CN214206240U

CN214206240U - Heat dissipation device for electronic equipment

Info

Publication number: CN214206240U
Application number: CN202023345244.3U
Authority: CN
Inventors: 王策
Original assignee: Shenzhen Qimiaoxingqiu Culture Creativity Co Ltd
Current assignee: Shenzhen Qimiaoxingqiu Culture Creativity Co Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-09-14
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses an electronic equipment heat abstractor, including heat-conducting component, liquid container, radiator unit, fluid pipeline and drive cooling liquid drive piece that flows in the fluid pipeline, the fluid pipeline includes the first pipeline of connecting between radiator unit and heat-conducting component and the second pipeline of connecting between liquid container and radiator unit, the radiator unit includes the condensation duct of connecting between first pipeline and second pipeline and carries out the radiating fan to the condensation duct; the heat conduction assembly comprises a heat conduction surface used for being attached to the electronic equipment, heat generated by the electronic equipment is transferred to the heat conduction assembly, cooling liquid flows in a circulating mode among the liquid container, the heat dissipation assembly and the heat conduction assembly through the fluid pipeline under the action of the driving piece, the cooling liquid carries away heat generated by the electronic equipment when flowing through the heat conduction assembly, and the heat is released to the surrounding environment when flowing through the heat dissipation assembly.

Description

Heat dissipation device for electronic equipment

Technical Field

The utility model belongs to the technical field of the heat dissipation technique and specifically relates to an electronic equipment heat abstractor.

Background

In recent years, live webcasting and mobile phone games are very hot, so that long-time running is needed, and the heat productivity of the mobile phone is large. Although the mobile phone is provided with the heat dissipation device, the expected heat dissipation effect cannot be achieved when the mobile phone is used for a long time, and if the heat cannot be dissipated in time, the normal use of the mobile phone can be influenced, and even the service life of the mobile phone can be influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem that exists now, the utility model provides an assist electronic equipment heat abstractor who promotes electronic equipment radiating efficiency.

In order to achieve the above object, the embodiment of the present invention provides a technical solution that:

a heat dissipation device for electronic equipment comprises a heat conduction assembly, a liquid container, a heat dissipation assembly, a fluid pipeline connecting the heat conduction assembly, the heat dissipation assembly and the liquid container, and a driving element driving cooling liquid to flow in the fluid pipeline, wherein the fluid pipeline comprises a first pipeline connected between the heat dissipation assembly and the heat conduction assembly and a second pipeline connected between the liquid container and the heat dissipation assembly, and the heat dissipation assembly comprises a condensation pipeline connected between the first pipeline and the second pipeline and a fan for dissipating heat of the condensation pipeline;

the heat conducting assembly comprises a heat conducting surface used for being attached to electronic equipment, heat generated by the electronic equipment is transferred to the heat conducting assembly, the cooling liquid circularly flows among the liquid container, the heat radiating assembly and the heat conducting assembly through the fluid pipeline under the action of the driving piece, and the cooling liquid takes away the heat generated by the electronic equipment when flowing through the heat conducting assembly and releases the heat to the surrounding environment when flowing through the heat radiating assembly.

The fan comprises a shell and a fan wheel contained in the shell, the shell comprises a bottom plate, a side plate and a flat plate, the side plate extends outwards from one side of the bottom plate, the flat plate is connected to one end, far away from the bottom plate, of the side plate, the flat plate, the side plate and the bottom plate are jointly surrounded to form a containing cavity containing the fan wheel, an air inlet is formed in the flat plate, and a through hole is formed in the position, right opposite to the fan wheel, of the bottom plate.

The shell further comprises a cover body arranged on the other side of the bottom plate, the cover body comprises a top plate and a side wall extending outwards from the edge of the top plate, the top plate and the side wall jointly enclose a containing space used for containing the condensation pipeline, and an air outlet is formed in the side wall.

