the performance and detects the computer simultaneously, therefore the performance of each chip can be detected out to the performance detection computer.
According to the technical scheme, the turnover driving wheel is installed in the middle of the detection conveying belt, in the detection process of the detection conveying belt, the pins of the chips are required to be downward, the elastic electromagnet can adsorb the pins of the chips, the performance of each chip can be detected by the performance detection computer through current, the turnover driving wheel is installed in the middle of the detection conveying belt, if the pins are upward when the chips reach the detection conveying belt, the chips cannot be attracted by the elastic electromagnet, therefore, the chips with the upward pins can be turned over under the influence of gravity and fall back to the detection conveying belt when passing through the turnover driving wheel, then the pins are adsorbed by the elastic electromagnet, at the moment, the chips cannot fall down due to gravity when passing through the turnover driving wheel, and therefore, the chips can be conveyed to a next process.
According to the technical scheme, a missing recovery pipe is installed on one side of the detection conveying belt, a pneumatic transmitting valve is installed at the front end of the missing recovery pipe, a recovery hose is connected to the other side of the pneumatic transmitting valve, the other side of the recovery hose is connected with the collection port, too many chips are put down at the collection port at one time, or when pins of the chips with pins facing upwards are still facing upwards after the chips are clamped by two chips and are turned over by a turning transmission wheel, the chips can fall down due to gravity when passing through the corner of the detection conveying belt, the missing recovery pipe can recover the chips at the moment, then the pneumatic transmitting valve can transmit the chips by utilizing compressed air, the chips are enabled to fall back to the detection conveying belt from the collection port again along the recovery hose, and therefore the chips are detected.
According to the technical scheme, the scrapping channel is formed in the bottom of the performance detection device, the chip scrapping collection box is installed at the bottom of the scrapping channel, the repairing channel is formed in the bottom of the performance detection device, the chip repairing collection box is installed at the bottom of the repairing channel, the wax sealing channel is formed in the tail end of the performance detection device, after performance detection of each chip is finished, the chip can be divided into scrapping, required repairing and qualified according to performance data of each chip, and when each chip reaches the upper portion of the corresponding classification channel, the elastic electromagnet is closed, so that the chip falls into the corresponding channel for subsequent processing.
According to the technical scheme, the tail end of the wax sealing channel is connected with a chip wax sealing device, a wax sealing conveying platform is arranged inside the chip wax sealing device, the front half part of the wax sealing conveying platform is an inclined plane, the rear half part of the wax sealing conveying platform is a plane, a stop block is arranged at the tail end of the wax sealing conveying platform, a compressed air spray head is arranged inside the rear half part of the wax sealing conveying platform, a wax sealing conveying belt is arranged above the wax sealing conveying platform, an elastic electromagnet is arranged on the surface of the wax sealing conveying belt, after the performance detection device detects the chips, the chips qualified in detection can be put down from the wax sealing channel, at the moment, the pins of the chips are upward, the chips slide down from the wax sealing conveying platform, and when the chips slide to the lower part of the wax sealing conveying belt, the elastic electromagnet on the surface of the wax sealing conveying belt can adsorb the pins of the chips, so that the chips move along with, so that subsequent wax seals the step, if lead to the chip upset because of the collision when the chip falls on wax seals the conveying platform, when the chip reaches wax seals the first half of conveying platform back, compressed air of compressed air shower nozzle spun can blow the chip and turn over, and the chip blows and turns over back elastic electromagnet and can adsorb the pin of chip to flow down process, the piece that hinders of wax seals the conveying platform afterbody can block the chip, makes its wax that can not the landing department seal the conveying platform.
According to the technical scheme, the wax melting box is installed to the below of wax sealing conveyer belt, in the recovery storage process of chip, because the inside high accuracy circuit that is of chip, can not use in the storage process, consequently the chip can lead to the circuit to rust or corrode because of storage environment, cause unnecessary economic loss, and the chip wax sealing that will need to store, can completely cut off the contact of chip and air effectively, the possibility that the chip can be corroded is eliminated, the fault-tolerant rate that the chip was stored has been improved, when the chip needs reuse, also can with wax melt can, the deblocking process is also very simple and convenient.
