CN112197492A

CN112197492A - Clamping device and heat exchange module based on same

Info

Publication number: CN112197492A
Application number: CN202010982030.2A
Authority: CN
Inventors: 程春明; 张新星
Original assignee: Changhong Meiling Co Ltd
Current assignee: Changhong Meiling Co Ltd
Priority date: 2020-09-17
Filing date: 2020-09-17
Publication date: 2021-01-08

Abstract

The invention discloses a clamping device and a heat exchange module based on the same, and relates to the technical field of refrigerators. The invention comprises a clamping device body; the clamping device body is arranged in the box body; the clamping device body comprises a clamping front end and a clamping rear end; two pairs of boss structures are symmetrically arranged on two sides of the clamped rear end; an air duct, a compartment and a box body outer barrel are arranged in the box body; an electric cabin is arranged on the outer side surface of the outer barrel of the box body; an electric cabin back plate is arranged in the electric cabin; the front end of the clamping device comprises a pair of side plates A. The invention also provides a heat exchange module based on the clamping device, which comprises the clamping device; a heat exchange module body is matched in the clamping device; the periphery of the heat exchange module body is filled with a sealing material A. According to the invention, the clamping device is used for connecting the refrigerating end and the radiating end of the heat exchange module body together, so that the problems of low heat exchange efficiency, poor box body refrigerating effect and incapability of absorbing moisture and draining water when the conventional semiconductor refrigerator adopts air cooling refrigeration are solved.

Description

Clamping device and heat exchange module based on same

Technical Field

The invention belongs to the technical field of refrigerators, and particularly relates to a clamping device and a heat exchange module based on the clamping device.

Background

The refrigerating principle of the semiconductor refrigerator is completely different from that of a common compressor refrigerator, and when a semiconductor chip is electrified, the refrigerating and heating are realized by utilizing the difference of the kinetic energy levels of charge carriers in two materials. The semiconductor refrigerator is small in size, light and easy to carry, so that the requirements on the size of parts and the installation space of the refrigerator assembly are high, the semiconductor refrigerator is compact as much as possible, and the space is saved.

Most of semiconductor refrigerators in the market at present adopt a direct cooling mode to refrigerate, and have the advantages of simple structure, high space utilization rate and poor refrigerating effect. A series of problems need to be considered in the air cooling refrigeration mode, wherein the problems comprise how to effectively fix the attached structures of the cold surface and the hot surface of the semiconductor chip and how to isolate the cold surface and the hot surface of the semiconductor chip from the attached structures, the thermal bridge effect is reduced, the heat exchange efficiency is realized to the maximum extent, and no good technical scheme is available in the industry for solving the problems.

Disclosure of Invention

The invention aims to provide a clamping device and a heat exchange module based on the same, wherein a refrigerating end and a radiating end of a heat exchange module body are connected together through the clamping device, so that the problems of low heat exchange efficiency, poor box body refrigerating effect and incapability of absorbing moisture and draining water when the conventional semiconductor refrigerator adopts air cooling refrigeration are solved.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to a clamping device, which comprises a clamping device body; the clamping device body is arranged in the box body; the clamping device body comprises a clamping front end and a clamping rear end; two pairs of boss structures are symmetrically arranged on two sides of the clamped rear end; (ii) a An air duct, a compartment and a box body outer barrel are arranged in the box body; an electric cabin is arranged on the outer side surface of the outer barrel of the box body; an electric cabin back plate is arranged in the electric cabin.

Furthermore, the front end of the clamping device is of a rectangular box-shaped structure; the clamping front end comprises a pair of side plates A; a pair of side plates B is arranged between the upper end and the lower end of the pair of side plates A; the bottom of the side plate A is provided with a hole; a hole is formed in one surface of the side plate B; a clamp spring is arranged on the inner wall of the hole; the opening at the front end of the clamping device is provided with a first lead-in inclined plane.

