CN112153858A - Water cooling head - Google Patents

Water cooling head Download PDF

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Publication number
CN112153858A
CN112153858A CN202010573720.2A CN202010573720A CN112153858A CN 112153858 A CN112153858 A CN 112153858A CN 202010573720 A CN202010573720 A CN 202010573720A CN 112153858 A CN112153858 A CN 112153858A
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CN
China
Prior art keywords
water
heat transfer
space
working medium
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010573720.2A
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Chinese (zh)
Inventor
陈建安
陈建佑
陈韦豪
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Zehong Guangzhou Electronic Technology Co ltd
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Zehong Guangzhou Electronic Technology Co ltd
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Publication of CN112153858A publication Critical patent/CN112153858A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The invention provides a water cooling head which comprises a heat absorption space, a heat transfer structure, a cavity and a communication structure. The heat absorption space is used for providing a working medium to flow in the heat absorption space; the heat transfer structure is arranged on the base and positioned in the heat absorption space and used for transferring the heat energy generated by the heat source contacted with the base to the working medium; the chamber is positioned in the shell above the heat transfer structure and is separated from the heat absorption space; the communicating structure is arranged in the shell to communicate the cavity and the heat absorbing space.

Description

Water cooling head
Technical Field
The invention relates to the field of heat dissipation, in particular to a water cooling head.
Background
According to modern requirements, computers and various electronic devices are rapidly developed and the performance thereof is continuously improved, but in the process, the heat dissipation problem caused by high-performance hardware is also followed. Generally, computers and various electronic devices usually use heat dissipation elements to dissipate heat, such as heat dissipation paste or heat dissipation fins to attach to electronic components to be dissipated, so as to draw out and dissipate heat. However, the heat dissipation method has limited effect, and thus a heat dissipation module using a liquid cooling method is developed.
In a conventional heat dissipation module using a liquid cooling method, a cooling liquid is generally used to absorb heat energy, for example, the cooling liquid is fluidly connected to an electronic component to be dissipated, the heated cooling liquid can flow to a lower temperature for heat exchange, and the cooling liquid after heat exchange can flow to the electronic component to be dissipated to absorb heat energy, thereby forming a heat dissipation cycle.
However, when the conventional heat dissipation module transports the cooling liquid to the space for absorbing the heat energy in the electronic component to be dissipated, the storage space of the cooling liquid is often insufficient, and the problem that the cooling liquid is not supplied in time when the position of the water cooling head is changed or moved is often caused.
Therefore, how to provide a water cooling head capable of solving the above problems is one of the issues to be solved in the industry.
Disclosure of Invention
An object of the present invention is to provide a water cooling head that ensures that the supply of working medium is not interrupted.
The water cooling head provided by the invention comprises: a housing; a base coupled to the housing to form an action space between the housing and the base for a working medium to flow therein; a chamber formed in the housing and separated from the action space and communicating with the action space through a communication structure; the heat transfer structure is arranged on the inner side of the base and is used for transferring the heat energy generated by the heat source contacted with the outer side of the base to the working medium in the action space; and the pump is arranged above part of the heat transfer structure and used for dividing the action space into a heat absorption space and a water drainage space so as to drive the working medium to flow from the chamber to the heat absorption space and the water drainage space through the communication structure.
In the foregoing water cooling head, still include: a first water inlet channel communicated with the chamber for flowing the working medium into the chamber; a second water inlet channel communicated with the communicating structure for making the working medium flow into the heat absorbing space; and a drainage channel communicated with the drainage space for draining the working medium from the drainage space.
In the above water-cooling head, the first water inlet channel and the water discharge channel are located on the same side of the shell, and the second water inlet channel and the water discharge channel are located on different sides of the shell.
In the above water-cooling head, the communicating structure is disposed between the chamber in the housing and the second water inlet channel.
In the aforementioned water cooling head, the housing has a recess on a side combined with the base, and a height of the heat transfer structure located below the pump is lower than a height of the heat transfer structure located below the recess.
In the above water cooling head, the cavity is exposed to an opposite side of a side where the shell and the base are combined.
In the above water-cooling head, the communication structure is a channel formed in the housing and communicating one side of the chamber with the periphery of the heat transfer structure.
In the above water-cooling head, the communicating structure is a flow guide groove on the housing penetrating through the cavity to the action space.
In the aforementioned water cooling head, the guiding groove is located above a part of the heat transfer structure.
