CN112185983B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN112185983B CN112185983B CN201910521568.0A CN201910521568A CN112185983B CN 112185983 B CN112185983 B CN 112185983B CN 201910521568 A CN201910521568 A CN 201910521568A CN 112185983 B CN112185983 B CN 112185983B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention provides a display panel and a display device, the display panel includes: the array substrate comprises a light-emitting device, an array substrate and connecting glue; the array substrate is electrically connected with the light-emitting device through the first conductive block and the second conductive block, and the first conductive block is not contacted with the second conductive block; the connecting glue is arranged between the light-emitting device and the array substrate, the projection of the connecting glue on the array substrate is positioned in the projection of the bottom wall of the light-emitting device facing the array substrate on the array substrate, and the connecting glue is positioned around the first conductive block and the second conductive block; the connecting glue is used for bonding the light emitting device and the array substrate. When the display panel is manufactured, the connecting layer between the light-emitting device and the substrate is decomposed, gas is generated to push the light-emitting device to be separated from the substrate, and the connecting glue between the light-emitting device and the array substrate can support the light-emitting device, so that the light-emitting device is prevented from being damaged due to uneven stress.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a display device.
Background
With the development of display device technology, micro light emitting diodes are increasingly used in various display devices with higher brightness and longer service life.
The display panel generally includes an array substrate and a light emitting device composed of micro light emitting diodes, and when the display panel is manufactured, the micro light emitting diodes are firstly manufactured on a substrate, then the micro light emitting diodes on the substrate are connected with the array substrate, and then the substrate is separated from the micro light emitting diodes. In the process, the micro light-emitting diodes are easily stressed unevenly, so that the micro light-emitting diodes are damaged.
Disclosure of Invention
In view of this, embodiments of the present invention provide a display panel and a display device to solve the technical problem that a micro light emitting diode is easily damaged due to uneven stress during a manufacturing process.
An embodiment of the present invention provides a display panel, including: the array substrate comprises a light-emitting device, an array substrate and connecting glue; the array substrate is electrically connected with the light-emitting device through a first conductive block and a second conductive block, and the first conductive block is not in contact with the second conductive block; the connecting glue is arranged between the light-emitting device and the array substrate, the projection of the connecting glue on the array substrate is positioned in the projection of the bottom wall of the light-emitting device facing the array substrate on the array substrate, and the connecting glue is positioned around the first conductive block and the second conductive block; the connecting glue is used for bonding the light-emitting device and the array substrate.
In the display panel, preferably, the connection glue is attached to the first conductive block and the second conductive block.
The display panel as described above, preferably, the connection glue is a thermoplastic glue; preferably, the connecting glue is photoresist; preferably, the connection glue comprises polymethacrylate or polystyrene or polycarbonate.
As described above, preferably, the bottom wall of the light emitting device is provided with a first electrode and a second electrode, and the first electrode and the second electrode are not in contact with each other; the first electrode is connected to the first conductive block, and the second electrode is connected to the second conductive block.
The display panel as described above, preferably, the light emitting device has a sidewall adjacent to the bottom wall; the first electrode comprises a first contact part positioned on the bottom wall and a first extension part positioned on the side wall, and the first conductive block is connected with the first contact part and the first extension part.
As described above, preferably, the second electrode includes a second contact portion on the bottom wall and a second extension portion on the sidewall, and the second conductive block is connected to the second contact portion and the second extension portion.
As described above, in the display panel, preferably, the area of the bottom wall of the light emitting device is smaller than the area of the top wall of the light emitting device.
In the display panel as described above, preferably, the first conductive block and the second conductive block are both metal blocks.
In the display panel as described above, preferably, the first conductive bumps are soldered to the first electrodes, and the second conductive bumps are soldered to the second electrodes.
The embodiment of the invention also provides a display device, which comprises a shell and the display panel, wherein the display panel is arranged on the shell.
According to the display panel and the display device provided by the embodiment of the invention, the array substrate is electrically connected with the light-emitting device through the first conductive block and the second conductive block, the connecting glue is arranged between the light-emitting device and the array substrate, the projection of the connecting glue on the array substrate is positioned in the projection of the bottom wall of the light-emitting device on the array substrate, and the connecting glue is positioned around the first conductive block and the second conductive block; when the display panel is manufactured, the connecting glue between the light-emitting device and the array substrate can support the light-emitting device, and the light-emitting device is prevented from being damaged due to uneven stress.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a first schematic diagram illustrating a connection between a light emitting device and an array substrate in a display panel according to an embodiment of the present invention;
FIG. 2 is a top view of a display panel with first conductive bumps, second conductive bumps, and a connection paste on an array substrate according to an embodiment of the invention;
fig. 3 is a second schematic view illustrating connection between a light emitting device and an array substrate in a display panel according to an embodiment of the present invention.