Further, the front end of the card comprises an inner cavity; the middle part of the inner cavity is fixedly provided with a one-day well head structure through a net structure; the overhead well head structure comprises surrounding enclosing plates; the end parts of the enclosing plates are provided with second lead-in inclined planes; the bottom of the coaming is provided with a through hole; a fixed frame is arranged on one side of the wellhead structure; and a third leading-in inclined plane is arranged at the opening of the fixed frame.

Furthermore, the fixing frame comprises wing plates on the periphery; the wing plate at the top is provided with a notch; a cylindrical boss with a central hole is arranged in the fixing frame; and screws are matched with the inner wall of the cylindrical boss.

Furthermore, a plurality of clamping jaws A are arranged on the edges of the side plates B; the outer side surface of the side plate A is fixedly connected with a pair of extending bosses; the middle part of the extending boss is provided with a through hole B; and a jaw B is arranged on one side surface of the jaw A.

Furthermore, the end part of the jaw B is provided with a chamfer inclined plane; the jaw A comprises a protruding section; the end part of the extending section is provided with a bending section; the root of the bending section is provided with a slope surface.

A heat exchange module based on a clamping device comprises the clamping device; a heat exchange module body is matched in the clamping device; the periphery of the heat exchange module body is filled with a sealing material A; the heat exchange module body comprises a refrigerating end, a radiating end, a semiconductor chip and a temperature overheat protector.

Further, the refrigerating end is assembled with the clamping front end; the heat dissipation end is assembled with the clamped rear end; the refrigerating end comprises a cold guide body, and a fan A is fixedly arranged on one side of the cold guide body; the heat dissipation end comprises a heat dissipation body, and a fan B is fixedly arranged on one side of the heat dissipation body; the semiconductor chip is provided with a wiring A and a heating surface; the temperature overheat protector is provided with a wiring B and a mounting hole A; a sealing material B is arranged between the temperature overheat protector and the cold conductor; a square hole is formed in the middle of the sealing material B; and one side of the square hole is provided with a abdicating hole.

Further, the heating surface is in contact with the heat radiation body through a wellhead structure; the sealing material A is of a Chinese character kou structure; notches are symmetrically formed in the left side edge and the right side edge of the sealing material A; the upper side and the lower side of the sealing material A are symmetrically provided with through holes A.

The invention has the following beneficial effects:

1. the invention connects the refrigerating end and the radiating end of the heat exchange module body together through the clamping device, and places the heat exchange module body in the box body of the small semiconductor refrigerator, thereby being particularly suitable for the semiconductor refrigerator adopting an air cooling mode for refrigeration.

2. When the cooling guide body clamped by the clamping device is used for refrigerating, the cooling guide body and the inner barrel of the box body form an air path system for refrigerating, moisture in the absorption box is gathered through the refrigerating end of the heat exchange module body, condensed water is formed, and the condensed water is discharged out of a compartment after being gathered together, so that the problems of high humidity and water accumulation in the box are solved; in addition, heat is discharged out of the refrigerator through the heat radiation body clamped by the clamping device, so that heat exchange is realized, the interior of the refrigerator compartment is kept dry, and the user experience is improved.

3. According to the invention, by arranging the wiring A and the heating surface on the semiconductor chip and by adopting the principle of exchanging the cold and hot surfaces of the semiconductor, when the hot surface is arranged in the box and the cold surface is arranged outside the box, the temperature in the box is raised by operation, so that the dehumidification in the box is facilitated.

4. The refrigeration end of the invention comprises a cold guide body, and one side of the cold guide body is fixedly provided with a fan A; the heat dissipation end comprises a heat dissipation body, and a fan B is fixedly mounted on one side of the heat dissipation body and used for improving the heat exchange efficiency, and the refrigeration effect is good.