In the above water cooling head, the heat transfer structure is a plurality of fins, and the extending direction of the guiding groove is different from the extending direction of the plurality of fins.
In the above water cooling head, a flow converging region is formed by recessing the inner side of the base around the heat transfer structure, so as to guide the working medium to below the pump.
Another object of the present invention is to provide a water cooling head, comprising: a heat absorbing space in which a working medium flows; the heat transfer structure is arranged on the base and positioned in the heat absorption space and used for transferring the heat energy generated by the heat source contacted with the base to the working medium; a chamber located within the housing above the heat transfer structure and separated from the heat absorption space; and a communicating structure arranged in the shell to communicate the chamber and the heat absorbing space.
In the foregoing water cooling head, still include: at least one water inlet channel for the working medium to flow into the chamber; and a drainage channel for discharging the working medium from the heat absorption space.
In the above water cooling head, the water inlet channel and the water outlet channel are located on the same side or different sides of the shell.
In the above water-cooling head, the communicating structure is disposed between the cavity in the housing and the water inlet channel.
In the above water cooling head, a recess is formed on a side of the shell facing the heat transfer structure, and a height of the heat transfer structure located below the recess is higher than a height of the heat transfer structure not located below the recess.
In the above water cooling head, the chamber is exposed to an opposite side of a side of the shell facing the heat transfer structure.
In the above water-cooling head, the communication structure is a channel formed in the housing and communicating one side of the chamber with the periphery of the heat transfer structure.
In the water cooling head, the communicating structure is a flow guide groove penetrating through the cavity to the heat absorption space on the shell.
In the aforementioned water cooling head, the guiding groove is located above a part of the heat transfer structure.
In the above water cooling head, the heat transfer structure is a plurality of fins, and the extending direction of the guiding groove is different from the extending direction of the plurality of fins.
In the above water cooling head, a flow converging region is formed by recessing the base around the heat transfer structure.
The invention has the advantages that the working medium is effectively stored in the shell temporarily, and the supply of the working medium is ensured not to be interrupted. In addition, the design of the communication structure communicated with the cavity and the action space in the water-cooling head can more effectively guide the working medium temporarily stored in the cavity to the heat transfer structure for absorbing heat energy.
Drawings
Fig. 1A and 1B are schematic perspective views of a water cooling head according to the present invention at different viewing angles.
FIG. 1C is an exploded schematic view of the water head of the present invention.
Fig. 2A to 2D are schematic perspective views of the housing and the pump in the water cooling head of the present invention at different viewing angles.
FIG. 3A is a schematic cross-sectional view taken along line 3A-3A in FIG. 1A.
FIG. 3B is a schematic cross-sectional view taken along line 3B-3B in FIG. 1A.
FIG. 3C is a schematic cross-sectional view taken along line 3C-3C in FIG. 1A.
FIG. 3D is a schematic cross-sectional view taken along line 3D-3D in FIG. 1A.
FIG. 4A is a perspective view of the pump and base of the water head of the present invention.
Fig. 4B and 4C are schematic perspective views of the pump in the water cooling head according to the present invention from different viewing angles.
Fig. 5A and 5B are schematic diagrams of the water-cooling head of the present invention and other water-cooling heads together forming a circuit.
FIG. 6A is a schematic perspective view of another embodiment of a water cooled head of the present invention.
Fig. 6B is a perspective view of the housing of fig. 6A after disassembly.
Fig. 6C and 6D are schematic perspective views of the exposed cavity of fig. 6B with the upper cover disassembled.
FIG. 6E is an exploded schematic view of another embodiment of a water head of the present invention.
Fig. 7A and 7B are perspective views of a water cooling head according to another embodiment of the present invention, illustrating a housing and a pump after and before assembly.
FIG. 8A is a cross-sectional view taken along line 8A-8A in FIG. 6A.
FIG. 8B is a cross-sectional view taken along line 8B-8B in FIG. 6A.
FIG. 8C is a cross-sectional view taken along line 8C-8C in FIG. 6A.
Fig. 9A and 9B are schematic views illustrating a process of flowing a working medium between a housing and a base in another embodiment of a water cooling head of the present invention.
Fig. 9C to 9E are schematic diagrams of different embodiments of the flow guide grooves in another embodiment of the water-cooling head of the present invention.