According to the technical scheme, the air-dry device is installed to one side of melting the wax case, and the air-dry device can air-dry the wax mould that the chip surface melts fast, can save natural air-dried time, can promote work efficiency, also can prevent that the wax that melts from dripping, causes the waste.
According to the technical scheme, chip classification device is installed to the below of wax sealing conveyer belt, chip classification device's internally mounted has categorised conveyer belt, and when the chip that air-dries the completion reached chip classification device top, the elastic electromagnet can be closed for on the chip that air-dries the completion can drop the categorised conveyer belt, the chip can be along with categorised conveyer belt forward motion.
According to the technical scheme, the collecting conveyor belt is sequentially arranged above the classifying conveyor belt, the surface of the collecting conveyor belt is provided with the elastic electromagnet, one side of the collecting conveyor belt is provided with the pin induction group, the lower part of the collecting conveyor belt is provided with the classifying storage box, the pin induction group comprises a lead, a counting module, a timing module and a control module, the two sides of the pin induction group are respectively connected with the leads, the leads are arranged on the two sides of the classifying conveyor belt, the height of the leads is flush with the height of the pins leaked from the wax-sealed chip, when the chip passes through each pin induction group, the leads on the two sides of the pin induction group can be contacted with the paired pins of the chip, the counting module can record the number of the leads, the timing module can record the time required for each pair of the pins to pass through, and then the, make each collection conveyer belt can adsorb the chip of the same quantity pin, and convey and store in each categorised storage box, if wherein when the elapsed time difference of two pairs of pins was too big, then represent as two solitary chips, need to zero and recount the count module, can accomplish the classification to the chip from this, also can increase or reduce sorter's quantity according to the demand in categorised conveyer belt top simultaneously, perhaps change the numerical value of setting for of each pin response group, make it can satisfy the categorised demand of different chips, with this flexibility that increases the sorter of integrated circuit encapsulation chip.
Compared with the prior art, the invention has the following beneficial effects: the chip can be hermetically stored, and the chip can be hermetically stored, according to the invention,
(1) by arranging the performance detection device, in the chip recycling and classifying process, the performance of the chip needs to be detected firstly, an elastic electromagnet is arranged on a detection conveying belt in the performance detection device, the elastic electromagnet can adsorb metal pins of each packaged chip, and meanwhile, the elastic electromagnet is electrically connected with a performance detection computer, so that the performance detection computer can detect the service performance of each chip, the chips can be classified into scrapped, repaired and qualified according to the performance data of each chip, and when each chip reaches the position above the corresponding classifying channel, the elastic electromagnet is closed, so that the chip falls into the corresponding channel for subsequent processing;
(2) the turnover driving wheel is arranged, in the detection process of the detection conveying belt, the pins of the chips are required to be downward, the elastic electromagnets can adsorb the pins of the chips, so that a performance detection computer can detect the performance of each chip through current, the turnover driving wheel is arranged in the middle of the detection conveying belt, if the pins are upward when the chips reach the detection conveying belt, the chips cannot be attracted by the elastic electromagnets, therefore, when the chips with the upward pins pass through the turnover driving wheel, the chips can be turned over and fall back to the detection conveying belt under the influence of gravity, then the pins are adsorbed by the elastic electromagnets, and at the moment, the chips cannot fall down due to the gravity when passing through the turnover driving wheel because the pins of the chips are adsorbed by the elastic electromagnets, and therefore, the chips can be conveyed to the;