Description of the reference numerals:
10: a light emitting device;
101: a first electrode layer;
102: a light emitting layer;
103: a second electrode layer;
104: a first electrode;
105: a second electrode;
106: an insulating layer;
1041: a first contact portion;
1042: a first extension portion;
1051: a second contact portion;
1052: a second extension portion;
20: an array substrate;
201: a first conductive block;
202: a second conductive block;
30: and (5) connecting glue.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The display panel generally includes an array substrate and a light emitting device formed by micro light emitting diodes, the array substrate is provided with a first metal column and a second metal column, the first metal column and the second metal column are not in contact, the light emitting device is provided with a first electrode and a second electrode, the first electrode and the second electrode are not in contact, the first metal column is connected with the first electrode in a welding manner, and the second metal column is also connected with the second electrode in a welding manner, so that the mechanical connection between the light emitting device and the array substrate is realized on the basis of realizing the electrical connection between the array substrate and the light emitting device. During preparation, the micro light-emitting diode is firstly prepared on the substrate, then the micro light-emitting diode on the substrate is welded with the array substrate, and finally laser with certain wavelength is used for irradiating the substrate to decompose a connecting layer between the substrate and the micro light-emitting diode to generate gas, so that the substrate and the micro light-emitting diode are separated.
However, when the connection layer is decomposed, the generated gas pushes the micro light emitting diode to be separated from the substrate, the cross-sectional areas of the first metal column and the second metal column are smaller, and the micro light emitting diode is easily stressed unevenly at the moment, so that the micro light emitting diode is damaged.
Fig. 1 is a first schematic diagram illustrating a connection between a light emitting device and an array substrate in a display panel according to an embodiment of the present invention; FIG. 2 is a top view of a display panel with first conductive bumps, second conductive bumps, and a connection paste on an array substrate according to an embodiment of the invention; fig. 3 is a second schematic view illustrating connection between a light emitting device and an array substrate in a display panel according to an embodiment of the present invention.
Please refer to fig. 1-3. The present embodiment provides a display panel including: a light emitting device 10, an array substrate 20, and a connection paste 30; the array substrate 20 and the light emitting device 10 are electrically connected through a first conductive block 201 and a second conductive block 202, wherein the first conductive block 201 and the second conductive block 202 are not in contact; the connection glue 30 is arranged between the light emitting device 10 and the array substrate 20, a projection of the connection glue 30 on the array substrate 20 is positioned in a projection of the bottom wall of the light emitting device 10 facing the array substrate 20 on the array substrate 20, and the connection glue 30 is positioned around the first conductive block 201 and the second conductive block 202; the connection paste 30 is used to bond the light emitting device 10 and the array substrate 20.
The light emitting device 10 in the present embodiment may be an organic light emitting device 10 or an inorganic light emitting device 10, and the present embodiment does not limit the light emitting device 10 as long as the light emitting device 10 can emit light when power is supplied to the light emitting device 10. Continuing to refer to fig. 1, by way of example, the light emitting device 10 may include an insulating layer 106, and a first electrode layer 101, a light emitting layer 102, and a second electrode layer 103, which are stacked; the insulating layer 106 is wrapped on the outer sides of the first electrode layer 101, the light emitting layer 102 and the second electrode layer 103, so that the light emitting layer 102 can be driven to emit light when the first electrode layer 101 and the second electrode layer 103 are charged.
In this embodiment, the array substrate 20 is electrically connected to the light emitting device 10 through the first conductive block 201 and the second conductive block 202, a thin film transistor is disposed in the array substrate 20, the thin film transistor is electrically connected to the first conductive block 201 and the second conductive block 202, and the first conductive block 201 and the second conductive block 202 are electrically connected to the light emitting device 10, so that the first conductive block 201 and the second conductive block 202 are controlled by the thin film transistor to supply power to the light emitting device 10, thereby implementing display of the display panel.