Wherein, first pipeline includes into water pipeline and return water pipeline, heat-conducting component include the pedestal and form in cooling channel in the pedestal, the pedestal towards one side of heat-radiating component is equipped with respectively with water inlet and return water mouth that the pipeline of intaking and return water pipeline communicate.

The cooling channel comprises a plurality of transverse channels for guiding the cooling liquid to flow transversely along the heat conducting assembly and a plurality of vertical channels for guiding the cooling liquid to flow vertically along the heat conducting assembly, and the transverse channels and the vertical channels are sequentially connected end to end.

The condensation pipeline comprises a water inlet connector and a water return connector which are respectively connected with the water inlet pipeline and the water return pipeline.

The heat conducting assembly further comprises a heat conducting plate which is covered on one side of the base body far away from the heat radiating assembly, and the heat conducting plate is made of metal materials.

Wherein, one side of the liquid container is provided with a water filling port, and the liquid container also comprises a box cover which is detachably arranged on the water filling port so as to seal the water filling port.

The second pipeline comprises a water inlet pipeline and a water outlet pipeline, and the condensation pipeline comprises a water inlet connector and a water outlet connector which are respectively communicated with the water inlet pipeline and the water outlet pipeline.

The driving part is communicated with the fluid pipeline or the condensation pipeline, a power line connected with an external power supply is arranged on the driving part, and/or a power interface used for being connected with the external power supply is arranged on the driving part.

In the heat dissipating device for electronic equipment provided in the above embodiment, the heat conducting component and the heat dissipating component are connected to the water tank through the fluid conduit, heat generated by the electronic equipment is transferred to the heat conducting component, the cooling liquid flows in a circulating manner through the fluid conduit under the action of the driving member among the liquid container, the heat dissipating component and the heat conducting component, the cooling liquid takes away heat generated by the electronic equipment when flowing through the heat conducting component and releases the heat to the surrounding environment when flowing through the heat dissipating component, wherein the heat dissipating component includes the condensation conduit connected between the first conduit and the second conduit and the fan for dissipating heat from the condensation conduit, and when the cooling liquid flows through the heat dissipating component after absorbing heat generated by the electronic equipment from the heat conducting component, the cooling liquid can accelerate to discharge heat generated by the electronic equipment to the surrounding environment, the cooling liquid circulates among the liquid container, the heat dissipation assembly and the heat conduction assembly in a reciprocating manner through the fluid pipeline, so that the heat dissipation efficiency of the heat dissipation device of the electronic equipment can be greatly improved.

Drawings

Fig. 1 is a perspective view of a heat dissipation device of an electronic device in an embodiment of the present application;

FIG. 2 is an exploded view of the heat sink of the electronic device of FIG. 1;

FIG. 3 is a perspective view of another angle of the heat sink of the electronic device of FIG. 1;

fig. 4 is an exploded view of the heat sink of the electronic device of fig. 3.

Detailed Description

The technical solution of the present invention will be further described in detail with reference to the drawings and specific embodiments. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the following description, reference is made to the expression "some embodiments" which describe a subset of all possible embodiments, but it should be understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

It will also be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "inner," "outer," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 4, an embodiment of the present application provides a heat dissipation apparatus for electronic equipment, including a heat conducting assembly 10, a liquid container 40, a heat dissipation assembly 50, a fluid pipeline 20 connecting the heat conducting assembly 10, the heat dissipation assembly 50 and the liquid container 40, and a driving member 30 driving a cooling liquid to flow in the fluid pipeline 20, where the fluid pipeline 20 includes a first pipeline connected between the heat dissipation assembly 50 and the heat conducting assembly 10 and a second pipeline connected between the liquid container 40 and the heat dissipation assembly 50, the heat dissipation assembly 50 includes a condensation pipeline 51 connected between the first pipeline and the second pipeline, and a fan configured to dissipate heat of the condensation pipeline 51; the heat conducting assembly 10 includes a heat conducting surface for attaching to an electronic device, heat generated by the electronic device is transferred to the heat conducting assembly 10, the cooling liquid circulates among the liquid container 40, the heat dissipating assembly 50 and the heat conducting assembly 10 through the fluid conduit 20 under the action of the driving member 30, and the cooling liquid carries away the heat generated by the electronic device when flowing through the heat conducting assembly 10 and releases the heat to the surrounding environment when flowing through the heat dissipating assembly 50.