(3) through the arrangement of the omission recovery pipe, when too many chips are put down at the collection port at one time or when the pins of the chips are still upward after the chips with the upward pins pass through the turnover transmission wheel due to the clamping of two chips, the chips can fall down due to gravity when passing through the corner of the detection conveying belt, at the moment, the omission recovery pipe can recover the chips, and then the pneumatic emission valve can emit the chips by utilizing compressed air to enable the chips to fall back to the detection conveying belt from the collection port along the recovery hose again, so that the chips are detected again;
(4) by arranging the chip wax sealing device, in the recycling and storing process of the chip, because the chip is internally provided with a high-precision circuit and cannot be used in the storing process, the chip can be rusted or corroded due to the storing environment, so that unnecessary economic loss is caused, the chip needing to be stored is wax sealed, the contact between the chip and the air can be effectively isolated, the possibility that the chip can be corroded is eliminated, the fault tolerance rate of chip storage is improved, when the chip needs to be reused, the wax can be melted, and the unsealing process is very simple and convenient;
(5) through the arrangement of the wax-sealed conveying platform, after the performance detection device detects the chips, the chips qualified for detection can be put down from the wax-sealed channel, pins of the chips face upwards, the chips slide down from the wax-sealed conveying platform and slide to the lower part of the wax-sealed conveying belt, the pins of the chips can be adsorbed by the elastic electromagnet on the surface of the wax-sealed conveying belt, so that the chips move along with the wax-sealed conveying belt, and a subsequent wax-sealed step is facilitated;
(6) by arranging the air drying device, the air drying device can quickly air-dry the wax mould melted on the surface of the chip, so that the natural air drying time can be saved, the working efficiency can be improved, and the melted wax can be prevented from dripping to cause waste;
(7) by arranging the classification conveyor belt, when the air-dried chips reach the upper part of the chip classification device, the elastic electromagnet is closed, so that the air-dried chips fall onto the classification conveyor belt, the chips move forwards along with the classification conveyor belt, two sides of the pin induction groups are respectively connected with leads, the leads are arranged at two sides of the classification conveyor belt, the height of the leads is flush with the height of pins leaked from the wax-sealed chips, when the chips pass through each pin induction group, the leads at two sides of the pin induction group can be contacted with the paired pins of the chips, the number of the paired pins can be recorded by the counting module at the moment, the required time for each pair of pins to pass through is recorded by the timing module, then the control module can control the elastic electromagnet on each collection conveyor belt to be opened through the data, so that each collection conveyor belt can adsorb the chips with the same number of the, if the difference between the elapsed time of the two pairs of pins is too large, the two pairs of pins are represented as two independent chips, and the counting module needs to be reset to zero and count again, so that the classification of the chips can be completed.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic overall workflow of the present invention;
FIG. 2 is a schematic view of the internal structure of the performance testing apparatus of the present invention;
FIG. 3 is a schematic view of the internal structure of the chip wax sealing device of the present invention;
FIG. 4 is a schematic diagram of the internal structure of the chip sorting apparatus according to the present invention;
FIG. 5 is a schematic view of the construction of the various conveyor belts of the present invention;
