CN112172346A - 滴落信息实时测量装置、排出液滴实时校正装置及方法 - Google Patents

滴落信息实时测量装置、排出液滴实时校正装置及方法 Download PDF

Info

Publication number
CN112172346A
CN112172346A CN202010637399.XA CN202010637399A CN112172346A CN 112172346 A CN112172346 A CN 112172346A CN 202010637399 A CN202010637399 A CN 202010637399A CN 112172346 A CN112172346 A CN 112172346A
Authority
CN
China
Prior art keywords
drop
information
real
discharged
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010637399.XA
Other languages
English (en)
Other versions
CN112172346B (zh
Inventor
李东和
尹大建
崔在镕
孙尚郁
金大星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN112172346A publication Critical patent/CN112172346A/zh
Application granted granted Critical
Publication of CN112172346B publication Critical patent/CN112172346B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04535Control methods or devices therefor, e.g. driver circuits, control circuits involving calculation of drop size, weight or volume
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04506Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting manufacturing tolerances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04536Control methods or devices therefor, e.g. driver circuits, control circuits using history data
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0456Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04581Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04593Dot-size modulation by changing the size of the drop
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/07Ink jet characterised by jet control
    • B41J2/075Ink jet characterised by jet control for many-valued deflection
    • B41J2/095Ink jet characterised by jet control for many-valued deflection electric field-control type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/07Ink jet characterised by jet control
    • B41J2/125Sensors, e.g. deflection sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/21Ink jet for multi-colour printing
    • B41J2/2132Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
    • B41J2/2142Detection of malfunctioning nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • B41J29/393Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867Applying pastes or inks, e.g. screen printing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Ceramic Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

本发明涉及可通过反馈滴落信息来实时校正排出程度的排出液滴实时校正装置及方法。为此,本发明提供如下的排出液滴实时校正装置,即,包括:排出控制部,用于控制喷墨头的驱动;以及滴落测量部,设置于基板的下部,对向上述基板排出的液滴的滴落信息进行测量,来向上述排出控制部进行反馈,上述排出控制部利用上述滴落信息来对排出液滴的喷嘴波形进行校正。因此,本发明具有如下的优点,即,可通过同时测量滴落的位置、大小以及体积信息来实时向喷墨头部进行反馈,从而能够以头部不产生单独的移动的方式获取滴落信息。