In the above embodiment, the heat dissipation apparatus for electronic equipment includes a heat conducting assembly 10, a liquid container 40, a heat dissipation assembly 50, a fluid pipe 20 connecting the heat conducting assembly 10, the heat dissipation assembly 50 and the liquid container 40, and a driving member 30 for driving a cooling liquid to flow in the fluid pipe 20, the heat discharging assembly 50 includes a condensation duct 51 connected between the first duct and the second duct and a fan discharging heat from the condensation duct 51, when the cooling liquid flows through the heat dissipation assembly 50 after absorbing heat generated from the electronic device from the heat conductive assembly 10, the heat generated by the electronic device can be discharged to the surrounding environment by the cooling liquid in an accelerated manner, and the cooling liquid circulates among the liquid container 40, the heat dissipation assembly 50 and the heat conduction assembly 10 through the fluid pipeline 20 in a reciprocating manner, so that the heat dissipation efficiency of the heat dissipation device for the electronic device can be greatly improved.

Optionally, the fan includes a housing 52 and a fan wheel 53 accommodated in the housing 52, the housing 52 includes a bottom plate, a side plate extending outward from one side of the bottom plate, and a flat plate connected to one end of the side plate far away from the bottom plate, the flat plate, the side plate, and the bottom plate together enclose a containing cavity 520 for containing the fan wheel 53, the flat plate is provided with an air inlet 521, and a through hole is formed at a position of the bottom plate opposite to the fan wheel 53. The bottom plate is substantially rectangular plate-shaped, and the fan wheel 53 can be mounted in the housing cavity 520 of the housing 52 through a through hole in the bottom plate. The intake opening 521 may include a plurality of strip-shaped holes formed in the flat plate and arranged in parallel, and optionally, the strip-shaped holes may extend to the side plates, so that the intake opening 521 is formed in the bottom plate and the side plates, respectively, to increase the intake amount of the fan wheel 53.

Optionally, the housing 52 further includes a cover body 55 disposed on the other side of the bottom plate, the cover body 55 includes a top plate and a side wall extending outward from an edge of the top plate, the top plate and the side wall together enclose an accommodating space 550 for accommodating the condensation duct 51, and an air outlet is disposed on the side wall. The condensation duct 51 is accommodated in the accommodating space 550, the accommodating space 550 can be communicated with the accommodating cavity 520 through a through hole on the bottom plate, and the air flow generated by the operation of the fan wheel 53 flows to the condensation duct 51 in the cover 55 from the through hole, takes away the heat on the condensation duct 51 and blows out from the air outlet on the side wall, so that the heat is released to the surrounding environment. The condensation duct 51 comprises a plurality of layers of bent and folded ducts, so that the overall volume of cooling liquid flowing through the condensation duct 51 can be increased, the contact area between the fan airflow and the condensation duct 51 can be greatly increased, the heat dissipation efficiency of the airflow of the fan wheel 53 on the condensation duct 51 is improved, and the heat dissipation efficiency of the heat dissipation device of the electronic equipment is increased.