5. The device has compact structure and smaller overall dimension, integrates and assembles the two end parts of the heat exchange to form a module, not only meets the refrigeration function of the refrigerator, but also can improve the space utilization rate and the volume rate of the refrigerator, and has high degree of integration and generalization of the parts.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a card-mounting device according to the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A-A;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

FIG. 4 is a schematic structural view of the body of the card-mounting device;

FIG. 5 is an exploded view of the heat exchange module body;

FIG. 6 is a schematic structural view of the shroud;

FIG. 7 is a front view of FIG. 6;

FIG. 8 is a schematic cross-sectional view taken along line B-B of FIG. 7;

FIG. 9 is a side view of FIG. 6;

in the drawings, the components represented by the respective reference numerals are listed below:

1-clamping device body, 2-heat exchange module body, 3-sealing material A, 4-box body, 11-clamping front end, 12-clamping rear end, 21-refrigerating end, 22-radiating end, 23-semiconductor chip, 24-temperature overheat protector, 25-clamp spring, 26-sealing material B, 31-notch, 32-through hole A, 41-air duct, 42-compartment, 43-box outer barrel, 111-inner cavity, 121-clamping jaw A, 122-extending boss, 123-boss structure, 211-cold guide body, 221-radiating body, 230-heating surface, 231-wiring A, 241-wiring B, 242-mounting hole A, 261-square hole, 262-abdicating hole, 431-electric cabin, 1100-a first lead-in inclined plane, 1101-a side plate A, 1102-a side plate B, 1111-a ceiling opening structure, 1112-a fixing frame, 1211-an extending section, 1212-a bending section, 1221-a through hole B, 1222-a claw B, 2111-a fan A, 2211-a fan B, 4311-an electric cabin back plate, 11011-a hole, 11021-an eyelet, 11110-a coaming, 11120-a third lead-in inclined plane, 11121-a cylindrical boss, 12121-a slope plane, 12321-a chamfer inclined plane, 111101-a second lead-in inclined plane, 111102-a through hole, 111201-a wing plate and 1112011-a notch.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention is a card device, including a card device body 1; the clamping device body 1 is arranged in the box body 4; the clamping device body 1 comprises a clamping front end 11 and a clamping rear end 12; two pairs of boss structures 123 are symmetrically arranged on two sides of the clamped rear end 12; (ii) a The box body 4 is internally provided with an air duct 41, a compartment 42 and a box body outer barrel 43; an electric cabin 431 is arranged on the outer side surface of the outer barrel 43 of the box body; an electric chamber back plate 4311 is arranged in the electric chamber 431.

Preferably, as shown in fig. 1, the clamping front end 11 is a rectangular box-shaped structure; the card-fitting front end 11 includes a pair of side plates a 1101; a pair of side plates B1102 are arranged between the upper ends and the lower ends of the pair of side plates A1101; a hole 11011 is formed in the bottom of the side plate A1101, so that the wiring A231 of the semiconductor chip 23 and the wiring B241 of the temperature overheat protector 24 can be combined and then penetrate out of the hole 11011 conveniently; an eyelet 11021 is formed on one surface of the side plate B1102; a clamp spring 25 is arranged on the inner wall of the eyelet 11021 and used for fixing the cold end 21; the openings of the clamping front end 11 are provided with first lead-in inclined planes 1100, so that the cold conductor 211 on the heat exchange module body 2 can be positioned and installed conveniently.

Preferably, as shown in fig. 1, the card-mounting front end 11 includes an inner cavity 111; a one-day wellhead structure 1111 is fixedly arranged in the middle of the inner cavity 111 through a net structure; the ceiling opening structure 1111 comprises surrounding boards 11110; the end parts of the enclosing plates 11110 are provided with second lead-in inclined planes 111101, so that the semiconductor chip 23 is positioned and mounted conveniently; the bottom of the enclosing plate 11110 is provided with a through hole 111102 for the wiring A231 to pass through; a fixing frame 1112 is arranged on one side of the wellhead structure 1111 and used for fixing the temperature overheat protector 24; the opening of the fixing frame 1112 is provided with a third lead-in inclined plane 11120, which is convenient for positioning and installing the temperature overheat protector 24.

