CN215073576U - Medical electronic equipment's casing subassembly and medical electronic equipment - Google Patents
Medical electronic equipment's casing subassembly and medical electronic equipment Download PDFInfo
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- CN215073576U CN215073576U CN202120717173.0U CN202120717173U CN215073576U CN 215073576 U CN215073576 U CN 215073576U CN 202120717173 U CN202120717173 U CN 202120717173U CN 215073576 U CN215073576 U CN 215073576U
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Abstract
The application relates to a shell assembly of medical electronic equipment and the medical electronic equipment, wherein the shell assembly is provided with an installation cavity which is used for accommodating a heating device of the medical electronic equipment; the lateral wall of installation cavity has the cooling chamber, and the cooling chamber is used for the coolant liquid circulation, and the outer wall of casing subassembly is provided with the radiating piece. The side wall of the installation cavity for installing the heating device is provided with the cooling cavity, when the heating device generates heat in the working process of the medical electronic equipment, the heat of the heating device is absorbed through the cooling cavity, and the absorbed heat is discharged to the external environment of the medical electronic equipment through the heat radiating piece, so that the heat radiation of the heating device is realized. Because the cooling cavity is arranged on the side wall of the mounting cavity, namely the cooling cavity is formed on the shell assembly of the medical electronic equipment, a cooling system does not need to be additionally arranged in the inner cavity of the shell assembly, so that the cooling cavity does not occupy the space of the mounting cavity of the shell assembly, electronic devices of the medical electronic equipment are convenient to arrange, and the volume of the medical electronic equipment is reduced.
Description
Technical Field
The application relates to the technical field, in particular to a shell assembly of medical electronic equipment and the medical electronic equipment.
Background
The medical electronic device generally includes components such as a main board and a chip, and during the operation of the medical electronic device, the components such as the main board and the chip generally emit large heat, which causes the medical electronic device to have an excessively high temperature and thus affects the operating efficiency. At present, a cooling system of medical electronic equipment is usually arranged in a shell of the medical electronic equipment, but the cooling system of the scheme can occupy the internal space of the medical electronic equipment, so that the volume of the medical electronic equipment is overlarge, and the miniaturization is not facilitated.
SUMMERY OF THE UTILITY MODEL
The application provides a shell assembly of medical electronic equipment and the medical electronic equipment, wherein a cooling system of the medical electronic equipment is built in and occupies a small space.
The first aspect of the application provides a housing assembly of medical electronic equipment, wherein the housing assembly is provided with a mounting cavity, and the mounting cavity is used for accommodating a heating device of the medical electronic equipment; the lateral wall of installation cavity has the cooling chamber, the cooling chamber is used for the coolant liquid circulation, the outer wall of casing subassembly is provided with the radiating piece.
In this scheme, because the lateral wall that is used for the installation to generate heat the installation cavity of device is provided with the cooling chamber, consequently, when the device that generates heat produced heat in the medical electronic equipment course of working, can absorb the heat of the device that generates heat through the cooling chamber that sets up in the lateral wall of installation cavity to discharge the external environment of medical electronic equipment with the absorbed heat through the radiating piece, thereby realize the heat dissipation to the device that generates heat. Meanwhile, the cooling cavity is arranged on the side wall of the mounting cavity, namely the cooling cavity is formed in the shell assembly of the medical electronic equipment, and a cooling system does not need to be additionally arranged in the inner cavity of the shell assembly, so that the cooling cavity does not occupy the space of the mounting cavity of the shell assembly, electronic devices of the medical electronic equipment are convenient to arrange, and the size of the medical electronic equipment is reduced.
In one possible design, the cooling chamber includes at least a first chamber and a second chamber that are in communication, and the cooling fluid can circulate in the first chamber and the second chamber;
in a possible design, the heat dissipation element is disposed on an outer wall of the second cavity, and the first cavity is configured to correspond to a heat generation device of the medical electronic device. The second cavity surrounds the first cavity.
In one possible design, a first communication port and a second communication port are arranged between the first cavity and the second cavity; the first communicating port and the second communicating port are arranged oppositely.
In one possible design, the first cavity and the mounting cavity are arranged in a thickness direction of the housing assembly.
In one possible design, a heat conducting member is disposed in the first cavity, and the heat conducting member is used for conducting heat of a heat generating device of the medical electronic device.
In one possible design, the housing assembly further includes a water pump for driving the coolant to circulate in the first cavity and the second cavity; the water pump is located in the second cavity.
In one possible design, the housing assembly includes a first outer wall and a second outer wall; the first outer wall is provided with an interface and a power supply, and the heat dissipation piece is arranged on the second outer wall.
In one possible design, the housing assembly is made of metal.
A second aspect of the present application provides a medical electronic device comprising: a heat generating device; a housing assembly, the housing assembly being the housing assembly described above; wherein, the heating device is installed in the installation cavity of the shell component.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of a medical electronic device provided herein;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a cross-sectional view of FIG. 1;
FIG. 4 is a cross-sectional view from another perspective of FIG. 1;
fig. 5 is an internal schematic view of fig. 1.
Reference numerals:
1-a housing assembly;
11-a mounting cavity;
12-a first cavity;
121-a flow guide;
13-a second cavity;
14-a first communication port;
15-a thermally conductive member;
16-a water pump;
17-a first outer wall;
171-interface;
172-a power source;
18-a heat sink;
19-a cover body;
2-heat generating device.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
The application embodiment provides a shell assembly 1 of medical electronic equipment, as shown in fig. 2 to 4, the shell assembly 1 has a mounting cavity 11, a heating device 2 (for example, an electronic device such as a circuit board or a chip) of the medical electronic equipment is mounted in the mounting cavity 11, meanwhile, a cooling cavity is arranged on a side wall of the mounting cavity 11, cooling liquid circulates in the cooling cavity, and a heat dissipation member 18 is arranged on an outer wall of the shell assembly 1.
In this embodiment, since the side wall of the mounting cavity 11 for mounting the heating device 2 is provided with the cooling cavity, when the heating device 2 generates heat during the operation of the medical electronic device, the cooling cavity arranged on the side wall of the mounting cavity can absorb the heat of the heating device 2, and the heat sink 18 can discharge the absorbed heat to the external environment of the medical electronic device, thereby dissipating the heat of the heating device 2. Meanwhile, since the cooling cavity is formed in the side wall of the mounting cavity 11, that is, the cooling cavity is formed in the housing assembly 1 of the medical electronic device, it is not necessary to additionally provide a cooling system in the inner cavity of the housing assembly 1, so that the cooling cavity does not occupy the space of the mounting cavity 11 of the housing assembly 1, thereby facilitating the arrangement of the electronic devices of the medical electronic device and contributing to the reduction of the volume of the medical electronic device.
Specifically, as shown in fig. 2 to 4, the cooling cavity at least includes a first cavity 12 and a second cavity 13, a heat sink 18 is disposed on an outer wall of the second cavity 13, the first cavity 12 corresponds to the heat generating device 2 in the mounting cavity 11, the first cavity 12 is communicated with the second cavity 13, and the cooling liquid can circulate in the first cavity 12 and the second cavity 13.
In this embodiment, since the first cavity 12 corresponds to the heat generating device 2, the heat of the heat generating device 2 can be transferred to the cooling liquid in the first cavity 12, and the cooling liquid can circulate in the first cavity 12 and the second cavity 13, so that the heat of the heat generating device 2 is transferred to the heat dissipating member 18 disposed on the outer wall of the second cavity 13 and dissipated to the outside. Therefore, in the present embodiment, by providing the first cavity 12 and the second cavity 13 that communicate with each other, it is possible to facilitate the transfer of heat of the heat generating device 2 to the heat sink 18.
In one embodiment, as shown in fig. 2 and 3, the second cavity 13 surrounds the first cavity 12, and the heat sink 18 is disposed on an outer sidewall of the second cavity 13.
In this embodiment, the second cavity 13 surrounds the first cavity 12, and after the cooling liquid absorbs the heat of the heat generating device 2 in the first cavity 12, the cooling liquid with increased temperature can flow to the second cavity 13 at the periphery of the first cavity 12 and dissipate through the heat dissipating member 18 arranged at the outer side wall of the second cavity 13, so as to dissipate the heat of the heat generating device 2. In this embodiment, when the second cavity 13 surrounds the first cavity 12, the arrangement space of the heat sink 18 can be increased, and the space of the cooling cavity is reduced while the heat of the heat generating device 2 is effectively absorbed and dissipated to the outside, which is beneficial to the miniaturization of the medical electronic device.
Specifically, as shown in fig. 3, a first communication port 14 and a second communication port (not shown) are provided between the first cavity 12 and the second cavity 13, so that the first cavity 12 and the second cavity 13 are communicated with each other through the first communication port 14 and the second communication port, wherein the first communication port 14 and the second communication port are arranged opposite to each other.
In this embodiment, one of the first communicating port 14 and the second communicating port is an inlet of the first cavity 12, and the other is an outlet of the first cavity 12, and when the first communicating port 14 and the second communicating port are oppositely arranged, the distance between the two is large, so that the flow path of the cooling liquid in the first cavity 12 is long, the heat of the heat generating device 2 can be effectively absorbed, and the cooling effect of the cooling system on the heat generating device 2 is improved.
In the embodiment shown in fig. 3, the first communication port 14 is an inlet of the first cavity 12, i.e. the cooling liquid enters the first cavity 12 through the first communication port 14, and the second communication port is disposed on the other side wall opposite to the first communication port 14.
More specifically, as shown in fig. 2, a heat conduction member 15 is disposed in the first cavity 12, and the heat conduction member 15 is used for conducting heat of the heat generating device 2. The heat conducting member 15 may be a plurality of heat conducting fins disposed in the first cavity 12, and the plurality of heat conducting fins are distributed at intervals, and the cooling liquid can flow between adjacent heat conducting fins.
In this embodiment, the heat conducting member 15 in the first cavity 12 can contact with the coolant flowing in the first cavity 12, so that the heat of the heat generating device 2 absorbed by the heat conducting member 15 is transferred to the coolant, and further transferred to the heat dissipating member 18 through the flowing of the coolant in the first cavity 12 and the second cavity 13, and dissipated. Therefore, the heat-conducting member 15 is provided to improve the efficiency of heat transfer from the heat generating device 2 to the coolant, thereby improving the cooling efficiency of the heat generating device 2 by the cooling system.
Meanwhile, as shown in fig. 2, a flow guiding member 121 is disposed in the first cavity 12, the flow guiding member 121 is disposed at the first communication port 14 (the inlet of the first cavity 12), and when the cooling liquid enters the first cavity 12 through the first communication port 14, the flow guiding member 121 is used for guiding the cooling liquid to the area of the heat conducting member 15.
In the above embodiments, as shown in fig. 4, the first cavity 12 and the mounting cavity 11 are arranged along the thickness direction of the housing assembly 1, that is, in the placing direction shown in fig. 4, the mounting cavity 11 is located below the first cavity 12, and the second cavity 13 surrounds the first cavity 12 and the mounting cavity 11, therefore, in this embodiment, the first cavity 12 is disposed on the upper side wall of the mounting cavity 11, and the second cavity 13 is disposed on the outer peripheral wall of the mounting cavity 11, that is, both the first cavity 12 and the second cavity 13 surround the mounting cavity 11, so that the heat of the heat generating device 2 in the mounting cavity 11 can be effectively absorbed, and is transferred to the heat dissipating member 18 on the outer side wall of the second cavity 13, thereby achieving heat dissipation.
Specifically, as shown in fig. 5, the housing assembly 1 of the medical electronic device further includes a water pump 16, the water pump 16 is used for driving the cooling liquid to circulate in the first cavity 12 and the second cavity 13, and the water pump 16 is disposed in the second cavity 13.
In this embodiment, the water pump 16 is used to provide a driving force for the coolant to flow in the first cavity 12 and the second cavity 13, so as to promote the coolant to circulate between the first cavity 12 and the second cavity 13, and improve the cooling efficiency of the cooling system on the heat generating device 2. Meanwhile, when the water pump 16 is installed in the second cavity 13, the distance between the water pump 16 and the heating device 2 is large, the risk that the heat of the heating device 2 damages the water pump 16 can be reduced, the service life and the reliability of the water pump 16 are improved, the space of the second cavity 13 can be reasonably utilized, the space of the first cavity 12 can be increased under the condition that the overall volume of the shell assembly 1 is not increased, and the heat absorption rate of the heating device 2 is improved.
In addition, according to actual conditions, the shell assembly 1 may further include an internal air pressure balance piston, and the internal air pressure balance piston is used for balancing the internal air pressure and the external air pressure of the medical electronic device shell assembly 1, so that the cooling liquid is driven by the water pump 16 to be smoother.
In the above embodiments, the housing assembly 1 of the medical electronic device includes the first outer wall 17 and the second outer wall, the first outer wall 17 is provided with the interface 171 and the power supply 172, and the heat sink 18 is provided on the second outer wall. The interface 171 may be an I/O port.
In this embodiment, the interface 171 and the power supply 172 of the first outer wall 17 are used to be electrically connected to external components, for example, the interface 171 may be a network interface, and the power supply 172 is used to be electrically connected to an external power supply, so as to energize the heat generating device 2 of the medical electronic device, so that the medical electronic device can normally operate. Meanwhile, when the interface 171, the power supply 172 and the heat sink 18 are disposed on different outer walls of the housing assembly 1, the interface 171 and the power supply 172 can be prevented from affecting the disposition of the heat sink 18, the disposition area of the heat sink 18 can be increased, and the heat dissipation efficiency can be improved.
In addition, in order to improve the safety of the medical electronic device, a waterproof member may be disposed on an outer side of the first outer wall 17 where the interface 171 and the power supply 172 are disposed, so that the waterproof performance of the medical electronic device is improved, the safety thereof is improved, and a user can sterilize the first outer wall 17 with a disinfectant (e.g., alcohol, etc.).
In the above embodiments, the housing assembly 1 of the medical electronic device is made of metal.
In this embodiment, because each electronic device of the medical electronic device is located in the installation cavity 11 of the housing assembly 1, when the housing assembly 1 is made of metal, the housing assembly 1 forms a closed metal magnetic shielding structure for the electronic device in the installation cavity 11, so that the requirement of the medical electronic device on electromagnetic shielding can be met, and the medical electronic device can normally work. Meanwhile, the magnetic shielding structure of the medical electronic equipment is also realized through the shell assembly 1, and the magnetic shielding structure is not required to be additionally arranged, so that the structure of the medical electronic equipment can be further simplified, and the miniaturization of the medical electronic equipment can be further realized. In addition, as described in the above embodiments, the case assembly 1 also forms a cooling system of the medical electronic apparatus, and therefore, the case assembly 1 has a cooling function and a magnetic shield function.
In addition, as shown in fig. 2, the housing assembly 1 further includes a cover 19, and the cover 19 can seal the first cavity 12 and the second cavity 13 of the housing assembly 1, so as to prevent the cooling liquid from leaking.
The embodiment of the present application further provides a medical electronic device, as shown in fig. 1, the medical electronic device includes a housing assembly 1 and an electronic device located in the housing assembly 1, the electronic device may include components such as a circuit board, a chip, and a controller, and is used for implementing functions of the medical electronic device, and heat is generated during the operation of the electronic device.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. All within the spirit and principles of the present application.
Claims (10)
1. A housing assembly of a medical electronic device, characterized in that the housing assembly (1) has a mounting cavity (11), the mounting cavity (11) is used for accommodating a heat generating device (2) of the medical electronic device;
the side wall of the installation cavity (11) is provided with a cooling cavity, the cooling cavity is used for circulating cooling liquid, and a heat dissipation piece (18) is arranged on the outer wall of the shell assembly (1).
2. The medical electronics housing assembly according to claim 1, wherein the cooling chamber comprises at least a first chamber (12) and a second chamber (13) in communication, the cooling fluid being able to circulate inside the first chamber (12) and the second chamber (13);
the heat dissipation piece (18) is arranged on the outer wall of the second cavity (13), and the first cavity (12) is used for corresponding to the heating device (2) of the medical electronic equipment.
3. Medical electronics housing assembly according to claim 2, wherein the second cavity (13) surrounds the first cavity (12).
4. The medical electronics housing assembly according to claim 3, characterized in that the first cavity (12) and the second cavity (13) have a first communication opening (14) and a second communication opening therebetween;
the first communication port (14) is disposed opposite to the second communication port.
5. The medical electronics housing assembly according to claim 2, characterized in that the first cavity (12) and the mounting cavity (11) are arranged in the thickness direction of the housing assembly (1).
6. The housing assembly of a medical electronic device according to claim 5, wherein a heat conducting member (15) is arranged in the first cavity (12), and the heat conducting member (15) is used for conducting heat of the heat generating component (2) of the medical electronic device.
7. The medical electronics housing assembly according to claim 2, characterized in that the housing assembly (1) further comprises a water pump (16), the water pump (16) being adapted to drive the circulation of the cooling liquid within the first cavity (12) and the second cavity (13); the water pump (16) is positioned in the second cavity (13).
8. The medical electronics housing assembly according to any one of claims 1 to 7, wherein the housing assembly (1) comprises a first outer wall (17) and a second outer wall;
the first outer wall (17) is provided with an interface (171) and a power supply (172), and the heat sink (18) is provided to the second outer wall.
9. The medical electronic device housing assembly according to any one of claims 1 to 7, wherein the housing assembly (1) is made of metal.
10. A medical electronic device, comprising:
a heat generating device (2);
a housing assembly (1), the housing assembly (1) being a housing assembly (1) according to any one of claims 1 to 9;
wherein the heating device (2) is mounted in the mounting cavity (11) of the shell component (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120717173.0U CN215073576U (en) | 2021-04-08 | 2021-04-08 | Medical electronic equipment's casing subassembly and medical electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120717173.0U CN215073576U (en) | 2021-04-08 | 2021-04-08 | Medical electronic equipment's casing subassembly and medical electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073576U true CN215073576U (en) | 2021-12-07 |
Family
ID=79147010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120717173.0U Active CN215073576U (en) | 2021-04-08 | 2021-04-08 | Medical electronic equipment's casing subassembly and medical electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073576U (en) |
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2021
- 2021-04-08 CN CN202120717173.0U patent/CN215073576U/en active Active
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