in the figure: 1. a collection port; 2. a performance detection device; 3. a performance detection computer; 4. a chip scrap collecting box; 5. a chip repair collection box; 6. a chip wax sealing device; 7. a chip sorting device; 9. detecting a conveyor belt; 10. a turning-over driving wheel; 11. a scrapped channel; 12. repairing the channel; 13. wax sealing the channel; 14. omitting the recovery pipe; 15. a pneumatic launch valve; 16. recovering the hose; 17. a wax-sealed transfer platform; 18. blocking; 19. a compressed air nozzle; 20. a wax melting box; 21. wax sealing the conveyor belt; 22. a sorting conveyor belt; 23. a pin induction group; 24. a collection conveyor belt; 25. classifying and storing boxes; 32. an elastic electromagnet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 5, the present invention provides a technical solution: a sorting device for integrated circuit packaged chips comprises a collecting port 1, and is characterized in that: the tail end of the collecting port 1 is provided with a performance detection device 2, a detection conveyor belt 9 is arranged in the performance detection device 2, an elastic electromagnet 32 is arranged on the surface of the detection conveyor belt 9, one side of the elastic electromagnet 32 is electrically connected with a performance detection computer 3, the performance of the chips needs to be detected firstly in the chip recovery and classification process, the elastic electromagnet 32 is arranged on the detection conveyor belt 9 in the performance detection device 2, the elastic electromagnet 32 can adsorb metal pins of each packaged chip, and meanwhile, the elastic electromagnet 32 is electrically connected with the performance detection computer 3, so that the performance detection computer 3 can detect the service performance of each chip;
referring to fig. 2 and 5, a turning-over driving wheel 10 is installed in the middle of the detection conveyor belt 9, and in the detection process of the detection conveyor belt 9, the pins of the chip must be ensured to face downwards, so that the elastic electromagnet 32 can adsorb the pins of the chip, the performance detection computer 3 can detect the performance of each chip through current, the turning-over driving wheel 10 is arranged in the middle of the detection conveyor belt 9, if the pins face upwards when the chips reach the detection conveyor belt 9, the chips are not attracted by the elastic electromagnet 32, therefore, when the chips with the upward pins pass through the turnover driving wheel 10, the chips can turn over under the influence of gravity and fall back to the detection conveyor belt 9, then the pins are attracted by the elastic electromagnet 32, at this time, because the pins of the chip are attracted by the elastic electromagnet 32, therefore, the chip can not fall down due to gravity when passing through the turning transmission wheel 10, and the chip can be transported to the next procedure;
referring to fig. 3 and 5, a missing recovery tube 14 is installed on one side of a detection conveyor belt 9, a pneumatic emission valve 15 is installed at the front end of the missing recovery tube 14, a recovery hose 16 is connected to the other side of the pneumatic emission valve 15, the other side of the recovery hose 16 is connected to a collection port 1, too many chips are put down at the collection port 1 at one time, or when two chips are clamped and lead to upward pins after passing through a turning-over driving wheel 10, such chips fall down due to gravity when passing through a corner of the detection conveyor belt 9, at the moment, the missing recovery tube 14 recovers the chips, and then the pneumatic emission valve 15 emits the chips by using compressed air, so that the chips fall back onto the detection conveyor belt 9 from the collection port 1 along the recovery hose 16 again, so as to detect again;
referring to fig. 1 and 2, a scrapping channel 11 is formed at the bottom of a performance detection device 2, a chip scrapping collection box 4 is installed at the bottom of the scrapping channel 11, a repairing channel 12 is formed at the bottom of the performance detection device 2, a chip repairing collection box 5 is installed at the bottom of the repairing channel 12, a wax sealing channel 13 is formed at the tail end of the performance detection device 2, after performance detection of each chip is finished, the chip can be classified into scrapping, repairing and qualified according to performance data of each chip, and when each chip reaches above a corresponding classification channel, an elastic electromagnet 32 is closed, so that the chip falls into the corresponding channel for subsequent processing;