Illustratively, the first conductive bump 201 is electrically connected to the first electrode layer 101 on the light emitting device 10, and the second conductive bump 202 is electrically connected to the second electrode layer 103 on the light emitting device 10, so as to supply power to the light emitting device 10 through the first conductive bump 201 and the second conductive bump 202.
It should be noted that the first conductive bumps 201 and the second conductive bumps 202 may be disposed on the array substrate 20 in this embodiment, and of course, the first conductive bumps 201 and the second conductive bumps 202 may also be disposed on the light emitting devices 10 as long as the array substrate 20 can supply power to the light emitting devices 10 through the first conductive bumps 201 and the second conductive bumps 202.
In the present embodiment, the connection paste 30 is disposed between the light emitting device 10 and the array substrate 20, and the projection of the connection paste 30 on the array substrate 20 is located in the projection of the bottom wall of the light emitting device 10 on the array substrate 20, and the connection paste 30 is located around the first conductive bump 201 and the second conductive bump 202. Referring to the orientation shown in fig. 1, specifically, the top end of the first conductive bump 201 is in contact with the bottom wall of the light emitting device 10 facing the array substrate 20, and the bottom end of the first conductive bump 201 is in contact with the top surface of the array substrate 20; similarly, the top end of the second conductive bump 202 contacts the bottom wall of the light emitting device 10 facing the array substrate 20, and the bottom end of the second conductive bump 202 contacts the top surface of the array substrate 20.
In this embodiment, the connection glue 30 is located around the first conductive block 201 and the second conductive block 202, specifically, the connection glue 30 may surround the first conductive block 201 and the second conductive block 202 and contact with the first conductive block 201 and the second conductive block 202, or surround the first conductive block 201 and the second conductive block 202 but not contact with the first conductive block 201 and the second conductive block 202, and it should be noted that it is required to ensure that one surface of the connection glue 30 is attached to the light emitting device 10, and the other surface of the connection glue 30 is attached to the array substrate 20, so as to ensure that the connection glue 30 can support the light emitting device 10. In addition, the connection glue 30 bonds the light emitting device 10 to the array substrate 20, so that the connection force between the light emitting device 10 and the array substrate 20 is improved, and the light emitting device 10 is prevented from being separated from the array substrate 20.
In this embodiment, preferably, the connection glue 30 surrounds the first conductive bumps 201 and the second conductive bumps 202 and contacts the first conductive bumps 201 and the second conductive bumps 202, that is, the connection glue 30 fills the whole glue containing region, and compared with the connection glue 30 and the first conductive bumps 201 and the second conductive bumps 202 having a gap, the connection glue 30 increases the contact area between the connection glue 30 and the light emitting device 10, further supports the light emitting device 10, further increases the connection force between the light emitting device 10 and the array substrate 20, and further prevents the light emitting device 10 from being separated from the array substrate 20.
In this embodiment, the connection paste 30 may be various as long as it can bond the light emitting device 10 and the array substrate 20. Preferably, the connection glue 30 may be a thermoplastic glue. Such as: acrylate or polystyrene, etc. The viscosity of the thermoplastic adhesive is gradually reduced along with the increase of the temperature, and the thermoplastic adhesive is gradually solidified along with the reduction of the temperature, and the process can be repeatedly carried out; the connection glue 30 is a thermoplastic glue, and the viscosity of the connection glue 30 can be adjusted by changing the temperature, so that the adhesion between the array substrate 20 and the light emitting device 10 is facilitated. Of course, the connection glue 30 in this embodiment may also be a thermosetting glue, which gradually cures with the temperature, and the viscosity after curing does not change with the temperature.