Description

滴落信息实时测量装置、排出液滴实时校正装置及方法
技术领域
本发明涉及滴落信息实时测量装置、利用其的排出液滴实时校正装置及方法,具体地,涉及可通过反馈滴落信息来对排出程度实时进行校正的滴落信息实时测量装置、利用其的排出液滴实时校正装置及方法。
背景技术
为了制造液晶显示器(LCD)等的显示装置,在形成配向膜或涂敷紫外光固化(UV)墨水或在基板上涂敷滤色器等的情况下,通常会使用喷墨设备来排出液滴。
这种喷墨设备包括用于排出液滴的头部、用于向上述头部供给液滴的墨水罐等,其中,由于通过喷嘴喷射液滴的头部需按准确的排出量向准确的位置喷射液滴,因而需得到精密控制。
尤其,由于近来需按微细图案排出液滴,因而对于排出量提出了达到高水平的精密度。
根据图1所示的公开专利第10-2017-0133799号,喷墨头10包括:下部组件13,喷嘴23配置于上述下部组件13;以及上部组件11,与储存部相连接,向喷嘴供给液滴。
并且,在上部组件11设置根据所施加的电压的大小来决定上述液滴的排出量的压电器19。
在这种喷墨装置中,墨水滴落的位置和大小信息可通过线扫描摄像机(Line ScanCamera)、玻璃视角摄像机(Glass View Camera)等的测量来获取,体积信息可通过墨滴观测仪(Drop Watcher)、激光多普勒仪(Laser Doppler Measurement)等的测量来获取。
但是,由于无法同时获取墨水滴落的位置、大小及体积信息,因而需要进行互相完善这种信息的追加性的作业,因此无法实时获取墨水滴落的位置、大小及体积信息。
并且,为了实现获取如上所述的信息所需的测量,需通过使喷墨头部进行移动来实现测量,这种测量方法存在增加总生产时间并导致生产率下降的问题。
发明内容
本发明用于解决如上所述的问题,具体地,通过实时获取从喷嘴排出的液滴的滴落信息来对从喷墨头排出液滴的形态进行校正。
并且,本发明的目的在于,通过同时测量滴落的位置、大小及体积信息来向喷墨头部进行反馈。
为了实现上述目的,本发明提供一种滴落信息实时测量装置,包括滴落测量部,滴落测量部设置于基板的下部,用于对从喷墨头向上述基板排出的液滴的滴落信息进行测量,其特征在于,上述滴落测量部包括配置有多个传感器的传感器模块,上述滴落测量部利用通过上述传感器模块测量的信息来测量滴落位置、滴落大小以及滴落体积。
优选地,上述滴落测量部利用检测到滴落的传感器的数量来测量滴落大小。
优选地,上述滴落测量部包括矩阵形态的压力传感器模块,利用上述矩阵的节点信息来计算滴落位置、滴落大小以及滴落体积。
优选地,上述节点信息包含各个节点的坐标、所检测的压力值。
优选地,上述滴落测量部可包括至少一对电极传感器模块,可根据由设置于上述电极传感器模块的电极传感器产生的电场的变化,来计算具有导电性的液滴的滴落位置、滴落大小以及滴落体积。
上述电极传感器模块包括信号电极及接地电极,借助施加于上述信号电极的球形波,来在上述信号电极与上述接地电极之间形成以上述基板作为介质产生变化的电场。
并且,本发明提供一种排出液滴实时校正装置,上述排出液滴实时校正装置包括:排出控制部,用于控制喷墨头的驱动;以及滴落测量部,设置于基板的下部,对向上述基板排出的液滴的滴落信息进行测量,来向上述排出控制部进行反馈,上述排出控制部利用上述滴落信息来对排出液滴的喷嘴波形进行校正。
上述滴落测量部可利用检测到滴落的传感器的数量来计算滴落大小。
优选地,上述滴落测量部包括矩阵形态的压力传感器模块,利用上述矩阵的节点信息来计算滴落位置、滴落大小以及滴落体积并进行映射。上述节点信息包含各个节点的坐标、所检测的压力值。
优选地,上述滴落测量部向排出控制部传送经过上述映射的信息,上述排出控制部对预先存储的数据和经过上述映射的信息进行比较并利用因不同之处而产生的结果值来控制喷墨头的排出量。
上述滴落测量部可利用上述矩阵的节点中的检测到滴落的节点的数量来计算滴落大小。
优选地,上述滴落测量部将滴落到每个像素的液滴的数量检测成每个像素的滴落数量,来向排出控制部传送,上述排出控制部在对上述每个像素的滴落数量和预先存储的基准数量进行比较之后利用结果值来控制喷墨头。
优选地,上述滴落测量部包括至少一对电极传感器模块,根据因设置于上述电极传感器模块的电极传感器而产生的电场的变化来计算具有导电性的液滴的滴落位置、滴落大小以及滴落体积并映射。