referring to fig. 1, 3 and 5, the end of the wax sealing channel 13 is connected to the chip wax sealing device 6, the wax sealing transport platform 17 is installed inside the chip wax sealing device 6, the front half of the wax sealing transport platform 17 is an inclined plane, the rear half of the wax sealing transport platform 17 is a plane, the end of the wax sealing transport platform 17 is provided with a stop block 18, the compressed air nozzle 19 is installed inside the rear half of the wax sealing transport platform 17, the wax sealing transport belt 21 is installed above the wax sealing transport platform 17, the surface of the wax sealing transport belt 21 is provided with an elastic electromagnet 32, after the performance detection device 2 detects the chip, the qualified chip will be put down from the wax sealing channel 13, at this time, each chip has a pin facing upwards, slide down from the wax sealing transport platform 17 to slide below the wax sealing transport belt 21, the elastic electromagnet 32 on the surface of the wax sealing transport belt 21 will absorb the pin of each chip, so that the chip will move along with the wax sealing transport belt 21, in order to facilitate the subsequent wax sealing step, if the chip is turned over due to collision when the chip falls on the wax sealing conveying platform 17, when the chip reaches the rear half part of the wax sealing conveying platform 17, the compressed air sprayed by the compressed air spray nozzle 19 blows over the chip, the elastic electromagnet 32 can adsorb the pins of the chip after the chip is blown over so as to flow to the next procedure, and the block 18 at the tail part of the wax sealing conveying platform 17 can block the chip so as not to slide off the wax sealing conveying platform 17;
referring to fig. 3, a wax melting box 20 is installed below a wax sealing conveyor belt 21, in the process of recovering and storing chips, since the chips are internally provided with high-precision circuits and cannot be used in the process of storing, the chips may be rusted or corroded due to the storage environment, and unnecessary economic loss is caused, the chips to be stored are wax sealed, the contact between the chips and air can be effectively isolated, the possibility that the chips are corroded is eliminated, the fault tolerance rate of chip storage is improved, when the chips need to be reused, the wax can be melted, and the process of unsealing is very simple and convenient;
an air drying device is arranged on one side of the wax melting box 20, and can quickly dry the wax mold melted on the surface of the chip, so that the natural air drying time can be saved, the working efficiency can be improved, and the melted wax can be prevented from dripping to cause waste;
referring to fig. 1, 4 and 5, a chip sorting device 7 is installed below the wax-sealed conveyor belt 21, a sorting conveyor belt 22 is installed inside the chip sorting device 7, and when the air-dried chips reach the upper part of the chip sorting device 7, the elastic electromagnet 32 is closed, so that the air-dried chips fall onto the sorting conveyor belt 22 and move forward along with the sorting conveyor belt 22;
referring to fig. 4, a collecting conveyor belt 24 is sequentially installed above a sorting conveyor belt 22, an elastic electromagnet 32 is installed on the surface of the collecting conveyor belt 24, a pin sensing group 23 is installed on one side of the collecting conveyor belt 24, a sorting storage box 25 is installed below the collecting conveyor belt 24, the pin sensing group 23 includes wires, a counting module, a timing module and a control module, the wires are respectively connected to two sides of the pin sensing group 23, the wires are installed on two sides of the sorting conveyor belt 22, the height of the wires is flush with the height of pins leaked from a chip after wax sealing, when the chip passes through each pin sensing group 23, the wires on two sides of the pin sensing group 23 can be contacted with paired pins of the chip, at this time, the counting module records the number of the paired pins, the timing module records the time required for each pair of pins to pass through, and then the control module can control the, make each collect conveyer belt 24 can adsorb the chip of the same quantity pin to convey and store in each categorised bin 25, if the time gap of the two pairs of pins wherein is too big, then represent as two solitary chips, need zero and recount the count module, can accomplish the classification to the chip from this, also can increase or reduce sorter's quantity according to the demand in categorised conveyer belt 22 top simultaneously, perhaps change the settlement numerical value of each pin response group 23, make it can satisfy different chip classification demands, with this flexibility that increases the sorter of integrated circuit encapsulation chip.