When the connection glue 30 is a thermoplastic glue, in the manufacturing process, a whole layer of connection glue 30 may be formed on the bottom surface of the array substrate 20, and then a photosensitive layer is formed on the connection glue 30; then, covering a mask plate on the photosensitive layer, wherein the mask plate is provided with a light shielding part, and the projection of the light shielding part on the array substrate 20 is the same as the projection of the bottom wall of the light-emitting device 10 on the array substrate in shape; exposing the mask plate to expose the photosensitive layer outside the shading part, removing the exposed photosensitive layer and the connecting glue 30 corresponding to the exposed photosensitive layer, wherein the photosensitive layer corresponding to the shading part is not exposed and remains, the connecting glue 30 corresponding to the shading part is also stored on the array substrate 20, and then the photosensitive layer is removed; at this time, a rubber block made of the connection rubber 30 is formed on the array substrate 20, and a projection of the rubber block on the array substrate 20 completely overlaps a projection of the bottom wall of the light emitting device 10 on the array substrate 20. The first conductive block 201 and the second conductive block 202 may be pre-mounted on the light emitting device 10, at this time, the light emitting device 10 is attached to the adhesive block, the adhesive block is heated to reduce the viscosity of the adhesive block, and at the same time, the light emitting device 10 is pressed to make the first conductive block 201 and the second conductive block 202 penetrate through the adhesive block and contact the array substrate 20, and at the same time, the connection adhesive 30 is located around the first conductive block 201 and the second conductive block 202 to electrically connect the first conductive block 201 and the second conductive block 202 with the array substrate 20; after that, the temperature of the glue block is reduced to solidify the glue block, so that the light emitting device 10 and the array substrate 20 can be bonded. In the above process, the first conductive block 201 and the second conductive block 202 may also be fabricated on the top surface of the array substrate 20 in advance, and then the entire layer of connection glue 30 is formed on the top surface of the array substrate 20, at this time, the connection glue 30 surrounds the first conductive block 201 and the second conductive block 202, and then the glue block is formed by the same method, the light emitting device 10 is attached to the glue block, and the glue block is heated to reduce the viscosity of the glue block; while pressing the light emitting devices 10 to bring the light emitting devices 10 into contact with the first and second conductive bumps 201 and 202, electrical connection between the light emitting devices 10 of the first and second conductive bumps 201 and 202 is achieved.
When the connection glue 30 is a thermoplastic glue, in the manufacturing process, the connection glue 30 may also be directly formed on the bottom wall of the light emitting device 10, at this time, the first conductive block 201 and the second conductive block 202 may be formed on the array substrate 20 in advance, then the light emitting device 10 is attached to the array substrate 20, the connection glue 30 is heated and the light emitting device 10 is pressed, so that the first conductive block 201 and the second conductive block 202 penetrate through the connection glue 30 to contact with the light emitting device 10, and then the cooling and the solidification are performed. Of course, the first conductive bumps 201 and the second conductive bumps 202 may be formed on the bottom wall of the light emitting device 10 in advance.
The connection paste 30 in this embodiment may also be a photoresist. The connection paste 30 may be formed in a certain shape through a photolithography process, so that the connection paste 30 on the array substrate 20 is located in the projection of the bottom wall of the light emitting device 10 on the array substrate 20, and the connection paste 30 is located around the first conductive bump 201 and the second conductive bump 202, which simplifies the manufacturing process.
Illustratively, a full layer of connection paste 30 may be formed on the top surface of the array substrate 20; then, performing photolithography processing on the connection glue 30 to form a glue block, wherein a projection of the glue block on the array substrate 20 is located in a projection of the bottom wall of the light-emitting device 10 on the array substrate 20, the glue block has a first through hole and a second through hole, a projection of the first conductive block 201 on the array substrate 20 is located in a projection of the first through hole on the array substrate 20, and a projection of the second conductive block 202 on the array substrate 20 is located in a projection of the second through hole on the array substrate 20; then attaching the light emitting device 10 with the first conductive block 201 and the second conductive block 202 on the adhesive block, and making the first conductive block 201 penetrate through the first through hole and the second conductive block 202 penetrate through the second through hole, so that the first conductive block 201 and the second conductive block 202 are electrically connected with the array substrate 20; the connection between the light emitting device 10 and the array substrate 20 may be achieved. Wherein the lithography process comprises: the connection glue 30 is covered with a mask plate, the mask plate is provided with a shading part, the projection of the shading part on the array substrate 20 is coincided with the projection of the bottom wall of the light-emitting device 10 on the array substrate 20, the shading part is provided with a first light hole and a second light hole, the first light hole corresponds to the first conductive block 201, the second light hole corresponds to the second conductive block 202, the mask plate is exposed, and then the exposed connection glue 30 is removed to form a glue block and a first through hole and a second through hole on the glue block.
Of course, the first conductive bumps 201 and the second conductive bumps 202 may also be pre-disposed on the array substrate 20, and the connection glue 30 is formed on the top surface of the array substrate 20, where the connection glue 30 covers the array substrate 20 outside the first conductive bumps 201 and the second conductive bumps 202; then, photoetching treatment is carried out on the connecting glue 30 to form a glue block; the light emitting device 10 is attached on the connection paste 30, and the first and second conductive bumps 201 and 202 are electrically connected to the light emitting device 10 to complete the connection between the light emitting device 10 and the array substrate 20.