上述电极传感器模块可包括信号电极及接地电极,可借助施加于上述信号电极的球形波,来在上述信号电极与上述接地电极之间形成以上述基板作为介质产生变化的电场。
本发明还提供一种排出液滴实时校正方法,即,包括:向喷墨头的下方移送基板的步骤;使滴落测量部位于上述基板的下部的步骤;从上述喷墨头向基板排出液滴的步骤;通过上述滴落测量部对向上述基板排出的液滴的滴落信息进行测量的步骤;以及滴落测量部利用上述滴落信息来向排出控制部反馈能对从喷墨头排出的液滴的大小进行控制的信号的步骤。
优选地,上述滴落测量部包括矩阵形态的压力传感器,利用上述矩阵的节点信息来计算滴落位置、滴落大小以及滴落体积。
优选地,上述节点信息包含各个节点的坐标、所检测的压力值。
优选地,上述滴落测量部包括至少一对电极传感器模块,
根据由设置于上述电极传感器模块的电极传感器产生的电场的变化,来计算具有导电性的液滴的滴落位置、滴落大小以及滴落体积并进行映射。
优选地,还包括上述排出控制部通过对设定数据和从上述滴落测量部得到的反馈进行比较来判断是否实现排出校正的步骤。
优选地,上述设定数据包含液滴的大小、排出速度、对每个像素排出的液滴的数量、排出位置。
本发明具有如下的优点,即,可通过同时测量滴落位置、大小及体积信息来实时向喷墨头部进行反馈,从而能够以头部不产生单独的移动的方式获取滴落信息。
并且,本发明具有如下的优点,即,可通过获取从喷嘴排出的液滴的滴落信息来实时控制从喷墨头排出的液滴的大小。
附图说明
图1为示出现有技术的喷墨头的结构的结构图。
图2为示出本发明的排出液滴实时校正装置的结构的结构图。
图3为示出图2中的压力传感器模块的结构的结构图。
图4为用于说明图3中所示的滴落大小的计算方法的例示图。
图5及图6为示出本发明的排出液滴实时校正装置的另一实施例的例示图。
图7为示出本发明的排出液滴实时校正方法的流程图。
具体实施方式
参照附图,详细说明本发明实施例的结构及作用。
参照图2,本发明的排出液滴实时校正装置包括滴落测量部200及排出控制部320。
在本实施例中,上述滴落测量部200包括压力传感器模块210。上述压力传感器模块210包括矩阵形态的压力传感器,通过设置于基板下方来获取向基板上排出的液滴的滴落信息。
在本实施例中,基板100可使用用于制造液晶显示装置等的透明基板或用于制造有机电致发光(EL)显示装置等的基板等多种基板,例如,可使用聚萘二甲酸乙二醇酯(PEN,Polyethylene naphthalate)、聚对苯二甲酸乙二醇酯(PET,Polyethleneterephthalate)、聚醚砜(PES,Polyether sulfone)、聚酰亚胺(PI,Polyimide)、玻璃(Glass)等的基板。
上述基板设置于压力传感器模块210的上部,通过喷墨装置来以预先设定的形状向基板上排出化学液体。
在上述基板100上形成构成像素的像素隔板110,来呈现光学三原色(RGB)各自的颜色。
参照图3,压力传感器模块210使得压力传感器按矩阵形态配置于各个节点,基于由这些压力传感器获取的节点信息来在滴落测量部200计算液滴是否滴落到基板、滴落大小以及滴落体积。上述节点信息包括各个节点的坐标、所检测到的压力值等。
具体地,当压力传感器以5μm的间隔形成压力传感器模块210时,如图4所示,若有6个压力传感器检测到从喷墨头排出的液滴,则滴落位置可定为上述6个节点的坐标值的平均或最接近平均的节点的位置。并且,滴落大小S可计算成5×10=50μm2
而且,若由上述6个压力传感器测量的压力值分别为P1、P2、P3、P4、P5、P6,则滴落测量部200可将通过上述6个压力传感器检测到的压力值的平均计算成如下方式。
PA=(P1+P2+P3+P4+P5+P6)/6
若将化学液体的质量设定为m,将密度设定为ρ,将体积设定为V,则形成如下关系式。
PA×S=mg=ρVg
因而,滴落体积V=(PA×S)/ρg。
在滴落测量部200中,将执行以使通过如上所述的方式计算的滴落信息与矩阵上的相应位置相对应的方式进行显示的映射,即,执行以使滴落位置、滴落大小及滴落体积与矩阵上的相应位置相对应的方式进行显示的映射。这种滴落信息可在映射时被数值化并存储。
在滴落测量部中执行的这种测量应先以基板所受到的压力作为基础来测量,例如,在排出化学液体之前,先将基板的压力值存储为初始压力值,利用从排出化学液体后由压力传感器模块检测到的压力值减去所存储的初始压力值之后的值来计算滴落信息。