The reference numbers are as follows:
1. 1' Water-cooled head
2 casing
21 electromechanical chamber
22. 22' first water inlet channel
23. 23' second water inlet channel
24 chamber
241 flow guide groove
25. 25' drainage channel
26 channel
27 recess
28. 29 groove
3 Upper cover
4 base
41 heat absorbing surface
42 heat transfer structure
43 inner side
44 confluence region
45 groove
5 Pump
51 Circuit Board
52 first magnetic element
53 Fan blade
531 Top wall
532 chassis
533 partition wall
534 shaft sleeve
535 shaft rod
536 hollow part
537 rib
538 drainage cavity
539 fastener
54 second magnetic element
55 electric wire
6 space of action
61 heat absorption space
62 drainage space
71. 72, 73 pipeline
74 closure
8 outer cover
9A, 9B, 9C joint
The angle theta.
Detailed Description
While the embodiments of the present invention are described below with reference to specific embodiments, other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein, and may be implemented or applied by other different embodiments.
The water cooling head provided by the invention can be arranged in an electronic device such as a computer host or a server, the inside of the water cooling head can be filled with working medium (such as cooling liquid), the working medium can absorb heat energy generated by a heating source (such as a chip or an electronic element such as a memory), the heated working medium can be transmitted to a condensing device for cooling, and the cooled working medium can be transmitted back to the water cooling head for next heat absorption and circulation flow.
Referring to fig. 1A to 1C and fig. 2A to 2D, the water cooling head 1 of the present invention may include a housing 2, an upper cover 3, a base 4 and a pump 5. The housing 2 can be used as a main structural member of the water cooling head 1, the upper part of the housing is combined with the upper cover 3, the lower part of the housing is combined with the base 4, and the side edges of the housing can be provided with a first water inlet channel 22, a second water inlet channel 23 and a water discharge channel 25. The combination of the housing 2 and the components can be formed with fixing structures such as screw holes, studs or buckles at different parts of the housing 2, so as to facilitate the combination of the components by locking during assembly, but the invention is not limited to this combination.
In the present embodiment, the housing 2 may structurally define different chambers and passages, including the electromechanical chamber 21, the first water inlet passage 22, the second water inlet passage 23, the chamber 24, the water outlet passage 25, and the like, wherein the electromechanical chamber 21 is opened at the top side of the housing 2 and is independent of the flow path of the working medium in the water-cooling head 1, so that the energizing element disposed in the electromechanical chamber 21 can be protected from the short circuit condition caused by the intervention of the working medium.
In this embodiment, the pump 5 may include a circuit board 51, a first magnetic element 52, a fan blade 53 and a second magnetic element 54, wherein the circuit board 51 and the first magnetic element 52 may be disposed in the electromechanical chamber 21, and the fan blade 53 and the second magnetic element 54 are disposed on another side of the electromechanical chamber 21 (for example, in a path through which a working medium flows, such as in the groove 28 shown in fig. 2C), and wherein the circuit board 51 provides electric power for operating the pump 5, for example, a power source (not shown) is connected by a wired connection manner of a wire 55 (as shown in fig. 6A to 6D) or other wireless connection manners such as electromagnetic induction. In the embodiment, the circuit board 51 and the first magnetic element 52 are separated from the fan blade 53 and the second magnetic element 54 by the housing 2, but the first magnetic element 52 and the second magnetic element 54 are still coaxially disposed. In one embodiment, the first magnetic element 52 and the second magnetic element 54 may be selected from magnets or other materials that can be driven or attracted by a magnetic field. In addition, the second magnetic element 54 is combined with the fan blade 53, when the pump 5 is powered on, under the combined action of the circuit board 51, the first magnetic element 52 and the second magnetic element 54, the fan blade 53 axially connected to the second magnetic element 54 is driven by the second magnetic element 54 to rotate, so that the rotation of the fan blade 53 brings the working medium to flow.
In the present embodiment, the base 4 is used for absorbing heat energy, and the material thereof may be selected from metal or other materials with good thermal conductivity. The base 4 may be a one-piece (integrally formed) structure or a composite structure composed of a plurality of layers or multiple elements, and the invention is not limited thereto. The outer side (the side far away from the housing 2) of the base 4 has a heat absorbing surface 41, and the inner side 43 (the side facing the housing 2) of the base 4 has a heat transfer structure 42 formed thereon (or can be provided with), wherein the heat absorbing surface 41 can directly or indirectly contact with a heat source, so that the heat absorbing surface 41 can absorb the heat energy generated by the heat source and then transfer the heat energy to the heat transfer structure 42, and the heat transfer structure 42 can transfer the heat energy to a working medium by contacting with the working medium.