Further, the connection glue 30 in this embodiment may also be a photoresist having a thermoplastic property. The photoresist having thermoplasticity may be mainly composed of polymethacrylate or polystyrene or polycarbonate, etc. That is, the photoresist is capable of being subjected to a photolithography process, and the viscosity of the photoresist is reduced after heating, and the viscosity of the photoresist is still reduced by gradually solidifying the photoresist when cooling and then heating again after solidification. At this time, when the light emitting device 10 is attached to the array substrate 20, the photoresist is appropriately heated, so that the photoresist is decreased in viscosity to be completely attached to the array substrate 20 and the light emitting device 10, and then the photoresist is cooled to be cured, thereby realizing the connection between the light emitting device 10 and the array substrate 20. It should be noted that when the connection paste 30 is a thermoplastic photoresist, it is not necessary to form a first through hole and a second through hole during the photolithography process, and when the array substrate 20 and the light emitting device 10 are attached, the photoresist is heated to lower the viscosity, and then the light emitting device 10 is pressed, so that the first conductive bump 201 and the second conductive bump 202 on the light emitting device 10 can be contacted with the array substrate 20 through the optical paste.
The processing procedure of the display panel provided by this embodiment is as follows: the light emitting device 10 is connected on the base through a connection layer, and the top wall of the light emitting device 10 facing away from the array substrate 20 is connected with the connection layer; forming a first conductive block 201 and a second conductive block 202 on the array substrate 20, and forming a connection paste 30; then, attaching the light emitting device 10 to the connection glue 30 through the substrate, and electrically connecting the first conductive bumps 201 and the second conductive bumps 202 to the light emitting device 10, wherein the connection glue 30 bonds the light emitting device 10 and the array substrate 20; after that, the connection layer is decomposed by means of light irradiation, so as to generate gas, and the gas pushes the substrate to be separated from the light emitting device 10, thereby realizing the manufacture of the display panel.
In the display panel provided by the embodiment, the array substrate 20 is electrically connected to the light emitting device 10 through the first conductive bump 201 and the second conductive bump 202, the connection glue 30 is disposed between the light emitting device 10 and the array substrate 20, a projection of the connection glue 30 on the array substrate 20 is located in a projection of a bottom wall of the light emitting device 10 on the array substrate 20, and the connection glue 30 is located around the first conductive bump 201 and the second conductive bump 202; when the display panel is manufactured, the connection layer connecting the light emitting device 10 and the substrate is decomposed, and then gas is generated to push the light emitting device 10 and the substrate to be separated, and at this time, the connection glue 30 between the light emitting device 10 and the array substrate 20 supports the light emitting device 10, so that the light emitting device 10 is prevented from being damaged due to uneven stress.
In addition, the connection glue 30 bonds the light emitting device 10 and the array substrate 20, so that the connection force between the light emitting device 10 and the array substrate 20 is improved, and the light emitting device 10 is prevented from being separated from the array substrate 20.
The projection of the connection paste 30 on the array substrate 20 in this embodiment is located within the projection of the bottom wall of the light emitting device 10 on the array substrate 20. With such an arrangement, when a plurality of light emitting devices 10 are simultaneously mounted on the array substrate 20, the connection glue 30 can be prevented from entering a gap between two adjacent light emitting devices 10, so that the connection glue 10 is prevented from contacting the substrate; thereby avoiding difficulty in separating the substrate from the light emitting device 10.
With continued reference to fig. 1. In this embodiment, the bottom wall of the light emitting device 10 is provided with the first electrode 104 and the second electrode 105, and the first electrode 104 and the second electrode 105 are not in contact; the first electrode 104 is connected to the first conductive pad 201, and the second electrode 105 is connected to the second conductive pad 202. The first conductive pad 201 is connected to the light emitting device 10 through the first electrode 104, and the second conductive pad 202 is electrically connected to the light emitting device 10 through the second electrode 105.
In this embodiment, the first electrode 104 and the second electrode 105 may be made of a metal material such as silver or copper, but in this embodiment, the first electrode 104 and the second electrode 105 may be made of a non-metal material such as graphite. As long as the first electrode 104 and the second electrode 105 are ensured to be conductive.
Similarly, in this embodiment, the first conductive block 201 and the second conductive block 202 may be metal blocks mainly made of metal material such as silver and copper, but in this embodiment, the first conductive block 201 and the second conductive block 202 may also be non-metal blocks mainly made of non-metal material such as graphite. As long as the first conductive block 201 and the second conductive block 202 are ensured to be conductive.