滴落测量部200将在执行映射作业后向排出控制部320传送映射信息。在排出控制部320中,通过对预先存储于存储部的设定数据和从滴落测量部传送的映射信息进行比较来计算因不同之处而产生的结果值,并利用上述结果值控制喷墨头。
具体地,存储部中存储应根据作业种类排出的液滴的大小、排出速度、对每个像素排出的液滴的数量、排出位置等的设定数据。并且,若喷墨装置开始启动,则排出控制部320以存储于存储部的设定数据为基础来驱动压电器件并排出化学液体。
在喷墨装置启动的过程中,在滴落测量部200计算所排出的液滴的滴落信息,生成映射信息并重新向排出控制部320进行反馈,在排出控制部通过从基于设定数据的滴落位置及滴落大小减去由排出控制部反馈的滴落位置及滴落大小来计算两者之差。
例如,在从基于设定数据的滴落大小减去所反馈的滴落大小的结果值为负数的情况下,排出控制部减弱压电器件的驱动来使排出大小变小。在此情况下,通过以达到上述结果值的大小的方式调节压电器件的驱动,来调节喷嘴的波形,精密地校正化学液体的排出量。
对于滴落位置而言,在排出控制部中,以与计算滴落大小的方法相同的方法通过从基于设定数据的滴落位置的坐标减去所反馈的滴落位置的坐标来计算两者之差的向量,基于上述两者之差的向量来控制喷墨头的移动,从而精密地校正排出位置。
上述滴落测量部200可利用压力传感器模块来计算滴落位置、滴落大小、滴落体积及每个像素的滴落数量。
上述每个像素的滴落数量意味着滴落到一个像素的液滴的数量,在滴落测量部测量向压力传感器施加压力的次数,来检测每个像素的滴落数量并向排出控制部传送上述每个像素的滴落数量。
在排出控制部中,对存储于设定数据的向每个像素排出的液滴的数量和从排出控制部反馈的每个像素的滴落数量进行比较,在比较结果为存在不同的情况下,对两者之差进行校正。
接着,对滴落测量部的另一实施例进行说明。
参照图5,滴落测量部可设置有其他方式的传感器模块,在本实施例中,上述滴落测量部至少包括一对电极传感器模块250、251。
上述电极传感器模块250、251以矩阵形态配置,通过设置于基板下方来获取向基板上排出的液滴的滴落信息。
具体地,上述电极传感器模块包括信号电极250及接地电极251,在滴落测量部200中,向上述信号电极250施加球形波。这样,在信号电极250与接地电极251之间形成以基板100作为介质产生变化的电场,将形成位移电流(displacement current)。
在此情况下,若具有导电性的液滴从喷墨头滴落到基板上,则电场将以图6所示的方式产生变化,两个电极之间的静电容量及位移电流也变得不同,可在滴落测量部200判断液滴是否滴落到相应位置。
并且,在以矩阵形态配置的电极传感器中判断是否在几个电极检测到滴落并由此计算滴落大小,还可通过之前说明的方法计算滴落体积。为了计算上述滴落大小,判断是否在相邻的几个电极检测到滴落,在由未相邻的互相隔开的电极检测到滴落的情况下,优选地,判断为独立的滴落。
接着,参照图7对本发明的排出液滴实时校正方法进行说明。
若基板被移送,则上述基板将设置于压力传感器模块或电极传感器模块的上方,若基板设置于准确位置,则滴落测量部将进行初始化。即,基于基板本身的压力信息将存储于滴落测量部,这种基板自身的压力信息将被设置为0。
若初始化步骤结束,则从滴落测量部向排出控制部传送初始化结束信号,若排出控制部接收上述初始化结束信号,则读取存储于存储部的设定数据并以设定数据为基础来驱动喷墨头。这种设定数据可包括液滴的大小、排出速度、向每个像素排出的液滴的数量、排出位置等的数据。
若基于设定数据来从喷墨头排出化学液体,则滴落测量部将测量滴落到基板的液滴的滴落信息。这种滴落信息可包括滴落位置、滴落大小、滴落体积、每个像素的滴落数量等的信息。
在滴落测量部中,以所测量的滴落信息为基础,生成与矩阵相对应的位置的映射信息,从而向排出控制部进行反馈。
排出控制部从滴落测量部接收反馈来对设定数据和反馈数据进行比较,由此判断是否实现排出校正。在此情况下,还通过设定数据与反馈数据之间的差值来判断进行校正的大小。
如上所述,在本实施例中,通过排出控制部来实时校正化学液体排出量或排出方法等,因而可在喷墨头不产生移动的情况下实现精密的控制。
以上,参照本发明的实施例进行了说明,但只要是本发明所属技术领域的普通技术人员就能够理解,可在不脱离记载于发明要求保护范围的本发明的思想及领域的范围内对本发明实施多种修改及变更。