Preferably, as shown in fig. 1, the fixing frame 1112 includes a wing 111201 around the fixing frame; the top wing plate 111201 is provided with a notch 1112011 for the wiring B241 to pass through; a cylindrical boss 11121 with a central hole is arranged in the fixing frame 1112; the inner wall of the cylindrical boss 11121 is matched with a screw; the temperature overheat protector 24 is fixed to the cylindrical boss 11121 by screws.

Preferably, as shown in fig. 1, the edges of the side plate B1102 are provided with a plurality of claws a121 for clamping and pre-fixing the heat radiator 221; a pair of extending bosses 122 are fixedly connected with the outer side surfaces of the side plates A1101; the middle part of the extending boss 122 is provided with a through hole B1221; the latch a121 has a latch B1222 on one side for fixing the wiring a231 and the wiring B241.

Preferably, as shown in fig. 1, the end of the pawl B1222 is provided with a chamfered surface 12321 to facilitate smooth insertion and fixation of the fixed wiring a231 and the wiring B241; the jaw a121 includes a protruding section 1211; the end of the extending section 1211 is provided with a bending section 1212 for fastening the heat dissipation body 221 to prevent falling off; the root of the bending section 1212 is provided with a slope 12121, which is convenient for clamping the heat sink 221 in the jaw a 121.

A heat exchange module based on a clamping device comprises the clamping device; a heat exchange module body 2 is matched in the clamping device; the sealing material A3 is filled around the heat exchange module body 2; the heat exchange module body 2 comprises a refrigerating end 21, a radiating end 22, a semiconductor chip 23 and a temperature overheat protector 24.

Preferably, as shown in fig. 1, the refrigerating end 21 is assembled with the card-fitting front end 11; the heat dissipation end 22 is assembled with the clamped rear end 12; the clamped front end 11, the clamped rear end 12, the refrigerating end 21 and the radiating end 22 form a heat exchange module assembly and are assembled on the box body 4; the refrigerating end 21 comprises a cold guide body 211, and a fan A2111 is fixedly arranged on one side of the cold guide body 211; the heat dissipation end 22 comprises a heat dissipation body 221, a fan B2211 is fixedly installed on one side of the heat dissipation body 221, and is used for improving the heat exchange efficiency, and the heat dissipation body 221 is fixed on the boss structure 123 through a fastening screw; a plurality of fan mounting holes 2212 are formed in one side, close to the fan B2211, of the heat radiation body 221; the heat exchange module body 2 is fixed with the electric cabin back plate 4311 through the fan mounting hole 2212, so that the connection, fixation and sealing effects with the box body 4 are realized; the semiconductor chip 23 is provided with a wiring A231 and a heating surface 230, and the temperature in the box can be raised when the box is operated by adopting the principle of exchanging the cold and hot surfaces of the semiconductor and adopting the cold surface outside the box, and the box can also be used for dehumidifying when the box is operated; the temperature overheat protector 24 is provided with a wiring B241 and a mounting hole A242; a sealing material B26 is arranged between the temperature overheat protector 24 and the cold conductor 211; the middle part of the sealing material B26 is provided with a square hole 261; one side of the square hole 261 is provided with a receding hole 262.

Preferably, as shown in fig. 1, the heating surface 230 is in contact with the heating body 221 through a ceiling structure 1111; the square hole 261 is used for assembling with the semiconductor chip 23; the relief hole 262 is used for assembling with the temperature overheat protector 24; the sealing material A3 is a Chinese character kou structure; notches 31 are symmetrically formed in the left side and the right side of the sealing material A3, and the notches 31 correspond to the boss structures 123; the sealing material A3 has through holes A32 on its upper and lower sides.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A clamping device comprises a clamping device body (1); the clamping device body (1) is arranged in the box body (4); the method is characterized in that:

the clamping device body (1) comprises a clamping front end (11) and a clamping rear end (12); two pairs of boss structures (123) are symmetrically arranged on two sides of the clamping rear end (12); (ii) a

An air duct (41), a compartment (42) and a box body outer barrel (43) are arranged in the box body (4);

an electric cabin (431) is arranged on the outer side surface of the outer barrel (43) of the box body; an electric cabin back plate (4311) is arranged in the electric cabin (431).