In this embodiment, when the first conductive block 201 and the second conductive block 202 are metal blocks, the first electrode 104 and the second electrode 105 are also made of metal, and at this time, the first conductive block 201 is welded to the first electrode 104, and the second conductive block 202 is welded to the second electrode 105. The first conductive bumps 201 and the second conductive bumps 202 are connected with the light emitting device 10 by welding, so that the connection strength between the light emitting device 10 and the array substrate 20 is improved on the basis of ensuring the electrical connection.
Preferably, when the first conductive block 201 is connected to the first electrode 104 by soldering, and the second conductive block 202 is connected to the second electrode 105 by soldering, the first conductive block 201 and the second conductive block 202 may both be made of indium, and because the melting point of indium is low, damage to the light emitting device 10 or the array substrate 20 due to too high temperature during soldering may be avoided.
In this embodiment, when the connection glue 30 is a photoresist having thermoplasticity, the connection glue 30 is heated while the first conductive bumps 201 and the second conductive bumps 202 are soldered, and the connection glue 30 is bonded to the array substrate 20 and the light emitting device 10 while the soldering is completed.
With continued reference to fig. 3, in the present embodiment, the light emitting device 10 has a sidewall thereon adjacent to the bottom wall; the first electrode 104 includes a first contact portion 1041 on the bottom wall and a first extension portion 1042 on the side wall, and the first conductive block 201 is connected to the first contact portion 1041 and the first extension portion 1042. The first conductive pad 201 is connected to the first contact portion 1041 and the first extension portion 1042, so that compared with the case where the first electrode 104 is only disposed on the bottom wall of the light emitting device 10, the contact area between the first conductive pad 201 and the first electrode 104 is increased, and poor contact between the first conductive pad 201 and the first electrode 104 is avoided. In addition, when the first conductive bumps 201 are connected to the first electrodes 104 by soldering, the connection strength between the first conductive bumps 201 and the first electrodes 104 may be increased, and thus the connection strength between the light emitting device 10 and the array substrate 20 may be increased.
With continued reference to fig. 3. Further, the second electrode 105 includes a second contact 1051 on the bottom wall and a second extension 1052 on the side wall, and the second conductive block 202 is connected to the second contact 1051 and the second extension 1052. The second conductive piece 202 is connected to the second contact portion 1051 and the second extension portion 1052, so that the contact area between the second conductive piece 202 and the second electrode 105 is increased and the contact failure between the second conductive piece 202 and the second electrode 105 is avoided, compared with the case where only the bottom wall of the light emitting device 10 is disposed on the second electrode 105. In addition, when the second conductive bumps 202 and the second electrodes 105 are connected by soldering, the connection force between the second conductive bumps 202 and the second electrodes 105, and thus the connection force between the light emitting device 10 and the array substrate 20, may be increased.
With continued reference to fig. 3, the present embodiment preferably has the area of the bottom wall of the light emitting device 10 smaller than the area of the top wall of the light emitting device 10. With this arrangement, the side wall of the light emitting device 10 is disposed obliquely, and the side wall area of the light emitting device 10 can be increased as compared with the case where the side wall of the light emitting device 10 is disposed vertically; on the premise that the distance between the first extension 1042 and the bottom wall of the light emitting device 10 is equal, the inclined sidewall can increase the area of the first extension 1042 to further increase the contact area between the first conductive bump 201 and the first electrode 104; similarly, the inclined sidewall may increase the area of the second extension portion 1052 on the premise that the distance between the second extension portion 1052 and the bottom wall of the light emitting device 10 is equal, so as to further increase the contact area between the second conductive block 202 and the second electrode 105.
Illustratively, the light emitting device 10 may have a circular truncated cone shape or a truncated pyramid shape to ensure that the area of the bottom wall of the light emitting device 10 is smaller than the area of the top wall of the light emitting device 10.
Continuing with fig. 1-3. In other embodiments, a display device is also provided, which includes a housing and the display panel as described above, the display panel being disposed on the housing.
The display device can be a product or a component with a display function, such as a mobile phone, a tablet computer, a television, a display, an electronic book, electronic paper, a smart watch, a notebook computer, a digital photo frame or a navigator.