The working principle is as follows: in the chip recycling and classifying process, the performance of the chip needs to be detected firstly, an elastic electromagnet 32 is arranged on a detection conveyor belt 9 in a performance detection device 2, the elastic electromagnet 32 can adsorb metal pins of each packaged chip, and meanwhile, the elastic electromagnet 32 is electrically connected with a performance detection computer 3, so that the performance of each chip can be detected by the performance detection computer 3, in the detection process of the detection conveyor belt 9, the pins of the chip are ensured to be downward, the elastic electromagnet 32 can adsorb the pins of the chip, so that the performance detection computer 3 can detect the performance of each chip through current, a turnover transmission wheel 10 is arranged in the middle of the detection conveyor belt 9, if the pins are upward when the chip reaches the detection conveyor belt 9, the chip cannot be attracted by the elastic electromagnet 32, and therefore, when the chip with the pins upward passes through the transmission wheel 10, the chip can be turned over under the influence of gravity and fall back to the, then the pins are adsorbed by the elastic electromagnets 32, at the moment, because the pins of the chip are adsorbed by the elastic electromagnets 32, the chip can not fall down due to gravity when passing through the turnover driving wheel 10, so that the chip can be transported to the next procedure, too many chips are put down at the collecting port 1 at one time, or when the pins of the chip with the upward pins are still upward after passing through the turnover driving wheel 10 due to the clamping of two chips, the chip can fall down due to gravity when passing through the corner of the detection conveying belt 9, the chip can be recovered by the omission recovery pipe 14 at the moment, then the chip can be emitted by the pneumatic emission valve 15 by using compressed air, so that the chip can fall back onto the detection conveying belt 9 from the collecting port 1 along the recovery hose 16 again, thus the detection is carried out again, and after the performance detection of each chip is finished, the chip can be classified into scrapped, required to be repaired, and, Qualified, when each chip reaches the upper part of the corresponding classification channel, the elastic electromagnet 32 is closed to enable the chip to fall into the corresponding channel for subsequent treatment, after the performance detection device 2 detects the chip, the chip qualified for detection is put down from the wax sealing channel 13, at the moment, each chip is in a pin-up state, slides down from the wax sealing conveying platform 17 to the lower part of the wax sealing conveying belt 21, the elastic electromagnet 32 on the surface of the wax sealing conveying belt 21 can absorb the pin of each chip, so that the chip can move along with the wax sealing conveying belt 21, so as to facilitate the subsequent wax sealing step, when the chip falls on the wax sealing conveying platform 17, if the chip is overturned due to collision, when the chip reaches the rear half part of the wax sealing conveying platform 17, the compressed air sprayed by the compressed air spray nozzle 19 can blow the chip over, the elastic electromagnet 32 can absorb the pin of the chip after the chip is blown over, so as to flow to the next process, the block 18 at the tail of the wax-sealed conveying platform 17 can block the chip, so that the chip can not slide down from the wax-sealed conveying platform 17, in the recovery and storage process of the chip, because the chip is internally provided with a high-precision circuit and can not be used in the storage process, the chip can be rusted or corroded due to the storage environment, thereby causing unnecessary economic loss, the chip to be stored can be wax-sealed, the contact between the chip and the air can be effectively isolated, the possibility that the chip can be corroded can be eliminated, the fault-tolerant rate of the chip storage is improved, when the chip needs to be reused, the wax can be melted, the deblocking process is also very simple and convenient, the air drying device can quickly air-dry the wax mould melted on the surface of the chip, the natural air drying time can be saved, the working efficiency can be improved, the melted wax can be prevented from dripping and being wasted, when the air-dried chips reach the upper part of the chip classification device 7, the elastic electromagnet 32 is closed, so that the air-dried chips fall onto the classification conveyor belt 22 and move forwards along with the classification conveyor belt 22, the two sides of the pin induction groups 23 are respectively connected with wires which are arranged on the two sides of the classification conveyor belt 22, the height of the wires is flush with the height of pins leaked from the wax-sealed chips, when the chips pass through each pin induction group 23, the wires on the two sides of the pin induction groups 23 can be contacted with the paired pins of the chips, the counting module records the number of the paired pins at the moment, the timing module records the time required for each pair of the pins to pass through, then the control module can control the elastic electromagnet 32 on each collection conveyor belt 24 to be opened through the data, so that each collection conveyor belt 24 can adsorb the chips with the same number of the pins and transmit the chips to each classification, if the difference between the elapsed time of the two pairs of pins is too large, the two pairs of pins are represented as two independent chips, the counting modules need to be reset to zero and counted again, so that the chips can be classified, meanwhile, the number of the classification devices can be increased or decreased above the classification conveyor belt 22 according to requirements, or the set value of each pin induction group 23 is changed, so that the classification requirements of different chips can be met, and the flexibility of the classification device for packaging the chips by the integrated circuit is increased.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. An integrated circuit package chip sorting device, comprising a collection port (1), characterized in that: collect the end of mouth (1) and install performance detection device (2), the internally mounted of performance detection device (2) has detection conveyer belt (9), the surface mounting who detects conveyer belt (9) has elastic electromagnet (32), one side electricity of elastic electromagnet (32) is connected with performance detection computer (3).