Claims (20)

1.一种滴落信息实时测量装置,包括滴落测量部,滴落测量部设置于基板的下部,用于对从喷墨头向上述基板排出的液滴的滴落信息进行测量,其特征在于,
上述滴落测量部包括配置有多个传感器的传感器模块,
上述滴落测量部利用通过上述传感器模块测量的信息来测量滴落位置、滴落大小以及滴落体积。
2.根据权利要求1所述的滴落信息实时测量装置,其特征在于,上述滴落测量部利用检测到滴落的传感器的数量来测量滴落大小。
3.根据权利要求1所述的滴落信息实时测量装置,其特征在于,
上述滴落测量部包括矩阵形态的压力传感器模块,
利用上述矩阵的节点信息来计算滴落位置、滴落大小以及滴落体积。
4.根据权利要求3所述的滴落信息实时测量装置,其特征在于,上述节点信息包含各个节点的坐标、所检测的压力值。
5.根据权利要求1所述的滴落信息实时测量装置,其特征在于,
上述滴落测量部包括至少一对电极传感器模块,
根据由设置于上述电极传感器模块的电极传感器产生的电场的变化,来计算具有导电性的液滴的滴落位置、滴落大小以及滴落体积。
6.根据权利要求5所述的滴落信息实时测量装置,其特征在于,
上述电极传感器模块包括信号电极及接地电极,
借助施加于上述信号电极的球形波,来在上述信号电极与上述接地电极之间形成以上述基板作为介质产生变化的电场。
7.一种排出液滴实时校正装置,其特征在于,
包括:
排出控制部,用于控制喷墨头的驱动;以及
滴落测量部,设置于基板的下部,对向上述基板排出的液滴的滴落信息进行测量,来向上述排出控制部进行反馈,
上述排出控制部利用上述滴落信息来对排出液滴的喷嘴波形进行校正。
8.根据权利要求7所述的排出液滴实时校正装置,其特征在于,上述滴落测量部利用检测到滴落的传感器的数量来计算滴落大小。
9.根据权利要求7所述的排出液滴实时校正装置,其特征在于,
上述滴落测量部包括矩阵形态的压力传感器模块,
利用上述矩阵的节点信息来计算滴落位置、滴落大小以及滴落体积并进行映射。
10.根据权利要求9所述的排出液滴实时校正装置,其特征在于,上述节点信息包含各个节点的坐标、所检测的压力值。
11.根据权利要求9所述的排出液滴实时校正装置,其特征在于,
上述滴落测量部向排出控制部传送经过上述映射的信息,
上述排出控制部对预先存储的数据和经过上述映射的信息进行比较并利用因不同之处而产生的结果值来控制喷墨头的排出量。
12.根据权利要求9所述的排出液滴实时校正装置,其特征在于,
上述滴落测量部将滴落到每个像素的液滴的数量检测成每个像素的滴落数量,来向排出控制部传送,
上述排出控制部在对上述每个像素的滴落数量和预先存储的基准数量进行比较之后利用结果值来控制喷墨头。
13.根据权利要求7所述的排出液滴实时校正装置,其特征在于,
上述滴落测量部包括至少一对电极传感器模块,
根据因设置于上述电极传感器模块的电极传感器而产生的电场的变化来计算具有导电性的液滴的滴落位置、滴落大小以及滴落体积并映射。
14.根据权利要求13所述的排出液滴实时校正装置,其特征在于,
上述电极传感器模块包括信号电极及接地电极,
借助施加于上述信号电极的球形波,来在上述信号电极与上述接地电极之间形成以上述基板作为介质产生变化的电场。
15.一种排出液滴实时校正方法,其特征在于,包括:
向喷墨头的下方移送基板的步骤;
使滴落测量部位于上述基板的下部的步骤;
从上述喷墨头向基板排出液滴的步骤;
通过上述滴落测量部对向上述基板排出的液滴的滴落信息进行测量的步骤;以及
滴落测量部利用上述滴落信息来向排出控制部反馈能对从喷墨头排出的液滴的大小进行控制的信号的步骤。
16.根据权利要求15所述的排出液滴实时校正方法,其特征在于,
上述滴落测量部包括矩阵形态的压力传感器,
利用上述矩阵的节点信息来计算滴落位置、滴落大小以及滴落体积。
17.根据权利要求16所述的排出液滴实时校正方法,其特征在于,上述节点信息包含各个节点的坐标、所检测的压力值。
18.根据权利要求15所述的排出液滴实时校正方法,其特征在于,
上述滴落测量部包括至少一对电极传感器模块,
根据由设置于上述电极传感器模块的电极传感器产生的电场的变化,来计算具有导电性的液滴的滴落位置、滴落大小以及滴落体积并进行映射。
19.根据权利要求15所述的排出液滴实时校正方法,其特征在于,还包括上述排出控制部通过对设定数据和从上述滴落测量部得到的反馈进行比较来判断是否实现排出校正的步骤。
20.根据权利要求19所述的排出液滴实时校正方法,其特征在于,上述设定数据包含液滴的大小、排出速度、对每个像素排出的液滴的数量、排出位置。
CN202010637399.XA 2019-07-05 2020-07-03 滴落信息实时测量装置、排出液滴实时校正装置及方法 Active CN112172346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0081480 2019-07-05
KR1020190081480A KR102281475B1 (ko) 2019-07-05 2019-07-05 실시간 탄착정보계측장치 및 그것을 이용한 실시간 토출액적보정장치 및 방법