In the display apparatus provided by the embodiment, the array substrate 20 is electrically connected to the light emitting device 10 through the first conductive bump 201 and the second conductive bump 202, the connection glue 30 is disposed between the light emitting device 10 and the array substrate 20, a projection of the connection glue 30 on the array substrate 20 is located in a projection of a bottom wall of the light emitting device 10 on the array substrate 20, and the connection glue 30 is located around the first conductive bump 201 and the second conductive bump 202; when the display panel is manufactured, the connection layer connecting the light emitting device 10 and the substrate is decomposed, and then gas is generated to push the light emitting device 10 and the substrate to be separated, and at this time, the connection glue 30 between the light emitting device 10 and the array substrate 20 supports the light emitting device 10, so that the light emitting device 10 is prevented from being damaged due to uneven stress.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
It should be noted that the terms "first" and "second" in the description of the present invention are used merely for convenience in describing different components, and are not to be construed as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In the present invention, unless otherwise specifically stated, the terms "mounted," "connected," "fixed," and the like are to be understood broadly, and for example, may be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or communicable with each other; they may be directly connected or indirectly connected through an intermediate medium, or they may be connected internally or in any other manner known to those skilled in the art, unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel, comprising: the array substrate comprises a light-emitting device, an array substrate and connecting glue;
the array substrate is electrically connected with the light-emitting device through a first conductive block and a second conductive block, and the first conductive block is not in contact with the second conductive block;
the connecting glue is arranged between the light-emitting device and the array substrate, the projection of the connecting glue on the array substrate is positioned in the projection of the bottom wall of the light-emitting device facing the array substrate on the array substrate, and the connecting glue is positioned around the first conductive block and the second conductive block;
the connecting glue is used for bonding the light-emitting device and the array substrate; the connecting glue is a thermoplastic photoresist.
2. The display panel according to claim 1, wherein the connection paste is attached to the first conductive block and the second conductive block.
3. The display panel according to claim 1, wherein the connection paste comprises polymethacrylate or polystyrene or polycarbonate.
4. The display panel according to any one of claims 1 to 3, wherein a first electrode and a second electrode are provided on the bottom wall of the light-emitting device, the first electrode and the second electrode being not in contact; the first electrode is connected with the first conductive block, and the second electrode is connected with the second conductive block.
5. The display panel according to claim 4, wherein the light emitting device has a sidewall adjacent to the bottom wall; the first electrode comprises a first contact part positioned on the bottom wall and a first extension part positioned on the side wall, and the first conductive block is connected with the first contact part and the first extension part.
6. The display panel according to claim 5, wherein the second electrode comprises a second contact portion on the bottom wall and a second extension portion on the side wall, and wherein the second conductive block is connected to the second contact portion and the second extension portion.
7. The display panel according to claim 6, wherein an area of the light-emitting device bottom wall is smaller than an area of the light-emitting device top wall.
8. The display panel according to claim 4, wherein the first conductive block and the second conductive block are both metal blocks.
9. The display panel according to claim 8, wherein the first conductive block is welded to the first electrode, and wherein the second conductive block is welded to the second electrode.
10. A display device comprising a housing and the display panel according to any one of claims 1 to 9, the display panel being provided on the housing.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910521568.0A CN112185983B (en) | 2019-06-17 | 2019-06-17 | Display panel and display device |
| KR1020217039278A KR102604712B1 (en) | 2019-06-17 | 2020-02-25 | Display device, display panel and method of manufacturing the same |
| PCT/CN2020/076524 WO2020253259A1 (en) | 2019-06-17 | 2020-02-25 | Display apparatus, display panel, and method for preparing same |
Applications Claiming Priority (1)
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| CN201910521568.0A CN112185983B (en) | 2019-06-17 | 2019-06-17 | Display panel and display device |
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| CN112185983A CN112185983A (en) | 2021-01-05 |
| CN112185983B true CN112185983B (en) | 2023-03-24 |
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| KR (1) | KR102604712B1 (en) |
| CN (1) | CN112185983B (en) |
| WO (1) | WO2020253259A1 (en) |
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| CN113724597B (en) * | 2021-08-31 | 2023-11-14 | 京东方科技集团股份有限公司 | Display module and display device |
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| Publication number | Publication date |
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| CN112185983A (en) | 2021-01-05 |
| WO2020253259A1 (en) | 2020-12-24 |
| KR20210153732A (en) | 2021-12-17 |
| KR102604712B1 (en) | 2023-11-22 |
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