CN112218483B - 电子设备和电子控制装置 - Google Patents

电子设备和电子控制装置 Download PDF

Info

Publication number
CN112218483B
CN112218483B CN202010255665.2A CN202010255665A CN112218483B CN 112218483 B CN112218483 B CN 112218483B CN 202010255665 A CN202010255665 A CN 202010255665A CN 112218483 B CN112218483 B CN 112218483B
Authority
CN
China
Prior art keywords
cover
generating elements
heat
heat generating
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010255665.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN112218483A (zh
Inventor
大门优树
大上达也
中田裕树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diamond Jiebula Motor Co ltd
Original Assignee
Diamond Jiebula Motor Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamond Jiebula Motor Co ltd filed Critical Diamond Jiebula Motor Co ltd
Publication of CN112218483A publication Critical patent/CN112218483A/zh
Application granted granted Critical
Publication of CN112218483B publication Critical patent/CN112218483B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
CN202010255665.2A 2019-07-10 2020-04-02 电子设备和电子控制装置 Active CN112218483B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019128706A JP7288363B2 (ja) 2019-07-10 2019-07-10 電子機器および電子制御装置
JP2019-128706 2019-07-10

Publications (2)

Publication Number Publication Date
CN112218483A CN112218483A (zh) 2021-01-12
CN112218483B true CN112218483B (zh) 2023-11-17

Family

ID=69650522

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010255665.2A Active CN112218483B (zh) 2019-07-10 2020-04-02 电子设备和电子控制装置

Country Status (4)

Country Link
US (1) US11558967B2 (https=)
EP (1) EP3764761A1 (https=)
JP (1) JP7288363B2 (https=)
CN (1) CN112218483B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4307850B1 (en) * 2019-11-18 2026-01-14 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
WO2021186935A1 (ja) * 2020-03-19 2021-09-23 富士電機株式会社 電力変換装置
JP7433735B2 (ja) * 2021-09-01 2024-02-20 矢崎総業株式会社 電子部品の固定構造、及び車載充電器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
JPH10107189A (ja) * 1996-09-25 1998-04-24 Sony Corp 放熱装置
CN1825001A (zh) * 2005-02-25 2006-08-30 Lg电子株式会社 电热灶
EP2172971A2 (de) * 2008-10-01 2010-04-07 Siemens AG Österreich Kühlanordnung
WO2010119546A1 (ja) * 2009-04-16 2010-10-21 三菱電機株式会社 発熱部品固定金具
JP2015118985A (ja) * 2013-12-17 2015-06-25 Tdk株式会社 固定金具

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5450284A (en) * 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
JP3790225B2 (ja) * 2003-03-25 2006-06-28 東芝キヤリア株式会社 放熱装置
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
TW200846881A (en) * 2007-05-18 2008-12-01 Acbel Polytech Inc Mounting device for chips and heat dissipating fins
KR200484015Y1 (ko) * 2013-09-12 2017-07-20 엘에스산전 주식회사 전력 변환 장치
JP6552327B2 (ja) 2015-08-10 2019-07-31 ダイヤモンド電機株式会社 電力変換装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
JPH10107189A (ja) * 1996-09-25 1998-04-24 Sony Corp 放熱装置
CN1825001A (zh) * 2005-02-25 2006-08-30 Lg电子株式会社 电热灶
EP2172971A2 (de) * 2008-10-01 2010-04-07 Siemens AG Österreich Kühlanordnung
WO2010119546A1 (ja) * 2009-04-16 2010-10-21 三菱電機株式会社 発熱部品固定金具
JP2015118985A (ja) * 2013-12-17 2015-06-25 Tdk株式会社 固定金具

Also Published As

Publication number Publication date
JP2021016225A (ja) 2021-02-12
CN112218483A (zh) 2021-01-12
US11558967B2 (en) 2023-01-17
JP7288363B2 (ja) 2023-06-07
US20210014984A1 (en) 2021-01-14
EP3764761A1 (en) 2021-01-13

Similar Documents

Publication Publication Date Title
JP7001960B2 (ja) 回路構成体
US8995130B2 (en) Power supply unit using housing in which printed circuit board is housed
CN112218483B (zh) 电子设备和电子控制装置
CN104853566B (zh) 电子部件的固定结构和固定电子部件的方法
KR20160115907A (ko) 파워전환 장치 및 파워전환 조립체
CN114079390B (zh) 功率转换装置
CN114041327B (zh) 电路结构体
CN113994774A (zh) 电路结构体
US11540424B2 (en) Electric power converter
CN216982372U (zh) 动力部件的散热组件结构
CN103037658A (zh) 用于紧固功率半导体的弹性夹件式装置
CN114342242A (zh) 电力转换装置
US12513822B2 (en) Electronic control module
CN110383612A (zh) 电气连接箱
CA3077851A1 (en) Thermal interface for plurality of discrete electronic devices
KR20190085389A (ko) 컨버터
US20230389197A1 (en) Control Module for a Vehicle With at Least One Electric Motor and a Transmission
WO2020080248A1 (ja) 回路構造体及び電気接続箱
KR20230020313A (ko) 방열 성능이 개선된 전자 소자 유닛 및 모듈, 그리고 이에 적용되는 탄성클램프
US20220312628A1 (en) Electrical device and method for producing a first and second electrical device from a kit
US20250358986A1 (en) Electrical device, electric drive system and vehicle
US20250096656A1 (en) Power conversion apparatus
JP2006339271A (ja) 電子部品冷却ユニット
KR101826727B1 (ko) 방열 장치 및 그 제조 방법
CN113228839B (zh) 电力变换装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20211118

Address after: Osaka, Japan

Applicant after: Diamond jiebula Motor Co.,Ltd.

Address before: Osaka, Japan

Applicant before: DIAMOND ELECTRIC MFG. Co.,Ltd.

GR01 Patent grant
GR01 Patent grant