Optionally, the first pipeline includes an inlet pipeline 21 and a return pipeline 22, the heat conducting assembly 10 includes a seat body 13 and a cooling channel 12 formed in the seat body 13, and a water inlet and a water return port respectively communicated with the inlet pipeline 21 and the return pipeline 22 are provided at a side of the seat body 13 facing the heat dissipating assembly 50. Wherein the cooling channels 12 comprise a plurality of transverse channels for guiding the cooling liquid to flow transversely along the heat conducting assembly 10 and a plurality of vertical channels for guiding the cooling liquid to flow vertically along the heat conducting assembly 10, and the transverse channels and the vertical channels are connected end to end in sequence. The shape of the seat body 13 is substantially rectangular, a plurality of guide plates are arranged in the seat body 13 in a staggered manner, and the guide plates separate the space in the seat body 13 to form a transverse channel and a vertical channel which are sequentially connected end to end, so that the cooling channel 12 is formed into a bent and extended shape, and water entering the cooling channel 12 flows roundly along the cooling channel 12, thereby increasing the length of the flow path of the cooling liquid in the cooling channel 12 and more fully carrying away heat generated by the electronic equipment.

The condensation pipeline 51 comprises a water inlet connector and a water return connector which are respectively connected with the water inlet pipeline 21 and the water return pipeline 22. Thus, the cooling channel 12 in the heat conducting component 10 is communicated with the condensation pipeline 51 of the heat radiating component 50 through the water inlet pipeline 21 and the water return pipeline 22, and waterproof rings can be arranged at the water inlet connecting port and the water return connecting port respectively to enhance the sealing performance between the water inlet pipeline 21 and the connection between the water return pipeline 22 and the condensation pipeline 51. Optionally, the heat conducting assembly 10 further includes a heat conducting plate 11 covering a side of the seat body 13 far away from the heat dissipating assembly 50, and the heat conducting plate 11 is made of a metal material. The heat conducting component 10 itself may be made of a metal material with good heat conductivity, or a portion of the heat conducting component 10 contacting the electronic device may be made of a metal material with good heat conductivity. In this embodiment, the heat conducting plate 11 is disposed on the side of the base 13 for contacting with the electronic device, and the heat generated by the electronic device during operation is absorbed by the heat conducting plate 11.

Optionally, a water filling port 41 is disposed at one side of the liquid container 40, and the liquid container 40 further includes a cover 42 detachably installed at the water filling port 41 to close the water filling port 41. The liquid container 40 may be a water tank, and a water filling port 41 is provided, and a tank cover 42 is detachably installed at the water filling port 41, so that the tank cover 42 can be opened to supplement or replace the cooling liquid into the liquid container 40. The second pipeline comprises a water inlet pipeline 24 and a water outlet pipeline 23, the condensation pipeline 51 comprises a water inlet connecting port and a water outlet connecting port which are respectively communicated with the water inlet pipeline 24 and the water outlet pipeline 23, and the condensation pipeline 51 is communicated with the liquid container 40 through the water inlet pipeline 24 and the water outlet pipeline 23. Waterproof rings 54 can be respectively arranged at the water inlet connector and the water outlet connector to enhance the sealing performance between the connection of the water inlet pipeline 24 and the water outlet pipeline 23 with the condensation pipeline 51.

Optionally, the driving member 30 is communicated with the fluid pipeline 20 or the condensation pipeline 51, the driving member 30 is a water pump, a power line connected to an external power source is provided on the driving member 30, and/or a power interface for connecting to an external power source is provided on the driving member 30. When the heat dissipation device for electronic equipment is in use, the driving member 30 can be connected to an external power source through a power line or a power interface, and the external power source can be a socket, a mobile power source, or even other electronic equipment.

When the heat dissipation device of the electronic device is used, the heat conducting component 10 can be attached to the back surface of the electronic device, and heat generated by the electronic device is transferred to the heat conducting component 10. The cooling liquid in the liquid container 40 flows from the water outlet pipe 23 to the condensation pipe 51 under the action of the driving member 30, and flows into the cooling channel 12 in the heat conducting assembly 10 through the condensation pipe 51 and the water inlet pipe 21, the cooling liquid fully absorbs the heat transferred to the heat conducting assembly 10 by the electronic device in the process of flowing through the cooling channel 12, and then flows to the condensation pipe 51 through the water return pipe 22, at this time, the fan wheel 53 of the heat dissipating assembly 50 rotates at a high speed to generate an air flow, the air flow blows to the condensation pipe 51 to cool the condensation pipe 51, the air flow blows from the air outlet to release the heat to the surrounding environment, and meanwhile, the cooling liquid cooled at the condensation pipe 51 flows back to the liquid container 40 through the water inlet pipe 24, and the circulation is performed in such a way to achieve the heat dissipation of the electronic device. The electronic equipment can be various portable electronic products such as mobile phones, tablets, learning machines and the like. In the above embodiment, the fan wheel 53 is used in cooperation with the condensing duct 51, so that the heat dissipation assembly 50 has a better heat dissipation effect; by arranging the water tank, the electronic equipment heat dissipation device can accommodate more cooling liquid, so that the heat dissipation effect is improved; the liquid container 40 is provided with a detachably connected box cover 42, so that the cooling liquid in the liquid container 40 can be replaced conveniently, for example, the cooling liquid in the liquid container 40 can be replaced by ice water, so as to further improve the heat dissipation effect.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A heat dissipation device for electronic equipment is characterized by comprising a heat conduction assembly, a liquid container, a heat dissipation assembly, a fluid pipeline and a driving piece, wherein the fluid pipeline connects the heat conduction assembly, the heat dissipation assembly and the liquid container, the driving piece drives cooling liquid to flow in the fluid pipeline;

2. The heat dissipating device of an electronic device as claimed in claim 1, wherein the fan includes a housing and a fan wheel received in the housing, the housing includes a bottom plate, a side plate extending outward from one side of the bottom plate, and a flat plate connected to an end of the side plate away from the bottom plate, the flat plate, the side plate, and the bottom plate together enclose a receiving cavity for receiving the fan wheel, the flat plate is provided with an air inlet, and a through hole is provided at a position of the bottom plate opposite to the fan wheel.

3. The heat dissipation device of claim 2, wherein the housing further comprises a cover body disposed on the other side of the bottom plate, the cover body comprises a top plate and a side wall extending outward from an edge of the top plate, the top plate and the side wall jointly enclose an accommodation space for accommodating the condensation duct, and the side wall is provided with an air outlet.

4. The heat dissipating device of claim 1, wherein the first pipe comprises an inlet pipe and a return pipe, the heat conducting member comprises a housing and a cooling channel formed in the housing, and a side of the housing facing the heat dissipating member is provided with an inlet and a return port respectively communicating with the inlet pipe and the return pipe.

5. The electronic device heat sink of claim 4, wherein the cooling channel comprises a plurality of transverse channels for guiding the cooling liquid to flow transversely along the heat conducting assembly and a plurality of vertical channels for guiding the cooling liquid to flow vertically along the heat conducting assembly, the transverse channels and the vertical channels being connected end to end in sequence.

6. The heat dissipating device of an electronic device of claim 4, wherein the condensation duct includes an inlet water connection port and a return water connection port connected to the inlet water duct and the return water duct, respectively.

7. The heat dissipating device of an electronic device of claim 4, wherein the heat conducting member further comprises a heat conducting plate covering a side of the housing away from the heat dissipating member, the heat conducting plate being made of a metal material.

8. The heat dissipating device of an electronic device as claimed in claim 1, wherein a water inlet is provided at one side of the liquid container, and the liquid container further comprises a cover detachably attached to the water inlet to close the water inlet.

9. The heat dissipating device of an electronic device of claim 1, wherein the second conduit comprises an inlet conduit and an outlet conduit, and the condensing conduit comprises an inlet connection port and an outlet connection port that communicate with the inlet conduit and the outlet conduit, respectively.

10. The heat dissipation device of any one of claims 1 to 9, wherein the driving member is in communication with the fluid conduit or the condensation conduit, and a power cord for connection to an external power source is provided on the driving member, and/or a power interface for connection to an external power source is provided on the driving member.