Publications (2)

Publication Number Publication Date
CN112172346A true CN112172346A (zh) 2021-01-05
CN112172346B CN112172346B (zh) 2024-01-02

Family

ID=73919208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010637399.XA Active CN112172346B (zh) 2019-07-05 2020-07-03 滴落信息实时测量装置、排出液滴实时校正装置及方法

Country Status (3)

Country Link
US (1) US11390071B2 (zh)
KR (1) KR102281475B1 (zh)
CN (1) CN112172346B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113108834A (zh) * 2021-04-06 2021-07-13 北京工业大学 基于电流测量和光学颗粒计数的静电喷射状态检测方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024515471A (ja) * 2021-03-25 2024-04-10 ストラタシス リミテッド 噴射特性を測定するための方法及びシステム
KR20230141383A (ko) 2022-03-31 2023-10-10 주식회사 나래나노텍 액적 탄착 오차 보상 방법 및 액적 탄착 오차 보상 시스템

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299275B1 (en) * 1999-07-14 2001-10-09 Hewlett-Packard Company Thermal drop detector and method of thermal drop detection for use in inkjet printing devices
US20040056917A1 (en) * 2001-07-25 2004-03-25 Wen-Li Su Ink drop detector configurations
KR20050121937A (ko) * 2004-06-23 2005-12-28 주식회사 탑 엔지니어링 액정토출장치 및 액정 토출량 제어방법
KR100781997B1 (ko) * 2006-08-21 2007-12-06 삼성전기주식회사 잉크젯 헤드의 캘리브레이션 방법 및 그 장치
CN101898456A (zh) * 2009-05-28 2010-12-01 精工爱普生株式会社 液滴排出装置及其控制方法
CN108944045A (zh) * 2017-12-25 2018-12-07 广东聚华印刷显示技术有限公司 喷墨打印方法、装置、存储介质和计算机设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6315383B1 (en) * 1999-12-22 2001-11-13 Hewlett-Packard Company Method and apparatus for ink-jet drop trajectory and alignment error detection and correction
US6575550B1 (en) * 2002-01-30 2003-06-10 Hewlett-Packard Development Company Determining performance of a fluid ejection device
KR20130035392A (ko) * 2011-09-30 2013-04-09 삼성전기주식회사 액적 검사 장치 및 그 동작 방법
KR102533210B1 (ko) 2016-05-26 2023-05-16 세메스 주식회사 액적 토출 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299275B1 (en) * 1999-07-14 2001-10-09 Hewlett-Packard Company Thermal drop detector and method of thermal drop detection for use in inkjet printing devices
US20040056917A1 (en) * 2001-07-25 2004-03-25 Wen-Li Su Ink drop detector configurations
KR20050121937A (ko) * 2004-06-23 2005-12-28 주식회사 탑 엔지니어링 액정토출장치 및 액정 토출량 제어방법
KR100781997B1 (ko) * 2006-08-21 2007-12-06 삼성전기주식회사 잉크젯 헤드의 캘리브레이션 방법 및 그 장치
CN101898456A (zh) * 2009-05-28 2010-12-01 精工爱普生株式会社 液滴排出装置及其控制方法
CN108944045A (zh) * 2017-12-25 2018-12-07 广东聚华印刷显示技术有限公司 喷墨打印方法、装置、存储介质和计算机设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113108834A (zh) * 2021-04-06 2021-07-13 北京工业大学 基于电流测量和光学颗粒计数的静电喷射状态检测方法
CN113108834B (zh) * 2021-04-06 2022-08-02 北京工业大学 基于电流测量和光学颗粒计数的静电喷射状态检测方法