2. The apparatus of claim 1, further comprising: and a turn-over driving wheel (10) is arranged in the middle of the detection conveying belt (9).
3. The apparatus of claim 1, further comprising: the detection device is characterized in that a leakage recovery pipe (14) is installed on one side of the detection conveyor belt (9), a pneumatic transmitting valve (15) is installed at the front end of the leakage recovery pipe (14), a recovery hose (16) is connected to the other side of the pneumatic transmitting valve (15), and the other side of the recovery hose (16) is connected with the collection port (1).
4. The apparatus of claim 1, further comprising: the device is characterized in that a scrapping channel (11) is formed in the bottom of the performance detection device (2), a chip scrapping collection box (4) is installed at the bottom of the scrapping channel (11), a repairing channel (12) is formed in the bottom of the performance detection device (2), a chip repairing collection box (5) is installed at the bottom of the repairing channel (12), and a wax sealing channel (13) is formed in the tail end of the performance detection device (2).
5. An apparatus for sorting integrated circuit packaged chips according to claim 2, wherein: the end-to-end connection of wax seals passageway (13) has chip wax to seal device (6), the internally mounted of chip wax seals device (6) has wax to seal conveying platform (17), the first half of wax seals conveying platform (17) is the inclined plane, the latter half of wax seals conveying platform (17) is the plane, the end of wax seals conveying platform (17) is provided with hinders piece (18), the internally mounted of wax seals conveying platform (17) the latter half has compressed air shower nozzle (19), wax seals conveyer belt (21) is installed to the top of wax seals conveying platform (17), the surface mounting of wax seals conveyer belt (21) has elastic electro-magnet (32).
6. An apparatus for sorting integrated circuit packaged chips according to claim 2, wherein: a wax melting box (20) is arranged below the wax sealing conveyor belt (21).
7. An apparatus for sorting integrated circuit packaged chips according to claim 2, wherein: and an air drying device is arranged on one side of the wax melting box (20).
8. An apparatus for sorting integrated circuit packaged chips according to claim 2, wherein: chip classification device (7) are installed to the below of wax sealing conveyer belt (21), the internally mounted of chip classification device (7) has categorised conveyer belt (22).
9. An apparatus for sorting integrated circuit packaged chips according to claim 2, wherein: install collection conveyer belt (24) in proper order above categorised conveyer belt (22), the surface mounting who collects conveyer belt (24) has elastic electromagnet (32), pin induction group (23) are installed to one side of collecting conveyer belt (24), the below of collecting conveyer belt (24) is provided with categorised bin (25). The pin induction group (23) comprises a lead, a counting module, a timing module and a control module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010909928.7A CN112246690A (en) | 2020-09-02 | 2020-09-02 | Classification device for integrated circuit packaged chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010909928.7A CN112246690A (en) | 2020-09-02 | 2020-09-02 | Classification device for integrated circuit packaged chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112246690A true CN112246690A (en) | 2021-01-22 |
Family
ID=74224523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010909928.7A Withdrawn CN112246690A (en) | 2020-09-02 | 2020-09-02 | Classification device for integrated circuit packaged chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112246690A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074542A (en) * | 1983-09-30 | 1985-04-26 | Hitachi Ltd | Automatic inspecting device for integrated circuit parts |
| CN101706457A (en) * | 2009-11-12 | 2010-05-12 | 无锡中微腾芯电子有限公司 | Device for automatic counting and pin checking of tube circuit |
| CN106000898A (en) * | 2016-07-14 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Automatic thickness grading device for high-pressure ceramic capacitor ceramic medium chips |
| CN106002510A (en) * | 2016-07-14 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Thickness grading and repairing production line for high-pressure ceramic capacitor ceramic medium chips |
| CN107671007A (en) * | 2017-09-30 | 2018-02-09 | 浙江农林大学 | Based on the pearl shaped intelligent sorting system of machine vision batch detection |
| CN206997131U (en) * | 2017-07-19 | 2018-02-13 | 重庆市敏城电子有限公司 | A kind of network transformer pin angle-adjusting mechanism |
| CN109225945A (en) * | 2018-09-05 | 2019-01-18 | 四川知创知识产权运营有限公司 | A kind of full-automatic chip intelligent test macro |
| CN211002026U (en) * | 2019-09-02 | 2020-07-14 | 高美（安远）电子有限公司 | Wax sealing device for electronic component |
-
2020
- 2020-09-02 CN CN202010909928.7A patent/CN112246690A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074542A (en) * | 1983-09-30 | 1985-04-26 | Hitachi Ltd | Automatic inspecting device for integrated circuit parts |
| CN101706457A (en) * | 2009-11-12 | 2010-05-12 | 无锡中微腾芯电子有限公司 | Device for automatic counting and pin checking of tube circuit |
| CN106000898A (en) * | 2016-07-14 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Automatic thickness grading device for high-pressure ceramic capacitor ceramic medium chips |
| CN106002510A (en) * | 2016-07-14 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Thickness grading and repairing production line for high-pressure ceramic capacitor ceramic medium chips |
| CN206997131U (en) * | 2017-07-19 | 2018-02-13 | 重庆市敏城电子有限公司 | A kind of network transformer pin angle-adjusting mechanism |
| CN107671007A (en) * | 2017-09-30 | 2018-02-09 | 浙江农林大学 | Based on the pearl shaped intelligent sorting system of machine vision batch detection |
| CN109225945A (en) * | 2018-09-05 | 2019-01-18 | 四川知创知识产权运营有限公司 | A kind of full-automatic chip intelligent test macro |
| CN211002026U (en) * | 2019-09-02 | 2020-07-14 | 高美（安远）电子有限公司 | Wax sealing device for electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110733690B (en) | Cigarette package strip two-dimensional code detection and information association system | |
| CN106885656B (en) | Helium leakage detection system for power battery cover plate | |
| CN201010070Y (en) | Specifying grasping device for IC full-automatic tray type detecting braider | |
| CN208622679U (en) | Surface encapsulation chip automatic production line | |
| CN106000919B (en) | A kind of lithium battery sorting unit of high automation | |
| KR20110028240A (en) | Device and method for checking container closures | |
| CN211281608U (en) | Inductance automatic test spouts a yard equipment for packing | |
| WO2023216736A1 (en) | Intelligent silicon wafer sorting system and method | |
| CN104960710A (en) | Crystal oscillator automatic packaging machine | |
| WO2024001595A1 (en) | Method for detecting appearance of dies after wafer dicing | |
| CN212125796U (en) | Automatic labeling machine | |
| CN107899958A (en) | Multi-platform article sorting system and method step by step | |
| CN106743788A (en) | A kind of discharging system for waste household appliance | |
| KR0176527B1 (en) | Method for testing hdd | |
| CN112246690A (en) | Classification device for integrated circuit packaged chips | |
| CN108688912A (en) | More specification particulate matter screenings synchronize baling line and its synchronous packing method of screening | |
| CN113716268B (en) | Silicon wafer classifying and collecting method | |
| CN105151827A (en) | Sheet material lifting, separating and feeding machine | |
| CN110201899B (en) | Method and device for sorting hard alloy cutters | |
| CN201766063U (en) | Classified material-receiving device | |
| CN208412375U (en) | More specification particulate matters sieve synchronous baling line | |
| CN104828286A (en) | Material-loading device capable of automatically removing material | |
| CN206857065U (en) | A kind of BTB connectors automatic detection packing device | |
| CN102962208B (en) | Semiconductor sorting device | |
| CN209256503U (en) | The flexible automation production line of fastener |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210122 |