CN112164733A - 一种太阳能电池扩散深结制备方法 - Google Patents
一种太阳能电池扩散深结制备方法 Download PDFInfo
- Publication number
- CN112164733A CN112164733A CN202010921289.6A CN202010921289A CN112164733A CN 112164733 A CN112164733 A CN 112164733A CN 202010921289 A CN202010921289 A CN 202010921289A CN 112164733 A CN112164733 A CN 112164733A
- Authority
- CN
- China
- Prior art keywords
- preparing
- solar cell
- flow rate
- follows
- deep junction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 238000000151 deposition Methods 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 13
- 239000011574 phosphorus Substances 0.000 claims abstract description 13
- 230000008021 deposition Effects 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000004437 phosphorous atom Chemical group 0.000 claims abstract description 5
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 4
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 4
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 4
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 4
- 230000000295 complement effect Effects 0.000 claims abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 40
- 229910052757 nitrogen Inorganic materials 0.000 claims description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/03529—Shape of the potential jump barrier or surface barrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明涉及太阳能电池生产领域。一种太阳能电池扩散深结制备方法,步骤一、制备一层SiO2层;步骤二、通过两次沉积在硅片表面制备恒定杂质磷源;步骤三、将磷原子推进至硅片内,形成PN结;步骤四、进行补扩散;步骤五、制备后氧化层;步骤六、在硅片表面再次沉积杂质磷源。步骤一前制备减反射绒面。本发明的有益效果是:在不改变整体方阻及工艺时间的情况下,有效增加PN结深和结区磷浓度差,提高电池片Uoc及FF,从而提高电池转换效率。
Description
技术领域
本发明涉及太阳能电池生产领域。
背景技术
扩散工艺是指通过高温扩散炉在P型硅片内掺杂磷原子形成PN结。目前扩散工艺主要为浅结工艺,优点为短波相应好,可以提高电池短路电流,缺点是做成组件后会有一部分电流损失,组件CTM值较低。随着原材料硅片工艺的不断进步,硅片少子寿命越来越好,提高电池短路电流已不在是难题。因此需要通过优化扩散工艺,提高PN结深度及结区浓度差,以提高电池Uoc及FF,从而提高电池转换效率。
发明内容
本发明所要解决的技术问题是:如何通过优化扩散工艺,提高PN结深度及结区浓度差。
本发明所采用的技术方案是:一种太阳能电池扩散深结制备方法,扩散制节步骤按照如下的步骤进行
步骤一、制备一层SiO2层;
步骤二、通过两次沉积在硅片表面制备恒定杂质磷源;
步骤三、将磷原子推进至硅片内,形成PN结;
步骤四、进行补扩散;
步骤五、制备后氧化层;
步骤六、在硅片表面再次沉积杂质磷源。
步骤一前制备减反射绒面。
步骤一中的工艺参数为:氧气流量600-1000sccm,氮气流量400-1000sccm,时间180-300s,压力100-150mbar,反应温度780-790℃。
步骤二中的工艺参数为:第1次沉积,小氮流量700-1000sccm,氮气流量600-1000sccm,氧气流量400-600sccm,时间180-250s,压力100-150mbar,反应温度780-790℃;第2次沉积温度为790-800℃,其余条件和第1此沉积一样。
步骤三中的工艺参数为:温度850-870℃,氮气流量1500-2000sccm,压力100-150mbar,时间900-1100s。
步骤四中的工艺参数为:降温至815-825℃进行补扩,小氮流量700-1000sccm,氮气流量600-1000sccm,氧气流量400-600sccm,时间60-120s,压力100-150mbar。
步骤五中的工艺参数为:氧气流量600-1000sccm,氮气流量400-1000sccm,时间400-500s,压力100-150mbar,反应温度790-800℃。
步骤六中的工艺参数为:小氮流量700-1000sccm,氮气流量600-1000sccm,氧气流量400-600sccm,时间300-400s,压力100-150mbar,反应温度790-800℃。
本发明的有益效果是:在不改变整体方阻及工艺时间的情况下,有效增加PN结深和结区磷浓度差,提高电池片Uoc及FF,从而提高电池转换效率。本发明PN结深度为0.26-0.3um,结区磷表面浓度差为1.6*1020-1.8*1020/cm3,方阻为130-150 Ohm。
具体实施方式
使用清洗制绒工艺,去除硅片损伤层,制备减反射绒面。
使用扩散炉在硅片表面制备一层SiO2层,氧气流量600sccm,氮气流量700sccm,时间300s,压力100mbar,反应温度780℃。
在硅片表面沉积恒定杂质磷源,第1次沉积:小氮流量800sccm,氮气流量600sccm,氧气流量500sccm,时间200s,压力100mbar,反应温度790℃;第2次沉积温度为800℃,其余条件和第1次沉积一样。备注:小氮为PClO3携带气体。
将反应生产的磷原子推进至硅片内,形成PN结。温度865℃,氮气流量1500sccm,压力100mbar,时间1000s。
降温至820℃并补扩,小氮流量700sccm,氮气流量600sccm,氧气流量500sccm,时间120s,压力100mbar。
制备后氧化层,氧气流量1000sccm,氮气流量6000sccm,时间400s,压力100mbar,反应温度790℃。
在硅片表面再次沉积杂质磷源,小氮流量700sccm,氮气流量600sccm,氧气流量500sccm,时间400s,压力100mbar,反应温度790℃。再次沉积杂质磷源起到聚杂降低结区磷表面浓度差,同时增加深度PN结深度。
Claims (8)
1.一种太阳能电池扩散深结制备方法,其特征在于:扩散制节步骤按照如下的步骤进行
步骤一、制备一层SiO2层;
步骤二、通过两次沉积在硅片表面制备恒定杂质磷源;
步骤三、将磷原子推进至硅片内,形成PN结;
步骤四、进行补扩散;
步骤五、制备后氧化层;
步骤六、在硅片表面再次沉积杂质磷源。
2.根据权利要求1所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤一前制备减反射绒面。
3.根据权利要求2所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤一中的工艺参数为:氧气流量600-1000sccm,氮气流量400-1000sccm,时间180-300s,压力100-150mbar,反应温度780-790℃。
4.根据权利要求3所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤二中的工艺参数为:第1次沉积,小氮流量700-1000sccm,氮气流量600-1000sccm,氧气流量400-600sccm,时间180-250s,压力100-150mbar,反应温度780-790℃;第2次沉积温度为790-800℃,其余条件和第1此沉积一样。
5.根据权利要求4所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤三中的工艺参数为:温度850-870℃,氮气流量1500-2000sccm,压力100-150mbar,时间900-1100s。
6.根据权利要求5所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤四中的工艺参数为:降温至815-825℃进行补扩,小氮流量700-1000sccm,氮气流量600-1000sccm,氧气流量400-600sccm,时间60-120s,压力100-150mbar。
7.根据权利要求6所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤五中的工艺参数为:氧气流量600-1000sccm,氮气流量400-1000sccm,时间400-500s,压力100-150mbar,反应温度790-800℃。
8.根据权利要求7所述的一种太阳能电池扩散深结制备方法,其特征在于:步骤六中的工艺参数为:小氮流量700-1000sccm,氮气流量600-1000sccm,氧气流量400-600sccm,时间300-400s,压力100-150mbar,反应温度790-800℃。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010921289.6A CN112164733A (zh) | 2020-09-04 | 2020-09-04 | 一种太阳能电池扩散深结制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010921289.6A CN112164733A (zh) | 2020-09-04 | 2020-09-04 | 一种太阳能电池扩散深结制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112164733A true CN112164733A (zh) | 2021-01-01 |
Family
ID=73857597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010921289.6A Withdrawn CN112164733A (zh) | 2020-09-04 | 2020-09-04 | 一种太阳能电池扩散深结制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112164733A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113257954A (zh) * | 2021-04-20 | 2021-08-13 | 山西潞安太阳能科技有限责任公司 | 一种解决碱抛se-perc电池el不良的方法 |
CN114497283A (zh) * | 2022-02-07 | 2022-05-13 | 通威太阳能(安徽)有限公司 | 一种用于硅片的扩散方法及光伏硅片 |
-
2020
- 2020-09-04 CN CN202010921289.6A patent/CN112164733A/zh not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113257954A (zh) * | 2021-04-20 | 2021-08-13 | 山西潞安太阳能科技有限责任公司 | 一种解决碱抛se-perc电池el不良的方法 |
CN114497283A (zh) * | 2022-02-07 | 2022-05-13 | 通威太阳能(安徽)有限公司 | 一种用于硅片的扩散方法及光伏硅片 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110164759B (zh) | 一种区域性分层沉积扩散工艺 | |
CN109449246B (zh) | 一种硅晶体片磷扩散方法 | |
CN107681018B (zh) | 一种太阳能电池片的低压氧化工艺 | |
CN111192935B (zh) | 一种管式perc太阳能电池背钝化结构及其制备方法 | |
CN109004038B (zh) | 太阳能电池及其制备方法和光伏组件 | |
JP2012506629A (ja) | 半導体デバイス製造方法、半導体デバイス、及び半導体デバイス製造設備 | |
CN112164733A (zh) | 一种太阳能电池扩散深结制备方法 | |
CN109103081A (zh) | 一种晶体硅太阳能电池的扩散工艺 | |
CN110106493B (zh) | 利用管式pecvd设备制备背面钝化膜的方法 | |
CN115000246B (zh) | P型钝化接触电池制备方法及钝化接触电池 | |
CN116190498B (zh) | 制备隧穿氧化层和非晶硅薄膜的方法及TOPCon电池 | |
CN114823969A (zh) | 一种提升钝化接触结构性能的低温氢等离子体辅助退火方法和TOPCon太阳能电池 | |
CN112510112B (zh) | 一种高致密性氧化层的扩散工艺方法 | |
CN114373674A (zh) | 一种高效的硼扩散工艺 | |
CN113571602B (zh) | 一种二次扩散的选择性发射极及其制备方法和应用 | |
CN113571411B (zh) | N型TOPCon太阳能电池的制作方法 | |
CN112652678B (zh) | 一种多晶变温沉积扩散的方法及其应用 | |
CN114583016A (zh) | 一种TOPCon电池及其制备方法 | |
CN113161447A (zh) | 一种铸造单晶或多晶类硅片的磷氢退火预处理方法 | |
CN102097534A (zh) | 同时形成晶体硅太阳能电池pn结和氮化硅减反射膜的方法 | |
CN111508829B (zh) | 一种能够匹配se+碱抛的单晶硅电池片扩散提效工艺 | |
CN111628044A (zh) | 一种硅太阳能电池的表面钝化处理方法和系统 | |
CN112820797B (zh) | 一种perc单晶电池用硅片的退火方法及perc单晶电池用硅片与应用 | |
CN109037395B (zh) | 一种提高方阻均匀性的扩散工艺 | |
CN113921660B (zh) | 应用高方阻选择性发射极技术的太阳能电池片的制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210101 |
|
WW01 | Invention patent application withdrawn after publication |