Also Published As

Publication number Publication date
CN112172346B (zh) 2024-01-02
US20210001624A1 (en) 2021-01-07
KR20210004689A (ko) 2021-01-13
KR102281475B1 (ko) 2021-07-23
US11390071B2 (en) 2022-07-19

Similar Documents

Publication Publication Date Title
CN112172346B (zh) 滴落信息实时测量装置、排出液滴实时校正装置及方法
JP4093167B2 (ja) 液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器
JP4635842B2 (ja) 吐出パターンデータ補正方法、吐出パターンデータ補正装置、液滴吐出装置、並びに電気光学装置の製造方法
US20060092436A1 (en) Methods and apparatus for inkjet printing of color filters for displays
JP2008145625A (ja) 描画システム、液状体の描画方法、カラーフィルタの製造方法、有機el素子の製造方法
JP2004337725A (ja) 液滴吐出装置、電気光学装置の製造方法、電気光学装置、電子機器および基板
JP2008209218A (ja) 着弾ドット測定方法および着弾ドット測定装置、並びに液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器
JP2006159116A (ja) ワークギャップ調整方法、ワークギャップ調整装置、液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器
TW201103648A (en) Droplet discharge method and droplet discharge device
US10847723B2 (en) Droplet discharge method, program, manufacturing method of organic el device, forming method of color filter
JP4702287B2 (ja) 液滴吐出装置、機能膜形成方法、液晶配向膜形成装置及び液晶表示装置の液晶配向膜形成方法
JP2004337726A (ja) 液滴吐出装置、電気光学装置の製造方法、電気光学装置、電子機器および基板
JP2004337727A (ja) 液滴吐出装置、電気光学装置の製造方法、電気光学装置、電子機器および基板
JP2006167544A (ja) 機能液滴吐出ヘッドの吐出量測定方法、機能液滴吐出ヘッドの駆動制御方法、機能液滴吐出ヘッドの吐出量測定装置、液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器
US8016377B2 (en) Inkjet recording apparatus
JP6519013B2 (ja) インクジェット印刷装置
JP2010115650A (ja) 吐出パターンデータ補正方法
US20210229423A1 (en) Liquid discharge method, non-transitory computer-readable storage medium storing drive pulse determination program, and liquid discharge apparatus
KR20090011589A (ko) 잉크젯 장치, 잉크젯 장치의 구동방법 및 이를 이용한표시장치의 제조방법
CN114523772A (zh) 喷墨打印方法、打印基板及喷墨打印装置
KR20080061776A (ko) 잉크젯 헤드에서 분사된 잉크의 드롭량을 균일하게 하는방법, 표시 기판의 패턴 형성 방법 및 장치
JP5355060B2 (ja) インクジェット塗布装置及び塗布体の製造方法
US20230060390A1 (en) Image formation method and image formation apparatus
JP5152041B2 (ja) 液滴吐出装置、液滴吐出方法、及びカラーフィルターの製造方法
US11504965B2 (en) Liquid discharge method, non-transitory computer-readable storage medium storing drive pulse determination program, and liquid discharge apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant