CN214206241U

CN214206241U - Electronic equipment radiator and mobile phone radiating shell

Info

Publication number: CN214206241U
Application number: CN202023347637.8U
Authority: CN
Inventors: 王策
Original assignee: Shenzhen Qimiaoxingqiu Culture Creativity Co Ltd
Current assignee: Shenzhen Qimiaoxingqiu Culture Creativity Co Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-09-14
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses an electronic equipment radiator and mobile phone heat dissipation shell, the electronic equipment radiator includes heat conduction component, the fluid pipeline connected with the heat conduction component, locate driving piece on the fluid pipeline and the connecting piece that connects the fluid pipeline with liquid container detachably, the connecting piece matches with the opening of the liquid container, the connecting piece is used for sealing the opening of the liquid container, the fluid pipeline includes the water inlet pipe and the return water pipe that stretch into in the liquid container after wearing to establish the connecting piece, the heat conduction component includes the heat conduction surface that is used for pasting with electronic equipment, the heat that the electronic equipment produced transmits to the heat conduction component, under the effect of the driving piece, the fluid pipeline absorbs cooling liquid from the liquid container, and the cooling liquid is in the fluid pipeline inner loop flows and takes away the heat on the heat conduction component, so as to realize the heat dissipation of the electronic equipment.

Description

Electronic equipment radiator and mobile phone radiating shell

Technical Field

The utility model belongs to the technical field of the heat dissipation technique and specifically relates to an electronic equipment radiator and cell-phone heat dissipation shell.

Background

In recent years, live webcasting and mobile phone games are very hot, so that long-time running is needed, and the heat productivity of the mobile phone is large. Although the mobile phone is provided with the heat dissipation device, the expected heat dissipation effect cannot be achieved when the mobile phone is used for a long time, and if the heat cannot be dissipated in time, the normal use of the mobile phone can be influenced, and even the service life of the mobile phone can be influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem that exists now, the utility model provides a conveniently carry, and can assist and carry out radiating electronic equipment radiator and cell-phone heat dissipation shell to electronic equipment.

In order to achieve the above object, the embodiment of the present invention provides a technical solution that:

the utility model provides an electronic equipment radiator, including heat-conducting component, with the fluid pipeline that heat-conducting component connects, locate driving piece on the fluid pipeline and with the connecting piece that fluid pipeline and liquid container detachably are connected, the connecting piece with the opening of liquid container matches, the connecting piece is used for sealing the liquid container the opening, the fluid pipeline is including wearing to establish stretch into behind the connecting piece inlet channel and the wet return pipeline in the liquid container, heat-conducting component is including being used for pasting the heat conduction face of establishing with electronic equipment, the heat transfer that electronic equipment produced extremely heat-conducting component, cooling liquid is in under the effect of driving piece the fluid pipeline inner loop flows, cooling liquid flows through take away when heat-conducting component the heat that electronic equipment produced.

The connecting piece is wrapped on the periphery of the opening of the liquid container and is in threaded connection with the opening.

The connecting piece is a water bottle cap which can be matched with the bottle mouths of various types of water bottles, and a cover body of the water bottle cap is provided with a through hole for the water inlet pipeline and the water return pipeline to penetrate through.

The heat conduction assembly is provided with a cooling channel, openings at two ends of the cooling channel are respectively communicated with the water inlet pipeline and the water return pipeline, and the cooling liquid flows into the cooling channel through the water inlet pipeline in the internal circulation flowing process of the fluid pipeline, takes away heat generated by the electronic equipment in the flowing process of the cooling channel and then flows back to the liquid container through the water return pipeline.

The cooling channel comprises a plurality of transverse channels for guiding the cooling liquid to flow transversely along the heat conducting assembly and a plurality of vertical channels for guiding the cooling liquid to flow vertically along the heat conducting assembly, and the transverse channels and the vertical channels are sequentially connected end to end.

The heat conducting surface of the heat conducting component is provided with a heat conducting plate, and the heat conducting plate is made of metal materials.

The fluid pipeline is a hose, the driving piece is arranged on the water inlet pipeline or on the water return pipeline, and the driving piece is fixed on the surface of the connecting piece and connected with an external power supply.

Wherein the open end of the water inlet pipe and the open end of the water return pipe are located at different heights in the liquid container.

The heat conduction assembly is a bracket used for clamping electronic equipment; or

The heat conducting component is an electronic equipment shell used for accommodating the electronic equipment.

A heat dissipation shell of a mobile phone comprises a mobile phone shell cover, a fluid pipeline connected with the mobile phone shell cover, a driving piece arranged on the fluid pipeline and a connecting piece detachably connecting the fluid pipeline and a liquid container, wherein the connecting piece comprises a bottle cap part matched with a standard threaded bottle mouth of the liquid container, the bottle cap part is in threaded connection with the standard threaded bottle mouth to seal the liquid container, the fluid pipeline comprises a water inlet pipeline and a water return pipeline which penetrate through the connecting piece and extend into the liquid container, the mobile phone shell cover is used for accommodating the mobile phone in the mobile phone shell cover, heat generated by the mobile phone is transferred to the mobile phone shell cover, cooling liquid flows along the fluid pipeline under the action of the driving piece in a circulating manner, and the heat dissipated by the mobile phone is taken away when the cooling liquid flows through the mobile phone shell cover via the fluid pipeline, so as to realize the heat dissipation of the mobile phone.

In the electronic device radiator and the mobile phone radiating shell provided by the embodiment, the heat conducting component is connected with the fluid pipeline, the fluid pipeline is detachably connected with the liquid container through the connecting piece, the fluid pipeline comprises the water inlet pipeline and the water return pipeline which penetrate through the connecting piece and extend into the liquid container, the heat conducting component comprises the heat conducting surface which is attached to the electronic device, heat generated by the electronic device is transferred to the heat conducting component, the cooling liquid circularly flows in the fluid pipeline under the action of the driving piece, and the heat generated by the electronic device is taken away when the cooling liquid flows through the heat conducting component, so that the heat conducting component is detachably connected with the liquid container through the connecting piece, and can be matched with different liquid containers to dissipate heat of the electronic device, and the carrying and the use are convenient; the electronic equipment is subjected to auxiliary heat dissipation through the circulating flow of the cooling liquid, and the heat dissipation effect of the electronic equipment can be improved.

Drawings

FIG. 1 is a perspective view of a heat sink of an electronic device in an embodiment of the present application;

FIG. 2 is an exploded view of the heat sink of the electronic device of FIG. 1;

fig. 3 is a cross-sectional view of a heat sink of an electronic device in an embodiment of the present application.

Detailed Description

The technical solution of the present invention will be further described in detail with reference to the drawings and specific embodiments. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the following description, reference is made to the expression "some embodiments" which describe a subset of all possible embodiments, but it should be understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

It will also be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "inner," "outer," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 3, an embodiment of the present invention provides a heat sink for electronic devices, including a heat conducting element 10, a fluid pipe 20 connected to the heat conducting element 10, a driving element 30 disposed on the fluid pipe 20, and a connecting element 40 detachably connecting the fluid pipe 20 and a liquid container 41, where the connecting element 40 is matched with an opening 42 of the liquid container 41, the connecting element 40 is used to close the opening 42 of the liquid container 41, the fluid pipe 20 includes a water inlet pipe 21 and a water return pipe 22 penetrating the connecting element 40 and extending into the liquid container 41, the heat conducting element 10 includes a heat conducting surface for attaching to an electronic device, heat generated by the electronic device is transferred to the heat conducting element 10, and cooling liquid circulates in the fluid pipe 20 under the action of the driving element 30, the cooling fluid carries away heat generated by the electronic device as it flows through the thermally conductive assembly 10.

In the above embodiment, the electronic device heat sink is detachably connected to the liquid container 41 through the connecting member 40, and the heat conducting assembly 10 can be matched with different liquid containers 41 to dissipate heat of the electronic device, so that the electronic device heat sink is convenient to carry and use; and the electronic equipment radiator sucks cooling liquid from the liquid container 41 through the fluid pipeline 20 and the driving part 30, and auxiliary heat dissipation is carried out on the electronic equipment through the circulating flow of the cooling liquid, so that the heat dissipation effect of the electronic equipment can be improved.

Alternatively, the connector 40 is wrapped around the opening 42 of the liquid container 41, and the connector 40 is screwed to the opening 42. The connector 40 is screwed to the opening 42 of the liquid container 41, and the electronic equipment heat sink can be fitted to the liquid container 41 having the same opening 42, and the electronic equipment heat sink can be easily attached and detached.

Optionally, the connecting piece 40 is a water bottle cap that can be matched with the bottle mouths of various types of water bottles, and a cover body of the water bottle cap is provided with a through hole through which the water inlet pipe 21 and the water return pipe 22 are inserted. The connecting piece 40 is designed to be a water bottle cap, so that the electronic equipment radiator can be directly matched with a common water bottle on the market for use, and is convenient to use without carrying a designated matched liquid container 41 when going out. The common water bottle on the market can be mineral water bottle, beverage bottle, etc. The cooling liquid can be water, other water solutions and the like, and the cooling liquid can also be subjected to cooling treatment in a refrigerator to improve the cooling effect.

Optionally, a cooling channel 12 is disposed on the heat conducting component 10, openings at two ends of the cooling channel 12 are respectively communicated with the water inlet pipe 21 and the water return pipe 22, and the cooling liquid flows into the cooling channel 12 through the water inlet pipe 21 during the circulation flow process in the fluid pipe 20, carries away heat generated by the electronic device during the flow process along the cooling channel 12, and then flows back to the liquid container 41 through the water return pipe 22. The cooling channels 12 are distributed over the cross section of the heat conducting component 10, and the sum of the areas of the cross sections of the cooling channels 12 is approximately equal to the cross section of the heat conducting component 10, so that the contact area between the cooling liquid flowing through the cooling channels 12 and the heat conducting component 10 can be increased to the greatest extent, and the heat dissipation effect is improved. The open end of the water inlet pipe 21 and the open end of the water return pipe 22 are located at different heights in the liquid container 41, so that the cooling liquid flowing back to the liquid container 41 through the water return pipe 22 can be sufficiently mixed with other cooling liquid in the liquid container 41, and then flows into the cooling channel 12 again through the water inlet pipe 21, thereby improving the heat dissipation effect.

In some embodiments, the cooling channels 12 include a plurality of transverse channels that guide the cooling liquid to flow transversely along the heat conducting assembly 10 and a plurality of vertical channels that guide the cooling liquid to flow vertically along the heat conducting assembly 10, the transverse channels and the vertical channels being connected end to end in sequence. The cooling channel 12 includes a lateral channel and a vertical channel, thereby being integrally formed in a shape of being distributed with being bent over the cross section of the heat conducting assembly 10, so that the cooling liquid entering the cooling channel 12 can flow roundly, thereby increasing the flow path length of the cooling liquid in the cooling channel 12 and enhancing the heat dissipation effect.

Optionally, a heat conducting plate 11 is disposed on the heat conducting surface of the heat conducting assembly 10, and the heat conducting plate 11 is made of a metal material. The heat conducting component 10 itself may be made of a metal material with good heat conductivity, or a portion of the heat conducting component 10 contacting the electronic device may be made of a metal material with good heat conductivity. The heat conductive member 10 may further be provided with a heat conductive plate 11 directly contacting a heat dissipating surface of the electronic device, and heat generated during operation of the electronic device is absorbed through the heat conductive plate 11.

Optionally, the fluid pipeline 20 is a hose, the driving element 30 is disposed on the water inlet pipeline 21 or on the water return pipeline 22, and the driving element 30 is fixed on the surface of the connecting element 40 and connected to an external power source. The fluid pipeline 20 is designed as a hose, so that the electronic device radiator can be conveniently stored in the process of being carried outside, the driving part 30 is connected with the water inlet pipeline 21 or the water return pipeline 22 and then is fixedly installed on the surface of the connecting part 40, and the connecting part 40 provides bearing support for the installation of the driving part 30. Optionally, the driving member 30 is a water pump, and a power line connected to an external power source is provided on the driving member 30, and/or a power interface for connecting to an external power source is provided on the driving member 30. In the use process of the electronic device heat sink, the driving member 30 may be connected to an external power source through a power line or a power interface, where the external power source may be a socket, a mobile power source, or even other electronic devices. Optionally, the heat conducting assembly 10 is a bracket for clamping an electronic device; or the heat conducting component 10 is an electronic device housing for accommodating the electronic device therein. When the heat conducting assembly 10 is a bracket, the bracket may include a body attached to the back of the electronic device and a clamping arm formed on the body for clamping the edge of the electronic device, and the heat conducting surface is formed on the body. When the heat conducting assembly 10 is an electronic device housing, an accommodating space for accommodating the electronic device is formed in the electronic device housing, and the heat conducting surface is an inner surface of the electronic device housing in the accommodating space.

The electronic equipment radiator can be adapted to different types of portable electronic equipment, such as mobile phones, tablet computers, learning machines and the like, and is particularly suitable for being used as an auxiliary radiator of the mobile phones, on the other hand, the application also provides a mobile phone radiating shell, which comprises a mobile phone shell, a fluid pipeline 20 connected with the mobile phone shell, a driving part 30 arranged on the fluid pipeline 20, and a connecting part 40 detachably connecting the fluid pipeline 20 with a liquid container 41, wherein the connecting part 40 comprises a bottle cap part matched with a standard threaded bottle opening of the liquid container 41, the bottle cap part is in threaded connection with the standard threaded bottle opening to seal the liquid container 41, the fluid pipeline 20 comprises a water inlet pipeline 21 and a water return pipeline 22 penetrating through the connecting part 40 and extending into the liquid container 41, and the mobile phone shell is used for accommodating the mobile phone inside, the heat that the cell-phone produced transmits to on the cell-phone shell cover, cooling liquid is in following under the effect of driving piece 30 fluid pipeline 20 circulation flow, cooling liquid takes away the heat that the cell-phone gived off when the fluid pipeline 20 flows through the cell-phone shell cover via to the realization is to the heat dissipation of cell-phone.

The standard threaded bottle opening of the liquid container 41 may be a water bottle opening of a common water bottle on the market, and the bottle cap portion may be a water bottle cap matched with the water bottle opening of the common water bottle. Other structures of the heat dissipation shell of the mobile phone can be the same as those of the heat radiator of the electronic device in the previous embodiment, and are not described herein again.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides an electronic equipment radiator, its characterized in that, including heat-conducting component, with the fluid pipeline that heat-conducting component is connected, locate driving piece on the fluid pipeline and with the connecting piece that fluid pipeline and liquid container detachably are connected, the connecting piece with liquid container's opening matches, the connecting piece is used for sealing liquid container's the opening, the fluid pipeline is including wearing to establish stretch into behind the connecting piece intake pipe and the return water pipeline in the liquid container, heat-conducting component is including being used for pasting the heat-conducting surface of establishing with electronic equipment, the heat transfer that electronic equipment produced extremely heat-conducting component, cooling liquid is in under the effect of driving piece the fluid pipeline inner loop flows, cooling liquid flows through take away when heat-conducting component the heat that electronic equipment produced.

2. The heat sink for electronic equipment according to claim 1, wherein the connector is wrapped around the opening of the liquid container, and the connector is screwed to the opening.

3. The electronic device radiator of claim 2, wherein the connecting piece is a water bottle cap capable of matching with the bottle mouths of various types of water bottles, and a cover body of the water bottle cap is provided with a through hole for the water inlet pipeline and the water return pipeline to penetrate through.

4. The heat sink for electronic equipment as claimed in claim 1, wherein said heat conducting member is provided with a cooling channel, both ends of said cooling channel are open and communicated with said water inlet pipe and said water return pipe, respectively, and said cooling liquid flows into said cooling channel through said water inlet pipe during the circulation flow in said fluid pipe, carries away the heat generated by said electronic equipment during the flow along said cooling channel, and flows back to said liquid container through said water return pipe.

5. The electronic device heat sink of claim 4 wherein the cooling channel comprises a plurality of transverse channels that direct the cooling liquid to flow transversely along the thermally conductive assembly and a plurality of vertical channels that direct the cooling liquid to flow vertically along the thermally conductive assembly, the transverse channels and the vertical channels being connected end to end in sequence.

6. The electronic device heat sink of claim 4, wherein the heat conducting surface of the heat conducting member is provided with a heat conducting plate, and the heat conducting plate is made of a metal material.

7. The electronic device heat sink of claim 1, wherein the fluid conduit is a hose, the driving member is disposed on the water inlet conduit or on the water return conduit, and the driving member is fixed to a surface of the connecting member and connected to an external power source.

8. The electronic device heat sink of claim 1, wherein an open end of the water inlet pipe and an open end of the water return pipe are located at different heights within the liquid container.

9. The electronic device heat sink of any of claims 1-8, wherein the thermally conductive component is a bracket for holding an electronic device; or

10. A mobile phone heat dissipation shell is characterized by comprising a mobile phone shell cover, a fluid pipeline connected with the mobile phone shell cover, a driving piece arranged on the fluid pipeline and a connecting piece detachably connecting the fluid pipeline with a liquid container, wherein the connecting piece comprises a bottle cap portion matched with a standard threaded bottle opening of the liquid container, the bottle cap portion is in threaded connection with the standard threaded bottle opening to seal the liquid container, the fluid pipeline comprises a water inlet pipeline and a water return pipeline which penetrate through the connecting piece and extend into the liquid container, the mobile phone shell cover is used for accommodating a mobile phone inside, heat generated by the mobile phone is transferred to the mobile phone shell cover, cooling liquid flows along the fluid pipeline in a circulating mode under the action of the driving piece, and the cooling liquid takes away the heat dissipated by the mobile phone when flowing through the mobile phone shell cover through the fluid pipeline, so as to realize the heat dissipation of the mobile phone.