In an embodiment, the heat transfer structure 42 of the base 4 may be a cut fin (cut fin), or other fins with a column shape, a sheet shape, or even an irregular shape, as long as the area contacting with the working medium can be increased to transfer heat energy to the working medium more quickly, and the specific structure of the heat transfer structure 42 is not limited by the invention.
Referring to fig. 3C and fig. 3D, when the base 4 is coupled to the housing 2, the housing 2 and the base 4 can define an action space 6 together, and the action space 6 can be filled with a working medium and is used for the working medium to flow. In one embodiment, the active space 6 can be divided by the fan 53 of the pump 5 into a heat absorbing space 61 and a water draining space 62 without relying on other partition walls or compartments, thereby simplifying the structure of the interior of the water cooling head 1. In the present embodiment, the first water inlet channel 22 and the second water inlet channel 23 of the housing 2 are communicated with the heat absorbing space 61, so that the cooled working medium flows into the heat absorbing space 61, and the working medium absorbs the heat energy transferred by the heat transfer structure 42. The fan blades 53 can suck the working medium directly from the heat absorption space 61 to the drain space 62. The drain passage 25 communicates with the drain space 62, and therefore the working medium whose temperature has been raised can be sent to the outside of the water head 1 and cooled. In addition, the first water inlet channel 22, the second water inlet channel 23 and the water outlet channel 25 can be extended outward or connected to the connectors 9A, 9B and 9C shown in fig. 6A to 6D, respectively, and the connectors 9A, 9B and 9C are communicated with a condensing device (such as a water cooling outlet, a fan, etc.) through the pipes 71, 72 and 73 shown in fig. 5A and 5B. The joints 9A, 9B, 9C may be vertically or horizontally connected to the housing 2, or may be disposed with an elbow to meet different space configuration requirements inside the water cooling head 1, and the invention is not limited thereto.
The overall structure of the fan blade 53 of the pump 5 in the water-cooling head 1 of the present invention is further described below with reference to fig. 4B and 4C. As described above, the working space 6 in the water cooling head 1 of the present invention is partitioned by the blades 53 of the pump 5 into the heat absorbing space 61 and the water discharging space 62, and therefore the blades 53 themselves have both functions of absorbing the working medium and discharging the working medium. In order to achieve the above function, the fan 53 is disposed in the working space 6 and adjacent to the drain channel 25, and is used for directly sucking the working medium from the heat absorption space 61 to the drain space 62, and then discharging the working medium out of the water cooling head 1 through the drain channel 25. Fan blade 53 includes top wall 531, base plate 532, partition wall 533, boss 534, and shaft bar 535, with hollow 536 formed between base plate 532 and boss 534, and base plate 532 and boss 534 may be connected by at least one rib 537 in hollow 536. The bottom plate 532 is a structure of the fan blade 53 that mainly divides the action space 6 into the heat absorption space 61 and the drainage space 62, and the heat absorption space 61 and the drainage space 62 are coupled (fluidly coupled) by the hollow portion 536, that is, the working medium is allowed to enter the drainage space 62 from the heat absorption space 61 through the hollow portion 536. The top wall 531 is spaced apart from the base plate 532, and a plurality of partition walls 533 are connected between the top wall and the base plate, thereby partitioning the plurality of drainage chambers 538. When the working medium is transferred from the heat absorbing space 61 to the drain space 62 through the hollow portion 536, the working medium contacts the top wall 531 and turns to move toward the drain cavities 538, and then the working medium in the drain cavities 538 is sequentially thrown into the drain channels 25 by the centrifugal force and discharged out of the water cooling head 1. The top wall 531 of the fan blade 53 has a guiding function for changing the flow direction, and simultaneously, the partition wall 533 is prevented from directly touching the housing 2, so that the chance of abrasion is reduced.
In the present embodiment, the fan blade 53 is driven by the electromagnetic induction between the first magnetic element 52 and the second magnetic element 54, and is not driven through the shaft 535, so that there is no linkage relationship between the fan blade 53 and the shaft 535. However, in order to maintain durability and stability of the fan blade 53, the fan blade 53 will not be off-axis or wear due to contact with the housing 2 during rotation, and therefore, a hollow shaft sleeve 534 can be disposed inside the fan blade 53 for receiving the shaft rod 535. In addition, in order to fix the shaft rod 535, one end of the shaft rod 535 may be received in the groove 28 at the top of the operation space 6 (i.e., the inner side of the housing 2), and the other end may be fixed by a fixing member 539, for example, the fixing member 539 may be provided with a blind hole or a through hole for receiving the shaft rod 535. In addition, the fixing member 539 may be received and fixed in a groove 29 on the bottom surface of the casing 2 (as shown in fig. 7A), or the fixing member 539 may be directly installed in a groove 45 of the base 4 (as shown in fig. 1C), which is not limited thereto. In one embodiment, when the shaft 535 is installed in the action space 6, it is preferably extended together with the fixing member 539 or inserted into the heat absorption space 61, which makes the fan blade 53 more stable when rotating, but the invention is not limited thereto.
In one embodiment, considering the material of the fan blade 53, if necessary, a shaft tube (not shown) may be further sleeved and fixed in the shaft sleeve 534, and the shaft tube is coaxially disposed with the shaft sleeve 534 and the shaft rod 535, and is located between the shaft sleeve 534 and the shaft rod 535. The material of shaft tube can be selected from wear-resistant or wear-resistant material, so as to reduce the wear of the fan blade 53 and the shaft rod 535 during relative rotation and prolong the service life of the fan blade 53.
In order to keep the supply of the working medium in the water cooling head 1 uninterrupted, a chamber 24 is formed in the housing 2. The chamber 24 communicates with the first water inlet passage 22 so that the working medium flows into the chamber 24 through the first water inlet passage 22. The chamber 24 is also in communication with the second water inlet channel 23 so that the working medium can flow into the chamber 24 through the second water inlet channel 23. In this embodiment, the first water inlet channel 22 and the water outlet channel 25 may be disposed on the same side of the housing 2 (the side adjacent to the pump 5), and the second water inlet channel 23 may be disposed on the other side of the housing 2 (the side away from the pump 5) different from the first water inlet channel 22 and the water outlet channel 25, that is, the first water inlet channel 22 and the second water inlet channel 23 are disposed on opposite sides of the chamber 24, but the invention is not limited thereto, and the first water inlet channel 22 and the second water inlet channel 23 may also be disposed on the adjacent sides or the same side of the chamber 24 according to the design requirement of the product structure, so as to increase the installation flexibility of the user.
In the present embodiment, the chamber 24 is substantially physically separated from the working space 6 (i.e. the chamber 24 and the working space 6 are separated independently by the housing 2), but the chamber 24 may communicate with the working space by a communication structure within the housing 2, which may be, for example, a passage 26 formed in the housing 2. Specifically, the passage 26 is formed at one side of the chamber 24 and located between the chamber 24 and the second water inlet passage 23, so that the working medium flows into the chamber 24 after flowing through the second water inlet passage 23 and then passes through the passage 26.
As shown in fig. 2C and 2D, the case 2 has a recess 27 on the side combined with the base 4. After the housing 2 is combined with the base plate 4, the recess 27 and the base plate 4 can jointly define a heat absorbing space 61 in the action space 6, and this recess 27 is also in communication with the channel 26. When the working medium flows in from the second water inlet channel 23, the working medium may directly flow into the heat absorbing space 61 after passing through the channel 26.
In one embodiment, the chamber 24 is exposed to the side opposite to the side where the housing 2 and the base 4 are combined, for example, the exposed direction of the chamber 24 can be the same side as the opening of the electromechanical chamber 21, and can be sealed by the upper cover 3. The upper cover 3 can be screwed into the screw hole of the housing 2, but can also be joined by heat fastening or other joining means, which is not limited by the invention. In another embodiment, the upper cover 3 may be made of transparent or translucent material to help the user to observe the supply of the working medium.
After the housing 2 and the base 4 are assembled, the channel 26 is located around the heat transfer structure 42, the recess 27 is capable of accommodating the heat transfer structure 42, and the pump 5 is disposed above a portion of the heat transfer structure 42 (as shown in fig. 4A), so that the electromechanical chamber 21 for mounting the pump 5 is located at different levels relative to the housing 2, and the recess 27 and the chamber 24 are not overlapped in the vertical direction, thereby effectively reducing the height of the water cooling head 1 and achieving a slim design. In one embodiment, as shown in fig. 1C, 3B and 4A, the fins of the heat transfer structure 42 may have different heights, for example, the fins of the heat transfer structure 42 below the pump 5 may have a height lower than the fins of the heat transfer structure 42 below the recess 27, which is to reduce the resistance of the working medium when the working medium leaves the heat transfer structure 42. In other embodiments, the heights of the fins of the heat transfer structure 42 may be equal, but the invention is not limited thereto.
Referring to fig. 3A to 3D, the working medium entering the water cooling head 1 can flow into the chamber 24 from the first water inlet channel 22 along the direction of arrow a, and can also flow into the chamber 24 or the channel 26 from the second water inlet channel 23 along the direction of arrow B. Then, the working medium in the chamber 24 or the working medium flowing in from the second water inlet channel 23 can flow into the channel 26, turn in the channel 26, and flow into the heat absorbing space 61 in the direction of the arrow C. Thereafter, the working medium passes through the inside of the heat transfer structure 42 in the direction of arrow D to absorb the heat energy absorbed by the heat transfer structure 42 and then flows to below the pump 5. Finally, the working medium is sucked from the heat absorbing space 61 to the drain space 62 by the fan blades 53 in the direction of arrow E, and is discharged from the drain passage 25 communicating with the drain space 62 to the outside of the water-cooled head 1 in the direction of arrow F for further cooling.
When the water-cooling head 1 of the present invention is applied, because the first water inlet channel 22 and the second water inlet channel 23 are located at different sides of the chamber 24, a plurality of water-cooling heads 1, 1' can be connected in series to enhance the cooling efficiency or simultaneously dissipate heat from a plurality of heat sources. As shown in fig. 5A, a pipe 71 is a supply pipe of the working medium, connected to the second water inlet passage 23 of the water cooling head 1, and the working medium is discharged from the water discharge passage 25 of the water cooling head 1 after absorbing the thermal energy inside the water cooling head 1, and enters a pipe 72. The line 72 can be connected again to the first water inlet channel 22 ' of the further water head 1 ' for the working medium to enter the water head 1 '. After the working medium absorbs the heat energy inside the water cooling head 1 ', the heat energy can be discharged from the water discharge channel 25' of the water cooling head 1 'and will leave the water cooling head 1' through the pipeline 73 to the condensing device (not shown). In the above embodiment, the second water inlet channel 23 ' of the water-cooling head 1 ' may be closed with the cover 74 so that the water-cooling head 1 ' may be disposed near a corner of the cabinet or adjacent to a sidewall of the cabinet without being limited by space.
In another embodiment, the water cooling heads 1, 1' can also be connected in series as shown in FIG. 5B. The pipe 71 is a supply pipe of the working medium, and is connected to the second water inlet passage 23 of the water cooling head 1, and the working medium is discharged from the water discharge passage 25 of the water cooling head 1 after absorbing the thermal energy inside the water cooling head 1, and enters the pipe 72. The line 72 can be connected again to the second water inlet channel 23 ' of the other water head 1 ' for the working medium to enter the water head 1 '. After the working medium absorbs the heat energy inside the water cooling head 1 ', the working medium can be discharged from the water discharge channel 25' of the water cooling head 1 'and leave the water cooling head 1' to a condensing device (not shown) via a pipe 73. In the above embodiment, the first water inlet passage of the water cooling head 1, 1' may be closed with the cover 74. This embodiment allows the pipes 71, 73 to fit into a relatively flat space without passing over the water headers 1, 1'.
Referring to fig. 6A to 7B, which are another embodiment of the water cooling head 1 of the present invention, the difference between the present embodiment and the previous embodiment is the design of the communication structure and the heat transfer structure in the housing, and the remaining structural features are substantially the same. Only the differences are described below, and the descriptions of the same are omitted.
In the present embodiment, the communicating structure is a flow guide groove 241 formed in the housing 2 and penetrating the chamber 24 and the action space 6. Specifically, the guiding groove 241 is an opening formed on the bottom of the cavity 24 (or the recess 27 of the housing 2), and is located above a portion of the heat transfer structure 42. In an embodiment, the extending direction of the flow guiding grooves 241 is different from the extending direction of the fins of the heat transfer structure 42, for example, the extending direction of the flow guiding grooves 241 may be perpendicular to the extending direction of the fins of the heat transfer structure 42, but the invention is not limited thereto. The extending direction of the guiding trench 241 and the extending direction of the fins of the heat transfer structure 42 may also form an angle (e.g., 30 degrees, 45 degrees, 60 degrees, etc.), as shown in fig. 9C, two ends of the guiding trench 241 may be respectively located in the inflow direction of the working medium along the arrow A, B, so that the extending direction of the guiding trench 241 and the extending direction of the fins of the heat transfer structure 42 form an angle θ, which may be changed according to the design requirement of the product structure, and the value of the angle θ is not particularly limited in the present invention. In addition, the positions of the two ends of the guiding gutter 241 may also be varied according to the design requirement of the product structure, and the invention does not specifically limit the positions of the two ends of the guiding gutter 241.
In an embodiment, the width of the guiding groove 241 near one end of the first water inlet channel 22 may be greater (or smaller) than the width near one end of the second water inlet channel 23, or the width from one end of the guiding groove 241 to the other end of the guiding groove 241 may gradually decrease. The position of the wider end of the guide groove 241 is not limited in the present invention, and the wider end of the guide groove 241 may be adjacent to the first water inlet passage 22 as shown in fig. 9A, or the wider end of the guide groove 241 may be adjacent to the second water inlet passage 23 as shown in fig. 9D. In another embodiment, as shown in fig. 9E, the guiding grooves 241 may have a uniform width.
In this embodiment, the chamber 24 can be sealed by the upper lid 3, and a cover 8 can be combined to strengthen the whole structure. The outer cover 8 can be coupled to the housing 2 through a screw hole, a stud, a hook, a slot or a fastener, and the outer cover 8 can also be made of a transparent or translucent material, so that a user can observe the supply or flow condition of the working medium.
Referring further to fig. 8A to 8C and fig. 9A to 9B, the working medium entering the water-cooling head 1 can flow into the chamber 24 from the first water inlet channel 22 along the direction of arrow a or flow into the chamber 24 from the second water inlet channel 23 along the direction of arrow B. Due to the flow guiding grooves 241 on the bottom of the chamber 24, the working medium in the chamber 24 is diverted to enter the heat absorbing space 61 along the direction of arrow C and pass through the inside of the heat transfer structure 42 along the direction of arrow D and take away the heat energy absorbed by the heat transfer structure 42. Since the extension direction of the flow guide grooves 241 is different from that of the fins of the heat transfer structure 42, the flow merging region 44 may be concavely formed on the inner side 43 of the base 4 around the heat transfer structure 42. The merge region 44 may collect and divert the working medium (e.g., in the direction of arrow D) and collect in the direction of arrow E under the fan blades 53 of the pump 5. Then, the working medium is attracted by the fan 53 and moves upward from the heat absorbing space 61 to the drain space 62 in the direction of the arrow F. Finally, the working medium is discharged to the outside of the water header 1 in the direction of arrow G via the drain passage 25 communicating with the drain space 62 to be cooled.
Through the design of the cavity in the water cooling head, the working medium can be effectively temporarily stored in the shell, and the supply of the working medium is not interrupted. In addition, the design of the communication structure communicated with the cavity and the action space in the water-cooling head can more effectively guide the working medium temporarily stored in the cavity to the heat transfer structure for absorbing heat energy. In addition, because the electromechanical cavity, the cavity and the concave part are respectively positioned at different horizontal positions of the shell, the invention can be used for temporarily storing working media and has the effect of thinning the water cooling head.
The above embodiments are merely illustrative of the technical principles, features and effects of the present invention, and are not intended to limit the scope of the present invention, and those skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. It is intended that all such equivalent modifications and variations be covered by the following claims. Rather, the scope of the invention is as set forth in the following claims.

Claims (22)

1. A water cooled head, comprising:
a housing;
a base coupled to the housing to form an action space between the housing and the base for a working medium to flow therein;
a chamber formed in the housing and separated from the action space and communicating with the action space through a communication structure;
the heat transfer structure is arranged on the inner side of the base and is used for transferring the heat energy generated by the heat source contacted with the outer side of the base to the working medium in the action space; and
and the pump is arranged above part of the heat transfer structure and used for dividing the action space into a heat absorption space and a water drainage space so as to drive the working medium to flow from the chamber to the heat absorption space and the water drainage space through the communication structure.
2. The water head as defined in claim 1, further comprising:
a first water inlet channel communicated with the chamber for flowing the working medium into the chamber;
a second water inlet channel communicated with the communicating structure for making the working medium flow into the heat absorbing space; and
a drainage channel communicated with the drainage space for draining the working medium from the drainage space.
3. The water-cooled head as defined in claim 2 wherein the first water inlet passage and the water discharge passage are located on the same side of the housing, and the second water inlet passage and the water discharge passage are located on different sides of the housing.
4. A water-cooled head as defined in claim 2 wherein the communication structure is provided in the housing between the chamber and the second water inlet passage.
5. The water-cooled head as recited in claim 1, wherein the housing has a recess on a side combined with the base, and a height of the heat transfer structure below the pump is lower than a height of the heat transfer structure below the recess.
6. The water-cooled head as defined in claim 1, wherein the chamber is exposed on an opposite side of a side of the shell and base combination.
7. The water-cooled head as recited in claim 1, wherein the communication structure is a passage formed in the housing and communicating one side of the chamber with a periphery of the heat transfer structure.
8. The water-cooled head as defined in claim 1 wherein the communication structure is a channel in the housing extending through the chamber to the working space.
9. The water-cooled head as defined in claim 8, wherein the channels are located above a portion of the heat transfer structure.
10. The water-cooled head as claimed in claim 9, wherein the heat transfer structure is a plurality of fins, and the extension direction of the channels is different from the extension direction of the fins.
11. The water head as defined in claim 8 wherein a flow combining region is recessed on an inner side of the base around the heat transfer structure to direct the working medium under the pump.
12. A water cooled head, comprising:
a heat absorbing space in which a working medium flows;
the heat transfer structure is arranged on the base and positioned in the heat absorption space and used for transferring the heat energy generated by the heat source contacted with the base to the working medium;
a chamber located within the housing above the heat transfer structure and separated from the heat absorption space; and
and the communicating structure is arranged in the shell to communicate the cavity and the heat absorption space.
13. The water head as defined in claim 12, further comprising:
at least one water inlet channel for the working medium to flow into the chamber; and
and the drainage channel is used for draining the working medium from the heat absorption space.
14. The water-cooled head as defined in claim 13 wherein the water inlet passage and the water outlet passage are located on the same side or different sides of the housing.
15. The water-cooled head as defined in claim 13, wherein the communication structure is disposed in the housing between the chamber and the inlet passage.
16. The water-cooled head as recited in claim 12 wherein the shell has a recess on a side facing the heat transfer structure, and wherein the height of the heat transfer structure below the recess is greater than the height of the heat transfer structure not below the recess.
17. The water-cooled head as defined in claim 12 wherein the chamber is exposed to an opposite side of a side of the shell facing the heat transfer structure.
18. The water-cooled head as recited in claim 12, wherein the communication structure is a passage formed in the housing and communicating one side of the chamber with a periphery of the heat transfer structure.
19. The water-cooled head as defined in claim 12 wherein the communication structure is a channel in the shell extending through the chamber to the heat absorption space.
20. The water-cooled head as defined in claim 19, wherein the channels are located above a portion of the heat transfer structure.
21. The water-cooled head as recited in claim 20, wherein the heat transfer structure is a plurality of fins, and the extension direction of the channels is different from the extension direction of the fins.
22. The water-cooled head as defined in claim 12 wherein, the base is recessed about the heat transfer structure to form a flow convergence region.
CN202010573720.2A 2019-06-26 2020-06-22 Water cooling head Pending CN112153858A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962866748P 2019-06-26 2019-06-26
US62/866,748 2019-06-26
US201962870864P 2019-07-05 2019-07-05
US62/870,864 2019-07-05

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249966A (en) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd Centrifugal pump and cooling device using the same
TWI320452B (en) * 2006-08-11 2010-02-11 Foxconn Tech Co Ltd Pump
TWM460510U (en) * 2013-03-18 2013-08-21 Cooler Master Co Ltd Water-cooling type heat dissipating device
CN105992488A (en) * 2015-01-28 2016-10-05 讯凯国际股份有限公司 Liquid cooling-type radiating structure and manufacturing method thereof
CN108227870B (en) * 2016-12-09 2021-04-16 讯凯国际股份有限公司 Cooling device for computing equipment
US10299406B2 (en) * 2016-01-19 2019-05-21 Cooler Master Co., Ltd. Liquid cooling heat sink device

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