CN208622679U - Surface encapsulation chip automatic production line - Google Patents
Surface encapsulation chip automatic production line Download PDFInfo
- Publication number
- CN208622679U CN208622679U CN201820908800.7U CN201820908800U CN208622679U CN 208622679 U CN208622679 U CN 208622679U CN 201820908800 U CN201820908800 U CN 201820908800U CN 208622679 U CN208622679 U CN 208622679U
- Authority
- CN
- China
- Prior art keywords
- production line
- sorter
- product
- encapsulation chip
- defective unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Sorting Of Articles (AREA)
Abstract
The utility model discloses surface encapsulation chip automatic production lines, the surface encapsulation chip automatic production line, it successively include automatic charging machine, Pressesservo, sorter, transport mechanism and electric logging device, feeding manipulator is set between the automatic charging machine and Pressesservo, splicing manipulator is set between the Pressesservo and sorter, four axis robots are set between the sorter and transport mechanism.The surface encapsulation chip automatic production line realizes automatic stamp, balance and electrical measurement, and whole process manless production, effectively Improving The Quality of Products, reduces cost of labor.Stamp, electrical measurement, inspection automation production are realized by Automated production line device, have been saved production cost while having been improved production efficiency and product quality.
Description
Technical field
The present invention relates to semiconductors, and field is made, in particular to a kind of surface encapsulation chip automatic production line.
Background technique
SMT, i.e. surface installation technique (Surface Mount Technology abbreviation SMT) are by hydrid integrated circuit skill
The circuit assembly technology of new generation that art develops, with the characteristics of using component surface mounting technology and reflow solder technique,
As package technique of new generation in Electronic products manufacturing.The extensive use of SMT promotes the miniaturization of electronic product, more function
Energyization provides condition for mass production, Low Defectivity production.SMT is exactly surface installation technique, is by hydrid integrated circuit
The circuit assembly technology of a new generation that technology develops.
SMT stamp at present, electrical measurement, balance remain as manually operation, and homework precision is low, high labor cost, and quality is hidden
Suffer from big.As the shortening of electronic product life cycle and the unit price of product gradually reduce, it is a kind of for improving the speed of production
Reduce the important means of production cost.
Summary of the invention
The present invention provides a kind of surface encapsulation chip automatic production lines, to solve the above problems.
In order to solve the above-mentioned technical problem, the technical scheme is that
A kind of surface encapsulation chip automatic production line successively includes automatic charging machine, Pressesservo, sorter, transmission
Feeding manipulator, the Pressesservo and sorter is arranged in mechanism and electric logging device between the automatic charging machine and Pressesservo
Between splicing manipulator is set, four axis robots are set between the sorter and transport mechanism.
Preferably, the Pressesservo includes upper die and lower die, the feeding manipulator by product be placed on it is described under
Mould, the upper die and lower die molding, product stay in the upper mold, and the splicing manipulator is taken out product and sent to the sorter.
Preferably, the sorter includes CCD detector, defective products box and non-defective unit box, the splicing manipulator will be produced
Product, which are arranged at the CCD detector, to be detected, and is sent non-defective unit to the non-defective unit box by four axis robot, and defective products is sent
To the defective products box.
Preferably, the sorter further includes non-defective unit box carrying cylinder, non-defective unit quantity is more, the appearance of each non-defective unit box
It measures limited, therefore the non-defective unit box carrying cylinder is set, empty non-defective unit box is sent to four axis robot to the work for placing non-defective unit
Position product to be put.
Preferably, the transport mechanism includes windrow mechanism, feeding mechanism and receiving mechanism, the windrow mechanism is used
Push plate, the receiving mechanism use body feed tank, and product balance is pushed to the feeding mechanism, the feeding mechanism by the push plate
Product is delivered to the body feed tank.
Preferably, the feeding mechanism use conveyer belt, including be arranged in conveyer belt Transfer pipe one end into
Mouthful, the outlet of the other end and the loading surface being arranged on the Transfer pipe, the body feed tank be arranged in the exit.
The present invention also provides the packaging methods of above-mentioned surface encapsulation chip automatic production line, and steps are as follows: product warp
Automatic charging machine is sent by the feeding manipulator to the Pressesservo, and product is mounted by the Pressesservo, then produced
Product are taken out by splicing manipulator and are sent to the sorter, and the sorter carries out defective products judgement to product and separates non-defective unit and not
Non-defective unit, defective products take out, and non-defective unit is sent by four axis robot to the transport mechanism, and the transport mechanism send product to institute
It states after electric logging device carries out circuit detection and discharges.
Preferably, the sorter includes CCD detector, defective products box and non-defective unit box, the splicing manipulator will be produced
Product, which are arranged at the CCD detector, to be detected, and is sent non-defective unit to the non-defective unit box by four axis robot, and defective products is sent
To the defective products box, the non-defective unit box is sent by four axis robot to the transport mechanism.
Preferably, the sorter further includes non-defective unit box carrying cylinder, the non-defective unit box carrying cylinder is by empty non-defective unit
Box send to four axis robot station product to be put for placing non-defective unit.
Compared with prior art, the invention has the following advantages that surface encapsulation chip automatic production line of the present invention,
It successively include automatic charging machine, Pressesservo, sorter, transport mechanism and electric logging device, the automatic charging machine and Pressesservo
Between feeding manipulator is set, splicing manipulator is set between the Pressesservo and sorter, and the sorter and windrow are sent
Four axis robots are set between material mechanism.The surface encapsulation chip automatic production line realizes automatic stamp, balance and electrical measurement,
Whole process manless production, effectively Improving The Quality of Products, reduces cost of labor.It is realized and is rushed by Automated production line device
Type, electrical measurement, inspection automation production, have saved production cost while having improved production efficiency and product quality.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the surface encapsulation chip automatic production line of a specific embodiment of the invention；
Fig. 2 is the schematic diagram at the A of the surface encapsulation chip automatic production line in Fig. 1 of the present invention；
Fig. 3 is the step flow chart of the method for the surface encapsulation chip of a specific embodiment of the invention.
It is as shown in the figure: 1- automatic charging machine, 11- feeding manipulator, 2- Pressesservo, 21- splicing manipulator, 22- lower die,
3- sorter, 4- transport mechanism.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.It should be noted that attached drawing of the present invention is all made of simplified form and uses non-essence
Quasi- ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Referring to Figure 1 and Fig. 2, a kind of surface encapsulation chip automatic production line successively includes automatic charging machine 1, servo
Punching machine 2, sorter 3, transport mechanism 4 and electric logging device (not shown).Between the automatic charging machine 1 and Pressesservo 2 in setting
Expect manipulator 11, splicing manipulator 21, the sorter 3 and transport mechanism 4 are set between the Pressesservo 2 and sorter 3
Between four axis robots (not shown) is set.
The Pressesservo 2 includes upper die and lower die 22, and product is placed in the lower die 22 by the feeding manipulator,
The upper die and lower die 22 molding attachment, product stays in the upper mold after the completion, the splicing manipulator 21 take out product send to
The sorter 3.
The sorter 3 includes CCD detector, defective products box and non-defective unit box, and product is arranged the splicing manipulator 21
Detect judgement at the CCD detector, and sent non-defective unit to the non-defective unit box by four axis robot, by defective products send to
The defective products box.The sorter 3 further includes non-defective unit box carrying cylinder, and non-defective unit quantity is more, the capacity of each non-defective unit box
Limited, non-defective unit box needs to constantly change, therefore the non-defective unit box carrying cylinder is arranged, and empty non-defective unit box is sent to the four axis machine
The station product to be put of tool hand placement non-defective unit.
The transport mechanism 4 includes windrow mechanism, feeding mechanism and receiving mechanism, and the windrow mechanism uses push plate, institute
Receiving mechanism is stated using body feed tank, product balance is pushed to the feeding mechanism by the push plate, and the feeding mechanism is by product
It is delivered to the body feed tank.The feeding mechanism use conveyer belt, including be arranged in conveyer belt Transfer pipe one end into
Mouthful, the outlet of the other end and the loading surface being arranged on the Transfer pipe, the body feed tank be arranged in the exit.
Fig. 3 is referred to, the packaging method of the surface encapsulation chip automatic production line, steps are as follows:
Product is sent by the feeding manipulator 11 to the Pressesservo 2 through automatic charging machine 1, passes through Pressesservo 2
The molding dress patch of upper die and lower die 22, then, product is taken out by splicing manipulator 21 and is sent to the sorter 3, the CCD inspection
It surveys instrument to judge product defective products, separates non-defective unit and defective products, defective products is sent to defective products box and removed by four axis robot
The surface encapsulation chip automatic production line out, non-defective unit send in non-defective unit box and by four axis robot and send to the transmission
Mechanism 4, the rushing board mechanism are sent to body feed tank by product balance, by the conveyer belt, and product is by described in the body feed tank
Electric logging device discharges after carrying out circuit test.
The surface encapsulation chip automatic production line realizes automatic stamp, balance and electrical measurement, whole process manless production,
Effectively Improving The Quality of Products reduces cost of labor.Stamp, electrical measurement, inspection automation are realized by Automated production line device
Production, has saved production cost while having improved production efficiency and product quality.
Those skilled in the art can carry out various modification and variations without departing from spirit and model of the invention to invention
It encloses.In this way, if these modifications and changes of the present invention is within the scope of the claims of the present invention and its equivalent technology, then
The invention is also intended to include including these modification and variations.
Claims (6)
1. a kind of surface encapsulation chip automatic production line, which is characterized in that successively include automatic charging machine, Pressesservo, divide
Pick machine, transport mechanism and electric logging device；Feeding manipulator, the Pressesservo are set between the automatic charging machine and Pressesservo
Splicing manipulator is set between sorter, four axis robots are set between the sorter and transport mechanism.
2. surface encapsulation chip automatic production line according to claim 1, which is characterized in that the Pressesservo includes
Upper die and lower die, the feeding manipulator place product in the lower die, and the upper die and lower die mold, and product stays on described
Mould, the splicing manipulator are taken out product and are sent to the sorter.
3. surface encapsulation chip automatic production line according to claim 1, which is characterized in that the sorter includes
CCD detector, defective products box and non-defective unit box, product is arranged at the CCD detector splicing manipulator detects, and by
Four axis robot send non-defective unit to the non-defective unit box, and defective products is sent to the defective products box.
4. surface encapsulation chip automatic production line according to claim 3, which is characterized in that the sorter further includes
Vacant non-defective unit box is sent to four axis robot work for placing non-defective unit by non-defective unit box carrying cylinder, the non-defective unit box carrying cylinder
Position product to be put.
5. surface encapsulation chip automatic production line according to claim 1, which is characterized in that the transport mechanism includes
Windrow mechanism, feeding mechanism and receiving mechanism, the windrow mechanism use push plate, and the receiving mechanism uses body feed tank, described
Product balance is pushed to the feeding mechanism by push plate, and product is delivered to the body feed tank by the feeding mechanism.
6. surface encapsulation chip automatic production line according to claim 5, which is characterized in that the feeding mechanism uses
Including Transfer pipe, import that described Transfer pipe one end is arranged in, going out for the Transfer pipe other end is arranged in conveyer belt
Mouth and the loading surface being arranged on the Transfer pipe, the body feed tank are arranged in the exit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820908800.7U CN208622679U (en) | 2018-06-12 | 2018-06-12 | Surface encapsulation chip automatic production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820908800.7U CN208622679U (en) | 2018-06-12 | 2018-06-12 | Surface encapsulation chip automatic production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208622679U true CN208622679U (en) | 2019-03-19 |
Family
ID=65703003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820908800.7U Expired - Fee Related CN208622679U (en) | 2018-06-12 | 2018-06-12 | Surface encapsulation chip automatic production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208622679U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987312A (en) * | 2018-06-12 | 2018-12-11 | 欣兴同泰科技（昆山）有限公司 | Surface encapsulation chip automatic production line and its packaging method |
| CN110176413A (en) * | 2019-04-15 | 2019-08-27 | 南宁聚信众信息技术咨询有限公司 | Safe and reliable efficient mechanical equipment for chip sorting |
| CN111229990A (en) * | 2020-01-19 | 2020-06-05 | 温州源利智能科技有限公司 | Pin cutting device of electronic chip tray filler |
| CN114013731A (en) * | 2021-11-24 | 2022-02-08 | 联德精密材料（中国）股份有限公司 | Automatic assembly line for packaging of punched products |
-
2018
- 2018-06-12 CN CN201820908800.7U patent/CN208622679U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987312A (en) * | 2018-06-12 | 2018-12-11 | 欣兴同泰科技（昆山）有限公司 | Surface encapsulation chip automatic production line and its packaging method |
| CN110176413A (en) * | 2019-04-15 | 2019-08-27 | 南宁聚信众信息技术咨询有限公司 | Safe and reliable efficient mechanical equipment for chip sorting |
| CN111229990A (en) * | 2020-01-19 | 2020-06-05 | 温州源利智能科技有限公司 | Pin cutting device of electronic chip tray filler |
| CN114013731A (en) * | 2021-11-24 | 2022-02-08 | 联德精密材料（中国）股份有限公司 | Automatic assembly line for packaging of punched products |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208622679U (en) | Surface encapsulation chip automatic production line | |
| CN103501085B (en) | Mobile phone motor automatic assembly production line | |
| CN105490473B (en) | Rotor automatic setup system | |
| CN107052819B (en) | Automatic production line | |
| CN110178210A (en) | Element processor | |
| CN108807640A (en) | A kind of integrated assembly line of SMD encapsulation | |
| CN108987312A (en) | Surface encapsulation chip automatic production line and its packaging method | |
| CN212160007U (en) | Automatic chip testing device | |
| CN209327522U (en) | A kind of Optimum Design device of circuit board | |
| CN108545220A (en) | The secondary counterweight packaging facilities of automatic granule object and its counterweight packing method | |
| CN108688912A (en) | More specification particulate matter screenings synchronize baling line and its synchronous packing method of screening | |
| CN209720964U (en) | A kind of slotting packet all-in-one machine of sheave carrying | |
| CN208412375U (en) | More specification particulate matters sieve synchronous baling line | |
| CN105959904A (en) | Automatic microphone wire welding equipment | |
| CN215680621U (en) | Full-automatic arranging and continuously installing equipment for semiconductor or chip capacitor | |
| CN108686967A (en) | Chip detecting system and detection method | |
| CN210526929U (en) | Automatic push away material binding apparatus and full-automatic sorting and bundling production line | |
| TW201527771A (en) | Testing equipment of electronic components and testing method thereof | |
| CN208189536U (en) | Bio-identification chip package dispensing test device | |
| CN215796941U (en) | Full-automatic electric detection device for chip | |
| CN202404039U (en) | Multi-connection panel detecting device | |
| CN219025047U (en) | Dispensing and weighing equipment | |
| CN217193800U (en) | Micro-USB double-feeding automatic assembling and automatic detecting machine | |
| CN215695954U (en) | Detection device is used in chip resistor production | |
| CN217195777U (en) | Blanking assembly line device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190319 Termination date: 20200612 |