2. A clamping device according to claim 1, characterized in that said clamping front end (11) is a rectangular box-like structure; the card-mounting front end (11) comprises a pair of side plates A (1101); a pair of side plates B (1102) are arranged between the upper ends and the lower ends of the pair of side plates A (1101);

the bottom of the side plate A (1101) is provided with a hole (11011);

an eyelet (11021) is formed in one surface of the side plate B (1102); a clamp spring (25) is mounted on the inner wall of the eyelet (11021);

the openings of the clamping front end (11) are provided with first lead-in inclined planes (1100).

3. A card-mounting device according to claim 2, characterized in that said card-mounting front end (11) comprises an inner cavity (111); the middle part of the inner cavity (111) is fixedly provided with a one-day well head structure (1111) through a net structure;

the ceiling mouth structure (1111) comprises surrounding boards (11110); the end parts of the enclosing plates (11110) are provided with second lead-in inclined planes (111101);

the bottom of the coaming (11110) is provided with a through hole (111102); a fixed frame (1112) is arranged on one side of the wellhead structure (1111); the opening of the fixed frame (1112) is provided with a third lead-in inclined plane (11120).

4. A mounting device according to claim 3, wherein the holder (1112) comprises a peripheral flange (111201); the top wing plate (111201) is provided with a notch (1112011);

a cylindrical boss (11121) with a central hole is arranged in the fixed frame (1112); and a screw is matched with the inner wall of the cylindrical boss (11121).

5. A clamping device according to claim 2, 3 or 4, characterized in that the edges of the side plates B (1102) are provided with a plurality of claws A (121);

a pair of extending bosses (122) are fixedly connected to the outer side face of the side plate A (1101); a through hole B (1221) is formed in the middle of the extending boss (122);

a jaw B (1222) is arranged on one side face of the jaw A (121).

6. A clamping device according to claim 5, characterized in that the end of the jaw B (1222) is provided with a chamfered bevel (12321);

the jaw A (121) includes a protruding section (1211); the end part of the extending section (1211) is provided with a bending section (1212);

the root of the bending section (1212) is provided with a slope surface (12121).

7. A heat exchange module based on a clamping device, which is characterized by comprising the clamping device as claimed in any one of claims 1 to 6; a heat exchange module body (2) is matched in the clamping device; the periphery of the heat exchange module body (2) is filled with a sealing material A (3);

the heat exchange module body (2) comprises a refrigerating end (21), a heat dissipation end (22), a semiconductor chip (23) and a temperature overheat protector (24).

8. A heat exchange module based on a clamping device according to claim 7, characterized in that the refrigerating end (21) is assembled with the clamping front end (11); the heat dissipation end (22) is assembled with the clamped rear end (12);

the refrigerating end (21) comprises a cold guide body (211), and a fan A (2111) is fixedly installed on one side of the cold guide body (211); the heat dissipation end (22) comprises a heat dissipation body (221), and a fan B (2211) is fixedly installed on one side of the heat dissipation body (221);

the semiconductor chip (23) is provided with a wiring A (231) and a heating surface (230); the temperature overheat protector (24) is provided with a wiring B (241) and a mounting hole A (242);

a sealing material B (26) is arranged between the temperature overheat protector (24) and the cold conductor (211); a square hole (261) is formed in the middle of the sealing material B (26); and one side of the square hole (261) is provided with an abdicating hole (262).

9. The heat exchange module based on the clamping device as claimed in claim 8, wherein the heating surface (230) is in contact with the heat sink (221) through a ceiling opening structure (1111);

the sealing material A (3) is of a Chinese character kou structure; notches (31) are symmetrically formed in the left side and the right side of the sealing material A (3); through holes A (32) are symmetrically formed in the upper side and the lower side of the sealing material A (3).